CN112305866A - Gas bath device and lithographic apparatus - Google Patents
Gas bath device and lithographic apparatus Download PDFInfo
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- CN112305866A CN112305866A CN201910702136.XA CN201910702136A CN112305866A CN 112305866 A CN112305866 A CN 112305866A CN 201910702136 A CN201910702136 A CN 201910702136A CN 112305866 A CN112305866 A CN 112305866A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Abstract
The invention provides a gas bath device and a photoetching device, wherein the gas bath device is arranged in the photoetching device, the photoetching equipment comprises a workpiece bearing module for bearing a workpiece, the gas bath device comprises a gas supply module and a first gas bath module communicated with the gas supply module, the gas supply module is used for providing gas with a set temperature range, because the first air bath module is arranged on the workpiece bearing module and can move along with the workpiece bearing module, since a stable gas layer is formed on the upper surface of the workpiece support module by blowing gas toward the upper surface of the workpiece support module, the full-stroke gas bath coverage of the workpiece bearing module is realized, the influence of the motion of the workpiece bearing module is avoided, the environment stability of the upper surface of the workpiece bearing module is realized, and the exposure precision and/or the measurement precision of the photoetching equipment can be improved.
Description
Technical Field
The invention relates to the technical field of photoetching, in particular to a gas bath device and photoetching equipment.
Background
The photoetching equipment is a key equipment in the semiconductor industry, the precision requirement of the photoetching equipment is extremely high, the structure is very complex, and the product precision reaches the nanometer level. In order to realize the normal operation of high-precision equipment, a stable working environment needs to be established inside the whole photoetching equipment to control the temperature, pressure and pollutants inside the whole equipment.
The control of the temperature, the pressure and the pollutants in the whole photoetching equipment is realized by forming a certain positive pressure environment in each area of the whole photoetching equipment, so that the temperature and the pressure of the gas in each area of the whole equipment can be ensured to be constant, and the external pollutants can not enter each area of the whole equipment. Such an environment with positive pressure is generally achieved by continuously blowing a cleaning gas into the lithographic apparatus through a gas bath device. However, different areas in the whole photoetching equipment have different requirements on temperature and pressure, and especially, the workpiece bearing module area has higher requirements on temperature and pressure. In the workpiece bearing module area, because the workpiece bearing module has very high speed and acceleration during working, the workpiece bearing module is a moving heat source and has influence on the surrounding environment, and in order to ensure that the precise motion of the workpiece bearing module is stable and reliable, the environment of the workpiece bearing module area needs to be stable, however, the motion track of the workpiece bearing module is large, and the gas bath device needs to cover the motion area of the whole workpiece bearing module, so that a large space needs to be occupied.
Disclosure of Invention
The invention aims to provide a gas bath device and a photoetching device, which can ensure that a workpiece bearing module is always covered by a gas bath no matter what state the workpiece bearing module is at any position, and realize the environmental stability of the upper surface of the workpiece bearing module.
In order to achieve the above object, the present invention provides a gas bath apparatus for performing gas bath coverage of a lithographic apparatus including an inner workpiece support module for supporting a workpiece, comprising:
the gas supply module is used for providing gas in a set temperature range;
the first air bath module is arranged on the workpiece bearing module and communicated with the air supply module, and a stable air layer is formed on the upper surface of the workpiece bearing module by blowing air to the upper surface of the workpiece bearing module.
Optionally, the workpiece bearing module includes a moving stage and a workpiece bearing stage, the workpiece bearing stage is disposed on the moving stage and moves along with the moving stage, and the first air bath module is located on at least one side of the workpiece bearing stage.
Optionally, the first air bath module is disposed in the workpiece carrying table, and a set angle is formed between a direction of an air flow blown out from the air outlet by the first air bath module and the upper surface of the workpiece carrying table.
Optionally, the first air bath module is disposed around the workpiece carrying table, an air outlet of the first air bath module is not higher than an upper surface of the workpiece carrying table, and a set angle is formed between a direction of an air flow blown out by the first air bath module through the air outlet and the upper surface of the workpiece carrying table.
Optionally, the first air bath module is disposed around the workpiece carrying table, an air outlet of the first air bath module is higher than the upper surface of the workpiece carrying table, and a direction of an air flow blown out by the first air bath module through the air outlet is parallel to the upper surface of the workpiece carrying table.
Optionally, the set angle is between 0 ° and 45 °.
Optionally, the set angle is formed between the air outlet of the first air bath module and the upper surface of the workpiece carrying table, so that the set angle is formed between the direction of the air flow blown out by the first air bath module through the air outlet and the upper surface of the workpiece carrying table.
