CN112300740A - Room-temperature-cured high-heat-resistance high-peel-strength bi-component epoxy adhesive - Google Patents
Room-temperature-cured high-heat-resistance high-peel-strength bi-component epoxy adhesive Download PDFInfo
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- CN112300740A CN112300740A CN202011281014.7A CN202011281014A CN112300740A CN 112300740 A CN112300740 A CN 112300740A CN 202011281014 A CN202011281014 A CN 202011281014A CN 112300740 A CN112300740 A CN 112300740A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Abstract
The invention discloses a room-temperature-cured high-heat-resistance high-peel-strength bi-component epoxy adhesive, which comprises a component A and a component B; the component A is bisphenol A type epoxy resin; self-made acrylic acid modified epoxy resin; core-shell toughening particles; a reactive diluent; a silane coupling agent; the component B consists of polyamide; an accelerator; and (4) filler composition. The room temperature curing high heat-resistant high-peel-strength bi-component epoxy adhesive has the advantages that the operation time is 40-50min at 25 ℃, the cured bi-component epoxy adhesive has better adhesive force on the surfaces of various metal base materials, the peel strength of a roller for various sandwich structure plates is higher than 60N.mm/mm in general, and the plane tensile strength is higher than 5 MPa. In addition, the epoxy adhesive has good heat resistance and aging resistance, still has good performance at the temperature of 80 ℃, and the strength attenuation is still in the required range after a specific aging test. Meanwhile, compared with similar products, the epoxy glue has relatively low overall cost, high cost performance and strong competitiveness in the market of sandwich structural plates.
Description
Technical Field
The invention relates to the field of room-temperature-cured high-strength structural adhesives, in particular to a room-temperature-cured high-heat-resistant high-roller-peeling-strength epoxy adhesive.
Background
In recent years, in the industries of transportation, construction, and the like, a concept of weight reduction has been proposed for better operation, and in addition to the requirement of lightweight and strong materials, new requirements for connection between materials have been made.
The sandwich structure is a composite-structured plate shell structure and comprises plates with thin two sides and a core material with a light middle part, different materials are combined together through the connection to obtain a material with light weight and extraordinary firmness, and an adhesive is needed to be used for realizing the material of the sandwich structure.
The epoxy resin adhesive is widely applied to various sandwich structure materials as an adhesive with excellent performance, so that the materials for obtaining the sandwich structure can meet most requirements. However, the epoxy adhesives on the market at present have some defects, some products with excellent performance after curing can achieve high strength only at a higher curing temperature, and curing conditions of some manufacturers are difficult to achieve the requirement of high-temperature curing; some products improve the peeling strength of glue by adding some toughening agents, but the aging resistance is seriously influenced, and the board with the sandwich structure has a serious strength attenuation phenomenon after a period of time; at present, due to the fact that requirements of people for environmental protection and health are higher and higher, requirements of industries such as vehicles and buildings for VOC of various materials are stricter and stricter, and many manufacturers need to remove VOC through high-temperature baking and other modes after a plate is formed, so that the adhesive is required to have certain high-temperature resistance and aging resistance.
The epoxy glue on the market at present is difficult to realize the aims of room temperature curing, high temperature resistance and aging resistance and higher peel strength at the same time, so that the toughness of the cured glue is improved by adding the self-prepared acrylic acid modified epoxy resin into the epoxy adhesive, the peel strength of a roller is improved, the heat resistance and aging resistance of the product cannot be obviously influenced, and the epoxy glue has a certain promotion effect on the curing of the epoxy resin at normal temperature.
Disclosure of Invention
In order to meet the requirements of room-temperature-curable, high-temperature-resistant and aging-resistant high-roller peel strength adhesives in the market, the invention provides a room-temperature-curable, high-temperature-resistant and aging-resistant high-roller peel strength adhesive which is used for meeting the requirements of room-temperature-curable, high-temperature-resistant and aging-resistant high-roller peel strength adhesives in specific application occasions.
In order to achieve the purpose, the invention provides the following technical scheme:
a room temperature curing high heat-resistant high peel strength bi-component epoxy adhesive comprises a component A and a component B, and is characterized in that the component A consists of bisphenol A type epoxy resin, self-made acrylic modified epoxy resin, core-shell toughening particles, an active diluent, a silane coupling agent, a wetting dispersant and a filler; the component B consists of polyamide, tertiary amine accelerator and filler.
In a preferred embodiment, the weight ratio of the component A to the component B is 2: 1.
