CN112300713A - Pure glue film suitable for flexible circuit board - Google Patents
Pure glue film suitable for flexible circuit board Download PDFInfo
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- CN112300713A CN112300713A CN202011155500.4A CN202011155500A CN112300713A CN 112300713 A CN112300713 A CN 112300713A CN 202011155500 A CN202011155500 A CN 202011155500A CN 112300713 A CN112300713 A CN 112300713A
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- circuit board
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- flexible circuit
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- 239000003292 glue Substances 0.000 title claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 claims abstract description 20
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 17
- 150000002148 esters Chemical class 0.000 claims abstract description 16
- 229920000570 polyether Polymers 0.000 claims abstract description 16
- 239000002313 adhesive film Substances 0.000 claims abstract description 12
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 11
- 239000011737 fluorine Substances 0.000 claims abstract description 11
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 10
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 11
- 239000010445 mica Substances 0.000 claims description 10
- 229910052618 mica group Inorganic materials 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 6
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 4
- TYCFGHUTYSLISP-UHFFFAOYSA-N 2-fluoroprop-2-enoic acid Chemical compound OC(=O)C(F)=C TYCFGHUTYSLISP-UHFFFAOYSA-N 0.000 claims description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 4
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000007810 chemical reaction solvent Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000000977 initiatory effect Effects 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 4
- 238000010992 reflux Methods 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
- -1 ethyl hydroxy Chemical group 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- JYLRDAXYHVFRPW-UHFFFAOYSA-N butane-1,1-diol;terephthalic acid Chemical compound CCCC(O)O.OC(=O)C1=CC=C(C(O)=O)C=C1 JYLRDAXYHVFRPW-UHFFFAOYSA-N 0.000 claims description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003472 neutralizing effect Effects 0.000 claims description 2
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 claims description 2
- 238000006068 polycondensation reaction Methods 0.000 claims description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 36
- 239000012790 adhesive layer Substances 0.000 abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011889 copper foil Substances 0.000 abstract description 8
- 229920001721 polyimide Polymers 0.000 abstract description 6
- 230000003712 anti-aging effect Effects 0.000 abstract description 2
- 238000010525 oxidative degradation reaction Methods 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 11
- 238000002156 mixing Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 4
- 238000007719 peel strength test Methods 0.000 description 3
- 238000013112 stability test Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- ZTHZCEHSJHFZBS-UHFFFAOYSA-N butane-1,1-diol;phthalic acid Chemical compound CCCC(O)O.OC(=O)C1=CC=CC=C1C(O)=O ZTHZCEHSJHFZBS-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09J127/18—Homopolymers or copolymers of tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
- C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2234—Oxides; Hydroxides of metals of lead
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a pure adhesive film suitable for a flexible circuit board, which comprises a pure adhesive film, wherein the pure adhesive film comprises a first release film layer, an adhesive layer and a second release film layer, and the adhesive layer comprises the following components in parts by weight: 8-15 parts of organic silicon modified epoxy resin, 20-40 parts of hydroxyl-terminated polybutadiene modified polyether ester, 75-85 parts of fluorine-containing acrylic resin, 3-7 parts of curing agent and 3-5 parts of filler. The pure glue film has the advantages of heat resistance temperature of over 280 ℃, strong adhesiveness with copper foil and polyimide film, good anti-aging property and capability of preventing the problem of thermo-oxidative degradation at high temperature.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a pure adhesive film suitable for a flexible circuit board.
Background
The flexible circuit board is a printed circuit board made of a flexible insulating base material. Flexible circuits provide excellent electrical performance, meet design requirements for smaller and higher density packaging, and also help reduce assembly processes and enhance reliability. The flexible circuit board is the only solution to meet the miniaturization and movement requirements of electronic products. The flexible printed circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized; the flexible circuit board can greatly reduce the volume and the weight of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability.
As shown in fig. 1, the flexible printed circuit board is formed by stacking a PI, an adhesive layer, a copper foil layer, an adhesive layer and a PI, and the PI and the copper foil layer are connected by the adhesive layer, wherein the adhesive layer is made of epoxy resin and polyphenylene oxide resin. However, the conventional adhesive layer generally has the defects of poor heat resistance stability, easy yellowing and aging, poor viscosity and the like.
Disclosure of Invention
Aiming at the problems, the invention provides the pure adhesive film suitable for the flexible circuit board, which has the advantages of heat resistance temperature of over 280 ℃, strong adhesion with copper foil and polyimide film, good anti-aging property and capability of preventing the problem of thermal-oxidative degradation at high temperature.