Optionally, a diversion inclined plane is arranged at a position where the workpiece bearing table is in contact with an air outlet of the first air bath module, the diversion inclined plane forms the set angle with the upper surface of the workpiece bearing table, and the first air bath module blows out air flow through the air outlet and forms the set angle with the upper surface of the workpiece bearing table after being guided by the diversion inclined plane.
Optionally, the air outlet of the first air bath module comprises a plurality of equidistant slits.
Optionally, a mesh air plate is arranged in the air outlet of the first air bath module, and the mesh air plate is provided with a plurality of uniformly distributed through holes.
Optionally, the width of each through hole is between 0.02mm and 0.05mm, and the distance between every two adjacent through holes is between 0.02mm and 0.05 mm.
Optionally, the flow velocity of the air flow blown by the first air bath module to the upper surface of the workpiece bearing module is between 0.5m/s and 5 m/s.
Optionally, the lithographic apparatus further includes a main substrate and a plane grating disposed at a bottom of the main substrate, and the gas bath device further includes:
and the second gas bath module is positioned at the bottom of the main substrate and arranged around the plane grating, is communicated with the gas supply module, and continuously blows gas into the photoetching equipment to keep the temperature and the pressure inside the photoetching equipment constant.
Optionally, the second gas bath module includes a first gas bath cavity, a second gas bath cavity and a third gas bath cavity that are communicated with each other, the second gas bath cavity is located between the first gas bath cavity and the third gas bath cavity, the first gas bath cavity is closer to the center of the lithographic apparatus than the third gas bath cavity, and the gas flows blown out from the second gas bath cavity and the third gas bath cavity are perpendicular to the plane where the main substrate is located, and an acute angle is formed between the direction of the gas flow blown out from the first gas bath cavity and the plane where the main substrate is located.
Optionally, a piezoresistive adjusting plate is disposed between the first gas bath cavity and the second gas bath cavity, so that the flow rate of the gas flow blown out from the first gas bath cavity is greater than the flow rates of the gas flows blown out from the second gas bath cavity and the third gas bath cavity.
Optionally, the lithographic apparatus further comprises a plurality of grating read heads located on the motion stage, and the gas bath device further comprises:
and the third gas bath module surrounds the grating reading head, is communicated with the gas supply module and forms a stable gas layer on the upper surface of the grating reading head by blowing gas to the upper surface of the grating reading head.
Optionally, the gas supply module includes first gas supply unit and second gas supply unit, first gas supply unit does first gas bath module provides the gas of setting for the temperature range, second gas supply unit does second gas bath module reaches third gas bath module provides the gas of setting for the temperature range, just the humidity of the gas that second gas supply unit provided is greater than the humidity of the gas that first gas supply unit provided.
Optionally, the gas bath apparatus further comprises:
and the pumping module comprises an air outlet and a pumping unit communicated with the air outlet, and the pumping unit is used for exhausting gas in the photoetching equipment through the air outlet.
The invention also provides a lithographic apparatus comprising the gas bath device.
The gas bath device provided by the invention is arranged in a photoetching device, the photoetching device comprises a workpiece bearing module for bearing a workpiece, the gas bath device comprises a gas supply module and a first gas bath module communicated with the gas supply module, the gas supply module is used for providing gas in a set temperature range, the first gas bath module is arranged on the workpiece bearing module and can move along with the workpiece bearing module, and a stable gas layer is formed on the upper surface of the workpiece bearing module by blowing gas to the upper surface of the workpiece bearing module so as to realize the full-stroke gas bath coverage of the workpiece bearing module, so that the environment stability of the upper surface of the workpiece bearing module is realized without being influenced by the movement of the workpiece bearing module, and the exposure precision and/or the measurement precision of the photoetching device can be improved.
