CN112289727A - Chip position adjusting mechanism and chip transmission mechanism - Google Patents
Chip position adjusting mechanism and chip transmission mechanism Download PDFInfo
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- CN112289727A CN112289727A CN202011188282.4A CN202011188282A CN112289727A CN 112289727 A CN112289727 A CN 112289727A CN 202011188282 A CN202011188282 A CN 202011188282A CN 112289727 A CN112289727 A CN 112289727A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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Abstract
The invention provides a chip position adjusting mechanism and a chip transmission mechanism, wherein the position adjusting mechanism comprises a first adjusting module and a second adjusting module, and the first adjusting module comprises a first adjusting plate, a second adjusting plate, a first connecting piece and a first adjusting piece; the relative position of the first adjusting plate and the second adjusting plate in the horizontal direction is adjusted through the first adjusting piece; the second adjusting module comprises an installation base and an adjusting component for supporting and adjusting, and the posture of the second adjusting plate relative to the installation base is adjusted through the adjusting component. The position of the chip is adjusted in multiple directions through the first adjusting module and the second adjusting module so as to adjust the posture of the chip and reduce the alignment difficulty and the alignment cost of the AA process; in addition, the first adjusting module and the second adjusting module have the function of calibrating the chip jig, and the position precision of the chip jig is improved through periodic calibration.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing precision, in particular to a chip position adjusting mechanism.
Background
The semiconductor is widely applied to the fields of mobile phones, automobiles, sensors and the like, the technology of the semiconductor serving as a core component of the mobile phones and computers is increasingly enhanced, the social demand is gradually increased, the semiconductor tends to be miniaturized, and the manufacturing quantity is huge.
With the gradual increase of the requirements of the camera, the requirements on the manufacturing precision of the semiconductor are also increased. An optical active Alignment apparatus, i.e., an aa (active Alignment machine) process, is usually required in the semiconductor manufacturing process. The AA process can adjust all six degrees of freedom of the camera to realize the alignment function, and is a commonly used adjustment process in the prior art.
When the semiconductor is transferred to a designated location by the pick-up device before the AA process is performed, a difference in posture of the semiconductor product before the AA process is performed is large, increasing the alignment difficulty and the alignment cost of the AA process.
Disclosure of Invention
In view of this, the present invention provides a chip position adjusting mechanism, which reduces the alignment difficulty and the alignment cost of the AA process.
In order to solve the above technical problems, the present invention provides a chip position adjusting mechanism.
According to the chip position adjustment mechanism of the embodiment of the invention, the chip position adjustment mechanism comprises:
the first adjusting module comprises a first adjusting plate, a second adjusting plate, a first connecting piece and a first adjusting piece; a jig for placing a chip is fixedly arranged on the first adjusting plate; the first adjusting plate and the second adjusting plate are movably connected through the first connecting piece, and the relative position of the first adjusting plate and the second adjusting plate in the horizontal direction is adjusted through the first adjusting piece;
the second adjusting module comprises a mounting base and an adjusting component for supporting and adjusting; the adjusting component is arranged between the second adjusting plate and the mounting base; the posture of the second adjusting plate relative to the mounting base is adjusted through the adjusting component.
Preferably, a side edge of the second adjusting plate extends vertically to form a side plate, and the side plate is parallel to a side surface of the first adjusting plate; and the two ends of the first connecting piece and the first adjusting piece are respectively connected with the side surfaces of the side plate and the first adjusting plate.
Preferably, be equipped with a plurality of fixed orificess on the first regulating plate, work as first regulating part accomplishes the regulation back, through the fixed orifices will first regulating plate and second regulating plate fixed connection.
Preferably, the adjusting assembly comprises a second connecting piece and a second adjusting piece, one end of the second adjusting piece and one end of the second connecting piece are fixedly installed at the bottom end of the second adjusting plate, and the other end of the second adjusting piece are movably installed on the surface of the installing base.
Preferably, the second connecting piece comprises a bearing steel ball and a plurality of elastic pieces, the bearing steel ball for bearing weight is fixedly arranged on the mounting base, and the elastic pieces are uniformly distributed and arranged on the mounting base.
Preferably, a turntable is arranged on the second adjusting piece, the distance between the second adjusting plate and the mounting base is adjusted through rotating the turntable, and the second adjusting plate is leveled to the end, relative to the posture of the mounting base.
