CN112285434A - High-power microwave effect test system and method with monitoring and positioning functions - Google Patents
High-power microwave effect test system and method with monitoring and positioning functions Download PDFInfo
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Abstract
The invention provides a high-power microwave effect test system and a high-power microwave effect test method with a monitoring and positioning function. The invention enhances the testing capability and provides powerful support for the research of high-power microwave effect tests.
Description
Technical Field
The invention belongs to the technical field of microwaves, and particularly relates to a high-power microwave effect test system and method with a monitoring and positioning function.
Background
The high-power microwave effect test carried out on various electronic devices, particularly radio frequency front-end functional modules, is an important basis for finding out the electromagnetic environment adaptability of the devices and carrying out targeted protection and improvement. In the aspect of a high-power microwave effect test method, at present, microwave energy is mainly injected into a tested module (such as an amplitude limiter module and a low-noise amplifier module) through a directional coupler, another single-frequency-point and amplitude-fixed continuous wave reference working signal is provided and injected into the tested module, and an oscilloscope is used for monitoring incident, reflected and transmitted voltage waveforms. When the amplitude of the reflected or transmitted signal changes, the transmission coefficient of the tested module is changed, and therefore the physical damage of the module is judged. The test system is shown in FIG. 1.
The method can be used for online monitoring of signal waveforms at all positions in the injection test process, judging whether performance degradation occurs at a certain frequency point of a tested module, and calculating electromagnetic pulse energy absorbed by the module. However, this method has two problems: (1) the method is only suitable for judging whether the transmission coefficient of the tested module at a single frequency point changes or not, and the change condition of the transmission coefficient of the tested module in a specific frequency band before and after the test cannot be monitored on line; (2) when the tested module is damaged, the damaged part cannot be positioned, and the damage mechanism is determined. Therefore, it is necessary to research a new test method to realize online monitoring of the transmission coefficient of the tested module in the wide frequency band and rapid positioning of the damaged part in the electromagnetic pulse effect test.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the high-power microwave effect test system and method with the monitoring and positioning functions are used for monitoring the transmission coefficient of the effector broadband and positioning fault positions.
The technical scheme adopted by the invention for solving the technical problems is as follows: a high-power microwave effect test system with a monitoring and positioning function comprises a high-power microwave injection subsystem, a transmission coefficient measurement subsystem, a fault positioning subsystem and a function switching subsystem; the high-power microwave injection subsystem is used for injecting high-power microwaves into the tested module; if n is more than or equal to 1, when the number of the tested modules is n, the high-power microwave injection subsystem comprises a reflected power monitoring coupler, a first transmitted power monitoring coupler, …, an nth transmitted power monitoring coupler and a matched load; the reflected power monitoring coupler is used for monitoring the power of a reverse signal reflected from the tested module; the nth transmission power monitoring coupler is used for monitoring the transmission signal power output by the nth tested module; the transmission coefficient measuring subsystem is used for measuring the transmission coefficient of the tested module; the transmission coefficient measurement subsystem comprises a vector network analyzer and a DC blocking device; the fault positioning subsystem is used for positioning the fault of the tested module; the fault positioning subsystem comprises a step signal generator and a sampling oscilloscope; the step signal generator is used for outputting a fast rising edge pulse square wave signal and injecting the fast rising edge pulse square wave signal into the tested module; the sampling oscilloscope is used for monitoring the time domain voltage waveform of the port of the tested module; the function switch subsystem is used for switching the connection states of the high-power microwave injection subsystem, the transmission coefficient measurement subsystem, the fault positioning subsystem and the tested module; the function switch subsystem comprises a first transmission coefficient measurement switch, a second transmission coefficient measurement switch, …, a 2n transmission coefficient measurement switch, a first fault location measurement switch and a second fault location measurement switch; the input port of the first tested module is connected with the input port of the first transmission coefficient measurement change-over switch, the 1 state port of the first transmission coefficient measurement change-over switch is connected with the input port of the second fault location measurement change-over switch, and the 1 state port of the second fault location measurement change-over switch is connected with the reflected power monitoring coupler; the