CN112289201A - 一种led显示屏布局方法 - Google Patents

一种led显示屏布局方法 Download PDF

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CN112289201A
CN112289201A CN202010989929.7A CN202010989929A CN112289201A CN 112289201 A CN112289201 A CN 112289201A CN 202010989929 A CN202010989929 A CN 202010989929A CN 112289201 A CN112289201 A CN 112289201A
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Prior art keywords
led
display screen
led display
layout method
power supply
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赵立刚
宋光明
张有合
周杰
梁磊
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Huizhou Dewei Intelligent Technology Co ltd
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Huizhou Dewei Intelligent Technology Co ltd
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Priority to CN202010989929.7A priority Critical patent/CN112289201A/zh
Priority to US17/092,350 priority patent/US11552059B2/en
Publication of CN112289201A publication Critical patent/CN112289201A/zh
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
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Abstract

本发明公开了一种LED显示屏箱体，包括箱体(1)，所述箱体(1)的正面设有均匀排布的用于安装LED显示屏的安装口(2)，在所述安装口(2)之间设有间隔栏(3)，在所述间隔栏(3)的背面上设有用于安装电源的电源挂板(4)和用于固定电源挂板(4)的挂板孔(5)，在所述电源挂板(4)内设有电源(6)，在所述间隔栏(3)的正面上用于限定所述电源(6)的限位件(7)。解决现有LED显示屏箱体在电源维护困难的问题。

Description

一种LED显示屏布局方法
技术领域
本发明涉及LED显示屏领域，具体涉及一种LED显示屏布局方法。
背景技术
LED(Light Emitting Diode，发光二极管，简称LED)从1962年问世，经过近40年的发展，从早期的红色、黄绿色发展到现在的红绿蓝三基色色，封装形态也从早期的直插单灯、后来的矩阵模块发展到现在的贴片三合一全彩LED。
目前的三合一全彩LED显示屏的布局系具备三色的LED统一排列布局，这样布局设计简单，且生产工艺也比较简单。但是，当LED显示屏的屏体需要将模组旋转拼接的时候，由于模组上的LED排列方向是一致的，在旋转模组的相邻边界处，会出现蓝色的线条，影响显示屏的显示效果。如果要蓝色线条问题，按照传统的设计方法，需要设计和生产4种不同的LED显示模组进行拼接，这样会大幅提高设计和生产成本。
发明内容
本发明提供一种LED显示屏布局方法，解决现有采用三色的LED显示屏布局设计在旋转模组的相邻边界处，会出现蓝色的线条，影响显示屏的显示效果的问题。
为解决上述技术问题，本发明的技术方案是：一种LED显示屏布局方法，包括LED显示屏，所述LED显示屏通过多组LED模组拼接组成，每个所述LED模组包括四个三色LED灯，四个所述三色LED灯组成正方形，且四个所述三色LED灯的方向排列是由一个所述三色LED灯依次旋转90°排布。
优选的，所述LED显示屏上的每组所述LED模组都可插拔拆卸。
优选的，每组所述LED模组上的四个所述三色LED灯都固定连接。
优选的，每组所述LED模组上的四个所述三色LED灯通过焊接方式固定连接。
优选的，每组所述LED模组在插拔拆卸后可不区分正反面安装。
本发明实现的有益效果：(1)本发明的LED显示屏布局方法，将LED显示屏通过多组LED模组拼接组成，每个LED模组包括四个三色LED灯，四个三色LED灯组成正方形，且四个三色LED灯的方向排列是由一个所述三色LED灯依次旋转90°排布，这样的布局设计，当LED显示屏在旋转的时候，LED模组的相邻边界处不会出现蓝色的线条，不影响显示屏的显示效果。(2)本发明的LED显示屏布局方法，每组LED模组都是可以拆卸的，在出现损坏的时候，方便更换，且每组LED模组可以不区分正反的插拔安装操作。
附图说明
图1为本发明LED显示屏布局方法的组成的LED显示屏的在旋转时的部分放大平面图。
图2为本发明LED显示屏布局方法的组成的LED显示屏的每组LED模组和每个LED灯的排布放大图。
图3为传统的LED显示屏布局方法的组成的LED显示屏的在旋转时的部分放大平面图，其中，在中间方框圈住的地方即是出现蓝色的线条，影响显示屏的显示效果。
图4为LED显示屏整体示意图、拆分图及的每组LED模组和每个LED灯的排布放大图。
图5为LED显示屏组成的流程图。
图中的数字或字母代表的相应部件的名称或流程名称：1.LED显示屏；2.LED模组；3.三色LED灯。
附图仅用于示例性说明，不能理解为对本专利的限制；为了更好说明本实施例，附图某些部件会有省略、放大或缩小，并不代表实际产品的尺寸；对于本领域技术人员来说，附图中某些公知结构及其说明可能省略是可以理解的；相同或相似的标号对应相同或相似的部件；附图中描述位置关系的用语仅用于示例性说明，不能理解为对本专利的限制。
具体实施方式
为了便于本领域技术人员理解，下面将结合附图以及实施例对本发明进行进一步详细描述。具体如下：
如图1、2、5所示，LED显示屏布局方法，包括LED显示屏1，LED显示屏1通过多组LED模组2拼接组成，每个LED模组2包括四个三色LED灯3，每个三色LED灯由红、绿、蓝三色的三个发光二极管组成，如图1、2中的方框中圈住的，即为一个LED模组，四个三色LED灯3组成正方形，且四个三色LED灯3的方向排列是由一个三色LED灯3依次旋转90°排布，如图2所示。本实施例中这样的布局设计，当LED显示屏在旋转的时候，LED模组的相邻边界处不会出现蓝色的线条，不影响显示屏的显示效果。但是传统的会出现蓝色线条，如图4所示，传统的每个LED模组中的三色LED等都是一样的方向方式排布，且如图3所示，在中间方框圈住的地方即是出现蓝色的线条，影响显示屏的显示效果。
具体的，LED显示屏1上的每组LED模组2都可插拔拆卸，且每组LED模组2上的四个三色LED灯3都固定连接。本实例中的每组LED模组2在插拔拆卸后均可不区分正反面安装，每组LED模组2上的四个三色LED灯都是通过焊接固定连接。每组LED模组可以拆卸，在出现损坏的时候，方便更换。
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明权利要求的保护范围之内。