The invention also provides a chip transmission mechanism with any one of the chip position adjusting mechanisms, which comprises:
the chip position adjusting mechanism;
the first displacement module comprises a base, a first slide rail, a first driving assembly, a first sliding seat and a first bearing plate; the first slide rail and the first driving assembly are fixedly arranged on the base; the first sliding rail is connected with the first sliding seat in a sliding manner; the first sliding seat is fixedly connected with the first bearing plate; the first sliding seat and the first bearing plate reciprocate along the direction of the first sliding rail under the driving force of the first driving assembly;
the second displacement module comprises a second slide rail, a second slide seat, a second driving assembly, a vertical plate, a fourth slide rail, a third slide seat and a third driving assembly; the second sliding seat is connected with the second sliding rail in a sliding manner and reciprocates along the direction of the second sliding rail under the driving force of the second driving assembly;
the vertical plate is vertically and fixedly arranged on the second sliding seat, the third driving assembly and the fourth sliding rail are fixedly arranged on the side surface of the vertical plate, and the third sliding seat is connected with the fourth sliding rail in a sliding manner; the third sliding seat reciprocates along the vertical direction of the second sliding rail under the driving force of the third driving assembly;
a chip jig module;
the mounting base is fixedly mounted on the third sliding seat, and the chip jig is fixedly mounted on the surface of the first adjusting plate; the chip jig moves in multiple directions under the driving force of the first driving assembly, the second driving assembly and the third driving assembly.
Preferably, still include magnetic spring, magnetic spring fixed mounting in on the riser, when third drive assembly stop work, magnetic spring slows down the third slider is at the effect of gravity downstream.
Preferably, the chip jig module includes:
the chip base is fixedly arranged on the first adjusting plate;
the chip fixing plate is used for placing a chip and is fixedly arranged on the chip base;
the micro gas joint is arranged on the chip fixing plate and used for inputting gas into the chip fixing plate;
the fourth driving assembly is fixedly arranged on the chip base;
the fourth sliding rail is fixedly arranged on the chip base;
and the sensor assembly moves along the direction of the fourth sliding rail under the driving force of the fourth driving assembly so as to approach or depart from the chip fixing plate.
Preferably, the sensor assembly comprises:
one end of the guide rail connecting block is connected with the fourth sliding rail in a sliding manner, the other end of the guide rail connecting block is connected with the fourth driving assembly, and the guide rail connecting block reciprocates along the direction of the fourth sliding rail under the driving force of the fourth driving assembly;
the sensor mounting plate is fixedly connected with the guide rail connecting block;
and the sensor is fixedly arranged on the sensor mounting plate.
The technical scheme of the invention has the following beneficial effects:
according to the chip position adjusting mechanism and the chip transmission mechanism provided by the embodiment of the invention, the chip position adjusting mechanism carries out multi-directional adjustment on the position of the chip through the first adjusting module and the second adjusting module so as to adjust the posture of the chip and reduce the alignment difficulty and the alignment cost of the AA process; in addition, the first adjusting module and the second adjusting module have the function of calibrating the chip jig, and the position precision of the chip jig is improved through periodic calibration.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a chip transfer mechanism according to an embodiment of the present invention;
FIG. 2 is a side view of a chip transport mechanism according to one embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a first displacement module of the chip transport mechanism according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a second displacement module of the chip transport mechanism according to an embodiment of the present invention;
FIG. 5 is a schematic view of an angle of a chip position adjustment mechanism according to an embodiment of the present invention;
FIG. 6 is a schematic view of another angle of the chip position adjustment mechanism according to one embodiment of the present invention;
fig. 7 is a schematic structural diagram of a chip jig of a chip position adjustment mechanism according to an embodiment of the invention.
Reference numerals:
a first displacement module 31; a base 311; a first slider 312; a first drive assembly 313; a first carrier plate 314; a first slide rail 315;
a second displacement module 32; a second slide rail 320; the second carrier plate 321; a connecting plate 322; a riser 323; a magnetic spring 324; a third slide 325; a fourth slide rail 326; a second slide 327; a third drive assembly 328; a second drive assembly 329;
an adjusting mechanism 33; a first regulation plate 331; a second regulation plate 332; a first adjustment member 333; a mounting base 334; an elastic member 335; a first connector 336; a bearing steel ball 337; a second adjustment member 338; a side panel 339;
a chip jig module 34; a sensor 340; a sensor mounting plate 341; a support connection block 342; a rail connecting block 343; a chip fixing plate 344; a chip pad 345; a chip 346; a fourth drive assembly 347; a micro air connector 348; a fifth slide 349.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
First, a chip position adjustment mechanism according to an embodiment of the present invention will be described in detail with reference to the drawings.
As shown in fig. 1 to 7, the chip position adjusting mechanism 33 according to the embodiment of the present invention includes a first adjusting module and a second adjusting module; wherein the content of the first and second substances,
the first adjusting module includes a first adjusting plate 331, a second adjusting plate 332, a first connecting member 336 and a first adjusting member 333; a jig for placing a chip is fixedly installed on the first adjustment plate 331; the first adjusting plate 331 and the second adjusting plate 332 are movably connected by a first connecting member 336, and the relative position of the first adjusting plate 331 and the second adjusting plate 332 in the horizontal direction is adjusted by a first adjusting member 333.
Specifically, the first adjusting plate 331 is provided with a plurality of fixing holes, and after the first adjusting member 333 completes adjustment, the first adjusting plate 331 and the second adjusting plate 332 are fixedly connected through the fixing holes. The fixing holes not only fixedly connect the first adjusting plate 331 and the second adjusting plate 332, but also fixedly mount the chip jig on the upper surface of the first adjusting plate 331, so as to adjust the posture of the chip jig through the first adjusting plate 331 and the second adjusting plate 332.
In one embodiment of the present invention, a side edge of the second regulating plate 332 vertically extends a side plate 339, the side plate 339 being parallel to a side surface of the first regulating plate 331; the first connecting member 336 and the first adjusting member 333 have opposite ends connected to the side surfaces of the side plate 339 and the first adjusting plate 331, respectively. As shown in fig. 5 and 6, the first adjustment plate 331 is stacked on the surface of the second adjustment plate 332 and connected by a first connector 336, and the first connector 336 is preferably a spring connecting the first adjustment plate 331 and a side plate 339 of the second adjustment plate 332. The first connecting member 336 is a spring, and the first adjusting plate 331 and the side plate 339 of the second adjusting plate 332 are rigidly engaged to cause damage. The first adjusting member 333 is preferably a nut, by which the horizontal distance between the first adjusting plate 331 and the second adjusting plate 332 is adjusted.
The second adjusting module comprises a mounting base 334 and an adjusting component for supporting and adjusting; the adjusting assembly is installed between the second adjusting plate 332 and the installation base 334; the attitude of the second adjustment plate 332 with respect to the mounting base 334 is adjusted by the adjustment assembly. The mounting base 334 is mounted in parallel at a lower position of the second adjusting plate 332 through an adjusting assembly connection. The adjusting assembly adjusts the attitude of the second adjusting plate 332 relative to the mounting base 334 to meet the requirements.
Specifically, the adjusting assembly includes a second connecting member and a second adjusting member 338, one end of the second adjusting member 338 and one end of the second connecting member are fixedly mounted on the bottom end of the second adjusting plate 332, and the other end is movably mounted on the surface of the mounting base 334.
The second connecting piece comprises a bearing steel ball 337 and a plurality of elastic pieces 335, the bearing steel ball 337 for bearing weight is fixedly arranged on the mounting base 334, and the elastic pieces 335 are uniformly distributed and arranged on the mounting base 334. The elastic members 335 provide a partial support function, and the first adjustment plate 331 and the second adjustment plate 332 themselves and the weight of the load are mainly distributed on the steel bearing ball 337 and the second adjustment member 338. The plurality of resilient members 335 are preferably springs that provide a partial support and also prevent rigid contact between the second adjustment plate 332 and the mounting base 334. The bearing steel ball 337 is mounted on the bottom of the second adjusting plate 332 and the surface of the mounting base 334, respectively, and the second adjusting plate 332 uses the bearing steel ball 337 as a fulcrum and utilizes the second adjusting member 338 to perform posture adjustment of any angle. The second adjusting member 338 is preferably a rotating disc that rotates to adjust the distance between the second adjusting plate 332 and the mounting base 334 to flatten the posture of the second adjusting plate 332 with respect to the mounting base. The first adjusting module and the second adjusting module respectively adjust the horizontal displacement and the angle posture of the chip jig, and the adjustment of any posture of the chip jig is met. The chip jig is adjusted in any posture before the AA process is carried out, so that the alignment difficulty in the AA process is reduced, and the alignment cost is reduced.
The invention also provides a chip transmission mechanism, which comprises a chip position adjusting mechanism 33, a first displacement module 31, a second displacement module 32 and a chip jig module 34; wherein the content of the first and second substances,
as shown in fig. 3, the first displacement module 31 includes a base 311, a first slide rail 315, a first driving assembly 313, a first slide carriage 312 and a first carrier 314; the first slide rail 315 and the first driving assembly 313 are fixedly mounted on the base 311; the first slide rail 315 is slidably connected to the first slide carriage 312; the first sliding base 312 is fixedly connected to the first carrier 314; the first slider 312 and the first carrier 314 reciprocate along the first sliding rail 315 under the driving force of the first driving assembly 313. The first driving unit 313 is preferably a bar motor, and the first carrier plate 314 reciprocates in the Y-axis direction by a driving force of the bar motor.
As shown in fig. 4, the second transmission assembly includes a second slide rail 320, a second slide 327, a second driving assembly 329, a vertical plate 323, a fourth slide rail 326, a third slide 325, and a third driving assembly 328; the second slide rail 320 is fixedly mounted on the first carrier plate 314, the second slide 327 is slidably connected to the second slide rail 320, and the second slide 327 reciprocates along the direction of the second slide rail 320 under the driving force of the second driving assembly 329. The second driving unit 329 is preferably a bar motor, and the second slide 327 reciprocates in the X-axis direction by the bar motor.
The vertical plate 323 is vertically and fixedly arranged on the second sliding seat 327, the third driving component 328 and the fourth sliding rail 326 are fixedly arranged on the side surface of the vertical plate 323, and the third sliding seat 325 is in sliding connection with the fourth sliding rail 326; the third slider 325 reciprocates in the vertical direction of the second slide rail 320 by the driving force of the third driving assembly 328. The third driving unit 328 is preferably a rod motor, and the third carriage 325 reciprocates in the Z-axis direction by a driving force of the rod motor. The second slide 327 is fixedly mounted with the second supporting plate 321, and the mounting base 334 is fixedly mounted with the second supporting plate 321. A connecting plate 322 is fixedly connected above the second driving component, and the connecting plate 322 is fixedly connected with a vertical plate 323.
A chip jig module 34;
the mounting base 334 is fixedly mounted on the third slide carriage 325, and the chip jig module 34 is fixedly mounted on the surface of the first adjusting plate 331; the chip jig module 34 performs multi-directional movement under the driving force of the first driving assembly 313, the second driving assembly 329, and the third driving assembly 328. The chip jig for placing the chip moves in the directions of an X axis, a Y axis and a Z axis under the drive of the three rod-shaped motors.
In one embodiment of the present invention, a magnetic spring 324 is further included, the magnetic spring 324 is fixedly mounted on the riser 323, and when the third driving assembly 328 stops working, the magnetic spring 324 slows down the downward movement of the third slide 325 under the action of gravity. The magnetic spring 324 acts as a buffer protection to avoid damage from rigid contact between the components.
As shown in fig. 7, the chip jig module 34 includes a chip base 345, a chip fixing plate 344, a micro air connector 348, a fourth driving assembly 347, a fifth slide rail 349 and a sensor assembly; wherein the content of the first and second substances,
the chip base 345 is fixedly installed on the first adjustment plate 331; a chip fixing plate 344 for placing a chip is fixedly mounted on the chip base 345; a micro gas joint 348 installed on the chip mounting plate 344 for introducing gas into the chip mounting plate 344; fourth drive component 347 is fixedly mounted to die pad 345; the fifth slide rail 349 is fixedly mounted on the chip base 345; the sensor assembly moves in the direction of the fifth slide rail 349 to approach or separate from the chip fixing plate 344 by the driving force of the fourth driving assembly 347.
Further, the sensor assembly comprises a guide rail connecting block 343, a sensor mounting plate 341 and a sensor; wherein the content of the first and second substances,
one end of the guide rail connecting block 343 is slidably connected to the fifth slide rail 349, the other end of the guide rail connecting block 343 is connected to the fourth driving assembly 347, and the guide rail connecting block 343 reciprocates along the direction of the fifth slide rail 349 under the driving force of the fourth driving assembly 347; the sensor mounting plate 341 is fixedly connected with the guide rail connecting block 343; the sensor is fixedly mounted on the sensor mounting plate 341. The fourth driving assembly 347 is preferably a cylinder, and the rail connecting block 343 reciprocates in the Z-axis direction by the cylinder. The sensor mounting plate 341 is connected to a support connection plate 342, and the support connection plate 342 is located below the sensor mounting plate 341.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A chip position adjustment mechanism, comprising an adjustment mechanism, the adjustment mechanism comprising:
a first adjusting module comprising a first adjusting plate (331), a second adjusting plate (332), a first connecting member (336) and a first adjusting member (333); a jig for placing a chip is fixedly arranged on the first adjusting plate (331); the first adjusting plate (331) and the second adjusting plate (332) are movably connected through the first connecting piece (336), and the relative position of the first adjusting plate (331) and the second adjusting plate (332) in the horizontal direction is adjusted through the first adjusting piece (333);
a second adjustment module comprising a mounting base (334), an adjustment assembly for support and adjustment; the adjusting component is installed between the second adjusting plate (332) and the installation base (334); adjusting a posture of the second adjustment plate (332) with respect to the mounting base (334) by the adjustment assembly.
2. The chip position adjustment mechanism according to claim 1, wherein a side edge of the second adjustment plate (332) vertically extends a side plate (339), the side plate (339) being parallel to a side surface of the first adjustment plate (331); the two ends of the first connecting piece (336) and the first adjusting piece (333) are respectively connected with the side surfaces of the side plate (339) and the first adjusting plate (331).
3. The chip position adjusting mechanism according to claim 2, wherein the first adjusting plate (331) is provided with a plurality of fixing holes, and when the first adjusting member (333) is adjusted, the first adjusting plate (331) and the second adjusting plate (332) are fixedly connected through the fixing holes.
4. The chip position adjusting mechanism according to claim 1, wherein the adjusting assembly comprises a second connecting member and a second adjusting member (338), one end of the second adjusting member (338) and the second connecting member is fixedly mounted on the bottom end of the second adjusting plate (332), and the other end is movably mounted on the surface of the mounting base (334).
5. The chip position adjusting mechanism according to claim 4, wherein the second connecting member comprises a bearing steel ball (337) and a plurality of elastic members (335), the bearing steel ball (337) for bearing weight is fixedly mounted on the mounting base (334), and the plurality of elastic members (335) are uniformly distributed and mounted on the mounting base (334).
6. The chip position adjustment mechanism according to claim 4, wherein a turntable is provided on the second adjustment member (338), and the turntable is rotated to adjust a distance between the second adjustment plate (332) and the mounting base (334) to level the posture of the second adjustment plate (332) with respect to the mounting base (334).
7. A chip transfer mechanism, comprising:
the chip position adjustment mechanism according to any one of claims 1 to 6;
the first displacement module (31), the first displacement module (31) comprises a base (311), a first slide rail (315), a first driving component (313), a first sliding seat (312) and a first bearing plate (314); the first sliding rail (315) and the first driving component (313) are fixedly arranged on the base (311); the first sliding rail (315) is connected with the first sliding seat (312) in a sliding manner; the first sliding seat (312) is fixedly connected with the first bearing plate (314); the first sliding seat (312) and the first bearing plate (314) reciprocate along the direction of the first sliding rail (315) under the driving force of the first driving assembly (313);
a second displacement module (32), wherein the second displacement module (32) comprises a second slide rail (320), a second slide carriage (327), a second driving component (329), a vertical plate (323), a fourth slide rail (326), a third slide carriage (325) and a third driving component (328); the second sliding rail (320) is fixedly arranged on the first bearing plate (314), the second sliding seat (327) is connected with the second sliding rail (320) in a sliding manner, and the second sliding seat (327) reciprocates along the direction of the second sliding rail (320) under the driving force of the second driving assembly (329);
the vertical plate (323) is vertically and fixedly arranged on the second sliding seat (327), the third driving component (328) and the fourth sliding rail (326) are fixedly arranged on the side surface of the vertical plate (323), and the third sliding seat (325) is in sliding connection with the fourth sliding rail (326); the third sliding seat (325) reciprocates along the vertical direction of the second sliding rail (320) under the driving force of the third driving assembly (328);
a chip jig module (34);
the mounting base (334) is fixedly mounted on the third sliding seat (325), and the chip jig module (34) is fixedly mounted on the surface of the first adjusting plate (331); the chip jig module (34) moves in multiple directions under the driving force of the first driving assembly (313), the second driving assembly (329) and the third driving assembly (328).