Drawings
FIG. 1 is a schematic cross-sectional view of an internal environment of a lithographic apparatus along a horizontal direction according to an embodiment of the invention;
FIG. 2 is a schematic top view of an internal environment of a lithographic apparatus according to an embodiment of the invention;
FIG. 3 is a schematic structural view of a workpiece support module having four first air bath modules disposed thereon according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a workpiece support module having three first air bath modules;
FIG. 5 is a schematic diagram of an arrangement of two first air bath modules on a workpiece support module according to an embodiment of the present invention;
FIG. 6 is a schematic structural view of another arrangement of two first air bath modules on a workpiece support module according to an embodiment of the present invention;
FIG. 7 is a schematic view of a first air bath module disposed on a workpiece support module according to an embodiment of the present invention;
fig. 8a is a schematic structural view illustrating that the first air bath module is disposed inside the workpiece carrier and a set angle is formed between the air outlet of the first air bath module and the upper surface of the workpiece carrier according to the embodiment of the present invention;
FIG. 8b is a top view of the workpiece support table of FIG. 8a in accordance with an embodiment of the present invention;
fig. 9a is a schematic structural view illustrating that the first air bath module is disposed inside the workpiece carrier and a flow guiding slope is disposed inside the workpiece carrier according to an embodiment of the present invention;
FIG. 9b is a top view of the workpiece support table of FIG. 9a according to one embodiment of the present invention;
fig. 10a is a schematic structural view illustrating that the first air bath module is disposed outside the workpiece carrier and a set angle is formed between the air outlet of the first air bath module and the upper surface of the workpiece carrier according to the embodiment of the present invention;
fig. 10b is a schematic structural view of the first air bath module disposed outside the workpiece carrier and a flow guiding bevel disposed inside the workpiece carrier according to an embodiment of the present invention;
FIG. 10c is a top view of the workpiece holder of FIG. 10a or FIG. 10b according to an embodiment of the present invention;
fig. 11 is a schematic structural view illustrating the first air bath module provided in the embodiment of the present invention disposed outside the workpiece support platform and having an air outlet higher than the workpiece support platform;
fig. 12 is a schematic structural view of a short slit at an outlet of a first air bath module according to an embodiment of the present invention;
FIG. 13 is a schematic structural view of three gas bath cavities of a second gas bath module according to an embodiment of the present invention;
FIG. 14 is a schematic structural view of a third gas bath module provided in accordance with an embodiment of the present invention;
wherein the reference numerals are:
111-a wet gas generator; 112-wet gas temperature controller; 113-regulating valve; 121-dry gas generator; 122-dry gas filter; 123-temperature controller; 124-heat preservation air duct; 20-a workpiece carrier module; 21-a workpiece carrier; 211-a flow guiding bevel; 22-a motion stage; 23-a sensor; 31-a first air bath module; 311-an air outlet of the first air bath module; 32-a second gas bath module; 321-a first air bath cavity; 322-a second gas bath cavity; 323-a third gas bath chamber; 324-an air intake interface; 325-piezoresistive adjusting plate; 326-super filter; 33-a third gas bath module; 41-plane grating; 42-a grating read head; 50-a main substrate; 61-air outlet; 62-air extraction unit.
Detailed Description
The measurement system inside the lithography apparatus generally includes an interferometer measurement module and/or a grating ruler measurement module, but no matter the lithography apparatus has the interferometer measurement module or the grating ruler measurement module, the environment of the measurement module region needs to be stable. For lithographic apparatus comprising an interferometer measurement module, the gas bath device needs to cover the entire interferometer light path to stabilize the temperature on the light path, with small pressure fluctuations, to avoid the interferometer light path being affected by the surrounding environment. Because the tail end of the interferometer light path is close to the objective lens, the whole process of the whole interferometer light path cannot be provided with the gas bath module, therefore, the existing method is adopted to enable the gas bath device close to the tail end of the interferometer light path to have the function of oblique blowing, and the gas blown out by the gas bath device can cover the tail end of the interferometer light path. This function of diagonal blowing is usually achieved by changing the wind direction of the gas blown out from the gas bath device by means of grid guide plates, which are however fixedly arranged on the frame of the lithographic apparatus, the degree of change of the wind direction of the blown out gas is limited and there is a limitation on the temperature control effect of the workpiece carrier module.
For a lithography machine that includes a grating scale measurement module, the flat grating is typically mounted on the lower surface of the main substrate, while the grating read head is mounted on and moves with the workpiece carrier module. When the workpiece bearing module is in exposure work, the workpiece bearing module moves in a scanning mode according to a preset track, the position of the grating reading head is continuously changed due to the fact that the position of the workpiece bearing module is continuously changed, and the grating reading head can be always covered by the gas bath only when gas is required to be continuously blown and showered nearby the grating reading head of the workpiece bearing module, so that the temperature environment of the measuring module is stable. Meanwhile, the heat emitted by the workpiece bearing module can be taken away by continuously blowing and spraying the gas, so that the temperature of the workpiece bearing module is stable, the influence of the thermal deformation of the workpiece bearing module on the precision is reduced, and the improvement on the precision of the workpiece bearing module and the precision of the measuring module is facilitated. According to the movement track of the workpiece bearing module, the gas bath device needs to cover the whole workpiece bearing module area, so that the area of the gas bath device is large, and a large space needs to be occupied. However, a large part of the entire workpiece support module area is the area where the plane grating is located, and the gas bath device cannot be arranged.
Therefore, whether the photoetching equipment comprises a grating ruler measurement module or the photoetching equipment comprises an interferometer measurement module, the gas bath device inside the photoetching equipment is fixedly arranged relative to the frame of the photoetching equipment. In practical engineering applications, if the air flow blown out by the air bath device is to cover the workpiece, the grating reading head and the interferometer light path in the region where the workpiece bearing module is located all the time, a large-area air bath device is needed, and the space for arranging the air bath device in the lithography equipment is limited, the air bath device cannot be reasonably arranged at all, so that the workpiece bearing module cannot be covered by the air bath device fixedly arranged relative to the frame of the lithography equipment in the limited space all the time.