In a preferred embodiment, the component A consists of 30-50wt% of bisphenol A type epoxy resin, 10-30wt% of self-made acrylic modified epoxy resin, 5-20wt% of core-shell toughening particles, 5-20wt% of reactive diluent, 1-5wt% of silane coupling agent, 0.1-0.5wt% of wetting dispersant and 15-25wt% of filler.
In a preferred embodiment, the B component consists of 65 to 85wt% of the modified fatty amine, 1 to 10wt% of the accelerator, and 10 to 30wt% of the filler, based on the total weight of the B component.
In a preferred embodiment, the homemade acrylic modified epoxy resin is synthesized by taking one or more of methyl methacrylate, styrene, N-butyl methacrylate and ethyl methacrylate as an acrylic monomer component, taking bisphenol A epoxy resin as an epoxy component, taking one or more of N, N-dimethylethanolamine, N-dimethylformamide and N, N-dimethylaniline as a catalyst, taking one or more of hydroquinone, p-hydroxyanisole and phenothiazine as a polymerization inhibitor and grafting an acrylic monomer onto the epoxy resin by a dropping method.
In a preferred embodiment, the core-shell toughening particles are one or more of the combination of kaneka MZ100, kaneka MZ200, kaneka B-564 and kaneka M-701.
In a preferred embodiment, the reactive diluent is at least one or more of 1.4-butanediol diglycidyl ether, 1.6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, cardanol glycidyl ether and pentaerythritol tetraglycidyl ether.
In a preferred embodiment, the silane coupling agent is gamma-epoxypropyletherpropyltriethoxysilane.
In a preferred embodiment, the polyamide is at least one or more of Ancamide2784, G-640, G-0930 and G-5022.
In a preferred embodiment, the wetting and dispersing agent is at least one or more of BYK-163, EFKA-4010, Silok 7631.
In a preferred embodiment, the filler is at least one or more of 800 mesh calcium carbonate, 1500 mesh talc, fumed silica, and kaolin.
In a preferred embodiment, the accelerator is at least one or a combination of 2, 4, 6-tris (dimethylaminomethyl) phenol, resorcinol, salicylic acid, triphenylphosphine, 1, 8-diazabicycloundec-7-ene.
Compared with the prior art, the invention has the following beneficial effects:
the room temperature cured high heat-resistant high peel strength bi-component epoxy adhesive has the advantages that the operation time is 40-50min at 25 ℃, the cured bi-component epoxy adhesive has better adhesive force on the surfaces of various metal base materials, the roller peel strength of various sandwich structure plates is higher than 70N.mm/mm in general, and the plane tensile strength is higher than 6 MPa. In addition, the epoxy adhesive has good heat resistance and aging resistance, still has good performance at 80 ℃, and the strength of the epoxy adhesive is improved after a specific aging test. Meanwhile, compared with similar products, the epoxy glue has relatively low overall cost and high cost performance.
Detailed Description
The technical solution of the present invention will be clearly and completely described by the following detailed description.
Example 1
(1) Preparing a component A:
adding 45 parts by weight of bisphenol A type epoxy resin, 13 parts by weight of self-made acrylic modified epoxy resin, 12 parts by weight of core-shell toughening particles, 10 parts by weight of active diluent, 2 parts by weight of silane coupling agent and 0.2 part by weight of wetting dispersant into a planetary stirring kettle in sequence, raising the temperature of the materials to 60 ℃, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800 plus 900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Secondly, adding 27.8 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping the planetary stirring and the high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component A.
(2) Preparing a component B:
adding 33 parts by weight of polyamide and 2 parts by weight of accelerator into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, defoaming in vacuum for 15-20min, and then stopping planetary stirring and high-speed dispersion.
Adding 15 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component B.
Example 2
(1) Preparing a component A:
adding 42 parts by weight of bisphenol A type epoxy resin, 16 parts by weight of self-made acrylic modified epoxy resin, 3 parts by weight of core-shell toughening particles, 9 parts by weight of active diluent, 2 parts by weight of silane coupling agent and 0.3 part by weight of wetting dispersant into a planetary stirring kettle in sequence, raising the temperature of the materials to 60 ℃, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800 plus 900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Secondly, adding 27.7 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping the planetary stirring and the high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component A.
(2) Preparing a component B:
adding 35 parts by weight of polyamide and 2 parts by weight of accelerator into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, defoaming in vacuum for 15-20min, and then stopping planetary stirring and high-speed dispersion.
Secondly, 13 parts by weight of filler is added into a planetary stirring kettle, the planetary stirring is slowly accelerated to 60-70rpm, the high-speed dispersion is slowly accelerated to 800-900rpm, the planetary stirring and the high-speed dispersion are stopped after vacuum defoaming is carried out for 45-50min, and the component B is obtained after discharging.
