CN112297412A - Punching and cutting device and equipment - Google Patents
Punching and cutting device and equipment Download PDFInfo
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- CN112297412A CN112297412A CN202010906520.4A CN202010906520A CN112297412A CN 112297412 A CN112297412 A CN 112297412A CN 202010906520 A CN202010906520 A CN 202010906520A CN 112297412 A CN112297412 A CN 112297412A
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- guide
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- punching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The application provides a punching and cutting device and equipment. The stamping and cutting device comprises an installation bracket, a transmission assembly and a stamping assembly; the transmission component comprises two transmission parts; the punching press subassembly is located between two driving mediums, and the punching press subassembly includes driving piece, punching press pole and guide, and the driving piece is connected with the installing support, and the driving piece still is connected with the punching press pole, and the guide through-hole has been seted up to the guide, and the punching press pole is worn to locate in the guide through-hole and for the guide activity. Under the drive of the driving piece and under the guide of the guide piece, the stamping rod moves towards the high-temperature adhesive tape, so that the adhesive tape in the stamping specified shape is attached to the bonding pad through the stamping rod, manual attachment through an operator is not needed, the probability that a human hand contacts the bonding pad is reduced, and the cleanliness of the bonding pad is improved.
Description
Technical Field
The invention relates to the technical field of stamping and attaching, in particular to a stamping and cutting device and equipment.
Background
Along with the development of science and technology, the market demands electronic equipment to be more and more light and thin and small, small in size and high in heat dissipation, the demand of a high-integration chip is more and more large, the welding process is also continuously promoted, and a bonding process is generated in order to meet the assembly of high-density and high-precision elements. The bonding process is to connect the bonding pad and the component by a metal wire such as a gold wire or an aluminum wire through a special welding process. The surface of the bonding pad must be absolutely clean, free of organic pollution, free of any tiny particles and smooth in surface.
In the traditional process, after a circuit board is subjected to functional test and appearance inspection, high-temperature glue is manually pasted on the surface of a bonding pad needing a bonding process to protect the bonding pad. The high-temperature adhesive needs manual pasting by hands, and when the high-temperature adhesive is pasted by hands, the hands easily contact with the bonding pad to be bonded, so that the cleanliness of the bonding pad is unqualified, and the quality of the bonding pad is influenced.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a stamping and cutting device and equipment for improving the cleanliness of a bonding pad.
The purpose of the invention is realized by the following technical scheme:
a die cutting apparatus comprising: the stamping device comprises a mounting bracket, a transmission assembly and a stamping assembly; the transmission assembly comprises two transmission parts, each transmission part comprises a transmission motor and a transmission shaft, the transmission motor is connected with the mounting bracket, and a rotating shaft of the transmission motor is connected with the transmission shaft; the punching press subassembly is located two between the driving medium, the punching press subassembly includes driving piece, punching press pole and guide, the driving piece with the installing support is connected, the driving piece still with the punching press pole is connected, the direction through-hole has been seted up to the guide, the punching press pole is worn to locate in the direction through-hole and for the guide activity.
In one embodiment, the punching assembly further comprises a partition plate, wherein the partition plate is provided with a punching hole, and the punching hole is aligned with the guide through hole.
In one embodiment, the punching rod comprises a rod body and a glue tearing rod, the rod body and at least one glue tearing rod are connected to a power shaft of the driving piece, the glue tearing rod and the rod body are arranged side by side, and the glue tearing rod and the rod body are connected.
In one embodiment, a degumming hole is formed in one end of the rod body, which is far away from the driving piece.
In one embodiment, the punching assembly further comprises a clamping sleeve, the clamping sleeve is sleeved on the punching rod, and the power shaft of the driving piece is connected with the clamping sleeve.
In one embodiment, the transmission assembly further comprises a connecting piece, the connecting piece is connected with the power shaft of the driving piece, the clamping sleeve is provided with a clamping groove, and at least part of the connecting piece is clamped in the clamping groove.
In one embodiment, the transmission assembly further comprises a positioning pin, the clamping sleeve is further provided with a positioning hole, and the positioning pin is arranged in the positioning hole in a penetrating manner and is connected with the punching rod.
In one embodiment, the punching assembly further includes a mounting plate and a fixing member, the mounting plate is connected to the mounting bracket, the mounting plate is provided with a first mounting hole, the guide member is provided with a second mounting hole, and the fixing member is respectively inserted into the first mounting hole and the second mounting hole.
In one embodiment, the number of the first mounting holes is multiple, and the second mounting hole is aligned with one of the first mounting holes.
A punching and cutting device comprises a base and the punching and cutting device in any one of the embodiments, and a mounting bracket is connected with the base.