In this regard, the present invention provides a gas bath apparatus arranged in a lithographic apparatus comprising a workpiece carrier module for carrying a workpiece, the gas bath device comprises a gas supply module and a first gas bath module communicated with the gas supply module, the gas supply module is used for providing gas with a set temperature range, because the first air bath module is arranged on the workpiece bearing module and can move along with the workpiece bearing module, since a stable gas layer is formed on the upper surface of the workpiece support module by blowing gas toward the upper surface of the workpiece support module, the full-stroke gas bath coverage of the workpiece bearing module is realized, the influence of the motion of the workpiece bearing module is avoided, the environment stability of the upper surface of the workpiece bearing module is realized, and the exposure precision and/or the measurement precision of the photoetching equipment can be improved.
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The present embodiment provides a gas bath device disposed in a lithography apparatus, in the embodiment, the lithography apparatus is a 28nm immersion lithography machine, as shown in fig. 1-3, the lithography apparatus includes a main substrate 50 and a workpiece carrying module 20, the main substrate 50 is used for fixing an objective lens and a grating measuring module, wherein a plane grating 41 of the grating measuring module is mounted on a lower surface of the main substrate 50, a grating reading head 42 of the grating measuring module is mounted on the workpiece carrying module 20 and moves along with the workpiece carrying module 20, the workpiece carrying module 20 is located below the main substrate 50 and is used for carrying and moving a workpiece, and the gas bath device includes:
the gas supply module is used for providing clean gas in a set temperature range so as to enable the environment in the photoetching equipment to be always kept at positive pressure and enable the internal environment of the whole machine to be constant in temperature, and the set temperature range is usually 22 +/-0.1 ℃;
the first air bath module 31 is arranged on the workpiece bearing module 20, is communicated with the air supply module and forms a stable air layer on the upper surface of the workpiece bearing module by blowing air to the upper surface of the workpiece bearing module 20;
a second gas bath module 32, located on the lower surface of the main substrate 50 and surrounding the plane grating 41, the second gas bath module 32 being in communication with the gas supply module to keep the temperature and pressure inside the lithographic apparatus constant by continuously blowing gas into the lithographic apparatus;
and a third gas bath module 33, wherein the third gas bath module 33 is disposed around the grating read head 42 and is communicated with the gas supply module, and a stable gas layer is formed on the upper surface of the grating read head 42 by blowing gas onto the upper surface of the grating read head 42.
Because the first air bath module 31 and the third air bath module 33 are disposed on the workpiece support module 20 and can move together with the workpiece support module 20, the first air bath module 31 blows air to the upper surface of the workpiece support module 20 to form a stable air layer on the upper surface of the workpiece support module 20, so as to realize full-stroke air bath coverage of the workpiece support module 20, and is not affected by the movement of the workpiece support module 20, thereby realizing environmental stability of the upper surface of the workpiece support module 20 and preventing the workpiece support module 20 from generating thermal deformation; the third gas bath module 33 is arranged around the grating read head 42, and can continuously blow away heat emitted by the grating read head 42, so as to realize temperature control at the position of the grating read head 42 and ensure the measurement accuracy of the grating measurement module, and the second gas bath module 32 is responsible for controlling the temperature and pollutants of the large environment inside the whole lithography equipment and ensuring the stability of the internal environment of the lithography equipment, so that the exposure accuracy and/or the measurement accuracy of the lithography equipment can be improved. Also, the cooperation through the three gas bath modules does not require much area on the bottom of the main substrate 50.
Specifically, as shown in fig. 1 to 3, in this embodiment, the gas supply module includes a first gas supply unit and a second gas supply unit, the first gas supply unit includes a wet gas generator 111, a wet gas temperature controller 112 and a plurality of adjusting valves 113 that are sequentially connected, the wet gas generator 111 is configured to generate wet gas with a certain humidity (the humidity is usually between 30% and 55%) (in an immersion lithography apparatus, since an immersion liquid is contained in an immersion head, evaporation of the immersion liquid may cause ambient temperature change, so that an evaporation rate of a wet gas used for a gas bath near a liquid field may be reduced, thereby reducing influence of temperature change), the wet gas temperature controller 112 is configured to control the temperature of the wet gas generated by the wet gas generator 111 in the set temperature range and then input the wet gas into the first gas bath module 31, and the adjusting valves 113 are located in the wet gas temperature controller 112, the first gas bath module 31 and the pipes of the third gas bath module 33 In the way, the device is used for controlling the on-off of the gas or regulating the flow rate of the gas.