Example 3
(1) Preparing a component A:
adding 40 parts by weight of bisphenol A type epoxy resin, 16 parts by weight of self-made acrylic modified epoxy resin, 9 parts by weight of core-shell toughening particles, 10 parts by weight of active diluent, 2 parts by weight of silane coupling agent and 0.4 part by weight of wetting dispersant into a planetary stirring kettle in sequence, raising the temperature of the materials to 60 ℃, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800 plus 900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Secondly, adding 22.6 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component A.
(2) Preparing a component B:
adding 38 parts by weight of polyamide and 2 parts by weight of accelerator into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Secondly, adding 10 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component B.
Example 4
(1) Preparing a component A:
adding 42 parts by weight of bisphenol A type epoxy resin, 21 parts by weight of self-made acrylic modified epoxy resin, 4 parts by weight of core-shell toughening particles, 10 parts by weight of active diluent, 2 parts by weight of silane coupling agent and 0.4 part by weight of wetting dispersant into a planetary stirring kettle in sequence, raising the temperature of the materials to 60 ℃, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800 plus 900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Secondly, 20.6 parts by weight of filler is added into a planetary stirring kettle, the planetary stirring is slowly accelerated to 60-70rpm, the high-speed dispersion is slowly accelerated to 800-900rpm, the planetary stirring and the high-speed dispersion are stopped after vacuum defoaming is carried out for 45-50min, and the component A is obtained after discharging.
(2) Preparing a component B:
adding 40 parts by weight of polyamide and 1 part by weight of accelerator into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, defoaming in vacuum for 15-20min, and then stopping planetary stirring and high-speed dispersion.
Secondly, 9 parts by weight of filler is added into a planetary stirring kettle, the planetary stirring is slowly accelerated to 60-70rpm, the high-speed dispersion is slowly accelerated to 800-900rpm, the planetary stirring and the high-speed dispersion are stopped after vacuum defoaming is carried out for 45-50min, and the component B is obtained after discharging.
Example 5
(1) Preparing a component A:
adding 50 parts by weight of bisphenol A type epoxy resin, 10 parts by weight of self-made acrylic modified epoxy resin, 20 parts by weight of core-shell toughening particles, 20 parts by weight of active diluent, 1 part by weight of silane coupling agent and 0.5 part by weight of wetting dispersant into a planetary stirring kettle in sequence, raising the temperature of the materials to 60 ℃, simultaneously slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800 plus material of 900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Adding 15 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component A.
(2) Preparing a component B:
adding 65 parts by weight of polyamide and 2 parts by weight of accelerant into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, defoaming in vacuum for 15-20min, and then stopping planetary stirring and high-speed dispersion.
Secondly, adding 30 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component B.
Example 6
(1) Preparing a component A:
sequentially adding 30 parts by weight of bisphenol A type epoxy resin, 30 parts by weight of self-made acrylic modified epoxy resin, 5 parts by weight of core-shell toughening particles, 5 parts by weight of active diluent, 2 parts by weight of silane coupling agent and 0.3 part by weight of wetting dispersant into a planetary stirring kettle, raising the temperature of the materials to 60 ℃, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800 plus materials at 900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Adding 15 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component A.
(2) Preparing a component B:
adding 65 parts by weight of polyamide and 2 parts by weight of accelerant into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, defoaming in vacuum for 15-20min, and then stopping planetary stirring and high-speed dispersion.
Secondly, adding 10 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component B.
Comparative example
(1) Preparing a component A:
adding 50 parts by weight of bisphenol A type epoxy resin, 10 parts by weight of core-shell toughening particles, 9 parts by weight of reactive diluent, 2 parts by weight of silane coupling agent and 0.4 part by weight of wetting dispersant into a planetary stirring kettle in sequence, raising the temperature of the materials to 60 ℃, simultaneously slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the speed of high-speed dispersion to 800-900rpm, and shutting down the planetary stirring and high-speed dispersion after vacuum defoaming for 15-20 min.
Secondly, adding 22.6 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component A.
(2) Preparing a component B:
43 parts of polyamide and 1 part of accelerant by weight are added into a planetary stirring kettle, the planetary stirring is slowly accelerated to 60-70rpm, the high-speed dispersion is slowly accelerated to 800-900rpm, the planetary stirring and the high-speed dispersion are stopped after vacuum defoaming is carried out for 15-20 min.
Secondly, adding 6 parts by weight of filler into a planetary stirring kettle, slowly increasing the speed of planetary stirring to 60-70rpm, slowly increasing the high-speed dispersion to 800-900rpm, and stopping planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and discharging to obtain the component B.
