CN112297529A - Flexible cover plate and manufacturing method thereof - Google Patents

Flexible cover plate and manufacturing method thereof Download PDF

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Publication number
CN112297529A
CN112297529A CN202011139075.XA CN202011139075A CN112297529A CN 112297529 A CN112297529 A CN 112297529A CN 202011139075 A CN202011139075 A CN 202011139075A CN 112297529 A CN112297529 A CN 112297529A
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Prior art keywords
substrate layer
polyimide
flexible cover
flexible
cover plate
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CN202011139075.XA
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CN112297529B (en
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李林霜
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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    • B32B38/18—Handling of layers or the laminate
    • B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
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    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
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    • B32B7/03—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers with respect to the orientation of features
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    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584—Scratch resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
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Abstract

The invention discloses a flexible cover plate and a manufacturing method thereof, wherein the flexible cover plate comprises a first substrate layer, a second substrate layer and a third substrate layer which are sequentially stacked from bottom to top, the first substrate layer, the second substrate layer and the third substrate layer are all transparent polyimide film layers, the first substrate layer and the third substrate layer are rigid layers, and the second substrate layer is a flexible layer. The flexible cover plate with the three-layer structure of rigid-flexible-rigid has stronger shock resistance, and has bending resistance, wear resistance and scraping resistance.

Description

Flexible cover plate and manufacturing method thereof
Technical Field
The invention relates to the technical field of display, in particular to a flexible cover plate in a display device and a manufacturing method thereof.
Background
Foldable mobile phones are an important development direction of flexible display panels, and the flexible cover plate is one of the most important parts of the foldable mobile phones, and the requirements on abrasion resistance, scratch resistance, bending resistance and impact resistance are very strict. In the prior art, the flexible cover plate is mainly composed of two parts, a single-layer transparent polyimide flexible substrate and a hardened layer coated on the substrate. The disadvantages of the above solution are mainly two: (1) the impact resistance of the uniform single-layer flexible substrate is difficult to ensure; (2) the hardening layer coated on the flexible substrate hardly combines flexibility, wear resistance and scratch resistance.
Therefore, the prior art has defects and needs to be improved urgently.
Disclosure of Invention
The invention aims to overcome the defects that the impact resistance of a flexible cover plate is insufficient, and the flexibility, the wear resistance and the scratch resistance are difficult to be considered in the prior art.
In order to achieve the above purpose, the present invention provides a flexible cover plate, which includes a first substrate layer, a second substrate layer, and a third substrate layer that are sequentially stacked from bottom to top, where the first substrate layer, the second substrate layer, and the third substrate layer are all transparent polyimide film layers, the first substrate layer and the third substrate layer are rigid layers, and the second substrate layer is a flexible layer.
In particular, the polyimide in the first substrate layer comprises a hard segment and a soft segment, wherein the hard segment content exceeds 80% of the polyimide molecular weight.
In particular, the polyimide in the second substrate layer comprises a hard segment and a soft segment, wherein the soft segment content exceeds 80% of the polyimide molecular weight.
In particular, the polyimide in the third substrate layer comprises a hard segment and a soft segment, wherein the hard segment content exceeds 60% of the polyimide molecular weight, and the polyimide in the third substrate layer contains siloxane segments.
In particular, the third substrate layer is polyimide doped with a polyurethane elastomer.
The invention also provides a manufacturing method of the flexible cover plate, which comprises the following steps:
step S1, coating a first polyamic acid solution on a substrate to form a first base layer that is not completely cured;
step S2 of applying a second polyamic acid solution on the first substrate layer to form a second substrate layer that is not completely cured;
step S3, coating a third polyamic acid solution on the second substrate layer to form a third substrate layer that is not completely cured;
step S4, heating and curing the stacked first, second, and third base layers to obtain the flexible cover plate, and then separating the flexible cover plate from the substrate;
the cured first substrate layer, the cured second substrate layer and the cured third substrate layer are all transparent polyimide film layers, wherein the first substrate layer and the third substrate layer are rigid layers, and the second substrate layer is a flexible layer.