output port of the first tested module is connected with the input port of a second transmission coefficient measurement change-over switch, the 1 state port of the second transmission coefficient measurement change-over switch is sequentially connected with a first transmission power monitoring coupler and a second tested module, …, the nth tested module is connected with the input port of a (2n-1) th transmission coefficient measurement change-over switch, and the 1 state port of the (2n-1) th transmission coefficient measurement change-over switch is sequentially connected with an nth transmission power monitoring coupler and a matched load; the 0 state port of the first transmission coefficient measurement change-over switch is connected with a vector network analyzer through a first DC isolator, the vector network analyzer is connected with the input port of the 2n transmission coefficient measurement change-over switch, and the 1 state port of the 2n transmission coefficient measurement change-over switch is connected with the 0 state port of the (2n-1) transmission coefficient measurement change-over switch through the n DC isolator; the 0 state port of the second transmission coefficient measurement change-over switch is connected with the 0 state port of the 2n transmission coefficient measurement change-over switch through a second DC isolator; and the 0 state port of the second fault positioning and measuring change-over switch is connected with the input port of the first fault positioning and measuring change-over switch, the 1 state port of the first fault positioning and measuring change-over switch is respectively connected with the step signal generator and the sampling oscilloscope, and the 0 state port of the first fault positioning and measuring change-over switch is grounded.
According to the scheme, the high-power microwave injection subsystem further comprises a high-power microwave source, a circulator, a reference signal source, an isolator, a reference signal injection constant coupler, an incident power monitoring coupler, an attenuator, a detector and a digital storage oscilloscope; the reference signal injection fixed coupling is used for injecting a reference signal generated by a microwave signal source; the incident power monitoring coupler is used for monitoring the power of the forward high-power microwave signal injected into the tested module; the high-power microwave source is sequentially connected with the circulator, the reference signal injection constant coupler, the incident power monitoring coupler and the reflected power monitoring coupler; the reference signal source is connected with the coupling end of the reference signal injection constant coupling through the isolator; the incident power monitoring coupler, the reflected power monitoring coupler and the transmitted power monitoring coupler are respectively connected with a digital storage oscilloscope through an attenuator and a detector which are paired.
According to the scheme, the transmission coefficient measurement change-over switch and the fault location measurement change-over switch both adopt mechanical single-pole double-throw microwave switches.
Further, when the mechanical single-pole double-throw microwave switch is switched to the 1 state, the input port is communicated with the 1 state port; when the mechanical single-pole double-throw microwave switch is switched to the 0 state, the input port is communicated with the 0 state port.
A high-power microwave effect test method with a monitoring and positioning function comprises the following steps:
s1: determining the number of the tested modules, and building a corresponding high-power microwave effect test system with a monitoring and positioning function; the test system comprises a high-power microwave injection subsystem, a transmission coefficient measurement subsystem, a fault positioning subsystem and a function switching subsystem; setting n to be more than or equal to 1, when the number of the tested modules is n, the high-power microwave injection subsystem comprises a reflected power monitoring coupler, a first transmitted power monitoring coupler, …, an nth transmitted power monitoring coupler, a matched load, a high-power microwave source, a circulator, a reference signal source, an isolator, a reference signal injection coupler, an incident power monitoring coupler, an attenuator, a detector and a digital storage oscilloscope; the high-power microwave source is sequentially connected with the circulator, the reference signal injection constant coupler, the incident power monitoring coupler and the reflected power monitoring coupler; the reference signal source is connected with the coupling end of the reference signal injection constant coupling through the isolator; the incident power monitoring coupler, the reflected power monitoring coupler and the transmitted power monitoring coupler are respectively connected with a digital storage oscilloscope through an attenuator and a detector which are paired; the transmission coefficient measurement subsystem comprises a vector network analyzer and a DC blocking device; the barrier positioning subsystem comprises a step signal generator and a sampling oscilloscope; the function switch subsystem comprises a first transmission coefficient measurement switch, a second transmission coefficient measurement switch, …, a 2n transmission coefficient measurement switch, a first fault location measurement switch and a second fault location measurement switch; the input port of the first tested module is connected with the input port of the first transmission coefficient measurement change-over switch, the 1 state port of the