The room temperature curing high heat resistance high peel strength two-component epoxy adhesives obtained in examples 1, 2, 3, 4 and comparative examples of the present application were tested as follows:
roller peel strength test method: GBT 1457-
Tensile shear strength test method: GB/T7124-
The plane tensile strength test method comprises the following steps: GB/T1452-
Aging test protocol: ISO9142, D3.
The test data are shown in the following table:
the above results show that the tensile shear strength of the epoxy adhesive plane and the roller peel strength are obviously improved after the self-made acrylic modified epoxy resin is added, and the heat resistance and aging resistance of the epoxy adhesive are improved to a certain extent under the condition that the self-made acrylic modified epoxy resin is added in a proper proportion.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention.
Claims (12)
1. A room temperature curing high heat-resistant high peel strength bi-component epoxy adhesive comprises a component A and a component B, and is characterized in that the component A consists of bisphenol A type epoxy resin, self-made acrylic modified epoxy resin, core-shell toughening particles, an active diluent, a silane coupling agent, a wetting dispersant and a filler; the component B consists of polyamide, tertiary amine accelerator and filler.
2. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the weight ratio of the component A to the component B is 2: 1.
3. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claims 1 and 2, which is characterized in that: based on the total weight of the component A, the component A consists of 30-50wt% of bisphenol A type epoxy resin, 10-30wt% of self-made acrylic modified epoxy resin, 5-20wt% of core-shell toughening particles, 5-20wt% of reactive diluent, 1-5wt% of silane coupling agent, 0.1-0.5wt% of wetting dispersant and 15-25wt% of filler.
4. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claims 1 and 2, which is characterized in that: the component B consists of 65-85wt% of modified fatty amine, 1-10wt% of accelerator and 10-30wt% of filler based on the total weight of the component B.
5. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the self-made acrylic modified epoxy resin is synthesized by taking one or more of methyl methacrylate, styrene, N-butyl methacrylate and ethyl methacrylate as an acrylic monomer component, bisphenol A epoxy resin as an epoxy component, one or more of N, N-dimethylethanolamine, N-dimethylformamide and N, N-dimethylaniline as a catalyst, one or more of hydroquinone, p-hydroxyanisole and phenothiazine as a polymerization inhibitor and grafting an acrylic monomer onto the epoxy resin through a dropping method.
6. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the core-shell toughening particles are one or a combination of more of kaneka MZ100, kaneka MZ200, kaneka B-564 and kaneka M-701.
7. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the reactive diluent is at least one or a combination of more of 1.4-butanediol diglycidyl ether, 1.6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, cardanol glycidyl ether and pentaerythritol tetraglycidyl ether.
8. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the silane coupling agent is gamma-epoxypropyl ether propyl triethoxysilane.
9. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the polyamide is at least one or the combination of more than one of Ancamide2784, G-640, G-0930 and G-5022.
10. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the wetting dispersant is at least one or a combination of more of BYK-163, EFKA-4010 and Silok 7631.
11. The room-temperature-curing high-heat-resistance high-peel-strength two-component epoxy adhesive as claimed in claim 1, is characterized in that: the filler is at least one or the combination of more of 800-mesh calcium carbonate, 1500-mesh talcum powder, fumed silica and kaolin.
12. The room temperature curing high heat resistance high peel strength two-part epoxy adhesive of claim 1, wherein the accelerator is at least one or more of 2, 4, 6-tris (dimethylaminomethyl) phenol, resorcinol, salicylic acid, triphenylphosphine, 1, 8-diazabicycloundecan-7-ene.
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| CN202011281014.7A CN112300740A (en) | 2020-11-16 | 2020-11-16 | Room-temperature-cured high-heat-resistance high-peel-strength bi-component epoxy adhesive |
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| CN202011281014.7A CN112300740A (en) | 2020-11-16 | 2020-11-16 | Room-temperature-cured high-heat-resistance high-peel-strength bi-component epoxy adhesive |
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| CN107987767A (en) * | 2016-10-26 | 2018-05-04 | 北京天山新材料技术有限公司 | A kind of epoxy resin adhesive and application |
| CN107286887A (en) * | 2017-07-28 | 2017-10-24 | 上海回天新材料有限公司 | A kind of epoxyn and preparation method thereof |
| CN111826111A (en) * | 2020-08-05 | 2020-10-27 | 上海韬宁阀门有限公司 | Epoxy potting repair adhesive capable of being rapidly cured at room temperature and preparation method thereof |
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