CN112297256A - Large-size single crystal round bar cutting device and method - Google Patents
Large-size single crystal round bar cutting device and method Download PDFInfo
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- CN112297256A CN112297256A CN201910692584.6A CN201910692584A CN112297256A CN 112297256 A CN112297256 A CN 112297256A CN 201910692584 A CN201910692584 A CN 201910692584A CN 112297256 A CN112297256 A CN 112297256A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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Abstract
The invention relates to a large-size single crystal round bar cutting device.A diamond wire shaped like a Chinese character 'jing' is arranged in a cutting chamber, and is arranged at one end of a single crystal round bar and is parallel to the end surface of the single crystal round bar; the inner wall of the cutting chamber is provided with four edge clamping devices, and the four edge clamping devices respectively correspond to four edges obtained by cutting the single crystal round rod; when cutting, the single crystal round rod is cut at one end of the single crystal round rod along the axis direction of the single crystal round rod through a diamond wire shaped like a Chinese character 'jing'. The invention has the beneficial effects that: the diamond wire shaped like a Chinese character 'jing' is fed from the end face of the round rod, so that the contact area of the diamond wire and a single crystal is small, a wire bow is small, and the processing efficiency of the silicon rod can be improved; by adopting a sectional type cutting mode and matching with a side skin clamp to fix the cut side skin, the probability of silicon rod breakage can be effectively reduced, the surface quality of the single crystal silicon rod can be effectively improved, and the product percent of pass is improved.
Description
Technical Field
The invention belongs to the technical field of silicon rod cutting, and particularly relates to a large-size single crystal round rod cutting device and a large-size single crystal round rod cutting method.
Background
In the existing silicon rod cutting method, particularly when a round single crystal rod is cut, a cutter is inserted from the side surface of the round rod, as shown in fig. 1, the phenomenon of single crystal breakage after cutting and the phenomenon that a wire arch is enlarged affect the cutting efficiency, and the breakage cannot be removed through polishing if the breakage is too large, so that the overall quality and yield of the silicon rod are reduced. Particularly, when the silicon rod is used for the cutting process of a large-scale single crystal round rod, the silicon rod is large in size, the cut flaw piece is heavier, and the probability of breakage is higher.
The diameter of a round rod processed by an all-in-one machine is below 230mm at present, a mode of entering a cutter from the side surface of the round rod is adopted, if a large-diameter round rod single crystal (the diameter is 230-. In addition, the contact length of the diamond wire is the length of the single crystal silicon rod, which results in a large contact area between the diamond wire and the single crystal, and the wire bow also increases, thus affecting the overall processing speed and further affecting the processing efficiency.
Disclosure of Invention
In order to solve the technical problems, the invention provides a large-size single crystal round bar cutting device and a cutting method.
The technical scheme adopted by the invention is as follows: a diamond wire shaped like a Chinese character 'jing' is arranged in a cutting chamber and is arranged at one end of a single crystal round rod and is parallel to the end face of the single crystal round rod.
Preferably, the diamond wire shaped like a Chinese character 'jing' comprises warps and wefts which are arranged in front and back, wherein two ends of each warp are respectively connected with a warp sheave, the warp sheaves are respectively arranged on the top surface and the bottom surface of the inner wall of the cutting chamber, two ends of each weft are respectively connected with a weft sheave, and the weft sheaves are respectively arranged on the left side and the right side of the inner wall of the cutting chamber;
preferably, there is at least one warp and one weft.
Preferably, the four sides of the inner wall of the cutting chamber are provided with grooved wheel screw rods, and the warp grooved wheels and the weft grooved wheels are fixed on the corresponding grooved wheel screw rods.
Preferably, the inner wall of the cutting chamber is provided with a flaw-piece clamping device which can fix the flaw-pieces obtained by cutting;
preferably, the number of the flaw-piece clamping devices is not less than two, and the flaw-piece clamping devices respectively correspond to flaw-pieces obtained by cutting the single crystal round rods;
preferably, each edge skin clamping device comprises two oppositely arranged air cylinders, and the air cylinders are connected to the inner wall of the cutting chamber through a mechanical arm.
Preferably, the front end and the rear end of the single crystal round rod are respectively provided with a fixed sucker, and the fixed suckers are connected with the front end and the rear end of the cutting chamber through sucker screws.
