CN112285128A - Method for detecting copper leakage of printing ink - Google Patents
Method for detecting copper leakage of printing ink Download PDFInfo
- Publication number
- CN112285128A CN112285128A CN202011364525.5A CN202011364525A CN112285128A CN 112285128 A CN112285128 A CN 112285128A CN 202011364525 A CN202011364525 A CN 202011364525A CN 112285128 A CN112285128 A CN 112285128A
- Authority
- CN
- China
- Prior art keywords
- copper
- parts
- mixture
- weight
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 106
- 239000010949 copper Substances 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims abstract description 34
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 238000007689 inspection Methods 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 19
- 238000011179 visual inspection Methods 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 13
- 230000002378 acidificating effect Effects 0.000 claims abstract description 10
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001948 sodium oxide Inorganic materials 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 63
- 238000001723 curing Methods 0.000 claims description 44
- 238000003756 stirring Methods 0.000 claims description 44
- 239000003795 chemical substances by application Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 30
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 20
- 150000008064 anhydrides Chemical group 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- 238000005303 weighing Methods 0.000 claims description 17
- 239000003085 diluting agent Substances 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 16
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- -1 glycidyl ester Chemical class 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 8
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 8
- OTKCEEWUXHVZQI-UHFFFAOYSA-N 1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)CC1=CC=CC=C1 OTKCEEWUXHVZQI-UHFFFAOYSA-N 0.000 claims description 8
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 claims description 8
- 239000005995 Aluminium silicate Substances 0.000 claims description 8
- 239000004254 Ammonium phosphate Substances 0.000 claims description 8
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 8
- 235000012211 aluminium silicate Nutrition 0.000 claims description 8
- 229910000148 ammonium phosphate Inorganic materials 0.000 claims description 8
- 235000019289 ammonium phosphates Nutrition 0.000 claims description 8
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 8
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 8
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 8
- XNGJNGFXWWYBJS-UHFFFAOYSA-N phosphoroso-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=C(C(=O)P=O)C(C)=C1 XNGJNGFXWWYBJS-UHFFFAOYSA-N 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229910001431 copper ion Inorganic materials 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 238000006479 redox reaction Methods 0.000 claims description 7
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 claims description 7
- 238000011010 flushing procedure Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- VKQJCUYEEABXNK-UHFFFAOYSA-N 1-chloro-4-propoxythioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(OCCC)=CC=C2Cl VKQJCUYEEABXNK-UHFFFAOYSA-N 0.000 claims description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 18
- 230000001681 protective effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 11
- YUAWMAWMOFRUBT-UHFFFAOYSA-N ClC1=CC=C(C=2CC3=CC=CC=C3C(C12)=O)SOCCC Chemical compound ClC1=CC=C(C=2CC3=CC=CC=C3C(C12)=O)SOCCC YUAWMAWMOFRUBT-UHFFFAOYSA-N 0.000 description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005903 acid hydrolysis reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000003541 multi-stage reaction Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/34—Purifying; Cleaning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention relates to the technical field of circuit board detection, in particular to a method for detecting copper leakage of printing ink, which comprises the following steps: s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acidic solvent; s2, image transfer: uniformly attaching printing ink on a copper surface, finishing image transfer by ultraviolet irradiation, and removing a film on the copper surface of the protective circuit by sodium oxide to perform film stripping treatment; s3, optical inspection: comparing and dividing the data and graphic data provided by a client through AOI optical detection; s4, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection. The invention aims to provide a method for detecting copper leakage of printing ink, which is characterized in that by comparing products scanned by optical equipment and detected by manual visual inspection, fine copper exposure still exists in the process of rechecking of the products detected by manual inspection, and the copper exposure is not found in the rechecking of the products detected by optical inspection, so that the effect of completely avoiding the copper exposure output leakage is achieved.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a method for detecting copper leakage of printing ink.
Background
The mobile phone battery accessories are indispensable and important in the manufacture and use of mobile phones, due to the particularity of mobile phone battery protection products, the safety performance of the battery accessories plays a crucial role in the safe use of the mobile phones, the circuit protection of the battery accessories has higher and higher requirements on the quality standard of surface ink, at present, the falling of fine ink on the surface of a circuit cannot be completely detected by manual visual detection, and the potential safety hazard caused by the exposed circuit has attracted attention of manufacturers.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a method for detecting copper leakage of printing ink.