Compared with the prior art, the invention has at least the following advantages:
the high-temperature adhesive tape is transmitted through the transmission shaft, the punching rod is located between the two transmission parts, the punching rod moves towards the high-temperature adhesive tape under the driving of the driving part and under the guiding of the guiding part, the high-temperature adhesive tape is punched, the punching rod enables the adhesive tape with the punched specified shape to be attached to the bonding pad, manual attachment through an operator is not needed, the probability that the hand contacts the bonding pad is reduced, and the cleanliness of the bonding pad is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic view of a stamping and cutting device according to an embodiment;
FIG. 2 is a schematic view of the die cutting apparatus of FIG. 1 from another perspective;
FIG. 3 is a schematic view of the die cutting apparatus shown in FIG. 1 from yet another perspective;
FIG. 4 is an enlarged schematic view of the die cutting apparatus shown in FIG. 3 at A1;
fig. 5 is an enlarged schematic view of the die cutting apparatus shown in fig. 2 at a 2.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention relates to a stamping and cutting device. In one embodiment, the die cutting apparatus includes a mounting bracket, a drive assembly, and a die assembly. The transmission assembly comprises two transmission pieces. Each transmission part comprises a transmission motor and a transmission shaft. The transmission motor is connected with the mounting bracket. And a rotating shaft of the transmission motor is connected with the transmission shaft. The punching assembly is located between the two transmission pieces and comprises a driving piece, a punching rod and a guide piece. The driving piece is connected with the mounting bracket and the punching rod. The guide piece is provided with a guide through hole, and the stamping rod penetrates through the guide through hole and moves relative to the guide piece. The high-temperature adhesive tape is transmitted through the transmission shaft, the punching rod is located between the two transmission parts, the punching rod moves towards the high-temperature adhesive tape under the driving of the driving part and under the guiding of the guiding part, the high-temperature adhesive tape is punched, the punching rod enables the adhesive tape with the punched specified shape to be attached to the bonding pad, manual attachment through an operator is not needed, the probability that the hand contacts the bonding pad is reduced, and the cleanliness of the bonding pad is improved.
Please refer to fig. 1, which is a schematic perspective view of a stamping and cutting device according to an embodiment of the present invention.
The die cutting apparatus 10 of an embodiment includes a mounting bracket 100, a drive assembly 200, and a punch assembly 300. The transmission assembly 200 includes two transmission members 210. Each of the transmission members 210 includes a transmission motor 212 and a transmission shaft 214. The drive motor 212 is connected to the mounting bracket 100. The rotating shaft of the driving motor 212 is connected to the driving shaft 214. The driving shaft 214 is used for winding a high temperature adhesive tape. In the bonding procedure, the process environment temperature of the bonding pad is 350-400 ℃, the high-temperature adhesive tape is used for being attached to the bonding pad, and the bonding pad needing to be bonded is protected at high temperature by attaching the high-temperature adhesive tape to the bonding pad. Moreover, the welding disc can be locally protected according to actual needs. Referring to fig. 2, the punching assembly 300 is located between the two transmission members 210, and the punching assembly 300 includes a driving member 310, a punching rod 320, and a guiding member 330. The driving member 310 is connected to the mounting bracket 100, and the driving member 310 is further connected to the punching rod 320. The guide member 330 is provided with a guide through hole 332, and the punching rod 320 is movably disposed in the guide through hole 332. In this embodiment, the stamping and cutting of the stamping rod 320 has two processes, one of which is that one end of the stamping rod 320 far away from the driving member 310 is used to extend out of the guide through hole 332 and stamp the high temperature adhesive tape on one side of the guide member 330 far away from the driving member 310 to form a high temperature protective film adapted to the bonding pad, so that the high temperature protective film with a required shape is cut from the high temperature adhesive tape and attached to the bonding pad; and another process is, after cutting the completion, in order to avoid the ram rod to stretch into the figure hole that the high temperature sticky tape formed after cutting, the ram rod wears to locate in the figure hole on the high temperature sticky tape promptly, and can't continue to cut the high temperature sticky tape, the power shaft of driving piece drives the direction motion that the ram rod orientation is close to the driving piece, make the high temperature sticky tape blockked by the guide, thereby when making the ram rod come out from the direction through-hole, ram rod and high temperature sticky tape separate completely, be convenient for cut next time.
In this embodiment, in two drive motors 212, one is used for rolling the high temperature sticky tape, and another is used for unreeling the high temperature sticky tape, and two drive motors 212 are just equidirectionally rotated simultaneously, realize the transmission to the high temperature sticky tape. The high-temperature adhesive tape is transmitted through the transmission shaft 214, the punching rod 320 located between the two transmission parts 210 moves towards the high-temperature adhesive tape under the driving of the driving part 310 and under the guiding of the guide part 330 to punch the high-temperature adhesive tape, so that the punching rod 320 can attach the adhesive tape with the punched specified shape to a bonding pad without manual attachment by an operator, the probability that a human hand contacts the bonding pad is reduced, and the cleanliness of the bonding pad is improved.
