CN112312658A - Packaging structure and electronic equipment - Google Patents

Packaging structure and electronic equipment Download PDF

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Publication number
CN112312658A
CN112312658A CN202011190963.4A CN202011190963A CN112312658A CN 112312658 A CN112312658 A CN 112312658A CN 202011190963 A CN202011190963 A CN 202011190963A CN 112312658 A CN112312658 A CN 112312658A
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CN
China
Prior art keywords
pcb
connection surface
blocking wall
bracket
package structure
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Granted
Application number
CN202011190963.4A
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Chinese (zh)
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CN112312658B (en
Inventor
徐加骏
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN202011190963.4A priority Critical patent/CN112312658B/en
Publication of CN112312658A publication Critical patent/CN112312658A/en
Application granted granted Critical
Publication of CN112312658B publication Critical patent/CN112312658B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

The application discloses packaging structure and electronic equipment belongs to electronic components technical field. The packaging structure comprises a PCB, a bracket, a first electronic element and a second electronic element; the bracket is fixedly arranged on the PCB, the bracket and the PCB form an accommodating space, and the first electronic element is arranged in the accommodating space and is electrically connected with the PCB; the second electronic element is arranged on the bracket and is electrically connected with the PCB. In the packaging structure provided by the embodiment of the application, because a support is arranged on the PCB, the first electronic element can be connected on the PCB, and the second electronic element can be arranged on the support, so that the area occupied by the electronic element on the PCB is saved, the saved area can be used for arranging a battery with larger volume, and the cruising ability of an electronic product is improved.

Description

Packaging structure and electronic equipment
Technical Field
The application belongs to the technical field of electronic components, and particularly relates to a packaging structure and electronic equipment.
Background
With the development of science and technology, various electronic products have more and more powerful functions, the updating speed of the electronic products is faster and faster, and the dependence of people on the electronic products and the use requirements are higher and higher. The endurance time of electronic products is one of the very important performance indicators of electronic products, and especially, nowadays, the daily use time of people using electronic products is increasingly longer, and how to prolong the endurance time of electronic products becomes one of the key research points of the people's electronic engineers. The size of the battery is limited by the overall dimension of the electronic product, and before the energy density and the material of the battery can not break through the current technical barriers, the size of the battery becomes a key factor influencing the capacity of the battery. Therefore, reducing the occupied area of the electronic components on the mainboard as much as possible and increasing the volume of the battery become effective measures for prolonging the endurance time of the electronic product under the condition of certain power consumption of the electronic product.
Disclosure of Invention
An object of the embodiment of the application is to provide a packaging structure and an electronic device, so as to reduce the area occupied by electronic components on a main board.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a package structure, where the package structure includes:
the PCB comprises a PCB board, a bracket, a first electronic element and a second electronic element;
the bracket is fixedly arranged on the PCB, an accommodating space is formed by the bracket and the PCB, and the first electronic element is arranged in the accommodating space and is electrically connected with the PCB;
the second electronic element is arranged on the bracket and is electrically connected with the PCB.
In a second aspect, an embodiment of the present application provides an electronic device, including the package structure provided in the first aspect.
The technical scheme adopted by the application can achieve the following beneficial effects:
in the packaging structure provided by the embodiment of the application, because a support is arranged on the PCB, the first electronic element can be connected on the PCB, and the second electronic element can be arranged on the support, so that the area occupied by the electronic element on the PCB is saved, the saved area can be used for arranging a battery with larger volume, and the cruising ability of an electronic product is improved.
Drawings
Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view of a support in a package structure according to an embodiment of the present disclosure;
fig. 3 is a schematic partial structural diagram of a support in a package structure according to an embodiment of the present disclosure 1;
fig. 4 is a schematic partial structural diagram of a support in a package structure according to an embodiment of the present disclosure 2;
fig. 5 is a schematic perspective view of a support in a package structure according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a support bar in a package structure according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a PCB board in a package structure according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The electronic components provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 1, an embodiment of the present application provides a package structure, which includes a PCB 201, a bracket, a first electronic component 202, and a second electronic component 203; the bracket is fixedly arranged on the PCB 201, the bracket and the PCB 201 form an accommodating space, and the first electronic element 202 is arranged in the accommodating space and is electrically connected with the PCB 201; the second electronic component 203 is disposed on the bracket, and the second electronic component 203 is electrically connected to the PCB 201.