first transmission coefficient measurement change-over switch is connected with the input port of the second fault location measurement change-over switch, and the 1 state port of the second fault location measurement change-over switch is connected with the reflected power monitoring coupler; the output port of the first tested module is connected with the input port of a second transmission coefficient measurement change-over switch, the 1 state port of the second transmission coefficient measurement change-over switch is sequentially connected with a first transmission power monitoring coupler and a second tested module, …, the nth tested module is connected with the input port of a (2n-1) th transmission coefficient measurement change-over switch, and the 1 state port of the (2n-1) th transmission coefficient measurement change-over switch is sequentially connected with an nth transmission power monitoring coupler and a matched load; the 0 state port of the first transmission coefficient measurement change-over switch is connected with a vector network analyzer through a first DC isolator, the vector network analyzer is connected with the input port of the 2n transmission coefficient measurement change-over switch, and the 1 state port of the 2n transmission coefficient measurement change-over switch is connected with the 0 state port of the (2n-1) transmission coefficient measurement change-over switch through the n DC isolator; the 0 state port of the second transmission coefficient measurement change-over switch is connected with the 0 state port of the 2n transmission coefficient measurement change-over switch through a second DC isolator; the 0 state port of the second fault positioning and measuring change-over switch is connected with the input port of the first fault positioning and measuring change-over switch, the 1 state port of the first fault positioning and measuring change-over switch is respectively connected with the step signal generator and the sampling oscilloscope, and the 0 state port of the first fault positioning and measuring change-over switch is grounded;
s2: injecting high-power microwaves into the tested module by the high-power microwave injection subsystem;
s3: the transmission coefficient measuring subsystem measures the transmission coefficient of the tested module through a vector network analyzer;
s4: sampling a time domain voltage waveform curve of a tested module port monitored by an oscilloscope, linearly converting the time domain voltage waveform curve into a characteristic impedance curve on a signal transmission path inside the tested module, and displaying the characteristic impedance curve to a user;
s5: and comparing characteristic impedance curves inside the tested module obtained by measurement before and after high-power microwave injection by a user, if the impedance at a certain position is obviously changed, judging the damage of the position, and further positioning the fault element by combining with circuit design.
Further, when n is 1, in step S2,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 1 state;
when n is 2, in the step S2,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the third transmission coefficient measurement changeover switch is switched to the 1 state,
the fourth transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 0 state,
the second fault location measurement diverter switch switches to the 1 state.
Further, when n is 1, in step S3,
the first transmission coefficient measurement changeover switch is switched to the 0 state,
the second transmission coefficient measurement changeover switch is switched to the 0 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
when n is 2, when the transmission coefficient of the first test module is measured in step S3,
the first transmission coefficient measurement changeover switch is switched to the 0 state,
the second transmission coefficient measurement changeover switch is switched to the 0 state,
the third transmission coefficient measurement changeover switch is switched to the 0 state,
the fourth transmission coefficient measurement changeover switch is switched to the 0 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
when the transmission coefficient after the first tested module and the second tested module are cascaded is measured,
the first transmission coefficient measurement changeover switch is switched to the 0 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the third transmission coefficient measurement changeover switch is switched to the 0 state,
the fourth transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
further, when n is 1, in step S4,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 1 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
when n is 2, in the step S4,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the third transmission coefficient measurement changeover switch is switched to the 1 state,
the fourth transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 1 state,
the second fault location measurement diverter switch switches to the 0 state.
A computer storage medium having stored therein a computer program executable by a computer processor, the computer program performing the assay method of any one of claims 5 to 8.
The invention has the beneficial effects that:
1. the high-power microwave effect test system and method with the monitoring and positioning functions realize the functions of monitoring the transmission coefficient of the effector broadband and positioning the fault part by adding the transmission coefficient measuring subsystem, the fault positioning subsystem and the function switching subsystem on the conventional test system.