In one embodiment, referring to fig. 1 and 2, the punch assembly 300 further includes a spacer having a punch hole 352 aligned with the guide through hole. Further, the partition plates include a first partition plate 340 and a second partition plate 350, the first partition plate 340 is connected to a side of the guide member 330 facing away from the driving member 310, the first partition plate 340 is further connected to the second partition plate 350, so that the guide member 330, the first partition plate 340 and the second partition plate 350 form a transmission channel for transmitting the adhesive tape, the punching hole 352 is opened in the second partition plate 350, the transmission channel is communicated with the punching hole 352, and the punching hole 352 is aligned with the guide through hole 332. In this embodiment, the first partition plate 340 separates the second partition plate 350 from the guide member 330, and the guide member 330, the first partition plate 340 and the second partition plate 350 form a transmission channel, which is used for the high temperature adhesive tape to pass through, that is, the high temperature adhesive tape in a flattened state passes through the transmission channel, so that the punching rod 320 punches the high temperature adhesive tape, so that the punching rod 320 cuts the high temperature protection film having the same structure as the high temperature protection film, thereby facilitating the attachment of the high temperature protection film on the pad. Like this, first baffle 340 does guide 330 with second baffle 350 provides the interval, is convenient for form transmission channel, thereby it is right to be convenient for the high temperature sticky tape carries out the punching press, moreover, second baffle 350 is located between high temperature sticky tape and the pad, second baffle 350 separates high temperature sticky tape and pad, has avoided punching press pole 320 is when extrudeing high temperature sticky tape, with the high temperature sticky tape of other positions together laminating on the pad to other areas that need not to paste high temperature sticky tape on the pad paste high temperature sticky tape, have reduced the high temperature sticky tape on the pad and have pasted too much condition, have avoided the high temperature sticky tape overuse and the waste that leads to the fact.
In one embodiment, referring to fig. 1, fig. 3 and fig. 4, the punching rod 320 includes a rod 322 and a glue tearing rod 324, the rod and the glue tearing rod have at least one power shaft connected to the driving member, the glue tearing rod 324 is arranged side by side with the rod 322, and the glue tearing rod 324 is connected to the rod 322. In this embodiment, the rod body 322 and the glue tearing rod 324 are both used for forming a high temperature protection film, the high temperature protection film is used for protecting the surface of a pad which needs to be subjected to a bonding process, and the shape of the high temperature protection film is the same as that of the rod body 322 and that of the glue tearing rod 324, that is, the end of the rod body 322 and the end of the glue tearing rod 324 form the shape required by the high temperature protection film together, that is, the end shape of the rod body 322 and the end shape of the glue tearing rod 324 are the same as that of the high temperature protection film. The glue tearing rod 324 is located on the side of the rod body 322, that is, the glue tearing rod 324 protrudes out of the rod body 322, so that the shape of the high-temperature protection film punched by the punching rod 320 is partially protruded. And when the high-temperature protective film is attached to the bonding pad, the protruding part of the high-temperature protective film is positioned outside the bonding pad, so that when the high-temperature protective film needs to be torn off, the high-temperature protective film can be removed from the bonding pad by grabbing the protruding part of the high-temperature protective film, the probability that the hands of operators contact with the bonding pad is reduced, and the cleanliness of the bonding pad is improved.
Further, referring to fig. 4, a degumming hole 3222 is disposed at an end of the rod body 322 away from the driving member 310. In this embodiment, an end of the punching rod 320 facing away from the driving member 310 is used for punching the high temperature adhesive tape, so as to cut out the corresponding high temperature protective film. The contact area between the end of the rod body 322 away from the driving member 310 and the high temperature adhesive tape is larger than the contact area between the end of the adhesive tearing rod 324 away from the driving member 310 and the high temperature adhesive tape, that is, most of the high temperature adhesive tape is in contact with the rod body 322. In the process of cutting the high-temperature adhesive tape by stamping the stamping rod 320, the driving member 310 is opposite to the action force applied by the stamping rod 320, and the action force is large and short, so that the end part of the rod body 322 quickly cuts the high-temperature protective film from the high-temperature adhesive tape, the end part of the rod body 322 is excessively close to the high-temperature protective film, the high-temperature protective film is easily caused to be larger than the joint force between the high-temperature protective film and the bonding pad, and the high-temperature protective film can not be attached to the bonding pad. In order to reduce the above situation, a gap exists between the high-temperature protective film and the rod body 322 by the arrangement of the degumming holes 3222, so that the adhesion force between the high-temperature protective film and the rod body 322 is reduced, and the high-temperature protective film is convenient to fall off from the rod body 322.