In the packaging structure provided by the embodiment of the application, because the support is arranged on the PCB 201, the first electronic element 202 can be connected to the PCB 201, and the second electronic element 203 can be arranged on the support, so that the area occupied by the electronic component on the PCB is saved, and the saved area can be used for arranging a battery with a larger volume, thereby improving the cruising ability of the electronic product. Specifically, the first electronic component 202 and the second electronic component 203 may be electronic components such as a resistor, a capacitor, and an inductor, respectively.
Referring to fig. 1 and 2, in one embodiment, the rack includes a first subframe body 101 and a second subframe body 102, and the first subframe body 101 and the second subframe body 102 are arranged opposite to each other along a first direction. The first subframe body 101 has a first connection surface 1011 and a second connection surface 1012 arranged along a second direction in an opposite manner; the second subframe body 102 has a third connection surface 1021 and a fourth connection surface 1022 which are disposed along a second direction and are opposite to each other; the first connection surface 1011 and the third connection surface 1021 are both connected to the PCB 201, and the second connection surface 1012 and the fourth connection surface 1022 are both connected to the second electronic component 203.
In this particular example, the rack comprises two sub-racks, namely a first sub-rack 101 and a second sub-rack 102. When the bracket is applied to a package structure, the first subframe body 101 and the second subframe body 102 are arranged on the PCB 201 along a first direction, and both the first subframe body 101 and the second subframe body 102 are connected to the second electronic component 203, so as to provide a stable support for the second electronic component 203. Further, the first sub-frame body 101 has a first connection surface 1011 and a second connection surface 1012 oppositely arranged along the second direction, and the second sub-frame body 102 has a third connection surface 1021 and a fourth connection surface 1022 oppositely arranged along the second direction, so that when the support is applied to the above-mentioned package structure, the first connection surface 1011 and the third connection surface 1021 can be connected to the PCB 201, and the second connection surface 1012 and the fourth connection surface 1022 can jointly support and connect the second electronic component 203. Therefore, electronic components such as resistors, capacitors, inductors and the like can be arranged on the PCB 201 and can also be arranged on the support, so that the area occupied by the electronic components on the PCB 201 is saved, the saved area can be used for setting a battery with larger volume, and the cruising ability of an electronic product is improved. Further, the first subframe body 101 and the second subframe body 102 may be formed by stamping a metal material with low impedance, easy molding, and difficult deformation, such as an aluminum alloy material, a copper material, a stainless steel material, etc., so that the bracket is a conductive bracket. Further, the first connection surface 1011, the second connection surface 1012, the third connection surface 1021, and the fourth connection surface 1022 are all welding surfaces. When the bracket is applied to a package structure, the first connection surface 1011 and the third connection surface 1021 are soldered to the PCB 201, and the second connection surface 1012 and the fourth connection surface 1022 are soldered to the second electronic component 203. More specifically, the PCB 201 has a first surface 2011 and a second surface 2013 opposite to each other, the first connection surface 1011 and the third connection surface 1021 are soldered to the first surface 2011 of the PCB 201 by the solder 204, and the second connection surface 1012 and the fourth connection surface 1022 are soldered to the second electronic component 203 by the solder 204. During soldering, the first electronic component 202 is soldered to the first surface 2011 of the PCB 201 (this step includes first soldering), the bracket is soldered, the PCB 201 is re-passed through the oven after the bracket soldering is completed, then soldering is performed on the second connection surface 1012 and the fourth connection surface 1022 of the bracket (second soldering), and finally the second electronic component 203 is soldered. Further, the package structure further includes a chip 205, a solder ball 206 is disposed on the second surface 2013 of the PCB 201, and the chip 205 is connected to the solder ball 206. In summary, the first electronic component 202 is connected to the first surface 2011, and specifically, the first electronic component 202 is located between the first subframe 101 and the second subframe 102; the second electronic component 203 is connected to the second connection surface 1012 and the fourth connection surface 1022, so that more electronic components can be arranged corresponding to the same area on the first surface 2011, thereby saving the area occupied by the electronic components on the PCB 201 and providing more space for the battery.