2. The invention enhances the testing capability and provides powerful support for the research of high-power microwave effect tests.
Drawings
FIG. 1 is a connection diagram of a conventional RF front-end module electromagnetic pulse effect testing system.
Fig. 2 is a system connection diagram of the embodiment of the invention when the tested module is 1.
Fig. 3 is a system connection diagram of the embodiment of the invention when the tested module is 2.
Fig. 4 is a connection diagram of a fault location testing system according to an embodiment of the present invention.
Fig. 5 is a diagram of the results of the fault location in accordance with the embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, an embodiment of the present invention includes a high power microwave injection subsystem, a transmission coefficient measurement subsystem, a fault location measurement subsystem, and a function switch subsystem; the test system based on the invention develops three test items: high-power microwave injection test, transmission coefficient measurement and fault location measurement;
the high-power microwave injection subsystem is used for carrying out a high-power microwave injection test on a tested module, the transmission coefficient measurement subsystem is used for carrying out transmission system measurement on the tested module, the fault location measurement subsystem is used for carrying out fault location measurement on the tested module, and the function switch subsystem is used for switching the tested module among three different test items, namely the high-power microwave injection test, the transmission coefficient measurement and the fault location measurement;
the high-power microwave injection subsystem comprises a high-power microwave source, a circulator, a reference signal source, an isolator, a reference signal injection constant coupler, an incident power monitoring coupler, a reflected power monitoring coupler, a transmission power monitoring coupler, an attenuator, a detector and a digital storage oscilloscope;
the reference signal injection fixed coupling has the function of injecting a reference signal generated by a microwave signal source; the incident power monitoring coupler is used for monitoring the power of a forward high-power microwave signal injected into a tested module, the reflected power monitoring coupler is used for monitoring the power of a reverse signal reflected from the tested module, and the transmission power monitoring coupler is used for monitoring the power of a transmission signal output by the tested module;
the transmission coefficient measurement subsystem comprises a vector network analyzer and a DC blocking device;
the fault positioning and measuring subsystem comprises a step signal generator and a sampling oscilloscope;
and injecting a fast rising edge pulse square wave signal output by the step signal generator into the tested module, and monitoring the time domain voltage waveform of the port of the tested module by using the sampling oscilloscope. By linear transformation, the time domain curve of the port voltage waveform is transformed into a characteristic impedance curve on the signal transmission path inside the module under test. Comparing characteristic impedance curves inside the tested module obtained by measurement before and after a high-power microwave injection test, if the impedance at a certain position changes obviously, the position is damaged, and the circuit design is combined to judge which element has a problem.
The function switch subsystem comprises a plurality of transmission coefficient measurement switches and 2 fault location measurement switches.
When the number of the tested modules is n (n is more than or equal to 1), the number of the transmission coefficient measurement change-over switches is 2 n;
the transmission coefficient measurement change-over switch and the fault location measurement change-over switch both adopt mechanical single-pole double-throw microwave switches, and can bear higher peak power compared with a PIN diode switch usually adopted in a traditional switch matrix, so that a measuring instrument is effectively protected;
when the number of the tested modules is 1, the embodiment is shown in FIG. 2; the transmission coefficient measuring change-over switch 1, the transmission coefficient measuring change-over switch 2, the fault positioning change-over switch 1 and the fault positioning change-over switch 2 are used for switching among three test items of a high-power microwave injection test, a transmission coefficient measuring test and a fault positioning measuring test. The switch states when different test items were carried out are listed in the following table:
TABLE 1
When the number of the tested modules is 2, the system is formed as shown in FIG. 3; the switch states when different test items were carried out are listed in the following table:
TABLE 2
In fig. 3, the number of modules to be tested is 2 and the number of measurement switches used to the transmission system is 4; if the number of the tested modules is continuously increased, the number of the used change-over switches is correspondingly increased; assuming that the number of the tested modules is n, the number of the switches is 2 n.