The second gas supply unit comprises a dry gas generator 121, a dry gas filter 122, a temperature controller 123 and a heat preservation air channel 124 which are sequentially communicated, the dry gas generator 121 is used for generating clean dry gas (the humidity is usually less than 30%), the dry gas filter 122 is used for filtering chemical composition particles in the dry gas, the temperature controller 123 controls the temperature of the dry gas, the temperature of the dry gas is stabilized within the set temperature range, the dry gas is conveyed into the second gas bath module 32 through the heat preservation air channel 124, and the heat preservation air channel 124 can reduce the temperature loss of the gas in the conveying process.
It will be appreciated that when the lithographic apparatus is not an immersion lithographic apparatus, for example a conventional projection lithographic apparatus, the gas supply module may comprise only the second gas supply unit, the first gas bath module 31, the second gas bath module 32 and the third gas bath module 33 being supplied by the second gas supply unit.
As shown in fig. 2, the gas bath apparatus further includes a pumping module, the pumping module includes an air outlet 61 and an air pumping unit 62 communicated with the air outlet 61, the air pumping unit 62 is configured to exhaust air in the lithographic apparatus through the air outlet 61, so as to ensure that the flow field in the lithographic apparatus is stable and takes away contamination such as particles or heat generated during the operation of the apparatus, the number of the air outlets 61 may be multiple, and the air outlets 61 may be located at different positions in the lithographic apparatus.
Referring to fig. 3 to 7, in the present embodiment, the workpiece carrying module 20 includes a moving stage 22 and a workpiece carrying stage 21, the workpiece carrying stage 21 is used for carrying a workpiece, and the workpiece carrying stage 21 is further provided with a plurality of sensors 23. Further, the workpiece support 21 is disposed on the moving stage 22 and moves with the moving stage 22, the workpiece support 21 is a generally square support, and the first air bath module 31 is disposed along the periphery of the workpiece support 21. Alternatively, the first gas bath module 31 may be located on four side walls of the workpiece carrier table 21, as shown in fig. 3 in particular; alternatively, the first gas bath module 31 may be located on any three sidewalls of the workpiece carrier 21, as shown in particular in fig. 4; alternatively, the first gas bath module 31 may be located on any two sidewalls of the workpiece carrier 21, as shown in fig. 5 in particular; alternatively, the first gas bath module 31 may be located on any one of the sidewalls of the workpiece carrier 21, as shown in fig. 6 and 7; under the condition that the positions and the number of the first air bath modules 31 are different, different air outlets and air outlets 61 can be correspondingly arranged, so that the stability of the flow field on the upper surface of the workpiece bearing table 21 is ensured. It is understood that the workpiece carrier 21 may have other shapes, and the first gas bath module 31 may have other arrangements (around the workpiece carrier 21), which are not illustrated herein.
Further, as shown in fig. 8a to 9b, the first air bath module 31 may be disposed inside the workpiece carrier 21, and the air bath function may be added while maintaining the outer dimensions of the existing workpiece carrier, and a set angle θ is formed between the direction of the air flow blown out from the air outlet 311 by the first air bath module 31 and the upper surface of the workpiece carrier 21, so as to prevent the air flow blown out from the first air bath module 31 from impacting the plane grating 41 or the objective lens fixed on the main substrate 50.
Specifically, as shown in fig. 8a and 8b, the first air bath module 31 is disposed inside the workpiece holder 21, and the set angle θ is formed between the air outlet 311 of the first air bath module 31 and the upper surface of the workpiece holder 21, so that the set angle θ is formed between the direction of the air flow blown out by the first air bath module 31 through the air outlet 311 and the upper surface of the workpiece holder 21. Further, as shown in fig. 9a and 9b, the air outlet 311 of the first air bath module 31 may be parallel to the upper surface of the workpiece carrier 21, but a flow guiding inclined plane 211 is disposed on a side of the workpiece carrier 21 close to the air outlet 311, the set angle θ is formed between the flow guiding inclined plane 211 and the upper surface of the workpiece carrier 21, and the set angle θ is formed between the air flow blown out by the first air bath module 31 through the air outlet 311 and the upper surface of the workpiece carrier 21 after being guided by the flow guiding inclined plane 211. In this way, the gas flow from the first gas bath module 31 can form a stable gas layer on the upper surface of the workpiece stage 21 without disturbing the plane grating 41 or the objective lens fixed to the main substrate 50.