In particular, the polyimide in the first substrate layer comprises a hard segment and a soft segment, wherein the hard segment content exceeds 80% of the polyimide molecular weight.
In particular, the polyimide in the second substrate layer comprises a hard segment and a soft segment, wherein the soft segment content exceeds 80% of the polyimide molecular weight.
In particular, the third polyamic acid solution is coated after being modified by a silane coupling agent, the polyimide in the third substrate layer comprises a rigid chain segment and a flexible chain segment, and the content of the rigid chain segment is more than 60% of the molecular weight of the polyimide.
In particular, the third polyamic acid solution is doped with a polyurethane elastomer.
The invention has the beneficial effects that: the flexible cover plate is of a rigid-flexible-rigid distributed three-layer transparent polyimide film layer structure, the bending resistance and the shock resistance of the flexible cover plate can be obviously improved, the polyurethane-doped and siloxane-modified third substrate layer can play a role of a hardening layer, the wear resistance and the scratch resistance of the flexible cover plate are improved, and the interpenetrating grid structure can be formed among the adjacent substrate layers by simultaneously heating and curing the first substrate layer, the second substrate layer and the third substrate layer, so that the overall shock resistance of the flexible cover plate is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible cover plate according to an embodiment of the present invention.
Fig. 2 is a flowchart of a method for manufacturing a flexible cover according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The following detailed description of specific embodiments is made with reference to the accompanying drawings.
As shown in fig. 1, the flexible cover sheet of the present invention includes a first substrate layer 10, a second substrate layer 20, and a third substrate layer 30, which are sequentially stacked from bottom to top.
The first, second and third substrate layers 10, 20, 30 are all transparent polyimide substrates of the formula:
Figure BDA0002737635120000041
wherein, the R1 group, the R2 group and the R3 group contain one or more of a four-membered ring, a five-membered ring, a benzene ring, a biphenyl ring, a naphthalene ring and the like, and the R4 group is an alkyl chain;
Figure BDA0002737635120000042
rigid bodies of polyimideA neutral segment having a molecular weight of m1，
Figure BDA0002737635120000043
Is a flexible chain segment of polyimide and has a molecular weight of m2Wherein m is1＝1-35000，m2＝1-35000。
The content of the rigid segment in the molecular weight of the polyimide is m1/(m1+m2) The content of the soft segment in the molecular weight of the polyimide is m2/(m1+m2) The polyimide in the first substrate layer is mainly composed of rigid molecular chain segments, namely, the content of the rigid chain segments exceeds 50% of the molecular weight of the polyimide, so that the polyimide externally appears as a rigid layer and has certain rigidity and impact resistance, and the rigidity and the impact resistance are enhanced along with the increase of the content of the rigid chain segments. In this embodiment, the content of the rigid chain segment of the polyimide of the first base layer is preferably more than 80% of the molecular weight of the polyimide, so as to ensure that the formed flexible cover plate has better impact resistance.
The molecular chain segment of the polyimide in the second substrate layer 20 is mainly a flexible chain segment, that is, the content of the flexible chain segment in the polyimide exceeds 50% of the molecular weight of the polyimide, so that the second substrate layer 20 is a flexible layer on the outer surface, and has better bending resistance and deformation recovery performance, and the bending resistance and deformation recovery performance are enhanced along with the increase of the content of the flexible chain segment. In this embodiment, the content of the flexible molecular chain segment in the second substrate layer is preferably greater than 80% of the molecular weight of the polyimide, so that the bending resistance of the flexible cover plate is significantly improved to meet the use requirement.
The third substrate layer 30 also acts as a rigid layer, and the molecular segments of the polyimide in the third substrate layer 30 are mainly rigid molecular segments, that is, the content of the rigid segments exceeds 50% of the molecular weight of the polyimide.
