CN112290375A - Wavelength tunable optical component - Google Patents

Wavelength tunable optical component Download PDF

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Publication number
CN112290375A
CN112290375A CN202011181929.0A CN202011181929A CN112290375A CN 112290375 A CN112290375 A CN 112290375A CN 202011181929 A CN202011181929 A CN 202011181929A CN 112290375 A CN112290375 A CN 112290375A
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China
Prior art keywords
laser
wavelength
temperature
optical component
light
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Pending
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CN202011181929.0A
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Chinese (zh)
Inventor
宋琛
王继罗
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Ruitai Weihai Electronic Technology Co ltd
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Ruitai Weihai Electronic Technology Co ltd
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Priority to CN202011181929.0A priority Critical patent/CN112290375A/en
Publication of CN112290375A publication Critical patent/CN112290375A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0085—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for modulating the output, i.e. the laser beam is modulated outside the laser cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0267—Integrated focusing lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention relates to a wavelength tunable optical component, which comprises an XMD packaging shell, a laser, a temperature control module, a monitoring chip and a coupling lens, wherein the laser, the temperature control module, the monitoring chip and the coupling lens are respectively arranged in the XMD packaging shell; the coupling lens is used for being coupled with the laser under the effect of an external controller to emit light, so that the light wave is output in a parallel light or convergent light mode, the monitoring chip is used for detecting the light emitting state of the laser, if the light emitting state of the laser is abnormal, an abnormal prompt is sent to the external controller, and the temperature control module is used for controlling the temperature value of the light component with the tunable wavelength to be within a preset temperature range so as to stabilize the wavelength of the light wave. This technical scheme has realized that wavelength is adjustable and two functions of EML, and temperature control module can improve wavelength stability through adjusting the temperature value, adopts XMD encapsulation casing size to be fit for the miniaturized encapsulation requirement of module, has effectively improved heat dispersion for the use of optical module is more convenient.

Description

Wavelength tunable optical component
Technical Field
The invention relates to the technical field of optical fiber communication, in particular to an optical component with tunable wavelength.
Background
With the large-scale deployment of 5G, the construction of 5G bearer networks is receiving more and more attention. The forward transmission is an important part of the mobile return network, and the selection of the 5G forward transmission scheme directly influences the investment and construction efficiency of operators. From the analysis of optical fiber resources, the number of 5G forward-transmission construction base stations is increased by two to three times compared with that of the 4G era, and if the optical fiber direct-driving mode is only used, larger pressure is caused on the existing network optical cable.
The wavelength self-adaptive metropolitan area WDM access WDM of Port-intellectual Bi-directional access WDM (PAB-WDM, G.698.4 standard) is characterized in that: the capacity is big, DWDM, and wavelength self-adaptation (exempt from to configure), realizes based on pilot frequency and message channel, and single fiber is two-way, and the symmetry is good, and the time delay is low, and the shake is little, and saves the fiber resource of zooming out in a large number, and manageable is maintained, possesses succinct effective maintenance manageability, reduces the maintenance cost, improves and deploys the operation efficiency. The PAB-WDM technology is used for 5G forwarding, can reduce huge fiber resource consumption, and supports point-to-point, chain and ring networking. The method is used for scenes that the residual fiber cores are insufficient and the newly-built optical cable is difficult or high in cost, and the cost advantage is obvious. The DWDM wavelength tunable + EML technology has the advantages of multi-wavelength tunable and long-distance transmission, and is a preferred choice for realizing PAB-WDM wavelength self-adaptive metropolitan access, and the management and maintenance are simple and efficient.
At present, the main packaging mode of the optical module is the traditional TO base packaging. Although the TO base packaging mode is simple and convenient, the TO base packaging mode is limited by small size and low speed, can not simultaneously meet two functions of wavelength adjustability and EML, has poor heat dissipation performance, only supports commercial-grade application, and causes the optical module TO be inconvenient TO use.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a wavelength tunable optical module, so as to overcome the problem of inconvenient use of the existing optical module.