Alternatively, as shown in fig. 10a to 10c, the first gas bath module 31 may also be disposed around the workpiece carrier 21 as a separate component to facilitate modular integration of the apparatus, in case of insufficient internal space of the lithographic apparatus, the air outlet 311 of the first gas bath module 31 may be no higher than the upper surface of the workpiece carrier 21 (lower than the upper surface of the workpiece carrier 21 or flush with the upper surface of the workpiece carrier 21), and the direction of the air flow blown out by the first gas bath module 31 through the air outlet 311 forms the set angle θ with the upper surface of the workpiece carrier 21. It is understood that, in order to make the set angle θ between the direction of the airflow blown out by the first air bath module 31 through the air outlet 311 and the upper surface of the workpiece carrier 21, the air outlet 311 of the first air bath module 31 may make the set angle θ with the upper surface of the workpiece carrier 21, as shown in fig. 10 a; alternatively, the air outlet 311 of the first air bath module 31 is parallel to the upper surface of the workpiece holder 21, but the air guiding slope 211 is disposed on a side of the workpiece holder 21 close to the air outlet 311, as shown in fig. 10 b.
Further, as shown in fig. 11, in a case that the internal space of the lithographic apparatus is sufficient, the air outlet 311 of the first air bath module 31 may also be higher than the upper surface of the workpiece carrier 21, and the direction of the air flow blown out by the first air bath module 31 through the air outlet 311 is parallel to the upper surface of the workpiece carrier 21, so that the air direction is completely parallel to the upper surface of the workpiece carrier 21, which is beneficial to controlling the temperature of the workpiece carrier and reducing the impact influence of the air flow on the plane grating 41.
It is to be understood that, in order to minimize the impact of the air flow blown out from the first air bath module 31 on the plane grating 41, the angle of the air flow blown out by the first air bath module 31 (the set angle θ) and the blowing speed are both designed reasonably, and in this embodiment, the set angle theta is between 0 and 45 degrees, particularly preferably between 5 and 20 degrees, for example 10 °, 12 °, 15 ° or 18 °, etc., the flow rate of the gas stream blown out by the first gas bath module 31 is between 0.5m/s and 5m/s, preferably between 0.8m/s and 1.2m/s, for example, 0.9m/s, 1.0m/s, or 1.1m/s, at an angle that, in conjunction with the flow rate control of the first gas bath module 31, also facilitates gas flow proximate to the upper surface of the workpiece carrier 21.
As shown in fig. 8b and 9b, the air outlet 311 of the first air bath module 31 may be a long slit, which may extend from one end point of the workpiece support platform 21 to the other end point, so that the blown air flow may cover the whole workpiece support platform 21; alternatively, as shown in fig. 12, the outlet 311 of the first air bath module 31 may include at least two short slits, at least two of the short slits may be provided at equal intervals along the longitudinal direction, and the plurality of short slits may disperse the blown air flow to reduce the reaction force to the workpiece support table 21. Optionally, a mesh air plate (not shown) with a certain resistance may be further disposed in the air outlet 311, a plurality of through holes are uniformly distributed on the mesh air plate, the width of each through hole is between 0.02mm and 0.05mm, and the distance between two adjacent through holes is between 0.02mm and 0.05mm, so as to keep the airflow velocity at each point on the whole air outlet 311 uniform. Optionally, the mesh wind plate can be a standard metal mesh screen, the through holes on the standard metal mesh screen have 635 meshes, the width of each through hole is 0.02mm, and the distance between every two adjacent through holes is 0.04mm, so that the requirements are met, and the cost is saved.
Further, as shown in FIG. 2, the second gas bath module 32 is located on the lower surface of the main substrate 50 and is disposed around the plane grating 41 to ensure the stability of the internal environment of the lithographic apparatus. Alternatively, in the case where the space on the lower surface of the main substrate 50 is sufficient, the second gas bath module 32 may be disposed around the plane grating 41, and in the case where the space on the lower surface of the main substrate 50 is insufficient, the second gas bath module 32 may be disposed only on one side, two sides, or three sides of the plane grating 41. In this embodiment, as shown in fig. 2, a plurality of second gas bath modules 32 are disposed on two opposite sides of the planar grating 41 to ensure sufficient gas flow supply, and the number and the disposition positions of the second gas bath modules 32 may be set according to the lower surface space of the main substrate 50, the internal space of the lithographic apparatus, and the size of the second gas bath modules 32, which is not described herein again in detail.
As shown in fig. 2 and 13, the second gas bath module 32 includes a first gas bath cavity 321, a second gas bath cavity 322, and a third gas bath cavity 323 that are communicated with each other, the second gas bath cavity 322 is located between the first gas bath cavity 321 and the third gas bath cavity 323, and the first gas bath cavity 321 is closer to the center of the lithography apparatus than the third gas bath cavity 323. The second gas bath cavity 322 is provided with a gas inlet 324, the gas inlet 324 is communicated with the second gas supply unit to receive gas, and the gas flows into the first gas bath cavity 321 and the third gas bath cavity 323 from the second gas bath cavity 322. The end of the air inlet 324 is provided with an ultra-efficient filter 326 for re-filtering the air provided by the second air supply unit, and the filtering grade is between U16 and U17, so that the pollutants in the air can be further reduced. Further, since the second gas bath cavity 322 and the third gas bath cavity 323 are far away from the workpiece carrying module 20, the gas flows blown out from the second gas bath cavity 322 and the third gas bath cavity 323 can be perpendicular to the plane of the main substrate 50, and the first gas bath cavity 321 is located close to the workpiece carrying module 20, so that an acute angle is formed between the direction of the gas flow blown out from the first gas bath cavity 321 and the plane of the main substrate 50 to prevent the gas flow blown out from the first gas bath cavity 321 from impacting the workpiece carrying module 20.