In order to achieve the purpose, the invention is solved by the following technical scheme:
the pure glue film suitable for the flexible circuit board comprises a pure glue film, wherein the pure glue film comprises a first release film layer, a glue layer and a second release film layer, and the glue layer comprises the following components in parts by weight: 8-15 parts of organic silicon modified epoxy resin, 20-40 parts of hydroxyl-terminated polybutadiene modified polyether ester, 75-85 parts of fluorine-containing acrylic resin, 3-7 parts of curing agent and 3-5 parts of filler.
Specifically, the preparation process of the organosilicon modified epoxy resin is as follows: adding epoxy resin, organic silicon oligomer and cyclohexanone into a reaction container, uniformly stirring, adding a catalyst of butyl titanate, stirring, heating to 150-160 ℃ for reflux reaction, removing ethanol generated by the reaction by an oil-water separator, reacting for 30-60 min, cooling, and filtering to obtain the organic silicon modified epoxy resin.
Specifically, the organic silicon oligomer is selected from one of dimethyl silicone oil, methyl phenyl silicone oil and ethyl hydroxyl silicone oil.
Specifically, the hydroxyl-terminated polybutadiene modified polyether ester is prepared by taking butanediol terephthalate as a hard segment and taking polytetrahydrofuran ether and hydroxyl-terminated polybutadiene as soft segments through polycondensation.
Specifically, the fluoroacrylic acid resin is prepared by taking ethylene glycol monoethyl ether as a reaction solvent, taking methacrylic acid, acrylamide, acrylonitrile and tetrafluoroethylene as reaction raw materials, carrying out polymerization reaction under the initiation of dibenzoyl peroxide, neutralizing by hydroquinone, adding water to precipitate a solid, filtering and drying the solid.
Specifically, the curing agent is selected from one of diethylenetriamine, triethylene tetramine, tetraethylene pentamine, dimethylamino propylamine, trimethyl hexamethylene diamine, diethylamine and diamino diphenyl sulfone.
Specifically, the filler is formed by mixing lead trioxide, nano calcium carbonate and mica powder.
Specifically, the first release film layer and the second release film layer are both PET films.
The invention has the beneficial effects that:
the pure glue film is suitable for a flexible circuit board of a high-frequency electronic circuit, has high heat-resistant temperature and strong adhesiveness with a copper foil and a polyimide film, improves the problem of color change and aging of the traditional epoxy resin due to thermal oxygen degradation caused by high temperature during processing by adding the epoxy resin modified by organic silicon oligomer, improves the performances of low temperature resistance, hydrolysis resistance, electric insulation and the like of an adhesive layer by adding polyether ester modified by hydroxyl-terminated polybutadiene, introduces fluorine ions with strong hydrophobicity and improves the waterproof and moistureproof performances of the adhesive layer by adding fluorine-containing acrylic resin;
and secondly, a filler formed by mixing lead trioxide, nano calcium carbonate and mica powder is added, the lead trioxide can improve the heat-resistant stability of the adhesive layer, the granularity of the nano calcium carbonate is small, the fluidity among resins can be improved, the nano calcium carbonate has toughening and reinforcing effects on the adhesive layer, the mica powder has excellent heat-resistant and insulating properties, the heat conductivity coefficient is large, and the heat dissipation effect of the adhesive layer can be improved.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board.
FIG. 2 is a schematic structural diagram of a pure glue film.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
Example 1
Referring to FIG. 2: the utility model provides a pure glued membrane suitable for flexible line way board, includes pure glued membrane, and pure glued membrane includes first departure shape membrane layer, adhesive layer, second departure shape membrane layer, and first departure shape membrane layer is the PET film with second departure shape membrane layer, and the adhesive layer includes that the component of following part by weight makes: 10 parts of organic silicon modified epoxy resin, 30 parts of hydroxyl-terminated polybutadiene modified polyether ester, 80 parts of fluorine-containing acrylic resin, 5 parts of diethylenetriamine and 5 parts of filler, wherein the filler is formed by mixing 3:1:10 parts of lead trioxide, nano calcium carbonate and mica powder according to the mass ratio.
The preparation process of the organic silicon modified epoxy resin comprises the following steps: adding epoxy resin, organic silicon oligomer and cyclohexanone into a reaction container, uniformly stirring, adding a catalyst of butyl titanate, stirring, heating to 150 ℃ for reflux reaction, removing ethanol generated by the reaction by an oil-water separator, reacting for 30-60 min, cooling, and filtering to obtain the organic silicon modified epoxy resin.