A method for cutting a large-size single crystal round rod is characterized in that the single crystal round rod is cut at one end of the single crystal round rod along the axis direction of the single crystal round rod through a diamond wire shaped like a Chinese character 'jing'.
Preferably, the cutting comprises a cutter inlet section, a middle section and a cutter outlet section, wherein the feeding speed of the cutter inlet section and the cutter outlet section is less than that of the middle section, and the linear speed of the cutter inlet section and the cutter outlet section is less than that of the middle section;
preferably, the feeding speed of the cutter entering section is 15-25mm/min, the feeding speed of the middle section is 40-60mm/min, and the feeding speed of the cutter discharging section is 25-40 mm/min;
preferably, the length of the cutter inlet section is the same as that of the cutter outlet section, and the lengths of the cutter inlet section and the cutter outlet section are both 20-50 mm.
Preferably, the linear speed of the feeding knife is 17-20m/s, the intermediate linear speed is 21-25m/s, and the linear speed of the discharging knife is 16-19 m/s.
The specific cutting method is as follows:
firstly, taking and fixing a large-size single crystal round bar by a feeding clamp;
moving the manipulator to enable the cylinder to clamp the position of the side skin;
step three, adopting a diamond wire in a shape of a Chinese character 'jing' to enter from the end face of the single crystal round rod, carrying out sectional cutting on the single crystal round rod, and adopting a water cooling continuous flow mode to cool the diamond wire and remove ineffective micro powder in the cutting process;
fourthly, withdrawing the diamond wire in the shape of the Chinese character 'jing' after cutting is finished, and returning to the initial position;
and fifthly, moving the flaw-piece obtained by cutting to a corresponding position through a manipulator, and blanking the obtained crystal bar.
Preferably, the diameter of the single crystal round bar and the crystal line are detected by using a measuring probe before the cutting in the third step.
Preferably, the flow rate of the cooling liquid in the fourth step is 40-60L/min.
The invention has the advantages and positive effects that: the diamond wire shaped like a Chinese character 'jing' is fed from the end face of the round rod, so that the contact area of the diamond wire and a single crystal is small, a wire bow is small, and the processing efficiency of the silicon rod can be improved; by adopting a sectional type cutting mode and matching with a side skin clamp to fix the cut side skin, the probability of silicon rod breakage can be effectively reduced, the surface quality of the single crystal silicon rod can be effectively improved, and the product percent of pass is improved.
Drawings
FIG. 1 is a schematic cut-away view of a prior art single crystal round bar;
FIG. 2 is a schematic view of a cutting device according to an embodiment of the present invention;
fig. 3 is a structural sectional view of a cutting device according to an embodiment of the present invention.
In the figure:
1. cutting chamber 2, single crystal round bar 21 and fixed suction cup
31. Weft 32, weft sheave 33, warp
34. Warp sheave 35, sheave screw 41, cylinder
42. Mechanical arm
Detailed Description
An embodiment of the present invention will be described below with reference to the drawings.
As shown in FIG. 2 and FIG. 3, the invention relates to a cutting device and a cutting method for a large-size round single crystal rod, wherein a diamond wire shaped like a Chinese character 'jing' is arranged in a cutting chamber of the cutting device, the diamond wire shaped like the Chinese character 'jing' is arranged at one end of the round single crystal rod and is parallel to the end face of the round single crystal rod, and the round single crystal rod is cut at one end of the round single crystal rod along the axial direction of the round single crystal rod through the diamond wire shaped like the Chinese character 'jing'. The diamond wire in the shape of the Chinese character 'jing' comprises warps and wefts which are arranged in front and back, the distance between the planes of the warps and the wefts is 5-10cm, the warps and the wefts are two parallel to each other, the distance between the two warps is the same as that between the two wefts, and the distance is consistent with the size of a square rod to be cut, so that the diamond wire in the shape of the Chinese character 'jing' is formed.