Alternatively, the outlet of the first air bath cavity 321 may be provided with an inclined guiding hole, and the inclined guiding hole forms an acute angle (for example, 30 °) with the plane of the main substrate 50, so that the direction of the airflow blown out from the first air bath cavity 321 forms an acute angle with the plane of the main substrate 50. Of course, if the actual positions of the second gas bath cavity 322 and the third gas bath cavity 323 are also closer to the workpiece support module 20, the second gas bath cavity 322 and the third gas bath cavity 323 may also be provided with inclined guide holes, so that the directions of the air flows blown out from the second gas bath cavity 322 and the third gas bath cavity 323 also form an acute angle with the plane of the main substrate 50.
Further, a piezoresistive adjusting plate 325 is arranged between the first air bath cavity 321 and the second air bath cavity 322, so that the flow rate of the air flow blown out from the first air bath cavity 321 is greater than the flow rates of the air flows blown out from the second air bath cavity 322 and the third air bath cavity 323, and the air flow blown out from the first air bath cavity 321 can reach a farther position.
Referring to fig. 3, in the embodiment, the grating read heads 42 are disposed on the moving stage 22 and located at four corners of the workpiece carrier 21, and the third air bath modules 33 are also located around each grating read head 42, as shown in fig. 14, an air outlet of the third air bath module 33 may be a rectangular air outlet, the grating read head 42 is located in the rectangular air outlet of the third air bath module 33, and a direction of an air flow blown out by the third air bath module 33 may be parallel to a direction of an optical path emitted by the grating read head 42, so as to ensure that an environment of the optical path of the grating read head 42 in the third air bath module 33 is stable. And the third air bath module 33 is directly installed on the moving table 22, and can move along with the moving table 22, so that the full-stroke air flow coverage of the moving table 22 can be realized, and the influence of the movement of the moving table 22 is avoided.
The embodiment also provides a lithographic apparatus comprising the gas bath device.
In summary, the gas bath apparatus provided by the embodiments of the present invention is disposed in the lithographic apparatus, the lithographic apparatus includes a workpiece carrying module for carrying a workpiece, the gas bath device comprises a gas supply module and a first gas bath module communicated with the gas supply module, the gas supply module is used for providing gas with a set temperature range, because the first air bath module is arranged on the workpiece bearing module and can move along with the workpiece bearing module, since a stable gas layer is formed on the upper surface of the workpiece support module by blowing gas toward the upper surface of the workpiece support module, the full-stroke gas bath coverage of the workpiece bearing module is realized, the influence of the motion of the workpiece bearing module is avoided, the environment stability of the upper surface of the workpiece bearing module is realized, and the exposure precision and/or the measurement precision of the photoetching equipment can be improved.
Further, a second gas bath module is arranged on the lower surface of the main substrate and surrounds the plane grating, the second gas bath module is communicated with the gas supply module, and the interior of the photoetching equipment is kept constant in temperature and pressure by continuously blowing gas into the photoetching equipment; and arranging a third gas bath module surrounding the grating reading head on the grating reading head, wherein the third gas bath module is communicated with the gas supply module, and a stable gas layer is formed on the upper surface of the grating reading head by blowing gas to the upper surface of the grating reading head. The environmental stability of the upper surface of the workpiece support module can be realized through the cooperation of the three gas bath modules, and too much space in the photoetching equipment cannot be occupied.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (19)
1. A gas bath apparatus arranged in a lithographic apparatus for performing gas bath coverage of a workpiece-carrying module in the lithographic apparatus, comprising:
the gas supply module is used for providing gas in a set temperature range;
the first air bath module is arranged on the workpiece bearing module and communicated with the air supply module, and a stable air layer is formed on the upper surface of the workpiece bearing module by blowing air to the upper surface of the workpiece bearing module.
2. The gas bath apparatus according to claim 1, wherein the workpiece support module comprises a motion stage and a workpiece support stage disposed on and movable with the motion stage, the first gas bath module being located on at least one side of the workpiece support stage.