Referring to fig. 2, in one embodiment, the stand further includes a supporting rod 103, and along the first direction, the supporting rod 103 has a first end and a second end, the first end is connected to the first subframe body 101, and the second end is connected to the second subframe body 102.
Optionally, the support rod 103 is made of high temperature resistant polymer plastics, such as PPS (polyphenylene sulfide), PSU (polysulfone-based plastic); the setting of bracing piece 103 can be connected fixed the whole that becomes with first sub-support body 101 and second sub-support body 102 to improve the stability of whole support, and when carrying out connection operations such as welding to this support, the setting of bracing piece 103 can ensure that the support is difficult for taking place to warp and shifting, avoids welding deformation and off normal, guarantees to weld accurate and uniformity.
Referring to fig. 3 and 4, in an embodiment, the first subframe body 101 and the second subframe body 102 are both in a zigzag shape, and further, the second direction is a height direction of the zigzag shape.
In this specific example, the first subframe 101 and the second subframe 102 are both zigzag-shaped; in the first subframe 101, two bottom surfaces away from each other along the height direction of the zigzag shape are the first connection surface 1011 and the second connection surface 1012, respectively; in the second subframe 102, two bottom surfaces that are away from each other along the height direction of the zigzag shape are the third connection surface 1021 and the fourth connection surface 1022, respectively. The first subframe body 101 and the second subframe body 102 in the shape of the letter "Z" not only save space, but also form the connection surface to facilitate the connection operation such as welding. Of course, the first subframe body 101 and the second subframe body 102 may also have an i-shaped shape, a T-shaped shape, or the like.
Referring to fig. 2, in one embodiment, the first subframe body 101 and the second subframe body 102 are further arranged as mirror images of each other in the first direction.
Referring to fig. 2, the first sub-frame body 101 and the second sub-frame body 102 are arranged in a mirror image manner, specifically, the second sub-frame body 102 is arranged in a positive Z shape, and the first sub-frame body 101 is arranged in a reverse Z shape, so that the whole support structure is stable and electronic components such as resistors, capacitors, inductors and the like are easily connected and arranged thereon. It will be appreciated that the second direction is perpendicular to the first direction.
Referring to fig. 3 to 6, in an embodiment, the first subframe body 101 is provided with a first through hole 1013, the first end of the supporting rod 103 is provided with a first U-shaped fork, the first U-shaped fork is provided with a first blocking wall 1031 and a second blocking wall 1032 which are oppositely arranged, the first U-shaped fork is inserted into the first through hole 1013, the first blocking wall 1031 is connected to one side of the first through hole 1013 along a first direction, and the second blocking wall 1032 is connected to the other side of the first through hole 1013 along the first direction.
In this specific example, the first end of the supporting rod 103 is connected to the first sub-frame body 101 in an inserting manner, specifically, the first sub-frame body 101 is provided with a first through hole 1013 as a connecting hole for connecting to the first end of the supporting rod 103, and the first end of the supporting rod 103 is provided as a first U-shaped fork similar to a U shape, the first U-shaped fork includes a first blocking wall 1031 and a second blocking wall 1032 which are oppositely arranged, and a U-shaped opening is formed between the first blocking wall 1031 and the second blocking wall 1032; when the first blocking wall 1031 is connected, the first blocking wall 1031 passes through the first through hole 1013, the first blocking wall 1031 and the second blocking wall 1032 are respectively located at two sides of the first through hole 1013, and a part of the first sub-frame body 101 located at the edge of the first through hole 1013 is inserted between the first blocking wall 1031 and the second blocking wall 1032 to form a U-shaped opening, so that the first end of the supporting rod 103 and the first sub-frame body 101 form a stable connection relationship.
Referring to fig. 3 to 6, in an embodiment, the second subframe body 102 defines a second through hole 1023, the second end of the supporting rod 103 is provided with a second U-shaped fork, the second U-shaped fork has a third blocking wall 1033 and a fourth blocking wall 1034 that are oppositely disposed, the second U-shaped fork is inserted into the second through hole 1023, the third blocking wall 1033 is connected to one side of the second through hole 1023 along the first direction, and the fourth blocking wall 1034 is connected to the other side of the second through hole 1023 along the first direction.