The warp sheave is connected respectively at warp both ends, and four warp sheaves set up respectively at the top surface and the bottom surface of cutting indoor wall, drive two warps and remove along the vertical direction, and the weft sheave is connected respectively at corresponding weft both ends, and four weft sheaves set up respectively in the left and right sides of cutting indoor wall, drive two wefts and remove along the horizontal direction. The four sides of the inner wall of the cutting chamber are provided with grooved pulley lead screws, the warp grooved pulleys and the weft grooved pulleys are fixed on the corresponding grooved pulley lead screws, and the grooved pulleys on the grooved pulley lead screws move back and forth to cut the single crystal round bar; specifically, each warp grooved wheel and each weft grooved wheel are driven by a single grooved wheel screw, the grooved wheel screws of the four warp grooved wheels act in the same way, and the grooved wheel screws of the four weft grooved wheels act in the same way; the warp grooved pulley or the weft grooved pulley positioned on one side wall in the cutting chamber can be fixed on a grooved pulley screw rod, and the two grooved pulley screw rods on the opposite inner walls act in the same direction; thereby ensuring that the diamond wire shaped like a Chinese character 'jing' can be cut perpendicular to the axis of the single crystal silicon rod.
In order to avoid collapse loss of the silicon rod when the flaw-piece falls off, flaw-piece fixing devices are provided, flaw-piece clamping devices are arranged on the inner wall of the cutting chamber and comprise four flaw-piece clamping devices, the four flaw-piece clamping devices respectively correspond to four flaw-pieces obtained by cutting a single crystal round rod, the four flaw-pieces are fixed and are prevented from falling off in the cutting process, each flaw-piece clamping device comprises two air cylinders which are oppositely arranged, the air cylinders are connected to the inner wall of the cutting chamber through mechanical arms, routes of four groups of mechanical arms and a grooved pulley lead screw are not overlapped, and the cutting routes of the grooved pulley lead screw and a warp weft are not influenced by the mechanical; in order to fix the single crystal square rod obtained by cutting, the front end and the rear end of the single crystal round rod are respectively provided with a fixed sucker, the cross sections of the two fixed suckers are smaller than the cross section of the single crystal square rod, the front fixed sucker penetrates into a diamond wire in a shape like a Chinese character 'jing', the influence on a diamond wire cutting circuit is avoided, and the fixed suckers are connected to the front end and the rear end of a cutting chamber through sucker screw rods.
In order to further improve the square cutting qualification rate of the round single crystal rod, a sectional cutting method is adopted, the round single crystal rod is cut at one end of the round single crystal rod along the axis direction of the round single crystal rod through a diamond wire shaped like a Chinese character 'jing', in order to solve the problem of edge breakage of the square rod caused by instantaneous cutting-in and cutting-out, the modes of low feeding speed of cutting-in and cutting-out, high feeding speed of the middle, low linear speed of cutting-in and cutting-out and high linear speed of the middle position are adopted, the processing efficiency is ensured, and meanwhile, the large-size square rod with high quality is obtained. The cutting comprises a cutter inlet section, a middle section and a cutter outlet section, wherein the feeding speeds of the cutter inlet section and the cutter outlet section are less than the feeding speed of the middle section, and the linear speeds of the cutter inlet section and the cutter outlet section are less than the linear speed of the middle section; therefore, when the cutter is fed and discharged, the lower feeding speed and the diamond linear speed are adopted, so that the cutting is more exquisite, the cracking of the cutter feeding section and the cutter discharging section is avoided, the cracking of the middle part is not easy to occur, and the feeding speed and the diamond linear speed can be increased in order to improve the working efficiency; specifically, the feeding speed of the cutter entering section is 15-25mm/min, the feeding speed of the middle section is 40-60mm/min, and the feeding speed of the cutter discharging section is 25-40mm/min, because the speeds of the two stages are not too high easily due to the vibration of a machine and a cutting line during cutter entering and cutter discharging, and the cutting speed is increased in the middle stage, so that the stability of integral cutting is kept; meanwhile, when the cutter is initially inserted, the tension of the cutting line is set to be 90-120N during the processing process; the linear speed of the cutter feeding is 17-20m/s, the intermediate linear speed is 21-25m/s, and the linear speed of the cutter discharging is 16-19 m/s; the lengths of the cutter feeding section and the cutter discharging section are controlled to be the same and are 20-50mm, and the middle length can be adjusted according to the actual situation, so that the collapse loss of the silicon rod caused by the steel wire during cutter discharging and cutter feeding can be reduced, and the quality of the whole large-size single crystal square rod is improved.