In order to achieve the purpose, the invention adopts the following technical scheme:
a wavelength tunable optical component comprises an XMD packaging shell, a laser, a temperature control module, a monitoring chip and a coupling lens, wherein the laser, the temperature control module, the monitoring chip and the coupling lens are respectively arranged in the XMD packaging shell;
the laser is used for emitting light waves under the action of an external controller; the laser is an EML laser with tunable wavelength;
the coupling lens is arranged at a light wave emitting end of the laser, and the coupling lens is used for coupling light with the laser under the action of the external controller so as to output the light wave in a form of parallel light or convergent light;
the monitoring chip is used for detecting the light emitting state of the laser, and if the light emitting state of the laser is abnormal, an abnormal prompt is sent to the external controller;
the temperature control module is used for controlling the temperature value of the optical component with tunable wavelength to be within a preset temperature range so as to stabilize the wavelength of the light wave.
Further, in the above optical component with tunable wavelength, the temperature control module includes a temperature detection unit and a temperature adjustment unit;
the temperature detection unit is connected with the temperature adjusting unit;
the temperature detection unit is used for detecting the temperature value;
the temperature adjusting unit is used for adjusting the temperature according to the temperature value, so that the temperature value of the optical assembly is within a preset temperature range, and the wavelength of the light wave is stabilized.
Further, the wavelength tunable optical component described above, the temperature detection unit includes a thermistor;
the temperature adjustment unit includes a semiconductor refrigerator.
Further, the above wavelength tunable optical component further includes a first ceramic block pad;
the monitoring chip, the thermistor and the laser are all arranged on the first ceramic cushion block.
Further, the above wavelength tunable optical component further includes a second ceramic block pad;
the second ceramic block cushion block is arranged between the first ceramic block cushion block and the semiconductor refrigerator;
the coupling lens is arranged on the second ceramic block cushion block.
Further, the above wavelength tunable optical component further includes a bypass resistor-capacitor for impedance matching;
the bypass resistor-capacitor is connected with the radio frequency end of the laser in parallel and arranged on the first ceramic block cushion block.
Further, in the above wavelength tunable optical component, the wavelength interval of the light waves is 50GHz or 100 GHz;
the operating speed of the laser comprises 25Gbps and can be downward compatible.
Further, the above wavelength tunable optical component, the laser is used for modulating and emitting optical signals with N wavelengths;
wherein, N is a natural number between 1 and 32.
Further, in the above optical component with tunable wavelength, the XMD package housing is provided with a housing pin, and the external control device is connected to the laser through the housing pin;
the frequency bandwidth of the XMD packaging shell is more than or equal to 25GHz, the transmission rate of 28Gbps is met, and the XMD packaging shell is downward compatible with the transmission rate of 10 Gbps.
Further, in the wavelength tunable optical component described above, the XMD package housing adopts a hermetic package.
The invention relates to a wavelength tunable optical component, which comprises an XMD packaging shell, a laser, a temperature control module, a monitoring chip and a coupling lens, wherein the laser, the temperature control module, the monitoring chip and the coupling lens are respectively arranged in the XMD packaging shell; the monitoring chip is used for detecting the light emitting state of the laser, if the light emitting state of the laser is abnormal, an abnormal prompt is sent to the external controller, and the temperature control module is used for controlling the temperature value of the light component with the tunable wavelength to be within a preset temperature range so as to stabilize the wavelength of the light wave. By adopting the technical scheme, two functions of wavelength adjustability and EML are realized, the temperature control module can improve the wavelength stability by adjusting the temperature value, XMD packaging is adopted, the size of the shell is suitable for the requirement of module miniaturization packaging, and the heat dissipation performance is effectively improved when the whole volume of the shell is not increased, so that the optical module is more convenient to use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a block diagram provided by one embodiment of a wavelength tunable optical assembly of the present invention;
FIG. 2 is an internal structural view of FIG. 1;
FIG. 3 is a view in the direction A of FIG. 2;
fig. 4 is a view along direction B in fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Fig. 1 is a structural view provided with one embodiment of a wavelength tunable optical component of the present invention, fig. 2 is an internal structural view of fig. 1, fig. 3 is a view along direction a of fig. 2, and fig. 4 is a view along direction B of fig. 2.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the wavelength tunable optical component of the present embodiment includes an XMD package housing 10, and a laser 11, a temperature control module 12, a monitoring chip 13 and a coupling lens 14 respectively disposed in the XMD package housing 10.