The purpose of the invention is realized by the following technical scheme: a method for detecting copper leakage of printing ink comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: uniformly attaching printing ink on a copper surface, coating, then using ultraviolet light to irradiate to harden a selective local bridge frame to finish image transfer, then using sodium carbonate to dissolve and wash the printing ink of an unexposed part, leaving a photosensitive part, etching the copper surface of the unexposed part, finally removing the film of the copper surface of the protection circuit by using sodium oxide with the concentration of 4.0-4.5mol/L, and removing the film;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s4, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
According to the invention, the AOI optical detection is adopted to realize the comprehensive detection of the circuit board, no copper exposure is found in the product after the product is qualified through the AOI optical detection, the effect of completely avoiding the copper exposure product from leaking is achieved, and the product which is manually detected still has fine copper exposure in the process of the re-detection. In the pretreatment, oily substances and an oxide film on the copper surface are removed by an acidic solvent, so that the oxidation of the copper surface can be effectively reduced; and adopt sensitization printing ink to attach on the copper face when image rendition is handled, can utilize the photosensitive material in the printing ink to carry out the photochemical reaction, make the local crane span structure of selectivity harden, accomplish image transfer and be convenient for utilize AOI optical detection, in time discover slight dew copper, guarantee the inspection effect.
Preferably, the acidic solvent in step S1 is a mixture of 10-20 parts by weight of ammonium phosphate, 6-10 parts by weight of OP-10, 12-16 parts by weight of sodium carbonate and 1000 parts by weight of 500-1000 parts by weight of deionized water.
According to the invention, the copper surface is cleaned by adopting an acid solvent, so that oily substances on the copper surface are removed, and the copper surface is further cleaned. The adopted acid solvent obtains the degreasing agent with excellent degreasing effect through ammonium phosphate complex, the emulsifier OP-10, sodium carbonate and water, grease on the surface of the circuit board can be thoroughly removed when the circuit board is subjected to preorder treatment, the subsequent film removing treatment on the circuit board is facilitated, and the accuracy of AOI optical detection is improved.
Preferably, the ink in step S2 includes the following raw materials in parts by weight:
the ink is prepared from the raw materials, can solve the problems that the prior ink is not resistant to acid hydrolysis and soldering tin thermal shock, has the characteristics of good curing film hardness, small curing shrinkage, good adhesive force, photosensitive effect, developing effect and soldering tin thermal shock resistance, and is high in curing speed and production efficiency in the curing process.
Preferably, the photosensitive resin is prepared by the following steps:
1) weighing 40-60 parts of phenolic resin and 4-8 parts of glycidyl ester, uniformly mixing, heating to 70-90 ℃, and stirring for 10-20min to obtain a mixture A for later use;
2) weighing 0.1-1.0 part of triphenylantimony and 25-35 parts of ethylene glycol, mixing and stirring uniformly, adding into the mixture A obtained in the step 1), heating to 80-100 ℃, continuously stirring for 20-40min, and cooling to room temperature to obtain the photosensitive resin.
The photosensitive resin is prepared by the method, and the photosensitive resin prepared by the method has the characteristics of good cured film hardness, small curing shrinkage, good adhesive force, photosensitive effect, developing effect and good soldering tin impact resistance effect; the temperature of heating in the step 1) needs to be strictly controlled to be 70-90 ℃ in the preparation process, if the temperature is too high, the phenomenon of local coking of the phenolic resin and the glycidyl ester acid in the reaction process can be caused, and if the temperature is too low, the composite reaction of the phenolic resin and the glycidyl ester acid can not be facilitated, so that various performances of the finally prepared photosensitive resin can be influenced.
Preferably, each part of the reactive diluent is at least one of isobornyl acrylate, isobornyl methacrylate, pentaerythritol tetraacrylate, trimethylolpropane triacrylate and dipentaerythritol hexaacrylate; more preferably, each part of the reactive diluent is a mixture of isobornyl acrylate, pentaerythritol tetraacrylate and dipentaerythritol hexaacrylate in a weight ratio of 0.4-0.8:0.6-1.0: 0.8-1.2. Each part of the photoinitiator is at least one of benzoin butyl ether, diphenylethanone, benzoin ethyl ether, 2,4, 6-trimethylbenzoyl phosphine oxide and 1-chloro-4-propoxy thioxanthone; more preferably, each part of the photoinitiator is a mixture consisting of benzoin butyl ether, diphenylethanone, 2,4, 6-trimethylbenzoylphosphine oxide and 1-chloro-4-propoxythioanthrone in a weight ratio of 0.6-1.0:0.4-0.8: 0.8-1.2.