The specific cutting method is as follows:
firstly, taking and fixing a large-size single crystal round bar by a feeding clamp; grabbing large-size single crystals (the diameter of the round rod is 230-;
moving the manipulator to enable the cylinder to clamp the position of the side skin; the small air cylinder is used for clamping the flaw-piece, so that the silicon rod is prevented from being damaged when the flaw-piece falls due to non-clamping, and the quality of the large-size square rod is prevented from being influenced;
detecting the diameter of the single crystal round rod and the crystal line by using a measuring probe, and ensuring that the large-diameter round rod can meet the requirement of equipment processing; adopting a diamond wire shaped like a Chinese character 'jing' to enter from the end face of the single crystal round bar to cut the single crystal round bar in a sectional mode, wherein the feeding speed of a cutter entering section is 15-25mm/min, the feeding speed of a middle section is 40-60mm/min, and the feeding speed of a cutter discharging section is 25-40 mm/min; the lengths of the cutter inlet section and the cutter outlet section are the same and are both 20-50 mm; the linear speed of the cutter feeding is 17-20m/s, the intermediate linear speed is 21-25m/s, and the linear speed of the cutter discharging is 16-19 m/s; in the cutting process, a water cooling continuous flow mode is adopted to cool the diamond wire and remove ineffective micro powder; cooling the cutting line and taking away invalid micro powder in a water cooling continuous flow mode, wherein the cooling liquid is tap water, and the flow of the whole cooling liquid is 40-60L/min;
fourthly, withdrawing the diamond wire in the shape of the Chinese character 'jing' after cutting is finished, and returning to the initial position; in order to avoid the influence of the adhesion of the edge skin and the square rod under the action of water on the cutter withdrawal, the edge skin can be moved away for a certain distance in advance;
and fifthly, moving the flaw-piece obtained by cutting to a corresponding position through a manipulator, and blanking the obtained crystal bar.
The invention is further illustrated by the following specific examples.
Example 1:
a cutting device for a large-size round monocrystal rod is characterized in that a diamond wire shaped like a Chinese character 'jing' is arranged in a cutting chamber, and is arranged at one end of the round monocrystal rod and parallel to the end face of the round monocrystal rod; the diamond wire shaped like a Chinese character 'jing' comprises warps and wefts, the warps are arranged in front of the diamond wire, the wefts are arranged behind the diamond wire, the warps and the wefts are two in number, the two ends of each warp are respectively connected with a warp sheave, the warp sheaves are respectively arranged on the top surface and the bottom surface of the inner wall of a cutting chamber, the two ends of each weft are respectively connected with a weft sheave, the weft sheaves are respectively arranged on the left side and the right side of the inner wall of the cutting chamber, sheave screws are arranged on four sides of the inner wall of the cutting chamber, and the warp. Be equipped with the flaw-piece clamping device on the cutting chamber inner wall, the flaw-piece clamping device includes four, and four flaw-piece clamping device correspond four flaw-pieces that the cutting of single crystal pole obtained respectively, and every flaw-piece clamping device is including two cylinders that set up relatively, and the cylinder passes through the manipulator and connects on the cutting chamber inner wall. The front end and the rear end of the single crystal round bar are respectively provided with a fixed sucker, and the fixed suckers are connected with the front end and the rear end of the cutting chamber through sucker screws.
A method for cutting a large-size single crystal round rod comprises the following specific steps:
step 4, adopting a diamond wire shaped like a Chinese character 'jing' to enter from the end face of the single crystal round bar, and cutting the single crystal round bar in a sectional mode, wherein the feeding speed of a cutter entering section is 20mm/min, the feeding speed of a middle section is 50mm/min, and the feeding speed of a cutter discharging section is 30 mm/min; the lengths of the cutter inlet section and the cutter outlet section are the same and are both 30 mm; the linear speed of the cutter feeding is 18m/s, the intermediate linear speed is 22m/s, and the linear speed of the cutter discharging is 18 m/s; in the cutting process, a water cooling continuous flow mode is adopted to cool the diamond wire and remove ineffective micro powder; cooling the cutting line and taking away invalid micro powder in a water cooling continuous flow mode, wherein the cooling liquid is tap water, and the flow of the whole cooling liquid is 50L/min;
step 5, withdrawing the diamond wire in the shape of the Chinese character 'jing' after the cutting is finished, and returning to the initial position;
and 6, moving the flaw-piece obtained by cutting to a corresponding position through a manipulator, and blanking the obtained crystal bar.