In a specific embodiment, the XMD package housing 10 is a housing of an optical communication device, and is a metal wall-ceramic insulator structure, which provides an electrical signal transmission channel and an optical coupling interface for internal devices, provides mechanical support and hermetic protection, solves the problem of interconnection between a chip and an external circuit, and is used to package various optical communication devices such as optoelectronic transmitting and receiving devices and optical switches, and high-power lasers. The frequency bandwidth of the XMD package housing 10 of the present embodiment is 25GHz or more, meets 28Gbps transmission rate, and is downward compatible to 10Gbps transmission rate.
The laser 11 may be connected to an external controller, which emits light waves. In a specific embodiment, the laser 11 is a wavelength tunable EML laser, i.e. the laser 11 of the present embodiment has the dual functions of an EML laser chip and a DBR laser chip. In a specific embodiment, the tunable optical wavelength range of the optical wave is C-band (1529-. The wavelength interval of the optical waves is 50GHz or 100GHz, the operating speed of the laser 11 includes but is not limited to 25Gbps, and the downward compatibility is realized.
The coupling lens 14 is disposed at a light wave emitting end of the laser 11, and the coupling lens 14 is configured to couple light out of the laser 11 under the action of an external controller, so that the light wave is output in the form of parallel light or convergent light.
The monitor chip 13 is used for detecting the light emitting state of the laser 11 and determining whether the laser 11 emits light normally. If the light emitting state of the laser 11 is abnormal, an abnormal prompt is sent to an external controller, so that a worker can maintain and debug in time, and excessive loss is avoided. In a specific embodiment, the monitoring Chip is a laser backlight monitoring photodetector Chip (Monitor PD Chip), and the monitoring Chip 13 may be disposed at the rear end of the laser 11, as shown in fig. 1.
The temperature control module 12 is configured to control a temperature in the wavelength tunable optical component, and control a temperature value of the wavelength tunable optical component within a preset temperature range to stabilize a wavelength of the light wave, and also to realize heat dissipation in the wavelength tunable optical component. In addition, the temperature range in this embodiment may be set by a worker according to actual conditions, and the present embodiment is not limited herein.
The wavelength tunable optical component of the present embodiment includes an XMD package housing 10, and a laser 11, a temperature control module 12, a monitoring chip 13 and a coupling lens 14 respectively disposed in the XMD package housing 10, where the laser 11 is configured to emit a light wave under the action of an external controller; the laser 11 is a wavelength tunable EML laser, the coupling lens 14 is disposed at a light wave emitting end of the laser 11, the coupling lens 14 is used for coupling light with the laser 11 under the action of an external controller, so that the light waves are output in a form of parallel light or convergent light, the monitoring chip 13 is used for detecting a light emitting state of the laser 11, if the light emitting state of the laser 11 is abnormal, an abnormal prompt is sent to the external controller, and the temperature control module 12 is used for controlling a temperature value of the wavelength tunable optical component to be within a preset temperature range so as to stabilize the wavelength of the light waves. By adopting the technical scheme of the embodiment, two functions of wavelength adjustability and EML are realized, the temperature control module can improve the wavelength stability by adjusting the temperature value, an XMD packaging shell is adopted, the size of the shell is suitable for the requirement of module miniaturization packaging, the heat dissipation performance is effectively improved while the whole volume is not increased, and the optical module is more convenient to use.
The wavelength tunable optical component of the embodiment can be applied to a 5G fronthaul optical module, and by deploying and using the wavelength tunable optical module in a 5G fronthaul optical network, signals with different wavelengths within a certain bandwidth can be dynamically selected and output, so that the utilization rate of the optical network is improved, the types of modules are reduced, the maintenance cost is reduced, and the deployment and operation efficiency is improved.