In one embodiment, the punching assembly further comprises a clamping sleeve, the clamping sleeve is sleeved on the punching rod, and the power shaft of the driving piece is connected with the clamping sleeve. In this embodiment, the joint cover has the joint mouth, the one end of depression bar is located in the joint mouth, the joint cover will the surface cover of the one end of depression bar is put, makes the one end of depression bar is located in the joint cover. The joint cover through the joint the mode with the punching press pole is connected, the driving piece provides drive power, makes the punching press pole is in the motion in the direction through-hole, thereby makes the punching press pole is right the high temperature sticky tape carries out the punching press and cuts. The joint cover does the driving piece with adapting unit between the ram rod makes the driving piece with the ram rod separation is convenient for right the driving piece with the ram rod is maintained respectively.
Further, the transmission assembly further comprises a connecting piece, the connecting piece is connected with the power shaft of the driving piece, a clamping groove is formed in the clamping sleeve, and at least part of the connecting piece is clamped in the clamping groove. In this embodiment, the joint groove is seted up in the side of joint cover, the storage tank has been seted up to the connecting piece, the lateral wall epirelief of storage tank is equipped with the joint lug, the joint lug card is located the joint inslot, the lateral wall in joint groove will joint lug centre gripping, and the part of joint cover accept in the storage tank, the part of joint cover with the storage tank joint makes the connecting piece with joint strength between the joint cover increases, has improved the driving piece with joint strength between the ram rod.
Furthermore, the transmission assembly further comprises a positioning pin, the clamping sleeve is further provided with a positioning hole, and the positioning pin penetrates through the positioning hole and is connected with the stamping rod. In this embodiment, the clamping sleeve is sleeved with the stamping rod, namely, the clamping sleeve is sleeved on the surface of the stamping rod, and the stamping rod is connected with the clamping sleeve in a clamping manner. In order to improve joint sleeve with joint strength between the stamping rod, the locating hole set up in the joint sleeve, the locating pin passes the locating hole, the locating pin with the stamping rod butt makes the locating pin with the stamping rod is connected, thereby makes joint sleeve still passes through the locating pin with the stamping rod is connected, has improved joint sleeve with joint strength between the stamping rod. In other embodiments, the stamping rod is provided with a groove, the groove is aligned with the positioning hole, the positioning pin is respectively inserted into the positioning hole and the groove, so that the positioning pin passes through the positioning hole, and one end of the positioning pin is located in the groove. Therefore, the positioning pins are clamped in the positioning holes and the grooves respectively, the side walls of the positioning holes and the side walls of the grooves clamp the positioning pins, so that the contact area between the positioning pins and the stamping rod and between the clamping sleeves is increased, and the connection stability between the stamping rods and the clamping sleeves is improved.
In one embodiment, please refer to fig. 1 and fig. 2, wherein the stamping assembly 300 further includes a mounting plate 360 and a fixing member 370, the mounting plate 360 is connected to the mounting bracket 100, the mounting plate 360 defines a first mounting hole 362, the guide 330 defines a second mounting hole 334, and the fixing member 370 is respectively inserted into the first mounting hole 362 and the second mounting hole 334. In this embodiment, the guide 330 is mounted to the mounting bracket 100 by the mounting plate 360, and the mounting plate 360 provides a location for the guide 330 to be mounted. The first and second mounting holes 362 and 334 are aligned to facilitate the passage of the fixing member 370 therethrough such that the fixing member 370 mounts the guide member 330 to the mounting plate 360, thereby fixing the guide member 330 to the mounting bracket 100.
Further, the number of the first mounting holes 362 is plural, and the second mounting hole 334 is aligned with one of the first mounting holes 362. In this embodiment, the first mounting holes 362 are evenly distributed on the mounting plate 360, and the second mounting hole 334 is aligned with one of the first mounting holes 362. When the position of high temperature protection film laminating on the pad needs to change, the position that guide 330 was located also need adjust, through changing second mounting hole 334 with the corresponding position relation of first mounting hole 362 is convenient for adjust guide 330 is in position on the mounting panel 360 to be convenient for adjust the laminating position of high temperature protection film on the pad, improved punching press cutting device's suitability makes punching press cutting device is applicable to the pad of different laminating positions.
Except that the punching bar 320 performs punching cutting on the high temperature adhesive tape, that is, the punching bar 320 makes contact with the high temperature adhesive tape, when the high temperature adhesive tape passes through the punching bar 320, if the position of the high temperature adhesive tape in the conveying passage changes, that is, the distance between the high temperature adhesive tape and the guide 330 decreases, the probability of the contact of the high temperature adhesive tape with the edge of the guide 330 increases. In the case that the edge of the guide 330 is not edged, the edge of the guide 330 is generally right-angled, that is, the edge of the guide 330 is sharp, so that the high temperature adhesive tape is easily scratched by the edge of the guide 330 when passing through the conveying passage, and the high temperature adhesive tape is damaged.