3. The gas bath apparatus according to claim 2, wherein the first gas bath module is disposed in the workpiece holder, and a direction of a gas flow blown out from the first gas bath module through the outlet port forms a predetermined angle with an upper surface of the workpiece holder.
4. The gas bath apparatus according to claim 2, wherein the first gas bath module is disposed around the workpiece holder, and the outlet of the first gas bath module is not higher than the upper surface of the workpiece holder, and a predetermined angle is formed between the direction of the gas flow blown out from the outlet of the first gas bath module and the upper surface of the workpiece holder.
5. The gas bath apparatus according to claim 2, wherein the first gas bath module is disposed around the workpiece holder, and the outlet of the first gas bath module is higher than the upper surface of the workpiece holder, and the direction of the gas flow blown out from the outlet of the first gas bath module is parallel to the upper surface of the workpiece holder.
6. The gas bath apparatus according to claim 3 or 4, wherein the set angle is between 0 ° and 45 °.
7. The gas bath apparatus according to claim 3 or 4, wherein the set angle is formed between the outlet of the first gas bath module and the upper surface of the workpiece carrier, such that the direction of the gas flow blown out by the first gas bath module through the outlet forms the set angle with the upper surface of the workpiece carrier.
8. The gas bath device according to claim 3 or 4, wherein a position of the workpiece holder contacting the air outlet of the first gas bath module has a diversion inclined plane, the diversion inclined plane forms the set angle with the upper surface of the workpiece holder, and the air flow blown out from the air outlet by the first gas bath module is guided by the diversion inclined plane and forms the set angle with the upper surface of the workpiece holder.
9. The gas bath apparatus according to any one of claims 3-5, wherein the outlet of the first gas bath module comprises a plurality of equally spaced slits.
10. The gas bath device according to claim 9, wherein a mesh air plate is provided in the outlet of the first gas bath module, and a plurality of uniformly distributed through holes are provided in the mesh air plate.
11. The gas bath device according to claim 10, wherein the width of said through holes is between 0.02mm and 0.05mm, and the distance between two adjacent through holes is between 0.02mm and 0.05 mm.
12. The gas bath apparatus according to any one of claims 3 to 5, wherein the flow rate of the gas stream blown by the first gas bath module toward the upper surface of the workpiece support module is between 0.5m/s and 5 m/s.
13. The gas bath apparatus of any of claims 2-5, wherein the lithographic apparatus further comprises a primary substrate and a planar grating disposed at a bottom of the primary substrate, the gas bath apparatus further comprising:
and the second gas bath module is positioned at the bottom of the main substrate and arranged around the plane grating, is communicated with the gas supply module, and continuously blows gas into the photoetching equipment to keep the temperature and the pressure inside the photoetching equipment constant.
14. The gas bath device according to claim 13, wherein the second gas bath module comprises a first gas bath cavity, a second gas bath cavity and a third gas bath cavity which are communicated with each other, the second gas bath cavity is located between the first gas bath cavity and the third gas bath cavity, the first gas bath cavity is closer to the center of the lithography apparatus than the third gas bath cavity, the second gas bath cavity and the third gas bath cavity blow out gas flows perpendicular to the plane of the main substrate, and the direction of the gas flow blown out from the first gas bath cavity forms an acute angle with the plane of the main substrate.
15. The gas bath apparatus according to claim 14, wherein a piezoresistive adjusting plate is provided between the first gas bath chamber and the second gas bath chamber to make the flow rate of the gas flow blown out from the first gas bath chamber greater than the flow rates of the gas flows blown out from the second gas bath chamber and the third gas bath chamber.
16. The gas bath apparatus as claimed in claim 13, wherein the lithographic apparatus further comprises a plurality of grating read heads positioned on the motion stage, and the gas bath apparatus further comprises:
and the third gas bath module surrounds the grating reading head, is communicated with the gas supply module and forms a stable gas layer on the upper surface of the grating reading head by blowing gas to the upper surface of the grating reading head.
17. The gas bath device according to claim 16, wherein the gas supply module comprises a first gas supply unit and a second gas supply unit, the first gas supply unit provides the first gas bath module with gas in a set temperature range, the second gas supply unit provides the second gas bath module and the third gas bath module with gas in a set temperature range, and the humidity of the gas provided by the second gas supply unit is greater than the humidity of the gas provided by the first gas supply unit.
18. The gas bath apparatus of claim 1, further comprising:
and the pumping module comprises an air outlet and a pumping unit communicated with the air outlet, and the pumping unit is used for exhausting gas in the photoetching equipment through the air outlet.
19. A lithographic apparatus comprising a gas bath device according to any one of claims 1 to 18.
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Cited By (1)
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| CN114460814A (en) * | 2022-01-20 | 2022-05-10 | 中国科学院微电子研究所 | Lithographic apparatus, gas bath device and gas bath generator therefor |
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