In this specific example, the second end of the supporting rod 103 is connected to the second subframe body 102 in an inserting manner, specifically, a second through hole 1023 is formed in the second subframe body 102 as a connecting hole connected to the second end of the supporting rod 103, and the second end of the supporting rod 103 is configured to be similar to a U-shaped second U-shaped fork, the second U-shaped fork includes a third blocking wall 1033 and a fourth blocking wall 1034 that are arranged oppositely, and a U-shaped opening is formed between the third blocking wall 1033 and the fourth blocking wall 1034; when the connection is performed, the third blocking wall 1033 passes through the second through hole 1023, the third blocking wall 1033 and the fourth blocking wall 1034 are respectively located at two sides of the second through hole 1023, and meanwhile, a part of the area of the second subframe body 102 located at the edge of the second through hole 1023 is inserted between the third blocking wall 1033 and the fourth blocking wall 1034 to form a U-shaped opening, so that the second end of the supporting rod 103 and the second subframe body 102 form a stable connection relationship.
In one embodiment, the first connection surface 1011, the second connection surface 1012, the third connection surface 1021 and the fourth connection surface 1022 are all provided with a metal plating.
Specifically, the metal plating layer may be gold plating, silver plating, nickel plating, or the like, and the metal plating layer may enhance solderability of the first connection surface 1011, the second connection surface 1012, the third connection surface 1021, and the fourth connection surface 1022, and may prevent oxidation of the first connection surface 1011, the second connection surface 1012, the third connection surface 1021, and the fourth connection surface 1022. The present application is not particularly limited with respect to the specific manner of formation of the metal plating layer and the thickness of the metal plating layer.
In one embodiment, the areas other than the first connecting surface 1011, the second connecting surface 1012, the third connecting surface 1021 and the fourth connecting surface 1022 are provided with oxidation-resistant coatings.
In this specific example, the areas of the first sub-frame body 101 excluding the first connection surface 1011 and the second connection surface 1012 and the areas of the second sub-frame body 102 excluding the third connection surface 1021 and the fourth connection surface 1022 are subjected to surface oxidation prevention treatment by plating or the like, and an oxidation prevention coating is provided to prevent oxidation and prevent the solder paste on the soldering surface from diffusing to other areas.
Referring to fig. 7, in one embodiment, the PCB board 201 has a first surface 2011, and the bracket is connected to the first surface 2011; the first surface 2011 is provided with positioning posts 2012.
When welding second electronic component 203 to setting up on the support, in order to brush tin cream, need effectively fix a position the welding steel mesh, through set up reference column 2012 at PCB board 201's first surface 2011, the position of steel mesh can be fixed to reference column 2012, takes place to brush tin inhomogeneous, off normal scheduling problem when avoiding brushing tin cream. Optionally, the positioning columns 2012 are three and three positioning columns 2012 are arranged in a triangle, which is the most stable arrangement. Alternatively, the positioning posts 2012 can be fixedly connected to the first surface 2011 of the PCB board 201; the positioning column 2012 can be detachably connected with the first surface 2011 of the PCB 201, and the positioning column 2012 can be recycled by the detachable connection mode, so that raw materials are saved. The height of the locating posts 2012 is determined by the height of the rack, which is understood to be the dimension of the rack in the second direction.
An embodiment of the present application further provides an electronic device, including the package structure described above.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A package structure, comprising: the PCB comprises a PCB board (201), a bracket, a first electronic element (202) and a second electronic element (203);
the bracket is fixedly arranged on the PCB (201), the bracket and the PCB (201) form an accommodating space, and the first electronic element (202) is arranged in the accommodating space and is electrically connected with the PCB (201);
the second electronic component (203) is arranged on the bracket, and the second electronic component (203) is electrically connected with the PCB (201).
2. The package structure of claim 1, wherein the support comprises a first subframe body (101) and a second subframe body (102), and the first subframe body (101) and the second subframe body (102) are arranged oppositely along a first direction.