The active diluent adopted in the application can participate in the curing reaction of the photosensitive resin and become a part of a cross-linked network structure of a cured photosensitive resin; the specific type adopted in the photoinitiator can protect the printing ink, so that the printing ink has a good protection effect and is easy to remove, the photocuring speed is fastest, and the production efficiency is improved.
Preferably, each part of the curing agent is an anhydride curing agent; more preferably, the anhydride curing agent is a CD2020 anhydride curing agent produced by Guangzhou emperor chemical Co.
Preferably, each part of the filler is at least one of talcum powder, bentonite, barium sulfate, kaolin and calcium carbonate; more preferably, each part of the filler is a mixture of talcum powder, kaolin and carbonic acid according to the weight ratio of 0.4-0.8:0.8-1.2: 0.6-1.0.
The filler adopted in the application can reduce the shrinkage rate of the ink film, improve the dimensional stability, surface smoothness and smoothness of the ink film, can meet different performance requirements, improve the adhesive force, improve the electrical conductivity and thermal conductivity developing effect, the solder-resistant impact effect and the like, has excellent light stability and chemical corrosion resistance, and is further favorable for improving the competitive capacity of the ink in the market.
Preferably, the ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 60-80 ℃, and stirring for 25-35min to obtain a mixture A for later use;
e2, uniformly mixing and stirring the curing agent and the photoinitiator, adding the mixture into the mixture A obtained in the step E1, and continuously stirring at the speed of 300-400r/min for 1-2h to obtain the ink.
The ink is prepared by the method, has the characteristics of good cured film hardness, small curing shrinkage, good adhesive force, good photosensitive effect, good developing effect and good soldering tin impact resistance effect, and is high in curing speed and high in production efficiency in the curing process; the stirring speed in the step E2 needs to be strictly controlled to be 300-400r/min in the preparation process, if the stirring speed is too high, the curing agent, the photoinitiator and the mixture A are layered due to the centrifugal force in the stirring process because of different gravity, so that the full mixing of the curing agent, the photoinitiator and the mixture A is not facilitated, and the comprehensive performance of the prepared ink is finally influenced.
The invention has the beneficial effects that: according to the method for detecting the copper leakage of the printing ink, the AOI optical detection is adopted, so that the circuit board can be comprehensively detected, no copper leakage is found in the product after the product is qualified through the AOI optical detection, the effect of completely avoiding the leakage of the copper leakage yield is achieved, and fine copper leakage still exists in the product which is manually detected in the process of the re-detection. In the pretreatment, oily substances and an oxide film on the copper surface are removed by an acidic solvent, so that the oxidation of the copper surface can be effectively reduced; and adopt sensitization printing ink to attach on the copper face when image rendition is handled, can utilize the photosensitive material in the printing ink to carry out the photochemical reaction, make the local crane span structure of selectivity harden, accomplish image transfer and be convenient for utilize AOI optical detection, in time discover slight dew copper, guarantee the inspection effect.
Detailed Description
The present invention will be further described with reference to the following examples for facilitating understanding of those skilled in the art, and the description of the embodiments is not intended to limit the present invention.
Example 1
A method for detecting copper leakage of printing ink comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: uniformly attaching printing ink on a copper surface, coating, then irradiating by using ultraviolet light to harden a selective local bridge frame to finish image transfer, then dissolving and flushing the printing ink of an unexposed part by using sodium carbonate to leave a photosensitive part, etching to remove the copper surface of the unexposed copper-exposed part, finally removing a film of the copper surface of a protection circuit by using sodium oxide with the concentration of 4.0mol/L, and removing the film;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s3, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
In step S1, the acidic solvent is a mixture of 10 parts by weight of ammonium phosphate, 6 parts by weight of OP-10, 12 parts by weight of sodium carbonate, and 500 parts by weight of deionized water.