Further, in the wavelength tunable optical component of the present embodiment, the temperature control module 12 includes a temperature detecting unit 121 and a temperature adjusting unit 122. Wherein, the temperature detecting unit 121 may be connected to the temperature adjusting unit 122. The temperature detecting unit 121 is configured to detect a temperature value in the wavelength tunable optical component, and the temperature adjusting unit 122 is configured to adjust the temperature according to the temperature value, so that the temperature value of the optical component is within a preset temperature range, and the wavelength of the optical wave is stabilized. For example, if the temperature value is lower, the temperature value can be heated and increased, and if the temperature value is higher, the temperature value can be cooled and decreased. Generally, the operation of the temperature control module 12 is dominated by heat dissipation.
In a specific embodiment, the temperature sensing unit 121 includes a thermistor, and the temperature adjusting unit 122 includes a semiconductor cooler (TEC). Among them, the thermistor of the temperature detection unit 121 may be disposed at one side of the laser 11, as shown in fig. 1. The TEC is a device capable of heating and cooling, and the TEC performs heating or cooling operation under the control of the temperature detection unit 121, so that the temperature value of the optical component is within a preset temperature range to stabilize the wavelength of the light wave.
Further, the optical component with tunable wavelength of this embodiment further includes a first ceramic block pad 15, where the first ceramic block pad 15 provides a platform for placing the monitoring chip 13, the thermistor, and the laser 11, and the monitoring chip 13, the thermistor, and the laser 11 can all be disposed on the first ceramic block pad 15.
Further, the wavelength tunable optical component of the present embodiment further includes a second ceramic block 16. The second ceramic block 16 provides a resting platform for the first ceramic block 15 and the coupling lens 14, and the first ceramic block 15 and the coupling lens 14 may rest on the second ceramic block 16. Wherein the semiconductor refrigerator may be disposed on the other side of the second ceramic block pad 16, that is, the second ceramic block pad 16 is disposed between the first ceramic block pad 15 and the semiconductor refrigerator.
Ceramic material has stronger heat conductivity, and XMD encapsulation casing 10 that this implementation provided also has stronger heat conductivity, and the heat that produces when monitor chip 13, thermistor, laser instrument 11 and coupling lens 14 in the course of the work is more for when the temperature in the tunable optical assembly of wavelength is higher, can dispel the heat through TEC, encapsulation casing 10 again through first ceramic piece cushion 15, second ceramic piece cushion 16. For TO base packaging mode, the tunable optical subassembly of wavelength of this embodiment provides bigger heat radiating area, has higher radiating effect, and the tunable optical subassembly of wavelength of this embodiment still keeps the encapsulated form of small volume moreover, makes it can integrate in standard module, has improved the use convenience.
Further, the wavelength tunable optical component of the present embodiment further includes a bypass resistor-capacitor 17, the first ceramic block 15 provides a connection location between the bypass resistor-capacitor 17 and the circuit, and the bypass resistor-capacitor 17 is disposed on the first ceramic block 15. The bypass resistor-capacitor 17 provides impedance matching for the radio frequency end of the laser 11, and can also suppress alternating current components and suppress voltage noise. In one specific embodiment, the bypass resistor-capacitor 17 is connected in parallel with the rf end of the laser 11 in a plug-in manner, and is disposed at the side of the laser 11, as shown in fig. 4.
Further, in the wavelength tunable optical component of the present embodiment, the laser 11 is used for modulating and emitting optical signals with N wavelengths, where N is a natural number between 1 and 32. Specifically, the wavelength specification value ITU-T of the light wave is specified, and the tunable wavelength in this example can be 1 wavelength, or 2 wavelengths, or 3 wavelengths, and can be up to 32 wavelengths to meet the requirements of ITU-T.
Further, in the wavelength tunable optical component of the present embodiment, the XMD package housing 10 is provided with a housing pin 101, and the external control device is connected to the laser 11 through the housing pin 101. Specifically, the housing lead 101 is disposed at the rear end of the XMD package housing 10, and as shown in fig. 1, the electrical signal input and output of the optical component of the wavelength tunable optical component of the present embodiment are input and output through the housing lead 101 and the bonded gold wire lead 18.
Further, in the wavelength tunable optical component of the present embodiment, the XMD package housing 10 adopts a hermetic package.
By adopting the technical scheme of the embodiment, two functions of adjustable wavelength and EML are realized, the heat dissipation performance of the temperature control module 12 can be effectively improved by adjusting the temperature value, and the use convenience of the optical module is greatly improved. The wavelength tunable optical component of the embodiment can be applied to a 5G fronthaul optical module, and by deploying and using the wavelength tunable optical module in a 5G fronthaul optical network, signals with different wavelengths within a certain bandwidth can be dynamically selected and output, so that the utilization rate of the optical network is improved, the types of modules are reduced, the maintenance cost is reduced, and the deployment and operation efficiency is improved.
It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments.
It should be noted that the terms "first," "second," and the like in the description of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Further, in the description of the present invention, the meaning of "a plurality" means at least two unless otherwise specified.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (10)

1. The optical component is characterized by comprising an XMD packaging shell, a laser, a temperature control module, a monitoring chip and a coupling lens, wherein the laser, the temperature control module, the monitoring chip and the coupling lens are respectively arranged in the XMD packaging shell;
the laser is used for emitting light waves under the action of an external controller; the laser is an EML laser with tunable wavelength;
the coupling lens is arranged at a light wave emitting end of the laser, and the coupling lens is used for coupling light with the laser under the action of the external controller so as to output the light wave in a form of parallel light or convergent light;
the monitoring chip is used for detecting the light emitting state of the laser, and if the light emitting state of the laser is abnormal, an abnormal prompt is sent to the external controller;
the temperature control module is used for controlling the temperature value of the optical component with tunable wavelength to be within a preset temperature range so as to stabilize the wavelength of the light wave.
2. A wavelength tunable optical component according to claim 1, wherein the temperature control module comprises a temperature detection unit and a temperature adjustment unit;
the temperature detection unit is connected with the temperature adjusting unit;
the temperature detection unit is used for detecting the temperature value;
the temperature adjusting unit is used for adjusting the temperature according to the temperature value, so that the temperature value of the optical assembly is within a preset temperature range, and the wavelength of the light wave is stabilized.
3. A wavelength tunable optical component according to claim 2, wherein said temperature sensing unit comprises a thermistor;
the temperature adjustment unit includes a semiconductor refrigerator.
4. A wavelength tunable optical component according to claim 3, further comprising a first ceramic block spacer;
the monitoring chip, the thermistor and the laser are all arranged on the first ceramic cushion block.
5. A wavelength tunable optical component according to claim 4 further comprising a second ceramic block spacer;
the second ceramic block cushion block is arranged between the first ceramic block cushion block and the semiconductor refrigerator;
the coupling lens is arranged on the second ceramic block cushion block.
6. A wavelength tunable optical component according to claim 4 further comprising a shunt resistor-capacitor for impedance matching;
the bypass resistor-capacitor is connected with the radio frequency end of the laser in parallel and arranged on the first ceramic block cushion block.
7. A wavelength tunable optical component according to claim 1, wherein the wavelength interval of the optical waves is 50GHz or 100 GHz;
the operating speed of the laser comprises 25Gbps and can be downward compatible.
8. A wavelength tunable optical component according to claim 1 wherein said laser is operative to modulate optical signals emitting N wavelengths;
wherein, N is a natural number between 1 and 32.
9. A wavelength tunable optical component according to claim 1, wherein said XMD package housing is provided with housing pins through which said external control device is connected to said laser;
the frequency bandwidth of the XMD packaging shell is more than or equal to 25GHz, the transmission rate of 28Gbps is met, and the XMD packaging shell is downward compatible with the transmission rate of 10 Gbps.
10. A wavelength tunable optical component according to any one of claims 1-9, wherein said XMD package body is hermetically sealed.
CN202011181929.0A 2020-10-29 2020-10-29 Wavelength tunable optical component Pending CN112290375A (en)

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Citations (9)

* Cited by examiner, † Cited by third party
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