According to the invention, the three base layers form the rigid-flexible-rigid distributed flexible cover plate, so that the bending resistance and the impact resistance of the flexible cover plate can be obviously improved.
In some embodiments, the third substrate layer 30 is located on the surface of the flexible cover plate, and not only needs to have a certain impact resistance, but also puts high requirements on the wear resistance and scratch resistance. Preferably, the content of the polyimide molecular segment in the third substrate layer 30 is more than 60% of the polyimide molecular weight as the rigid molecular segment, and the polyimide in the third substrate layer contains siloxane segments. The polyimide can be mixed with a coupling agent for modification so as to adjust the molecular chain structure of the polyimide and further adjust the corresponding mechanical property of the polyimide, the coupling agent is preferably a silane coupling agent, the silane coupling agent such as KH550 contains a functional group capable of reacting with polyamide acid (CPAA), and siloxane in the silane coupling agent can be hydrolyzed into three silanol groups under certain conditions, so that different molecular chains and the same molecular chain can be polymerized, a plurality of molecules can be coupled, and the strength of a high polymer material layer can be improved; the third substrate layer 30 on the surface of the flexible cover plate has high wear resistance and scratch resistance and plays a good role of a hardening layer.
As shown in fig. 2, an embodiment of the present invention further provides a method for manufacturing a flexible cover plate, which specifically includes the following steps:
step S1, coating a first polyamic acid solution on a substrate to form a first base layer that is not completely cured;
step S2 of applying a second polyamic acid solution on the first substrate layer to form a second substrate layer that is not completely cured;
step S3, coating a third polyamic acid solution on the second substrate layer to form a third substrate layer that is not completely cured;
step S4, heat-curing the stacked first, second, and third base layers to obtain a flexible cover plate, and then separating the flexible cover plate from the substrate.
The first polyamic acid solution, the second polyamic acid solution, and the third polyamic acid solution include a polyamic acid and a solvent, and the polyamic acid has a structural formula:
Figure BDA0002737635120000061
wherein, the R1 group, the R2 group and the R3 group contain one or more of four-membered ring, five-membered ring, benzene ring, biphenyl ring, naphthalene ring and the like, the R4 group is alkyl chain, m is1＝1-35000，m21-35000. The solvent comprises one or a combination of more of acetonitrile, dimethylformamide, dimethyl sulfoxide and hexamethylphosphoric triamide.
The polyamic acid in the first substrate layer, the second substrate layer and the third substrate layer can be dehydrated to form an imide ring structure in the heating and curing process, particularly, interpenetrating grid structures of the imide ring structure are respectively formed between the first substrate layer 10 and the second substrate layer 20 and between the second substrate layer 20 and the third substrate layer 30, the formation of the interpenetrating grid structures can obviously improve the adhesion force between the rigid-flexible-rigid three-layer flexible cover plates, and the integral impact resistance of the flexible cover plates is improved.
The first substrate layer, the second substrate layer and the third substrate layer formed after curing are all transparent polyimide film layers, the polyimide comprises a rigid chain segment and a flexible chain segment, wherein the first substrate layer and the third substrate layer are rigid film layers, namely the rigid chain segment is taken as the main component, preferably, the rigid chain segment content of the polyimide in the first substrate layer exceeds 80% of the polyimide molecular weight, the rigid chain segment content of the polyimide in the third substrate layer exceeds 60% of the polyimide molecular weight, the second substrate layer is a flexible layer, namely, the flexible chain segment is taken as the main component, and preferably, the flexible chain segment content of the polyimide in the second substrate layer exceeds 80% of the polyimide molecular weight. The flexible cover plate manufactured by the manufacturing method has flexibility and rigidity, has higher bending resistance and shock resistance, and meets the high requirements of the bendable and foldable display device on the cover plate.