The ink in the step S2 comprises the following raw materials in parts by weight:
the photosensitive resin is prepared by the following steps:
1) weighing 40 parts of phenolic resin 2402 and 4 parts of glycidyl ester according to parts by weight, uniformly mixing, heating to 70 ℃, and stirring for 10min to obtain a mixture A for later use;
2) 0.1 part of triphenyl antimony and 25 parts of ethylene glycol are weighed, mixed and stirred evenly, added into the mixture A obtained in the step 1), heated to 80 ℃, continuously stirred for 20min, and cooled to room temperature to obtain the photosensitive resin.
Each part of the reactive diluent is a mixture consisting of isobornyl acrylate, pentaerythritol tetraacrylate and dipentaerythritol hexaacrylate according to the weight ratio of 0.4-0.8:0.6-1.0: 0.8-1.2.
Each part of the photoinitiator is a mixture consisting of benzoin butyl ether, diphenylethanone, 2,4, 6-trimethylbenzoylphosphine oxide and 1-chloro-4-propoxythioanthrone according to the weight ratio of 0.6-1.0:0.4-0.8: 0.8-1.2.
Each part of the curing agent is an anhydride curing agent; more preferably, the anhydride curing agent is a CD2020 anhydride curing agent produced by Guangzhou emperor chemical Co.
Each part of the filler is a mixture of talcum powder, kaolin and carbonic acid according to the weight ratio of 0.4-0.8:0.8-1.2: 0.6-1.0.
The ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 60 ℃, and stirring for 25min to obtain a mixture A for later use;
e2, uniformly mixing and stirring the curing agent and the photoinitiator, adding the mixture into the mixture A obtained in the step E1, and continuously stirring for 1h at the speed of 300r/min to obtain the ink.
Example 2
A method for detecting copper leakage of printing ink comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: uniformly attaching printing ink on a copper surface, coating, then irradiating by using ultraviolet light to harden a selective local bridge frame to finish image transfer, then dissolving and flushing the printing ink of an unexposed part by using sodium carbonate to leave a photosensitive part, etching to remove the copper surface of the unexposed copper-exposed part, and finally removing the film of the copper surface of the protection circuit by using sodium oxide with the concentration of 4.4mol/L to perform film stripping treatment;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s3, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
The acidic solvent in step S1 is a mixture of 17 parts ammonium phosphate, 7 parts OP-10, 13 parts sodium carbonate and 670 parts deionized water.
The ink in the step S2 comprises the following raw materials in parts by weight:
the photosensitive resin is prepared by the following steps:
1) weighing 45 parts of phenolic resin 2402 and 5 parts of glycidyl ester according to the parts by weight, uniformly mixing, heating to 75 ℃, and stirring for 13min to obtain a mixture A for later use;
2) 0.3 part of triphenyl antimony and 28 parts of ethylene glycol are weighed, mixed and stirred evenly, added into the mixture A obtained in the step 1), heated to 85 ℃, continuously stirred for 25min and cooled to room temperature to obtain the photosensitive resin.
Each part of the reactive diluent is a mixture consisting of isobornyl acrylate, pentaerythritol tetraacrylate and dipentaerythritol hexaacrylate according to the weight ratio of 0.5:0.7: 0.9.
Each part of the photoinitiator is a mixture consisting of benzoin butyl ether, diphenylethanone, 2,4, 6-trimethylbenzoylphosphine oxide and 1-chloro-4-propoxythioanthrone according to the weight ratio of 0.7:0.5: 0.9.
Each part of the curing agent is an anhydride curing agent; more preferably, the anhydride curing agent is a CD2020 anhydride curing agent produced by Guangzhou emperor chemical Co.
Each part of the filler is a mixture of talcum powder, kaolin and carbonic acid according to the weight ratio of 0.5:0.9: 0.7.
The ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 65 ℃, and stirring for 28min to obtain a mixture A for later use;
e2, uniformly mixing and stirring the curing agent and the photoinitiator, adding the mixture into the mixture A obtained in the step E1, and continuously stirring at the speed of 325r/min for 1.25h to obtain the ink.
Example 3
A method for detecting copper leakage of printing ink comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: uniformly attaching printing ink on a copper surface, coating, then irradiating by using ultraviolet light to harden a selective local bridge frame to finish image transfer, then dissolving and flushing the printing ink of an unexposed part by using sodium carbonate to leave a photosensitive part, etching to remove the copper surface of the unexposed copper-exposed part, and finally removing the film of the copper surface of the protection circuit by using sodium oxide with the concentration of 4.3mol/L to perform film stripping treatment;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s3, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
The acidic solvent in step S1 is a mixture of 15 parts ammonium phosphate, 8 parts OP-10, 14 parts sodium carbonate and 750 parts deionized water.