And connecting a tested module according to the graph of fig. 4 and performing fault positioning measurement, wherein the tested module comprises a filtering module, an amplitude limiting module and a low-noise amplification module. As shown in fig. 5, when the fault location measurement switch 1, the fault location measurement switch 2, and the transmission system measurement switch 1 are in the 1, 0, and 1 states, the fast rising edge pulse square wave output by the step signal generator is injected into the module under test, and the sampling oscilloscope collects the voltage signal of the port. Through linear transformation, the time domain curve of the port voltage signal can be transformed into a characteristic impedance curve on a signal transmission path of the tested module. The two curves shown in fig. 5 are respectively characteristic impedance curves obtained before and after the high-power microwave is injected into the tested module, and it can be seen that the impedance at the positions of the 3 rd-stage and 4 th-stage elements has a significant change, which indicates that the two elements are damaged during the high-power microwave injection.
The above embodiments are only used for illustrating the design idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention accordingly, and the protection scope of the present invention is not limited to the above embodiments. Therefore, all equivalent changes and modifications made in accordance with the principles and concepts disclosed herein are intended to be included within the scope of the present invention.
Claims (9)
1. The utility model provides a high power microwave effect test system with monitoring locate function which characterized in that:
the system comprises a high-power microwave injection subsystem, a transmission coefficient measurement subsystem, a fault positioning subsystem and a function switching subsystem;
the high-power microwave injection subsystem is used for injecting high-power microwaves into the tested module; if n is more than or equal to 1, when the number of the tested modules is n, the high-power microwave injection subsystem comprises a reflected power monitoring coupler, a first transmitted power monitoring coupler, …, an nth transmitted power monitoring coupler and a matched load; the reflected power monitoring coupler is used for monitoring the power of a reverse signal reflected from the tested module; the nth transmission power monitoring coupler is used for monitoring the transmission signal power output by the nth tested module;
the transmission coefficient measuring subsystem is used for measuring the transmission coefficient of the tested module; the transmission coefficient measurement subsystem comprises a vector network analyzer and a DC blocking device;
the fault positioning subsystem is used for positioning the fault of the tested module; the fault positioning subsystem comprises a step signal generator and a sampling oscilloscope; the step signal generator is used for outputting a fast rising edge pulse square wave signal and injecting the fast rising edge pulse square wave signal into the tested module; the sampling oscilloscope is used for monitoring the time domain voltage waveform of the port of the tested module;
the function switch subsystem is used for switching the connection states of the high-power microwave injection subsystem, the transmission coefficient measurement subsystem, the fault positioning subsystem and the tested module; the function switch subsystem comprises a first transmission coefficient measurement switch, a second transmission coefficient measurement switch, …, a 2n transmission coefficient measurement switch, a first fault location measurement switch and a second fault location measurement switch;
the input port of the first tested module is connected with the input port of the first transmission coefficient measurement change-over switch, the 1 state port of the first transmission coefficient measurement change-over switch is connected with the input port of the second fault location measurement change-over switch, and the 1 state port of the second fault location measurement change-over switch is connected with the reflected power monitoring coupler;
the output port of the first tested module is connected with the input port of a second transmission coefficient measurement change-over switch, the 1 state port of the second transmission coefficient measurement change-over switch is sequentially connected with a first transmission power monitoring coupler and a second tested module, …, the nth tested module is connected with the input port of a (2n-1) th transmission coefficient measurement change-over switch, and the 1 state port of the (2n-1) th transmission coefficient measurement change-over switch is sequentially connected with an nth transmission power monitoring coupler and a matched load;
the 0 state port of the first transmission coefficient measurement change-over switch is connected with a vector network analyzer through a first DC isolator, the vector network analyzer is connected with the input port of the 2n transmission coefficient measurement change-over switch, and the 1 state port of the 2n transmission coefficient measurement change-over switch is connected with the 0 state port of the (2n-1) transmission coefficient measurement change-over switch through the n DC isolator;
the 0 state port of the second transmission coefficient measurement change-over switch is connected with the 0 state port of the 2n transmission coefficient measurement change-over switch through a second DC isolator;
and the 0 state port of the second fault positioning and measuring change-over switch is connected with the input port of the first fault positioning and measuring change-over switch, the 1 state port of the first fault positioning and measuring change-over switch is respectively connected with the step signal generator and the sampling oscilloscope, and the 0 state port of the first fault positioning and measuring change-over switch is grounded.