Claims (5)

1.一种LED显示屏布局方法，其特征在于：包括LED显示屏(1)，所述LED显示屏(1)通过多组LED模组(2)拼接组成，每个所述LED模组(2)包括四个三色LED灯(3)，四个所述三色LED灯(3)组成正方形，且四个所述三色LED灯(3)的方向排列是由一个所述三色LED灯(3)依次旋转90°排布。
2.根据权利要求1所述的LED显示屏布局方法，其特征在于：所述LED显示屏(1)上的每组所述LED模组(2)都可插拔拆卸。
3.根据权利要求1或2所述的LED显示屏布局方法，其特征在于：每组所述LED模组(2)上的四个所述三色LED灯(3)都固定连接。
4.根据权利要求3所述的LED显示屏布局方法，其特征在于：每组所述LED模组(2)上的四个所述三色LED灯(3)通过焊接方式固定连接。
5.根据权利要求3所述的LED显示屏布局方法，其特征在于：每组所述LED模组(2)在插拔拆卸后可不区分正反面安装。
CN202010989929.7A 2020-09-18 2020-09-18 一种led显示屏布局方法 Withdrawn CN112289201A (zh)

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US17/092,350 US11552059B2 (en) 2020-09-18 2020-11-09 LED display screen with rotated LED modules

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CN116663089B (zh) * 2023-07-24 2023-12-12 深圳市千岩科技有限公司 灯具安装配置方法、装置、设备及介质

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US6367949B1 (en) * 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
DE602007012927D1 (de) * 2006-11-27 2011-04-14 Philips Solid State Lighting Itlicher projektionsbeleuchtung
DE102007041193A1 (de) * 2007-08-31 2009-03-05 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul für eine Beleuchtungseinrichtung und Beleuchtungseinrichtung
US10818644B2 (en) * 2017-09-22 2020-10-27 Harvatek Corporation Display device
KR102342626B1 (ko) * 2018-03-13 2021-12-23 애플 인크. 직하형 백라이트 유닛들을 갖는 디스플레이들
US20220029060A1 (en) * 2018-11-26 2022-01-27 Ryujin Lab, Inc. Arrangement structure for electrode of micro led
CN211479566U (zh) * 2020-01-10 2020-09-11 深圳市三诺数字科技有限公司 一种led封装结构
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