In some embodiments, the third polyamic acid solution in step 3 is a polyamic acid solution modified by siloxane, and specifically can be mixed and modified by adding a silane coupling agent to the third polyamic acid solution, wherein the modified polyamic acid contains siloxane chain units, and after a polymerization reaction of heating and curing, a polyimide containing siloxane chain units is formed; furthermore, a polyurethane elastomer can be doped in the third polyamic acid solution in the step 3, the polyurethane elastomer has good deformation capacity, and meanwhile, the siloxane chain segment has a very low friction coefficient, so that the wear resistance and the scratch resistance of the formed polyimide film layer structure can be further improved, and a good hardening layer effect is achieved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the description of the above embodiments is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. The utility model provides a flexible apron, its characterized in that includes from the first stratum basale, second stratum basale and the third stratum basale that stacks gradually the setting from supreme down, first stratum basale, second stratum basale and third stratum basale are transparent polyimide film layer, wherein, first stratum basale with third stratum basale is the rigid layer, the second stratum basale is the flexible layer.
2. The flexible cover sheet of claim 1 wherein the polyimide in the first substrate layer comprises hard segments and soft segments, the hard segments comprising more than 80% of the polyimide molecular weight.
3. The flexible cover sheet of claim 1 wherein the polyimide in the second substrate layer comprises hard segments and soft segments, the soft segments comprising more than 80% of the polyimide molecular weight.
4. The flexible cover sheet of claim 1, wherein the polyimide in the third substrate layer comprises a hard segment and a soft segment, the hard segment content exceeding 60% of the polyimide molecular weight, and wherein the polyimide in the third substrate layer comprises siloxane segments.
5. The flexible cover sheet of claim 4, wherein the polyimide in the third substrate layer is doped with a polyurethane elastomer.
6. A method for manufacturing a flexible cover plate is characterized by comprising the following steps:
step S1, coating a first polyamic acid solution on a substrate to form a first base layer that is not completely cured;
step S2 of applying a second polyamic acid solution on the first substrate layer to form a second substrate layer that is not completely cured;
step S3, coating a third polyamic acid solution on the second substrate layer to form a third substrate layer that is not completely cured;
step S4, heating and curing the stacked first, second, and third base layers to obtain a flexible cover plate, and separating the flexible cover plate from the substrate;
the first substrate layer, the second substrate layer and the third substrate layer formed after curing are all transparent polyimide film layers, wherein the first substrate layer and the third substrate layer are rigid layers, and the second substrate layer is a flexible layer.
7. The method of claim 6, wherein the polyimide in the first substrate layer comprises a hard segment and a soft segment, and the hard segment content exceeds 80% of the polyimide molecular weight.
8. The method of claim 6, wherein the polyimide in the second substrate layer comprises a hard segment and a soft segment, and the soft segment content exceeds 80% of the polyimide molecular weight.
9. The method for manufacturing a flexible cover plate according to claim 6, wherein the third polyamic acid solution is modified by a silane coupling agent and then coated, the polyimide in the third substrate layer comprises a hard segment and a flexible segment, and the content of the hard segment exceeds 60% of the molecular weight of the polyimide.
10. The method of manufacturing a flexible cover sheet according to claim 9, wherein the third polyamic acid solution is doped with a polyurethane elastomer.
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CN108877529A (en) * 2018-07-10 2018-11-23 昆山国显光电有限公司 Flexible display screen cover board, Flexible Displays mould group and flexible display apparatus
CN109830509A (en) * 2019-01-09 2019-05-31 云谷（固安）科技有限公司 Flexible display substrates and preparation method thereof
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CN103087521A (en) * 2011-11-01 2013-05-08 奇美实业股份有限公司 Polyimide resin composition containing polysiloxane and flexible substrate formed by same
CN108877529A (en) * 2018-07-10 2018-11-23 昆山国显光电有限公司 Flexible display screen cover board, Flexible Displays mould group and flexible display apparatus
CN109830509A (en) * 2019-01-09 2019-05-31 云谷（固安）科技有限公司 Flexible display substrates and preparation method thereof
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