8. The chip transport mechanism according to claim 7, further comprising a magnetic spring (324), wherein the magnetic spring (324) is fixedly mounted on the vertical plate (323), and when the third driving assembly (328) stops working, the magnetic spring (324) slows down the downward movement of the third slide (325) under the action of gravity.
9. The chip transport mechanism according to claim 7, wherein the chip jig module (34) comprises:
a chip base (345), the chip base (324) is fixedly installed on the first adjusting plate (331);
a chip fixing plate (344), wherein the chip fixing plate (344) for placing a chip is fixedly arranged on the chip base (345);
a micro gas connector (348), the micro gas connector (348) being mounted on the chip fixing plate (344) for inputting gas into the chip fixing plate (344);
a fourth drive assembly (347), said fourth drive assembly (347) being fixedly mounted to said die pad (345);
a fifth slide rail (349), the fifth slide rail (349) being fixedly mounted on the chip base (345);
a sensor assembly moving in a direction of the fifth slide rail (349) to approach or separate from the chip fixing plate (344) by a driving force of the fourth driving assembly (347).
10. The chip transport mechanism as claimed in claim 9, wherein the sensor assembly comprises:
one end of the guide rail connecting block (343) is slidably connected with the fifth sliding rail (349), the other end of the guide rail connecting block (343) is connected with the fourth driving assembly (347), and the guide rail connecting block (343) reciprocates along the direction of the fifth sliding rail (349) under the driving force of the fourth driving assembly (347);
the sensor mounting plate (341) is fixedly connected with the guide rail connecting block (343);
the sensor (340), the sensor (340) is fixedly installed on the sensor installation plate (341).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011188282.4A CN112289727B (en) | 2020-10-30 | 2020-10-30 | Chip position adjusting mechanism and chip transmission mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011188282.4A CN112289727B (en) | 2020-10-30 | 2020-10-30 | Chip position adjusting mechanism and chip transmission mechanism |
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| Publication Number | Publication Date |
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| CN112289727A true CN112289727A (en) | 2021-01-29 |
| CN112289727B CN112289727B (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011188282.4A Active CN112289727B (en) | 2020-10-30 | 2020-10-30 | Chip position adjusting mechanism and chip transmission mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115201664A (en) * | 2022-07-29 | 2022-10-18 | 河北圣昊光电科技有限公司 | Chip detection device and chip testing machine with same |
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| JPH04233245A (en) * | 1990-07-06 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | System and method for inspection and alignment at semiconductor chip and conductor lead frame |
| US20130119566A1 (en) * | 2010-05-18 | 2013-05-16 | Edward Bok | Semiconductor Chip and Substrate Transfer/Processing Tunnel -arrangement Extending in a Linear Direction |
| CN108022865A (en) * | 2017-11-16 | 2018-05-11 | 北京创昱科技有限公司 | Wafer orientation and Load System |
| CN110449684A (en) * | 2019-08-13 | 2019-11-15 | 昆山佰奥智能装备股份有限公司 | Multiple conducting wire chip synchronous welding mechanism |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04233245A (en) * | 1990-07-06 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | System and method for inspection and alignment at semiconductor chip and conductor lead frame |
| US20130119566A1 (en) * | 2010-05-18 | 2013-05-16 | Edward Bok | Semiconductor Chip and Substrate Transfer/Processing Tunnel -arrangement Extending in a Linear Direction |
| CN108022865A (en) * | 2017-11-16 | 2018-05-11 | 北京创昱科技有限公司 | Wafer orientation and Load System |
| CN110449684A (en) * | 2019-08-13 | 2019-11-15 | 昆山佰奥智能装备股份有限公司 | Multiple conducting wire chip synchronous welding mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115201664A (en) * | 2022-07-29 | 2022-10-18 | 河北圣昊光电科技有限公司 | Chip detection device and chip testing machine with same |
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| CN112289727B (en) | 2021-11-19 |
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