In order to reduce the damage rate of the high-temperature adhesive tape, referring to fig. 1, the punching and cutting device 10 further includes an adjusting assembly 400, the adjusting assembly 400 includes an adjusting piece 410, a first connecting rod 420 and a first rotating shaft sleeve 430, the adjusting piece 410 includes an adjusting plate 412, a fixing rod 414 and a fixing ring 416, the adjusting plate 412 is connected with the mounting bracket 100, the adjusting plate 412 is provided with an adjusting hole 4122, the fixing rod 414 is movably disposed in the adjusting hole 4122, the fixing rod 414 is connected with the mounting bracket 100, the fixing ring 416 is connected with the fixing rod 414, and the fixing ring 416 is abutted to a surface of the adjusting plate 412 facing away from the mounting bracket 100; the first connecting rod 420 and one side of the adjusting plate 412 departing from the mounting bracket 100 are connected, the first rotating shaft sleeve 430 is sleeved on the first connecting rod 420, the first rotating shaft sleeve 430 is arranged adjacent to the guide member 330, and the first rotating shaft sleeve 430 is used for extruding one side of the high-temperature adhesive tape close to the guide member 330. In this embodiment, before the high temperature adhesive tape enters the conventional channel for punching and cutting, a portion of the high temperature adhesive tape is located on a side of the first rotating sleeve 430 away from the driving member 310, that is, a portion of the high temperature adhesive tape is located below the first rotating sleeve 430. The high-temperature adhesive tape is supported and extruded by the first rotating shaft sleeve 430, so that part of the high-temperature adhesive tape in the transmission channel is far away from the guide part 330, and thus the part of the high-temperature adhesive tape in the transmission channel is not in contact with the guide part 330 and the second partition plate 350, the probability that the high-temperature adhesive tape is in contact with the edge of the guide part 330 in the transmission process is reduced, the probability that the high-temperature adhesive tape is scratched by the edge of the guide part 330 is reduced, the high-temperature adhesive tape is ensured to be kept complete before stamping and cutting, and the integrity of the stamped and cut high-temperature protective film is improved.
Also, the fixing rod 414 is located in the adjusting hole 4122, and when it is required to adjust the distance between the high temperature adhesive tape located in the conventional path and the guide 330, the fixing rod 414 is relatively moved in the adjusting hole 4122 by pushing the adjusting plate 412, so that the first connecting rod 420 is moved in a direction parallel to the pressing rod 320, thereby facilitating adjustment of the distance between the high temperature adhesive tape located in the conventional path and the guide 330. The fixing ring 416 is used to fix the adjusting plate 412 on the mounting bracket 100, and when the adjusting plate 412 moves to a specific position, the fixing ring 416 is connected to the fixing rod 414 to mount the adjusting plate 412 on the mounting bracket 100, so as to facilitate the adjustment of the position of the adjusting plate 412.
Further, the flatness of the high-temperature adhesive tape in the transmission channel affects the punching effect of the punching rod 320 on the high-temperature adhesive tape, for example, when the edge of the high-temperature adhesive tape is raised, the punching rod 320 extrudes and pushes the edge of the high-temperature adhesive tape to the middle part under high-speed punching, so that the thickness of a high-temperature protective film formed by punching is different, that is, the flatness of the high-temperature protective film is poor, and subsequent bonding processes cannot be met, so that the produced bonding pad is not satisfactory, and the qualification rate of the bonding pad is reduced.
In order to improve the flatness of the high temperature adhesive tape, referring to fig. 1, the punching and cutting device 10 further includes a leveling component 500, the leveling component 500 is located between one of the driving members 210 and the adjusting component 400, the leveling component 500 includes a first leveling member 510 and a second leveling member 520, the first leveling member 510 includes a first leveling rod 512 and a first leveling sleeve 514, the second leveling member 520 includes a second leveling rod 522, a second leveling sleeve 524, a first connecting plate 526, a second connecting plate 528, and a telescopic rod 521, the first leveling sleeve 514 is sleeved on the first leveling rod 512, the first leveling rod 512 is connected with the mounting bracket 100, the second leveling sleeve 524 is sleeved on the second leveling rod 522, the second leveling rod 522 is connected with the first connecting plate 526, and the first connecting plate 526 is connected with the second connecting plate 528 through the telescopic rod 521, the second connecting plate 528 is also connected to the mounting bracket 100. In this embodiment, the first leveling rod 512 and the second leveling rod 522 are disposed opposite each other, and the first leveling bushing 514 and the second leveling bushing 524 are disposed opposite each other, i.e., the distance between the first leveling member 510 and the second leveling member 520 is the distance between the first leveling bushing 514 and the second leveling bushing 524. Since the leveling assembly 500 is located between one of the transmission members 210 and the adjustment assembly 400, the high temperature adhesive tape from the transmission member 210 to the adjustment assembly 400 passes through the gap between the first leveling bushing 514 and the second leveling bushing 524, the first leveling bushing 514 and the second leveling bushing 524 remain parallel, ensuring that the high temperature adhesive tape passes in parallel, such that the high temperature adhesive tape is smoothed by at least one of the first leveling sleeve 514 and the second leveling sleeve 524, i.e., the high temperature adhesive tape, is adhered to a surface of at least one of the first leveling hub 514 and the second leveling hub 524, such that the high temperature adhesive tape is flattened prior to being transferred to the punch assembly 300, therefore, the flatness of the high-temperature adhesive tape is improved, and the high-temperature protective film which does not meet the requirement and is punched and cut by the punching rod 320 is reduced.