The preparation process of the hydroxyl-terminated polybutadiene modified polyether ester is as follows: adding butanediol phthalate, polytetrahydrofuran ether and hydroxyl-terminated polybutadiene into a reaction container, reacting for 3h at the pressure of 40Pa and the temperature of 250 ℃, and cooling to obtain white resin with grease gloss, namely the hydroxyl-terminated polybutadiene modified polyether ester.
The preparation process of the fluoroacrylic resin is as follows: ethylene glycol monoethyl ether is used as a reaction solvent, methacrylic acid, acrylamide, acrylonitrile and tetrafluoroethylene are used as reaction raw materials, polymerization reaction is carried out under the initiation of dibenzoyl peroxide, then hydroquinone is used for neutralization, finally water is added to separate out solid, and the solid is filtered and dried to obtain the fluoroacrylic acid resin.
The preparation process of the adhesive layer raw material is as follows: the adhesive layer is prepared by weighing the components according to the raw material proportion, namely, the organic silicon modified epoxy resin, the hydroxyl-terminated polybutadiene modified polyether ester, the fluorine-containing acrylic resin, diethylenetriamine, lead sesquioxide, nano calcium carbonate and mica powder for later use, adding the organic silicon modified epoxy resin, the hydroxyl-terminated polybutadiene modified polyether ester, the fluorine-containing acrylic resin, diethylenetriamine, lead sesquioxide, nano calcium carbonate and mica powder into a reaction kettle, and uniformly mixing at normal temperature.
The preparation process of the pure glue film is as follows: preparing a first release film layer and a second release film layer with the thickness of 0.5mm, uniformly coating a layer of adhesive layer raw material on the second release film layer, covering the second release film layer with the first release film layer, and laminating to obtain a pure adhesive film, wherein the thickness of the adhesive layer is 0.5-1 mm.
The application comprises the following steps: tearing the first release film layer and taking out, inverting the adhesive layer and attaching the lower end of the adhesive layer to the copper foil layer, tearing the second release film layer and taking out, attaching the polyimide film to the upper end of the adhesive layer, and subsequently manufacturing the flexible circuit board by using the conventional flexible circuit board laminating technology.
And (3) testing: the adhesive layer was subjected to a thermal stability test and a peel strength test, and the test results are reported in table 1 below.
Example 2
Referring to FIG. 2: the utility model provides a pure glued membrane suitable for flexible line way board, includes pure glued membrane, and pure glued membrane includes first departure shape membrane layer, adhesive layer, second departure shape membrane layer, and first departure shape membrane layer is the PET film with second departure shape membrane layer, and the adhesive layer includes that the component of following part by weight makes: 8 parts of organic silicon modified epoxy resin, 35 parts of hydroxyl-terminated polybutadiene modified polyether ester, 75 parts of fluorine-containing acrylic resin, 5 parts of diaminodiphenyl sulfone and 5 parts of filler, wherein the filler is formed by mixing lead trioxide, nano calcium carbonate and mica powder according to the mass ratio of 1:5: 5.
The preparation process of the organic silicon modified epoxy resin comprises the following steps: adding epoxy resin, organic silicon oligomer and cyclohexanone into a reaction container, uniformly stirring, adding a catalyst of butyl titanate, stirring, heating to 150 ℃ for reflux reaction, removing ethanol generated by the reaction by an oil-water separator, reacting for 30-60 min, cooling, and filtering to obtain the organic silicon modified epoxy resin.
The preparation process of the hydroxyl-terminated polybutadiene modified polyether ester is as follows: adding butanediol phthalate, polytetrahydrofuran ether and hydroxyl-terminated polybutadiene into a reaction container, reacting for 3h at the pressure of 40Pa and the temperature of 250 ℃, and cooling to obtain white resin with grease gloss, namely the hydroxyl-terminated polybutadiene modified polyether ester.
The preparation process of the fluoroacrylic resin is as follows: ethylene glycol monoethyl ether is used as a reaction solvent, methacrylic acid, acrylamide, acrylonitrile and tetrafluoroethylene are used as reaction raw materials, polymerization reaction is carried out under the initiation of dibenzoyl peroxide, then hydroquinone is used for neutralization, finally water is added to separate out solid, and the solid is filtered and dried to obtain the fluoroacrylic acid resin.