Example 2
A method for cutting a large-size single crystal round rod comprises the following specific steps:
step 4, adopting a diamond wire shaped like a Chinese character 'jing' to enter from the end face of the single crystal round bar, and carrying out sectional cutting on the single crystal round bar, wherein the feeding speed of a cutter entering section is 15mm/min, the feeding speed of a middle section is 40mm/min, and the feeding speed of a cutter discharging section is 25 mm/min; the lengths of the cutter inlet section and the cutter outlet section are the same and are both 20 mm; the linear speed of the cutter feeding is 17m/s, the linear speed of the middle cutter is 21m/s, and the linear speed of the cutter discharging is 16 m/s; in the cutting process, a water cooling continuous flow mode is adopted to cool the diamond wire and remove ineffective micro powder; cooling the cutting line and taking away invalid micro powder in a water cooling continuous flow mode, wherein the cooling liquid is tap water, and the flow of the whole cooling liquid is 40L/min;
step 5, withdrawing the diamond wire in the shape of the Chinese character 'jing' after the cutting is finished, and returning to the initial position;
and 6, moving the flaw-piece obtained by cutting to a corresponding position through a manipulator, and blanking the obtained crystal bar.
Example 3
A method for cutting a large-size single crystal round rod comprises the following specific steps:
step 4, adopting a diamond wire shaped like a Chinese character 'jing' to enter from the end face of the single crystal round bar, and carrying out sectional cutting on the single crystal round bar, wherein the feeding speed of a cutter entering section is 25mm/min, the feeding speed of a middle section is 60mm/min, and the feeding speed of a cutter discharging section is 40 mm/min; the lengths of the cutter inlet section and the cutter outlet section are the same and are both 50 mm; the linear speed of the cutter feeding is 20m/s, the linear speed of the middle cutter is 25m/s, and the linear speed of the cutter discharging is 19 m/s; in the cutting process, a water cooling continuous flow mode is adopted to cool the diamond wire and remove ineffective micro powder; cooling the cutting line and taking away invalid micro powder in a water cooling continuous flow mode, wherein the cooling liquid is tap water, and the flow of the whole cooling liquid is 60L/min;
step 5, withdrawing the diamond wire in the shape of the Chinese character 'jing' after the cutting is finished, and returning to the initial position;
and 6, moving the flaw-piece obtained by cutting to a corresponding position through a manipulator, and blanking the obtained crystal bar.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. A large-size single crystal round bar cutting device is characterized in that: and a diamond wire shaped like a Chinese character 'jing' is arranged in the cutting chamber, is arranged at one end of the single crystal round rod and is parallel to the end face of the single crystal round rod.
2. The large-sized single crystal round bar cutting apparatus according to claim 1, wherein: the diamond wire shaped like a Chinese character 'jing' comprises warps and wefts, wherein the warps and the wefts are arranged in front and back, two ends of each warp are respectively connected with a warp sheave, the warp sheaves are respectively arranged on the top surface and the bottom surface of the inner wall of the cutting chamber, two ends of each weft are respectively connected with a weft sheave, and the weft sheaves are respectively arranged on the left side and the right side of the inner wall of the cutting chamber;
preferably, the warp and the weft are both two.
3. The large-sized single crystal round bar cutting apparatus according to claim 2, wherein: the four sides of the inner wall of the cutting chamber are provided with grooved wheel lead screws, and the warp grooved wheels and the weft grooved wheels are fixed on the corresponding grooved wheel lead screws.
4. A large-size single crystal round bar cutting apparatus according to any one of claims 1 to 3, wherein: the inner wall of the cutting chamber is provided with a flaw-piece clamping device which can fix the cut flaw-pieces;
preferably, the edge skin clamping devices comprise four edge skins, and the four edge skin clamping devices respectively correspond to the four edge skins obtained by cutting the single crystal round rod;
preferably, each said flaw-piece clamping device comprises two oppositely arranged air cylinders, and said air cylinders are connected to the inner wall of said cutting chamber by a manipulator.
5. The large-sized single crystal round bar cutting apparatus according to claim 4, wherein: the front end and the rear end of the single crystal round bar are respectively provided with a fixed sucker, and the fixed suckers are connected with the front end and the rear end of the cutting chamber through sucker screws.