In addition, in this embodiment, the first connecting plate is provided with an accommodating space, and the second leveling rod and the second leveling shaft sleeve are accommodated in the accommodating space. The opening of the accommodating space faces the first leveling shaft sleeve, so that when the high-temperature rubber belt passes through, the first leveling shaft sleeve and the second leveling shaft sleeve can both level the high-temperature rubber belt, and the accommodating space is convenient for protecting the second leveling rod and the second leveling shaft.
In addition, the second connecting plate 528 is connected to the first connecting plate 526 through the expansion link 521, the second connecting plate 528 is installed between the installations, and the distance between the first leveling shaft sleeve 514 and the second leveling shaft sleeve 524 can be adjusted by adjusting the expansion length of the expansion link 521, so that the high temperature adhesive tape can be leveled on two sides, that is, the first leveling shaft sleeve 514 and the second leveling shaft sleeve 524 are both in contact with the high temperature adhesive tape, that is, two sides of the high temperature adhesive tape are respectively abutted against the first leveling shaft sleeve 514 and the second leveling shaft sleeve 524, so that the high temperature adhesive tape is leveled by the first leveling shaft sleeve 514 and the second leveling shaft sleeve 524 at the same time, and the flatness of the high temperature adhesive tape is further improved. Moreover, the length of the telescopic rod 521 is adjusted to facilitate the leveling of the high-temperature adhesive tapes with different thicknesses, that is, the distance between the first leveling shaft sleeve 514 and the second leveling shaft sleeve 524 corresponds to the thickness of the high-temperature adhesive tape.
Except for the promotion to the flattening degree of high temperature sticky tape, work as when stamping bar 320 carries out the punching press to the high temperature sticky tape after the roughness is handled and cuts, stamping bar 320 laminates stamping forming's high temperature protection film on the pad, and the high temperature protection film is pasted on the pad according to the stickness of self. However, when the operator erroneously mounts the tray having the high temperature adhesive tape, for example, the side of the high temperature adhesive tape having viscosity faces the guide 330. At this time, during the stamping and cutting process of the stamping rod 320, a high temperature protective film will adhere to the end of the stamping rod 320 far away from the driving member 310. With the increase of time, the number of the high-temperature protection films adhered to the stamping rod 320 is increased, so that the total thickness of the high-temperature protection films on the end portion of the stamping rod 320 is increased, each stamping time and the distance of the stamping rod 320 are fixed, and when the total thickness of the high-temperature protection films on the end portion of the stamping rod 320 reaches a certain thickness value, the end portion of the stamping rod 320 performs overpressure attachment on the pad, that is, the extrusion force between the end portion of the stamping rod 320 and the pad is too large, so that the pad is crushed, and the production cost is increased.
In order to reduce the probability of the pad being crushed by the punching rod 320, please refer to fig. 1, fig. 2 and fig. 5, the punching and cutting device 10 further includes a cleaning assembly 600, the cleaning assembly 600 includes a cleaning wedge 610, an elastic driving member 620, a driving motor 630 and a sensor 640, the driving motor 630 is connected to a surface of the second partition plate 350 close to the guiding member 330, the sensor 640 is connected to the driving motor 630, the cleaning wedge 610 is connected to the driving motor 630 through the elastic driving member 620, the cleaning wedge 610 is disposed adjacent to the punching rod 320, and the cleaning wedge 610 abuts against the punching rod 320. In this embodiment, after the punching and cutting of the punching rod 320 are completed, the punching rod 320 is drawn out from the punching hole 352, that is, the punching rod 320 moves towards a direction away from the second partition board 350, and when the punching rod 320 is separated from the cleaning inclined block 610, the cleaning inclined block 610 passes through an end of the punching rod 320 away from the driving member 310 in a direction parallel to the second partition board 350 under the elastic force of the elastic driving member 620, that is, a side of the cleaning inclined block 610 away from the second partition board 350 slides over an end of the punching rod 320 for punching the high temperature adhesive tape. Thus, when a high-temperature protective film is adhered to one end of the stamping rod 320, which is far away from the driving member 310, the cleaning inclined block 610 removes the high-temperature protective film on the stamping rod 320, so that the probability that the high-temperature protective film is adhered to one end of the stamping rod 320, which is far away from the driving member 310, is reduced, and the probability that the stamping rod 320 crushes the bonding pad is reduced.