The ink in the step S2 comprises the following raw materials in parts by weight:
the photosensitive resin is prepared by the following steps:
1) weighing 50 parts of phenolic resin 2402 and 6 parts of glycidyl ester according to the parts by weight, uniformly mixing, heating to 80 ℃, and stirring for 15min to obtain a mixture A for later use;
2) 0.5 part of triphenyl antimony and 30 parts of ethylene glycol are weighed, mixed and stirred evenly, added into the mixture A obtained in the step 1), heated to 90 ℃, continuously stirred for 30min, and cooled to room temperature to obtain the photosensitive resin.
Each part of the reactive diluent is a mixture of isobornyl acrylate, pentaerythritol tetraacrylate and dipentaerythritol hexaacrylate according to the weight ratio of 0.6:0.8: 1.0.
Each part of the photoinitiator is a mixture consisting of benzoin butyl ether, diphenylethanone, 2,4, 6-trimethylbenzoylphosphine oxide and 1-chloro-4-propoxythioanthrone according to the weight ratio of 0.8:0.6: 1.0.
Each part of the curing agent is an anhydride curing agent; more preferably, the anhydride curing agent is a CD2020 anhydride curing agent produced by Guangzhou emperor chemical Co.
Each part of the filler is a mixture of talcum powder, kaolin and carbonic acid according to the weight ratio of 0.6:1.0: 0.8.
The ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 70 ℃, and stirring for 30min to obtain a mixture A for later use;
e2, uniformly mixing and stirring the curing agent and the photoinitiator, adding the mixture into the mixture A obtained in the step E1, and continuously stirring the mixture for 1.5 hours at the speed of 350r/min to obtain the ink.
Example 4
A method for detecting copper leakage of printing ink comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: uniformly attaching printing ink on a copper surface, coating, then irradiating by using ultraviolet light to harden a selective local bridge frame to finish image transfer, then dissolving and flushing the printing ink of an unexposed part by using sodium carbonate to leave a photosensitive part, etching to remove the copper surface of the unexposed copper-exposed part, and finally removing the film of the copper surface of the protection circuit by using sodium oxide with the concentration of 4.4mol/L to perform film stripping treatment;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s3, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
The acidic solvent in step S1 is a mixture of 18 parts of ammonium phosphate, 9 parts of OP-10, 15 parts of sodium carbonate and 930 parts of deionized water.
The ink in the step S2 comprises the following raw materials in parts by weight:
the photosensitive resin is prepared by the following steps:
1) weighing 55 parts of phenolic resin 2402 and 7 parts of acid glycidyl ester, uniformly mixing, heating to 85 ℃, and stirring for 18min to obtain a mixture A for later use;
2) 0.8 part of triphenyl antimony and 33 parts of ethylene glycol are weighed, mixed and stirred evenly, added into the mixture A obtained in the step 1), heated to 95 ℃, continuously stirred for 35min, and cooled to room temperature to obtain the photosensitive resin.
Each part of the reactive diluent is a mixture consisting of isobornyl acrylate, pentaerythritol tetraacrylate and dipentaerythritol hexaacrylate according to the weight ratio of 0.7:0.9: 1.1.
Each part of the photoinitiator is a mixture consisting of benzoin butyl ether, diphenylethanone, 2,4, 6-trimethylbenzoylphosphine oxide and 1-chloro-4-propoxythioanthrone according to the weight ratio of 0.9:0.7: 1.1.
Each part of the curing agent is an anhydride curing agent; more preferably, the anhydride curing agent is a CD2020 anhydride curing agent produced by Guangzhou emperor chemical Co.
Each part of the filler is a mixture of talcum powder, kaolin and carbonic acid according to the weight ratio of 0.7:1.1: 0.9.
The ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 75 ℃, and stirring for 33min to obtain a mixture A for later use;
e2, mixing and stirring the curing agent and the photoinitiator uniformly, adding the mixture into the mixture A obtained in the step E1, and continuing stirring at the speed of 375r/min for 1.75h to obtain the ink.