The preparation process of the adhesive layer raw material is as follows: the adhesive layer is prepared by weighing the components according to the raw material ratio, namely, the organic silicon modified epoxy resin, the hydroxyl-terminated polybutadiene modified polyether ester, the fluorine-containing acrylic resin, the diaminodiphenyl sulfone, the lead sesquioxide, the nano calcium carbonate and the mica powder for later use, adding the organic silicon modified epoxy resin, the hydroxyl-terminated polybutadiene modified polyether ester, the fluorine-containing acrylic resin, the diethylenetriamine, the lead sesquioxide, the nano calcium carbonate and the mica powder into a reaction kettle, and uniformly mixing at normal temperature.
The preparation process of the pure glue film is as follows: preparing a first release film layer and a second release film layer with the thickness of 0.5mm, uniformly coating a layer of adhesive layer raw material on the second release film layer, covering the second release film layer with the first release film layer, and laminating to obtain a pure adhesive film, wherein the thickness of the adhesive layer is 0.5-1 mm.
The application comprises the following steps: tearing the first release film layer and taking out, inverting the adhesive layer and attaching the lower end of the adhesive layer to the copper foil layer, tearing the second release film layer and taking out, attaching the polyimide film to the upper end of the adhesive layer, and subsequently manufacturing the flexible circuit board by using the conventional flexible circuit board laminating technology.
And (3) testing: the adhesive layer was subjected to a thermal stability test and a peel strength test, and the test results are reported in table 1 below.
Comparative example 1
The epoxy resins were subjected to a thermal stability test and a peel strength test, and the test results are reported in table 1 below.
TABLE 1 test results
From the data in the above table, the TD of examples 1-2 is significantly higher than that of comparative example 1, and the heat resistant temperature can reach above 280 ℃, which indicates that the thermal stability is improved and the peel strength performance is improved, indicating that the adhesion between the adhesive layer of the present invention and the copper foil and the polyimide film is strong.
The above examples only show 2 embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. The pure glue film suitable for the flexible circuit board is characterized by comprising a pure glue film, wherein the pure glue film comprises a first release film layer, a glue layer and a second release film layer, and the glue layer comprises the following components in parts by weight: 8-15 parts of organic silicon modified epoxy resin, 20-40 parts of hydroxyl-terminated polybutadiene modified polyether ester, 75-85 parts of fluorine-containing acrylic resin, 3-7 parts of curing agent and 3-5 parts of filler.
2. The pure glue film suitable for the flexible circuit board according to claim 1, wherein the silicone modified epoxy resin is prepared by the following steps: adding epoxy resin, organic silicon oligomer and cyclohexanone into a reaction container, uniformly stirring, adding a catalyst of butyl titanate, stirring, heating to 150-160 ℃ for reflux reaction, removing ethanol generated by the reaction by an oil-water separator, reacting for 30-60 min, cooling, and filtering to obtain the organic silicon modified epoxy resin.
3. The pure adhesive film suitable for a flexible circuit board according to claim 2, wherein the silicone oligomer is selected from one of dimethyl silicone oil, methyl phenyl silicone oil and ethyl hydroxy silicone oil.
4. The pure adhesive film suitable for the flexible circuit board according to claim 1, wherein the hydroxyl-terminated polybutadiene modified polyether ester is prepared by using butanediol terephthalate as a hard segment and polytetrahydrofuran ether and hydroxyl-terminated polybutadiene as soft segments through polycondensation reaction.
5. The pure glue film suitable for the flexible circuit board according to claim 1, wherein the fluoroacrylic acid resin is prepared by taking ethylene glycol monoethyl ether as a reaction solvent, taking methacrylic acid, acrylamide, acrylonitrile and tetrafluoroethylene as reaction raw materials, performing polymerization reaction under initiation of dibenzoyl peroxide, neutralizing by hydroquinone, adding water to separate out a solid, filtering and drying the solid.
6. The pure adhesive film for a flexible printed circuit board according to claim 1, wherein the curing agent is selected from one of diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dimethylaminopropylamine, trimethylhexamethylenediamine, diethylamine, and diaminodiphenylsulfone.
7. The pure adhesive film suitable for flexible printed circuit board of claim 1, wherein said filler is a mixture of lead trioxide, nano calcium carbonate and mica powder.
8. The pure adhesive film suitable for the flexible circuit board according to claim 1, wherein the first release film layer and the second release film layer are both PET films.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114702923A (en) * | 2021-12-24 | 2022-07-05 | 广东东溢新材料科技有限公司 | Adhesive and preparation method and application thereof |
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