In order to prevent the removed high temperature protective film from falling on the pad through the punching hole 352, the cleaning inclined block 610 has an inclined surface 612, the inclined surface 612 is inclined toward the guide 330, and the inclined surface 612 is disposed away from the elastic driving member 620. In this embodiment, the distance between the inclined surface 612 and the guiding element 330 gradually increases from the direction approaching the elastic driving element 620 to the direction away from the elastic driving element 620. When one surface of the cleaning inclined block 610, which is far away from the second partition plate 350, is in contact with the end of the punching rod 320, the cleaning inclined block 610 removes the high-temperature protective film on the end of the punching rod 320, and the high-temperature protective film passes through the inclined surface 612 and moves along the inclined surface 612. Thus, when the cleaning inclined block 610 is ejected by the elastic driving element 620, the inclined surface 612 pushes the high-temperature protection film away from the punching hole 352, the probability that the high-temperature protection film falls into the punching hole 352 is reduced, and the probability that the high-temperature protection film falls on the bonding pad through the punching hole 352 is reduced.
In the above embodiment, the elastic driving member 620 is a spring, when the punching rod 320 is in the punching hole 352, the cleaning inclined block 610 abuts against the punching rod 320, and the elastic driving member 620 is in a compressed state. When the punching rod 320 leaves the punching hole 352 and is out of contact with the cleaning sloping block 610, the elastic driving part 620 releases the elastic acting force, so that the cleaning sloping block 610 slides over the end part of the punching rod 320, and the high-temperature protective film on the end part of the punching rod 320 is removed. After the elastic force of the elastic driving member 620 is released, that is, the elastic driving member 620 is in a natural extension state, the sensor 640 cannot sense the punching rod 320, and at this time, the driving motor 630 is turned on, so that the elastic driving member 620 starts to contract, and the cleaning inclined block 610 passes through the punching hole 352 again and moves to a position close to the driving motor 630, so that the cleaning inclined block 610 abuts against the punching rod 320 again when the punching rod 320 enters the punching hole 352 for punching next time. When the punching rod 320 is located in the punching hole 352, the sensor 640 senses the punching rod 320, so that the driving motor 630 is turned off, and the cleaning inclined block 610 abuts against the punching rod 320 under the extrusion of the elastic driving member 620. In other embodiments, the sensor 640 is an optical sensor 640 or an infrared sensor 640, and the driving motor 630 is a stepping motor.
Further, the clearance subassembly still includes the clearance baffle, the clearance baffle with clearance sloping block sets up relatively, the clearance baffle is used for accomodating follow the high temperature protection film of cleaing away on the stamping rod. In this embodiment, the clearance baffle surrounds the stamping rod setting, is convenient for limit the high temperature protection film of cleaing away wherein, has avoided breaking away from the high temperature protection film of cleaing away from on the stamping rod the second baffle and falling on other positions of pad, has ensured that the high temperature protection film falls into corresponding position.
The application also provides a stamping and cutting device which comprises a base and the stamping and cutting device in any one of the above embodiments. The mounting bracket is connected with the base. In this embodiment, the punching and cutting device comprises a mounting bracket, a transmission assembly and a punching assembly. The transmission assembly comprises two transmission pieces. Each transmission part comprises a transmission motor and a transmission shaft. The transmission motor is connected with the mounting bracket. And a rotating shaft of the transmission motor is connected with the transmission shaft. The punching assembly is located between the two transmission pieces and comprises a driving piece, a punching rod and a guide piece. The driving piece is connected with the mounting bracket and the punching rod. The guide piece is provided with a guide through hole, and the stamping rod penetrates through the guide through hole and moves relative to the guide piece. The high-temperature adhesive tape is transmitted through the transmission shaft, the punching rod is located between the two transmission parts, the punching rod moves towards the high-temperature adhesive tape under the driving of the driving part and under the guiding of the guiding part, the high-temperature adhesive tape is punched, the punching rod enables the adhesive tape with the punched specified shape to be attached to the bonding pad, manual attachment through an operator is not needed, the probability that the hand contacts the bonding pad is reduced, and the cleanliness of the bonding pad is improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A die cutting apparatus, comprising:
a support is arranged on the base plate, and the support is arranged on the support,
the transmission assembly comprises two transmission parts, each transmission part comprises a transmission motor and a transmission shaft, the transmission motors are connected with the mounting bracket, the rotating shafts of the transmission motors are connected with the transmission shafts, and the transmission shafts are used for winding the high-temperature adhesive tape;
the punching press subassembly, the punching press subassembly is located two between the driving medium, the punching press subassembly includes driving piece, punching press pole and guide, the driving piece with the installing support is connected, the driving piece still with the punching press pole is connected, the guide through-hole has been seted up to the guide, the punching press pole wears to locate in the guide through-hole and for the guide activity, the punching press pole is kept away from the one end of driving piece is used for the punching press the glued membrane of sticky tape to the shaping goes out the high temperature glued membrane with pad looks adaptation.