Example 5
A method for detecting copper leakage of printing ink comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: uniformly attaching printing ink on a copper surface, coating, then irradiating by using ultraviolet light to harden a selective local bridge frame to finish image transfer, then dissolving and flushing the printing ink of an unexposed part by using sodium carbonate to leave a photosensitive part, etching to remove the copper surface of the unexposed copper-exposed part, and finally removing the film of the copper surface of the protection circuit by using sodium oxide with the concentration of 4.5mol/L to perform film stripping treatment;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s3, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
In step S1, the acidic solvent is a mixture of 20 parts by weight of ammonium phosphate, 10 parts by weight of OP-10, 16 parts by weight of sodium carbonate, and 1000 parts by weight of deionized water.
The ink in the step S2 comprises the following raw materials in parts by weight:
the photosensitive resin is prepared by the following steps:
1) weighing 60 parts of phenolic resin 2402 and 8 parts of acid glycidyl ester, uniformly mixing, heating to 90 ℃, and stirring for 20min to obtain a mixture A for later use;
2) weighing 1.0 part of triphenylantimony and 35 parts of ethylene glycol, mixing and stirring uniformly, adding into the mixture A obtained in the step 1), heating to 100 ℃, continuously stirring for 40min, and cooling to room temperature to obtain the photosensitive resin.
Each part of the reactive diluent is a mixture consisting of isobornyl acrylate, pentaerythritol tetraacrylate and dipentaerythritol hexaacrylate according to the weight ratio of 0.8:1.0: 1.2.
Each part of the photoinitiator is a mixture consisting of benzoin butyl ether, diphenylethanone, 2,4, 6-trimethylbenzoylphosphine oxide and 1-chloro-4-propoxythioanthrone according to the weight ratio of 1.0:0.8: 1.2.
Each part of the curing agent is an anhydride curing agent; more preferably, the anhydride curing agent is a CD2020 anhydride curing agent produced by Guangzhou emperor chemical Co.
Each part of the filler is a mixture of talcum powder, kaolin and carbonic acid according to the weight ratio of 0.8:1.2: 1.0.
The ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 80 ℃, and stirring for 35min to obtain a mixture A for later use;
e2, uniformly mixing and stirring the curing agent and the photoinitiator, adding the mixture into the mixture A obtained in the step E1, and continuously stirring for 2 hours at the speed of 400r/min to obtain the ink.
Comparative example 1
This comparative example differs from example 1 above in that: in the comparative example, JL-202 produced by Guangzhou Haohnhong chemical technology Limited is used for replacing ink. The remainder of this comparative example is the same as example 1 and will not be described again here.
Comparative example 2
This comparative example differs from example 3 above in that: in this comparative example, DLP high-precision photosensitive resin was used in place of the photosensitive resin in the preparation of ink, and the other raw materials were mixed in the proportions of example 3. The remainder of this comparative example is the same as example 3 and will not be described again here.
The circuit boards were tested using the method for detecting copper leakage from ink described in examples 1, 3, 5 and comparative examples 1, 2, and the results are shown in table 1:
TABLE 1
| Item | Copper leakage detection precision (%) |
| Example 1 | 99.7 |
| Example 3 | 99.6 |
| Example 5 | 99.8 |
| Comparative example 1 | 85.6 |
| Comparative example 2 | 89.5 |
According to the above content, the method for detecting copper leakage of the printing ink has high precision; and no copper exposure is found in the product rechecking through optical detection, so that the effect of completely avoiding the copper exposure yield leakage is achieved.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.
Claims (10)
1. A method for detecting copper leakage of printing ink is characterized by comprising the following steps: the method comprises the following steps:
s1, pretreatment: removing oily substances and an oxide film on the copper surface of the circuit board by adopting an acid solvent, carrying out micro-etching to enable the copper surface to have an oxidation-reduction reaction, coarsening the copper surface, carrying out acid cleaning to remove copper ions, and then carrying out hot air to blow the surface of the circuit board for later use;
s2, image transfer: firstly, uniformly attaching printing ink on a copper surface, coating, then, irradiating by using ultraviolet light to harden a selective local bridge frame to finish image transfer, then, dissolving and flushing the printing ink of an unexposed part by using sodium carbonate to leave a photosensitive part, etching to remove the copper surface of the unexposed copper-exposed part, finally, removing a film for protecting the copper surface of a circuit by using sodium oxide, and removing the film;
s3, optical inspection: scanning the pattern on the circuit board by utilizing the reflection of the copper surface, recording the pattern on software, and comparing the pattern with data pattern data provided by a client through AOI optical detection in sequence;
s4, manual visual inspection: performing visual inspection on the circuit board after completing the automatic optical inspection.