2. The high-power microwave effect testing system with the monitoring and positioning functions as claimed in claim 1, wherein: the high-power microwave injection subsystem further comprises a high-power microwave source, a circulator, a reference signal source, an isolator, a reference signal injection constant coupler, an incident power monitoring coupler, an attenuator, a wave detector and a digital storage oscilloscope; the reference signal injection fixed coupling is used for injecting a reference signal generated by a microwave signal source; the incident power monitoring coupler is used for monitoring the power of the forward high-power microwave signal injected into the tested module;
the high-power microwave source is sequentially connected with the circulator, the reference signal injection constant coupler, the incident power monitoring coupler and the reflected power monitoring coupler;
the reference signal source is connected with the coupling end of the reference signal injection constant coupling through the isolator;
the incident power monitoring coupler, the reflected power monitoring coupler and the transmitted power monitoring coupler are respectively connected with a digital storage oscilloscope through an attenuator and a detector which are paired.
3. The high-power microwave effect testing system with the monitoring and positioning functions as claimed in claim 1, wherein: the transmission coefficient measuring change-over switch and the fault positioning measuring change-over switch both adopt mechanical single-pole double-throw microwave switches.
4. The high-power microwave effect testing system with the monitoring and positioning functions as claimed in claim 3, wherein:
when the mechanical single-pole double-throw microwave switch is switched to a state 1, the input port is communicated with the state 1 port;
when the mechanical single-pole double-throw microwave switch is switched to the 0 state, the input port is communicated with the 0 state port.
5. The test method of the high-power microwave effect test system with the monitoring and positioning functions based on any one of claims 1 to 4 is characterized in that: the method comprises the following steps:
s1: determining the number of the tested modules, and building a corresponding high-power microwave effect test system with a monitoring and positioning function; the test system comprises a high-power microwave injection subsystem, a transmission coefficient measurement subsystem, a fault positioning subsystem and a function switching subsystem;
setting n to be more than or equal to 1, when the number of the tested modules is n, the high-power microwave injection subsystem comprises a reflected power monitoring coupler, a first transmitted power monitoring coupler, …, an nth transmitted power monitoring coupler, a matched load, a high-power microwave source, a circulator, a reference signal source, an isolator, a reference signal injection coupler, an incident power monitoring coupler, an attenuator, a detector and a digital storage oscilloscope; the high-power microwave source is sequentially connected with the circulator, the reference signal injection constant coupler, the incident power monitoring coupler and the reflected power monitoring coupler; the reference signal source is connected with the coupling end of the reference signal injection constant coupling through the isolator; the incident power monitoring coupler, the reflected power monitoring coupler and the transmitted power monitoring coupler are respectively connected with a digital storage oscilloscope through an attenuator and a detector which are paired;
the transmission coefficient measurement subsystem comprises a vector network analyzer and a DC blocking device;
the barrier positioning subsystem comprises a step signal generator and a sampling oscilloscope;
the function switch subsystem comprises a first transmission coefficient measurement switch, a second transmission coefficient measurement switch, …, a 2n transmission coefficient measurement switch, a first fault location measurement switch and a second fault location measurement switch;
the input port of the first tested module is connected with the input port of the first transmission coefficient measurement change-over switch, the 1 state port of the first transmission coefficient measurement change-over switch is connected with the input port of the second fault location measurement change-over switch, and the 1 state port of the second fault location measurement change-over switch is connected with the reflected power monitoring coupler;
the output port of the first tested module is connected with the input port of a second transmission coefficient measurement change-over switch, the 1 state port of the second transmission coefficient measurement change-over switch is sequentially connected with a first transmission power monitoring coupler and a second tested module, …, the nth tested module is connected with the input port of a (2n-1) th transmission coefficient measurement change-over switch, and the 1 state port of the (2n-1) th transmission coefficient measurement change-over switch is sequentially connected with an nth transmission power monitoring coupler and a matched load;
the 0 state port of the first transmission coefficient measurement change-over switch is connected with a vector network analyzer through a first DC isolator, the vector network analyzer is connected with the input port of the 2n transmission coefficient measurement change-over switch, and the 1 state port of the 2n transmission coefficient measurement change-over switch is connected with the 0 state port of the (2n-1) transmission coefficient measurement change-over switch through the n DC isolator;
the 0 state port of the second transmission coefficient measurement change-over switch is connected with the 0 state port of the 2n transmission coefficient measurement change-over switch through a second DC isolator;
the 0 state port of the second fault positioning and measuring change-over switch is connected with the input port of the first fault positioning and measuring change-over switch, the 1 state port of the first fault positioning and measuring change-over switch is respectively connected with the step signal generator and the sampling oscilloscope, and the 0 state port of the first fault positioning and measuring change-over switch is grounded;
s2: injecting high-power microwaves into the tested module by the high-power microwave injection subsystem;
s3: the transmission coefficient measuring subsystem measures the transmission coefficient of the tested module through a vector network analyzer;
s4: sampling a time domain voltage waveform curve of a tested module port monitored by an oscilloscope, linearly converting the time domain voltage waveform curve into a characteristic impedance curve on a signal transmission path inside the tested module, and displaying the characteristic impedance curve to a user;
s5: and comparing characteristic impedance curves inside the tested module obtained by measurement before and after high-power microwave injection by a user, if the impedance at a certain position is obviously changed, judging the damage of the position, and further positioning the fault element by combining with circuit design.
6. The test method according to claim 5, characterized in that:
when n is 1, in the step S2,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 1 state;
when n is 2, in the step S2,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the third transmission coefficient measurement changeover switch is switched to the 1 state,
the fourth transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 0 state,
the second fault location measurement diverter switch switches to the 1 state.
7. The test method according to claim 5, characterized in that:
when n is 1, in the step S3,
the first transmission coefficient measurement changeover switch is switched to the 0 state,
the second transmission coefficient measurement changeover switch is switched to the 0 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
when n is 2, when the transmission coefficient of the first test module is measured in step S3,
the first transmission coefficient measurement changeover switch is switched to the 0 state,
the second transmission coefficient measurement changeover switch is switched to the 0 state,
the third transmission coefficient measurement changeover switch is switched to the 0 state,
the fourth transmission coefficient measurement changeover switch is switched to the 0 state,
the first fault location measurement switcher switches to the 0 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
when the transmission coefficient after the first tested module and the second tested module are cascaded is measured,
the first transmission coefficient measurement changeover switch is switched to the 0 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the third transmission coefficient measurement changeover switch is switched to the 0 state,
the fourth transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 0 state,
the second fault location measurement diverter switch switches to the 0 state.
8. The test method according to claim 5, characterized in that:
when n is 1, in the step S4,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 1 state,
the second fault positioning measurement change-over switch is switched to a 0 state;
when n is 2, in the step S4,
the first transmission coefficient measurement changeover switch is switched to the 1 state,
the second transmission coefficient measurement changeover switch is switched to the 1 state,
the third transmission coefficient measurement changeover switch is switched to the 1 state,
the fourth transmission coefficient measurement changeover switch is switched to the 1 state,
the first fault location measurement switcher switches to the 1 state,
the second fault location measurement diverter switch switches to the 0 state.
9. A computer storage medium, characterized in that: stored therein is a computer program executable by a computer processor, the computer program performing the assay method of any one of claims 5 to 8.
Priority Applications (1)
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| GB9709306D0 (en) * | 1997-05-09 | 1997-06-25 | Matra Bae Dynamics Uk Ltd | Apparatus for the measurement of microwave radiation |
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| CN114264891A (en) * | 2021-12-24 | 2022-04-01 | 电子科技大学 | High-power microwave effect experiment test method and automatic test system |
| CN114264891B (en) * | 2021-12-24 | 2023-08-08 | 电子科技大学 | High-power microwave effect experimental test method and automatic test system |
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