2. The die cutting apparatus of claim 1, wherein the punch assembly further includes a spacer plate defining a punch hole, the punch hole being aligned with the guide through hole.
3. The die cutting device of claim 1, wherein the punch stem includes a stem body and a glue tearing stem, at least one of the stem body and the glue tearing stem is connected to a power shaft of the driving member, the glue tearing stem is arranged side by side with the stem body, and the glue tearing stem is connected to the stem body.
4. The die cutting apparatus of claim 3, wherein an end of the rod body facing away from the driving member is provided with a glue-removing hole.
5. The die cutting apparatus of claim 1, wherein the punch assembly further comprises a clamping sleeve, the clamping sleeve is sleeved on the punch stem, and the power shaft of the driving member is connected with the clamping sleeve.
6. The die cutting device of claim 5, wherein the transmission assembly further comprises a connecting member, the connecting member is connected with the power shaft of the driving member, the clamping sleeve is provided with a clamping groove, and at least a part of the connecting member is clamped in the clamping groove.
7. The die cutting device of claim 5, wherein the transmission assembly further comprises a positioning pin, the clamping sleeve further defines a positioning hole, and the positioning pin is inserted into the positioning hole and connected to the punching rod.
8. The die cutting apparatus according to any one of claims 1 to 7, wherein the die assembly further includes a mounting plate and a fixing member, the mounting plate is connected to the mounting bracket, the mounting plate defines a first mounting hole, the guide member defines a second mounting hole, and the fixing member is respectively inserted into the first mounting hole and the second mounting hole.
9. The die cutting apparatus of claim 8, wherein said first mounting hole is plural in number and said second mounting hole is aligned with one of said first mounting holes.
10. A die cutting apparatus including a base and a die cutting device as claimed in any one of claims 1 to 9, said mounting bracket being connected to said base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010906520.4A CN112297412B (en) | 2020-09-01 | 2020-09-01 | Punching and cutting device and equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010906520.4A CN112297412B (en) | 2020-09-01 | 2020-09-01 | Punching and cutting device and equipment |
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| CN112297412A true CN112297412A (en) | 2021-02-02 |
| CN112297412B CN112297412B (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010906520.4A Active CN112297412B (en) | 2020-09-01 | 2020-09-01 | Punching and cutting device and equipment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020129905A1 (en) * | 2001-03-16 | 2002-09-19 | Miller Robert D. | Thermo-encapsulating system and method |
| CN209561554U (en) * | 2019-03-28 | 2019-10-29 | 深圳市智联智造自动化有限公司 | Tape sticking device for taping to battery core surface |
| CN209871900U (en) * | 2019-01-29 | 2019-12-31 | 惠州市欣宇科技有限公司 | Diaphragm paper die-cutting mechanism |
| CN209889953U (en) * | 2019-04-24 | 2020-01-03 | 无锡先导智能装备股份有限公司 | Rubberizing device |
| CN211125859U (en) * | 2019-11-26 | 2020-07-28 | 无锡先导智能装备股份有限公司 | Rubberizing mechanism and rubberizing device |
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2020
- 2020-09-01 CN CN202010906520.4A patent/CN112297412B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020129905A1 (en) * | 2001-03-16 | 2002-09-19 | Miller Robert D. | Thermo-encapsulating system and method |
| CN209871900U (en) * | 2019-01-29 | 2019-12-31 | 惠州市欣宇科技有限公司 | Diaphragm paper die-cutting mechanism |
| CN209561554U (en) * | 2019-03-28 | 2019-10-29 | 深圳市智联智造自动化有限公司 | Tape sticking device for taping to battery core surface |
| CN209889953U (en) * | 2019-04-24 | 2020-01-03 | 无锡先导智能装备股份有限公司 | Rubberizing device |
| CN211125859U (en) * | 2019-11-26 | 2020-07-28 | 无锡先导智能装备股份有限公司 | Rubberizing mechanism and rubberizing device |
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| Publication number | Publication date |
|---|---|
| CN112297412B (en) | 2022-01-25 |
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