2. The method of claim 1, wherein the step of detecting copper leakage comprises: in step S1, the acidic solvent is a mixture of 10-20 parts by weight of ammonium phosphate, 6-10 parts by weight of OP-10, 12-16 parts by weight of sodium carbonate and 1000 parts by weight of 500-1000 parts by weight of deionized water.
3. The method of claim 1, wherein the step of detecting copper leakage comprises: the concentration of the sodium oxide in the step S2 is 4.0-4.5 mol/L.
4. The method of claim 1, wherein the step of detecting copper leakage comprises: the ink in the step S2 comprises the following raw materials in parts by weight:
5. the method of claim 1, wherein the step of detecting copper leakage comprises: the photosensitive resin is prepared by the following steps:
1) weighing 40-60 parts of phenolic resin and 4-8 parts of glycidyl ester according to the parts by weight, uniformly mixing, heating to 70-90 ℃, and stirring for 10-20min to obtain a mixture A for later use;
2) weighing 0.1-1.0 part of triphenylantimony and 25-35 parts of ethylene glycol, mixing and stirring uniformly, adding into the mixture A obtained in the step 1), heating to 80-100 ℃, continuously stirring for 20-40min, and cooling to room temperature to obtain the photosensitive resin.
6. The method of claim 1, wherein the step of detecting copper leakage comprises: each part of the reactive diluent is at least one of isobornyl acrylate, isobornyl methacrylate, pentaerythritol tetraacrylate, trimethylolpropane triacrylate and dipentaerythritol hexaacrylate.
7. The method of claim 1, wherein the step of detecting copper leakage comprises: each part of the photoinitiator is at least one of benzoin butyl ether, diphenylethanone, benzoin ethyl ether, 2,4, 6-trimethylbenzoyl phosphine oxide and 1-chloro-4-propoxy thioxanthone.
8. The method of claim 1, wherein the step of detecting copper leakage comprises: each part of the curing agent is an anhydride curing agent.
9. The method of claim 1, wherein the step of detecting copper leakage comprises: each part of the filler is at least one of talcum powder, bentonite, barium sulfate, kaolin and calcium carbonate.
10. A method of detecting copper bleed out of an ink as claimed in any one of claims 4 to 9, wherein: the ink is prepared by the following steps:
e1, weighing photosensitive resin according to parts by weight, adding the photosensitive resin into a reaction kettle, slowly adding the reactive diluent and the filler under the stirring state, heating to 60-80 ℃, and stirring for 25-35min to obtain a mixture A for later use;
e2, uniformly mixing and stirring the curing agent and the photoinitiator, adding the mixture into the mixture A obtained in the step E1, and continuously stirring at the speed of 300-400r/min for 1-2h to obtain the ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011364525.5A CN112285128A (en) | 2020-11-27 | 2020-11-27 | Method for detecting copper leakage of printing ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011364525.5A CN112285128A (en) | 2020-11-27 | 2020-11-27 | Method for detecting copper leakage of printing ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112285128A true CN112285128A (en) | 2021-01-29 |
Family
ID=74426816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011364525.5A Pending CN112285128A (en) | 2020-11-27 | 2020-11-27 | Method for detecting copper leakage of printing ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112285128A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971419A (en) * | 2006-11-30 | 2007-05-30 | 华南理工大学 | Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method |
| CN101012301A (en) * | 2006-12-15 | 2007-08-08 | 深圳市深赛尔实业有限公司 | Epoxy acrylic resin and preparing method thereof |
| CN101045839A (en) * | 2007-04-10 | 2007-10-03 | 深圳市容大电子材料有限公司 | Liquid photosensitive ink and applied in printing circuit board |
| CN102807805A (en) * | 2011-05-31 | 2012-12-05 | 比亚迪股份有限公司 | Ultraviolet curing coating composition and preparation method thereof |
| CN108192415A (en) * | 2018-01-10 | 2018-06-22 | 东莞智炜新材料股份有限公司 | A kind of photosensitive aqueous PCB route protections ink of UV and preparation method thereof |