6. A method for cutting a large-size single crystal round rod is characterized by comprising the following steps: and cutting the single crystal round rod at one end of the single crystal round rod along the axis direction of the single crystal round rod through a diamond wire in a shape of a Chinese character 'jing'.
7. The method for cutting a large-sized single crystal round bar according to claim 6, wherein: the cutting comprises a cutter inlet section, a middle section and a cutter outlet section, wherein the feeding speed of the cutter inlet section and the cutter outlet section is less than that of the middle section, and the linear speed of the cutter inlet section and the cutter outlet section is less than that of the middle section;
preferably, the feeding speed of the cutter entering section is 15-25mm/min, the feeding speed of the middle section is 40-60mm/min, and the feeding speed of the cutter discharging section is 25-40 mm/min;
preferably, the length of the cutter inlet section is the same as that of the cutter outlet section, and the lengths of the cutter inlet section and the cutter outlet section are both 20-50 mm.
Preferably, the linear speed of the feeding knife is 17-20m/s, the intermediate linear speed is 21-25m/s, and the linear speed of the discharging knife is 16-19 m/s.
8. The method for cutting a large-size single crystal round bar according to claim 6 or 7, wherein: the specific cutting method is as follows:
firstly, taking and fixing a large-size single crystal round bar by a feeding clamp;
moving the manipulator to enable the cylinder to clamp the position of the side skin;
step three, adopting a diamond wire in a shape of a Chinese character 'jing' to enter from the end face of the single crystal round rod, carrying out sectional cutting on the single crystal round rod, and adopting a water cooling continuous flow mode to cool the diamond wire and remove ineffective micro powder in the cutting process;
fourthly, withdrawing the diamond wire in the shape of the Chinese character 'jing' after cutting is finished, and returning to the initial position;
and fifthly, moving the flaw-piece obtained by cutting to a corresponding position through a manipulator, and blanking the obtained crystal bar.
9. The method for cutting a large-sized single crystal round bar according to claim 8, wherein: and step three, detecting the diameter of the single crystal round rod and the crystal line by using a measuring probe before cutting.
10. The method for cutting a large-sized single crystal round bar according to claim 8, wherein: and in the fourth step, the flow rate of the cooling liquid is 40-60L/min.
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| CN201910692584.6A CN112297256A (en) | 2019-07-30 | 2019-07-30 | Large-size single crystal round bar cutting device and method |
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| CN201910692584.6A CN112297256A (en) | 2019-07-30 | 2019-07-30 | Large-size single crystal round bar cutting device and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113601738A (en) * | 2021-07-16 | 2021-11-05 | 宇泽半导体(云南)有限公司 | Processing method for processing rectangular photovoltaic cell silicon wafer by using native single crystal silicon rod |
| CN113843906A (en) * | 2021-11-01 | 2021-12-28 | 青岛高测科技股份有限公司 | Silicon rod cutting control method and silicon rod cutting method of silicon rod cutting system |
| CN114589824A (en) * | 2021-11-01 | 2022-06-07 | 青岛高测科技股份有限公司 | Cutting device of silicon rod cutting system and silicon rod cutting system |
| CN115366274A (en) * | 2021-05-21 | 2022-11-22 | 内蒙古中环协鑫光伏材料有限公司 | Wafer rod squaring recovery device and recovery method |
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2019
- 2019-07-30 CN CN201910692584.6A patent/CN112297256A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115366274A (en) * | 2021-05-21 | 2022-11-22 | 内蒙古中环协鑫光伏材料有限公司 | Wafer rod squaring recovery device and recovery method |
| CN113601738A (en) * | 2021-07-16 | 2021-11-05 | 宇泽半导体(云南)有限公司 | Processing method for processing rectangular photovoltaic cell silicon wafer by using native single crystal silicon rod |
| CN113843906A (en) * | 2021-11-01 | 2021-12-28 | 青岛高测科技股份有限公司 | Silicon rod cutting control method and silicon rod cutting method of silicon rod cutting system |
| CN114589824A (en) * | 2021-11-01 | 2022-06-07 | 青岛高测科技股份有限公司 | Cutting device of silicon rod cutting system and silicon rod cutting system |
| CN114589824B (en) * | 2021-11-01 | 2024-02-02 | 青岛高测科技股份有限公司 | Cutting device of silicon rod cutting system and silicon rod cutting system |
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