3. The package structure according to claim 2, wherein the first subframe (101) has a first connection surface (1011) and a second connection surface (1012) which are arranged opposite to each other along a second direction; the second subframe body (102) is provided with a third connecting surface (1021) and a fourth connecting surface (1022) which are arranged along a second direction in an opposite manner; the first connection surface (1011) and the third connection surface (1021) are both connected with the PCB (201), and the second connection surface (1012) and the fourth connection surface (1022) are both connected with the second electronic component (203).
4. The package structure of claim 2, wherein the bracket further comprises a support rod (103), and the support rod (103) has a first end and a second end along the first direction, the first end is connected to the first subframe body (101), and the second end is connected to the second subframe body (102).
5. The package structure of claim 2, wherein the first subframe body (101) and the second subframe body (102) are Z-shaped.
6. The packaging structure of claim 4, wherein the first sub-frame body (101) defines a first through hole (1013), the first end of the supporting rod (103) is provided with a first U-shaped fork, the first U-shaped fork has a first blocking wall (1031) and a second blocking wall (1032) which are oppositely disposed, the first U-shaped fork is inserted into the first through hole (1013), the first blocking wall (1031) is connected to one side of the first through hole (1013) along the first direction, and the second blocking wall (1032) is connected to the other side of the first through hole (1013) along the first direction.
7. The package structure of claim 4, wherein the second sub-frame (102) defines a second through hole (1023), the second end of the supporting rod (103) is provided with a second U-shaped fork, the second U-shaped fork has a third blocking wall (1033) and a fourth blocking wall (1034) which are oppositely disposed, the second U-shaped fork is inserted into the second through hole (1023), the third blocking wall (1033) is connected to one side of the second through hole (1023) along the first direction, and the fourth blocking wall (1034) is connected to the other side of the second through hole (1023) along the first direction.
8. The package structure according to claim 3, wherein the first connection surface (1011), the second connection surface (1012), the third connection surface (1021) and the fourth connection surface (1022) are provided with a metal plating.
9. The package structure according to claim 1, wherein the PCB board (201) has a first surface (2011), and the bracket is connected to the first surface (2011); the first surface (2011) is provided with a positioning column (2012).
10. An electronic device, characterized in that it comprises a package structure according to any one of claims 1 to 9.
CN202011190963.4A 2020-10-30 2020-10-30 Packaging structure and electronic equipment Active CN112312658B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011190963.4A CN112312658B (en) 2020-10-30 2020-10-30 Packaging structure and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011190963.4A CN112312658B (en) 2020-10-30 2020-10-30 Packaging structure and electronic equipment

Publications (2)

Publication Number Publication Date
CN112312658A true CN112312658A (en) 2021-02-02
CN112312658B CN112312658B (en) 2022-02-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050056923A1 (en) * 2001-05-25 2005-03-17 Simpletech, Inc. Apparatus and method for stacking integrated circuits
CN103199078A (en) * 2012-07-23 2013-07-10 珠海越亚封装基板技术股份有限公司 Multilayer electronic support structure with integrated structure constituent
CN203327459U (en) * 2013-05-23 2013-12-04 青岛海信移动通信技术股份有限公司 Portable mobile terminal
US20150022937A1 (en) * 2013-07-18 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Composite electronic component and board having the same
CN209710612U (en) * 2019-02-01 2019-11-29 维沃移动通信有限公司 A kind of Multi-layer circuit board structure and terminal device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050056923A1 (en) * 2001-05-25 2005-03-17 Simpletech, Inc. Apparatus and method for stacking integrated circuits
CN103199078A (en) * 2012-07-23 2013-07-10 珠海越亚封装基板技术股份有限公司 Multilayer electronic support structure with integrated structure constituent
CN203327459U (en) * 2013-05-23 2013-12-04 青岛海信移动通信技术股份有限公司 Portable mobile terminal
US20150022937A1 (en) * 2013-07-18 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Composite electronic component and board having the same
CN209710612U (en) * 2019-02-01 2019-11-29 维沃移动通信有限公司 A kind of Multi-layer circuit board structure and terminal device

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