| CN108449888A (en) * | 2018-03-20 | 2018-08-24 | 南浔双林荣丰磁材厂 | A kind of circuit inner cord manufacture craft |
| CN109777192A (en) * | 2017-11-15 | 2019-05-21 | 洛阳尖端技术研究院 | A kind of UV curable ink and preparation method thereof |
| CN109796804A (en) * | 2017-11-15 | 2019-05-24 | 洛阳尖端技术研究院 | A kind of UV curable ink and preparation method thereof |
| CN111393901A (en) * | 2020-05-23 | 2020-07-10 | 刘建忠 | PCB hole plugging ink and preparation method thereof |
-
2020
- 2020-11-27 CN CN202011364525.5A patent/CN112285128A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971419A (en) * | 2006-11-30 | 2007-05-30 | 华南理工大学 | Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method |
| CN101012301A (en) * | 2006-12-15 | 2007-08-08 | 深圳市深赛尔实业有限公司 | Epoxy acrylic resin and preparing method thereof |
| CN101045839A (en) * | 2007-04-10 | 2007-10-03 | 深圳市容大电子材料有限公司 | Liquid photosensitive ink and applied in printing circuit board |
| CN102807805A (en) * | 2011-05-31 | 2012-12-05 | 比亚迪股份有限公司 | Ultraviolet curing coating composition and preparation method thereof |
| CN109777192A (en) * | 2017-11-15 | 2019-05-21 | 洛阳尖端技术研究院 | A kind of UV curable ink and preparation method thereof |
| CN109796804A (en) * | 2017-11-15 | 2019-05-24 | 洛阳尖端技术研究院 | A kind of UV curable ink and preparation method thereof |
| CN108192415A (en) * | 2018-01-10 | 2018-06-22 | 东莞智炜新材料股份有限公司 | A kind of photosensitive aqueous PCB route protections ink of UV and preparation method thereof |
| CN108449888A (en) * | 2018-03-20 | 2018-08-24 | 南浔双林荣丰磁材厂 | A kind of circuit inner cord manufacture craft |
| CN111393901A (en) * | 2020-05-23 | 2020-07-10 | 刘建忠 | PCB hole plugging ink and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105086602B (en) | Photocuring thermally curable resin composition ink, purposes and use its wiring board | |
| KR101307882B1 (en) | Photosensitive resin composition and cured article thereof | |
| JP5393402B2 (en) | Photosensitive conductive paste and method for producing the same | |
| JPS61243869A (en) | Resist ink composition | |
| CN103788342B (en) | A kind of ultraviolet photo-thermal dual curable resin and containing the anti-solder ink of this resin and application | |
| CN108003699B (en) | Protective printing ink for glass acid etching process and preparation method and application thereof | |
| CN105131703A (en) | Liquid photo-imageable electrostatic-spraying solder mask and preparation and spraying methods thereof | |
| CN106398386A (en) | Solder resist ink for LED (Light Emitting Diode) exposure machine and preparation method thereof | |
| CN110673442B (en) | Photosensitive resin and application thereof in preparation of liquid photosensitive solder resist ink | |
| CN106444286A (en) | Light-sensitive circuit material and preparation method thereof | |
| JPS62187722A (en) | Liquid photopolymer composition and image formation using same | |
| CN110540771A (en) | Photosensitive solder resist material with short exposure time and preparation method thereof | |
| CN114716628A (en) | LDI photosensitive dry film and preparation method thereof | |
| CN106883719A (en) | Improve the adhesion promoter and its application method of photoresist and copper adhesive force | |
| CN112285128A (en) | Method for detecting copper leakage of printing ink | |
| CN105086606A (en) | Solder-resisting ink composition for LED light source | |
| CN110895381A (en) | Photosensitive solder resist ink composition, application thereof and circuit board containing same | |
| WO1981002474A1 (en) | Solder mask composition | |
| US7645564B2 (en) | Polymer solutions, aqueous developable thick film compositions, processes of making and electrodes formed thereof | |
| JPH0411626A (en) | Resin composition, solder resist resin composition, and cured product | |
| US20020120031A1 (en) | Photothermosetting component | |
| JP5399193B2 (en) | Photosensitive conductive paste and method for producing the same | |
| GB2237887A (en) | Photocurable composition | |
| CN115003046B (en) | Preparation method of flexible circuit board | |
| JP2001350260A (en) | Photosensitive resin, composition and method for preparing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |