CN112283436B

CN112283436B - Door valve assembly, semiconductor device and control method of door valve assembly

Info

Publication number: CN112283436B
Application number: CN202011221018.6A
Authority: CN
Inventors: 魏延宝
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2023-01-17
Anticipated expiration: 2040-11-05
Also published as: CN112283436A

Abstract

The invention provides a valve assembly, which comprises a valve plate, a valve plate control mechanism, an adjusting control module and an adjusting execution mechanism, wherein the valve plate control mechanism is used for controlling the position of the valve plate so as to enable the valve plate to be switched between a position for closing an air outlet, a position for opening the air outlet or a position for partially closing the air outlet, the valve plate control mechanism comprises a middle adjusting piece for adjusting the position of the valve plate when the air outlet is partially closed, and the adjusting control module is used for sending a control signal to the adjusting execution mechanism after receiving an external instruction so as to enable the adjusting execution mechanism to adjust the middle adjusting piece according to the control signal. In the gate valve assembly control method and the semiconductor equipment, the adjusting control module can drive the adjusting execution mechanism to automatically control the middle position adjusting part of the gate valve assembly on line according to an external instruction, so that the operation efficiency of controlling the gate valve assembly is improved. The invention also provides a semiconductor device and a control method of the door valve assembly.

Description

Door valve assembly, semiconductor device and control method of door valve assembly

Technical Field

The invention relates to the field of semiconductor processes, in particular to a gate valve assembly of semiconductor equipment, the semiconductor equipment and a control method of the gate valve assembly.

Background

High vacuum Gate valves (Gate valves) are widely used in PVD (Physical Vapor Deposition) apparatuses for achieving high vacuum isolation and small range pressure control of a process chamber in the PVD apparatus.

A typical gate valve arrangement generally includes a valve plate for mating with the outlet port of the process chamber and a valve plate control mechanism for controlling the Position of the valve plate such that the valve plate opens the outlet port (i.e., open Position) to close the outlet port (i.e., closed Position) or partially closes the outlet port (i.e., neutral Position). The valve plate control mechanism also comprises a middle position adjusting piece, and the middle position adjusting piece is used for adjusting the position of the valve plate when the valve plate is positioned at the middle position. When the gate valve structure enters the closed position, the process cavity is in a closed state, the air pressure is unchanged, when the gate valve structure enters the open position, the process cavity can be pumped at full speed, only when the gate valve structure enters the neutral position, the opening size of the air outlet can be adjusted through the neutral position adjusting piece, the air outlet rate of the process cavity is finely adjusted, and then the difference between the air inlet rate of the process cavity and the air outlet rate of the process cavity is changed, so that the air pressure in the process cavity is changed.

In the existing semiconductor production process, an operator needs to move to the position near a gate valve structure and manually adjust the gate valve structure, the middle position adjusting part is adjusted and then returns to an instrument for reflecting information such as air pressure in a cavity to observe the air pressure change condition in the process cavity, and then the middle position adjusting part is moved to the gate valve structure to manually adjust the middle position adjusting part again according to the observed air pressure condition, and the process is repeated for many times, so that the air pressure in the process cavity is adjusted to be within a required pressure range. The adjusting process is tedious to operate and consumes a long time, so that the overall efficiency of the semiconductor process is low.

Therefore, how to provide a gate valve assembly capable of efficiently and conveniently adjusting and controlling the gas pressure of a process chamber in semiconductor equipment becomes a technical problem to be solved in the field.

Disclosure of Invention

The invention aims to provide a gate valve assembly of semiconductor equipment and the semiconductor equipment.

In order to achieve the above object, according to one aspect of the present invention, there is provided a gate valve assembly of a semiconductor device, configured to be matched with a gas outlet of a process chamber in the semiconductor device, the gate valve assembly including a valve plate and a valve plate control mechanism, the valve plate control mechanism being configured to control a position of the valve plate so as to switch the valve plate between a position for closing the gas outlet, a position for opening the gas outlet, or a position for partially closing the gas outlet, the valve plate control mechanism including a neutral position adjusting member configured to adjust a position of the valve plate when partially closing the gas outlet, a regulation control module configured to generate a control signal upon receiving an external command and to send the control signal to a regulation actuator, and a regulation actuator configured to regulate the neutral position adjusting member according to the received control signal.

Optionally, the external instruction includes an open-loop external instruction, and the adjusting control module is configured to determine an open-loop adjustment amount according to the open-loop external instruction after receiving the open-loop external instruction, and send the open-loop adjustment amount to the adjusting execution mechanism, so that the adjusting execution mechanism adjusts the neutral position adjusting element according to the open-loop adjustment amount.

Optionally, the gate valve assembly further comprises a chamber pressure detection assembly for detecting a gas pressure inside the process chamber, the external command comprising a closed loop external command, the closed loop external command comprising a target gas pressure value for the process chamber;

the adjusting control module is used for circularly receiving the detection air pressure value of the chamber pressure detection assembly after receiving the closed-loop external instruction, determining a closed-loop adjusting quantity according to the difference value between the detection air pressure value of the chamber pressure detection assembly and the target air pressure value, and sending the closed-loop adjusting quantity to the adjusting execution mechanism, so that the adjusting execution mechanism adjusts the middle adjusting piece according to the closed-loop adjusting quantity until the difference value between the detection air pressure value detected by the chamber pressure detection assembly and the target air pressure value is smaller than a preset difference value.

Optionally, the closed-loop adjustment amount is positively correlated with a difference between the detected air pressure value and the target air pressure value.

Optionally, the valve plate control mechanism further includes a valve plate position detection unit, the valve plate position detection unit is configured to detect a position of the valve plate, and the adjustment control module is further configured to receive a detection signal of the valve plate position detection unit after receiving the external instruction, determine a position of the valve plate according to the detection signal, and send an abnormal signal when the valve plate closes the air outlet or opens the air outlet.

Optionally, the adjusting actuator includes an adjusting amount feedback unit, configured to detect an actual adjusting amount of the adjusting actuator, and the adjusting control module is further configured to receive the actual adjusting amount detected by the adjusting amount feedback unit after sending a control signal to the adjusting actuator each time, and perform the next step when the actual adjusting amount is the same as a target adjusting amount corresponding to the control signal.

Optionally, the middle position adjusting part is an adjusting bolt, the adjusting actuator includes a motor, an output shaft of the motor is connected with one end of the adjusting bolt, and the control signal includes a rotation angle of the adjusting bolt.

Optionally, the actual adjustment amount includes a rotation angle of an output shaft of the motor, the adjustment amount feedback unit includes an encoder, the encoder is disposed on the motor, and the encoder is configured to record the rotation angle of the output shaft of the motor and send the rotation angle to the motor control module.

As a second aspect of the present invention, there is provided a semiconductor device, including a process chamber, a gate valve assembly for closing, opening or partially closing an air outlet of the process chamber, the gate valve assembly being the gate valve assembly described above, and an upper computer for receiving manual input information, generating an external command according to the manual input information, and sending the external command to a regulation control module in the gate valve assembly.

As a third aspect of the present invention, there is provided a control method of a door valve assembly, applied to the door valve assembly proposed by the present invention, the control method comprising: s1, the adjusting control module receives the external instruction and forms a control signal according to the external instruction; and S2, the adjusting control module sends the control signal to the adjusting execution mechanism instructed by the external instruction so that the adjusting execution mechanism adjusts the middle position adjusting part according to the control signal.

In the gate valve assembly, the semiconductor equipment and the control method of the gate valve assembly, provided by the invention, the adjusting control module can drive the adjusting execution mechanism to automatically control the middle adjusting piece of the gate valve assembly on line according to an external instruction of an operator, so that the process that the operator moves back and forth between the valve plate control mechanism and an instrument of a process chamber to manually adjust the middle adjusting piece for multiple times is avoided, the operation time for controlling the gate valve assembly is saved, the operation efficiency for controlling the gate valve assembly is improved, and the production efficiency of the semiconductor equipment is further improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of a semiconductor device according to the present invention;

FIG. 2 is a schematic view showing the connection between the valve assembly and the adjustment control module and the adjustment actuator in the semiconductor device shown in FIG. 1;

FIG. 3 is a flow chart of a method of controlling a gate valve assembly provided by an embodiment of the present invention;

fig. 4 is a schematic diagram of a connection relationship between modules in the semiconductor device according to the present invention.

Detailed Description

The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are given by way of illustration and explanation only, not limitation.

To solve the above technical problems, as an aspect of the present invention, a gate valve assembly of a semiconductor apparatus is provided. As shown in fig. 1 and 2, the semiconductor apparatus includes a process chamber 9, the gate valve assembly 4 is configured to be disposed to match with the gas outlet 3 of the process chamber 9, the gate valve assembly 4 includes a valve plate 100 and a valve plate control mechanism 200, the valve plate control mechanism 200 is configured to control the position of the valve plate 100 so that the valve plate 100 is switched between a position for closing the gas outlet 3 (i.e., an off position), a position for opening the gas outlet 3 (i.e., an on position), or a position for partially closing the gas outlet 3 (i.e., a neutral position), and the valve plate control mechanism 200 includes a neutral position adjuster 240, and the neutral position adjuster 240 is configured to adjust the position of the valve plate 100 when the gas outlet 3 is partially closed (i.e., the position when the neutral position). The door valve assembly also includes a trim control module 500 for generating and sending a control signal to a trim actuator upon receiving an external command, and a trim actuator for adjusting the neutral position trim 240 based on the control signal received.

In the gate valve assembly provided by the embodiment of the invention, the adjusting control module 500 can drive the adjusting execution mechanism to automatically control the middle position adjusting piece 240 of the gate valve assembly 4 on line according to an external instruction, so that the process that an operator repeatedly moves to and fro the valve plate control mechanism 200 and an instrument of the process chamber 9 to manually adjust the middle position adjusting piece 240 is avoided, the operation time for controlling the gate valve assembly 4 is saved, the operation efficiency for controlling the gate valve assembly 4 is improved, the air pressure in the process chamber 9 of the semiconductor device can be efficiently and conveniently controlled, and the production efficiency of the semiconductor device is improved.

For example, as a preferred embodiment of the present invention, as shown in fig. 2, the middle position adjusting member 240 is an adjusting bolt, and accordingly, the adjusting actuator may include a motor 410 (a rotary motor), an output shaft of the motor 410 is connected to one end of the adjusting bolt, when the motor 410 is started, the output shaft thereof can drive the adjusting bolt to rotate to adjust the position of the valve plate 100, and the control signal includes a rotation angle of the adjusting bolt.

As shown in fig. 2, the adjusting actuator may further include a motor control module 420 for controlling the rotation angle of the output shaft of the motor 410 according to the rotation angle in the control signal.

In order to ensure the accuracy of the adjustment amount of the adjustment actuator to improve the accuracy of controlling the air pressure in the process chamber 9, the adjustment actuator preferably includes an adjustment amount feedback unit for detecting the actual adjustment amount of the adjustment actuator.

For example, when the adjustment actuator includes the motor 410, the adjustment feedback unit may be an encoder disposed on the motor 410, and the encoder can record the rotation angle of the output shaft during the rotation of the output shaft of the motor 410 and send the rotation angle to the motor control module 420, thereby implementing closed-loop control of the rotation angle of the motor 410.

The adjustment control module 500 is further configured to receive the actual adjustment amount detected by the adjustment amount feedback unit after sending a control signal to the adjustment actuator each time, and perform the next step when the actual adjustment amount is the same as the target adjustment amount corresponding to the control signal.

The embodiment of the present invention does not specifically limit how the adjustment control module 500 communicates with the adjustment actuator and how the motor 410 communicates with the motor control module 420, for example, as shown in fig. 2, the adjustment control module 500 may be connected with the adjustment actuator through a cable 600, and similarly, the motor 410 may also be connected with the motor control module 420 through the cable 600.

The embodiment of the present invention does not specifically limit the transmission manner of the valve plate control mechanism 200, for example, as shown in fig. 2, the valve plate control mechanism 200 is a pneumatic actuator, and a cylinder thereof has three CDA air inlets: the air inlet 211, the air inlet 221 and the air inlet 231 are used for controlling the valve plate 100 to be switched among an open position, a closed position and a middle position. For example, as an alternative embodiment of the present invention, the air inlet 211 is an open position air inlet, the air inlet 221 is an closed position air inlet, and the air inlet 231 is a middle position air inlet. When the air inlet 231 is filled with air and the air inlet 221 and the air inlet 231 are not filled with air, the baffle 100 moves to an open position; when the air inlet 221 is filled with air and the

air inlets

211 and 231 are not filled with air, the baffle 100 moves to the closed position; when the

intake ports

211 and 231 are supplied with air and the intake ports 221 are not supplied with air, the shutter 100 moves to the neutral position.

In order to increase the repeatability of the position of the valve plate 100 during multiple exhaust processes, preferably, the external command includes an open-loop external command, and the adjusting control module 500 is configured to determine an open-loop adjustment amount according to the open-loop external command after receiving the open-loop external command, and send the open-loop adjustment amount to the adjusting actuator, so that the adjusting actuator adjusts the middle adjuster 240 according to the open-loop adjustment amount.

It should be noted that the open-loop external command is issued by an operator, and the exhaust rate of the process chamber 9 may be the same value when the same operation is performed on the process chamber 9 a plurality of times under the same condition (e.g., the gas inlet rate of the process chamber 9 is not changed). Therefore, in order to improve the efficiency of repeatedly adjusting the position of the valve plate 100, the adjusting actuator can be directly controlled by an open-loop external command to adjust the neutral adjusting member 240 according to the open-loop adjustment amount (e.g., the adjustment amount of the adjusting member last time), so that the valve plate 100 can be directly adjusted to a set position, thereby improving the repeatability of the position of the valve plate 100 in multiple exhaust processes and the efficiency of adjusting the position of the valve plate 100.

To improve the ease of controlling the pressure within the process chamber 9, it is preferred that the gate valve assembly further comprises a chamber pressure sensing assembly 11, as shown in FIG. 1, for sensing the pressure within the process chamber 9, the external command may also comprise a closed loop external command comprising a target pressure value for the process chamber 9.

The adjusting control module 500 is configured to receive the detected air pressure value of the chamber pressure detection assembly cyclically after receiving the closed-loop external instruction, determine a closed-loop adjustment amount according to a difference between the detected air pressure value of the chamber pressure detection assembly and the target air pressure value, and send the closed-loop adjustment amount to the adjusting actuator, so that the adjusting actuator adjusts the middle adjuster 240 according to the closed-loop adjustment amount until the difference between the detected air pressure value detected by the chamber pressure detection assembly and the target air pressure value is smaller than a predetermined difference.

In the embodiment of the present invention, the adjusting control module 500 can perform closed-loop automatic adjustment on the central adjusting part 240 according to a target air pressure value in a closed-loop external instruction issued by an operator and the chamber pressure detected in real time by the pressure detecting assembly until the air pressure in the process chamber 9 is close enough to the target air pressure value, thereby realizing automatic adjustment of the air pressure in the process chamber 9 and improving the convenience of controlling the air pressure in the process chamber 9.

In order to improve the adjustment efficiency, preferably, the closed-loop adjustment amount determined by the adjustment control module 500 each time is positively correlated with (an absolute value of) a difference between the detected air pressure value and the target air pressure value, and the algorithm for performing the closed-loop adjustment on the middle position adjusting part 240 by the adjustment control module 500 according to the target air pressure value and the chamber pressure is not particularly limited in the embodiment of the present invention, for example, the adjustment control module 500 may calculate the closed-loop adjustment amount by using a PID closed-loop control algorithm.

It should be noted that the opening of the valve plate 100 affects the air pressure in the process chamber 9 only when the valve plate 100 enters the neutral position, and therefore, the air pressure in the process chamber 9 can be closed-loop adjusted by the adjusting control module 500 only when the valve plate 100 enters the neutral position (partially closing the air outlet 3).

In order to improve the safety and stability of the control system and avoid the situation that the closed-loop control is opened by mistake when the valve plate 100 is in the open position or the closed position, preferably, the valve plate control mechanism 200 is further not capable of detecting a valve plate position detecting unit, the valve plate position detecting unit is used for detecting the position of the valve plate 100, the adjusting control module 500 is further used for receiving a detection signal of the valve plate 100 position detecting unit after receiving the external instruction, determining the position of the valve plate 100 according to the detection signal, and sending an abnormal signal when the valve plate 100 closes the air outlet or opens the air outlet.

The structure of the position detection unit is not particularly limited in the embodiment of the present invention, for example, as shown in fig. 2, the position detection unit may include a position sensor 212, a position sensor 222, and a position sensor 232, which are respectively matched with the air inlet 211, the air inlet 221, and the air inlet 231, and the three position sensors may feed back the position of the baffle 100 in real time to cooperate with the adjustment control module 500 to find an abnormality in time.

As a second aspect of the present invention, there is provided a semiconductor apparatus including a process chamber 9 and a gate valve assembly for closing, opening or partially closing an outlet 3 of the process chamber 9, the gate valve assembly being the gate valve assembly 4 according to the embodiment of the present invention, the semiconductor apparatus further including a HOST computer (HOST) for receiving manual input information, generating an external command according to the manual input information, and transmitting the external command to a throttle control module 500 in the gate valve assembly 4.

In the embodiment of the present invention, an operator may send a control signal to the adjustment control module 500 through an upper computer, so as to send a setting value of an adjustment mode (open loop, closed loop) and an adjustment amount to the adjustment control module 500. When the adjustment control module 500 determines that the control signal is in the open-loop control mode, the output angle of the motor is controlled to the target angle directly through the motor control module, so that the valve plate 100 moves to the target position; when the adjustment control module 500 determines that the control signal is in the closed-loop control mode, it first determines that the valve plate 100 is located in the middle position according to the position detection unit, and then performs closed-loop adjustment according to the difference between the air pressure inside the process chamber 9 and the target air pressure value measured by the chamber pressure detection assembly 11, so that the air pressure inside the process chamber 9 approaches the target air pressure value.

In the semiconductor device provided by the embodiment of the invention, the adjusting and controlling module 500 controls the adjusting and executing mechanism to automatically control the middle position adjusting piece 240 of the gate valve assembly 4 on line according to the external instruction of the operator, so that the process that the operator moves to and fro the valve plate control mechanism 200 and the instrument of the process chamber 9 for multiple times to manually adjust the middle position adjusting piece 240 is avoided, the operation time of controlling the gate valve assembly 4 is saved, the operation efficiency of controlling the gate valve assembly 4 is improved, and the production efficiency of the semiconductor device is further improved.

The type of the semiconductor device is not particularly limited in the embodiments of the present invention, and the semiconductor device may be a physical vapor deposition device, for example.

The semiconductor apparatus according to the embodiment of the present invention is not particularly limited in other structures, and for example, the semiconductor apparatus may further include a housing 1 of the process chamber 9, an upper electrode 2 located above the process chamber 9, an exhaust pump 5, a base 6 for carrying a substrate, a lift pin 7 for lifting the substrate from the base 6, a shield plate 8, and the like.

The kind of the exhaust pump 5 is not particularly limited in the embodiment of the present invention, and for example, the exhaust pump 5 may be a condensation pump or a molecular pump.

In order to improve the device strength, the door valve assembly 4 preferably comprises a docking flange 300, the door valve assembly 4 is connected with the air outlet 3 of the process chamber 9 through the docking flange 300, and the valve plate 100 moves under the control of the adjusting actuator and shields or seals the air outlet 3 so as to change the communication state between the process chamber 9 and the high vacuum environment 10.

As a third aspect of the present invention, there is also provided a control method for controlling a gate valve assembly provided in an embodiment of the present invention, the control method including:

in step S1, the adjusting control module receives an external instruction and forms a control signal according to the external instruction;

in step S2, the adjustment control module sends a control signal to the adjustment actuator, so that the adjustment actuator adjusts the middle position adjusting element 240 according to the control signal.

In the control method provided by the embodiment of the invention, the adjusting control module 500 drives the adjusting execution mechanism to automatically control the middle position adjusting piece 240 of the gate valve assembly 4 on line according to an external instruction, so that the process that an operator repeatedly moves to and fro the valve plate control mechanism 200 and the instrument of the process chamber 9 to manually adjust the middle position adjusting piece 240 is avoided, the operation time of controlling the gate valve assembly 4 is saved, the operation efficiency of controlling the gate valve assembly 4 is improved, the air pressure in the process chamber 9 of the semiconductor equipment can be efficiently and conveniently controlled, and the production efficiency of the semiconductor equipment is improved.

In order to ensure the accuracy of the adjustment amount of the adjustment actuator and further improve the accuracy of controlling the air pressure in the process chamber 9, as shown in fig. 3, the control method preferably further includes receiving the actual adjustment amount detected by the adjustment amount feedback unit after sending a control signal to the adjustment actuator each time, and performing the next step when the actual adjustment amount is the same as the target adjustment amount corresponding to the control signal, and controlling the motor to rotate to a predetermined angle in a closed-loop control manner when the actual adjustment amount does not reach the target adjustment amount corresponding to the control signal.

In order to improve the repeatability of the position of the valve plate 100 during multiple exhaust processes, as shown in fig. 3, the step S2 preferably includes determining an open-loop adjustment amount according to the open-loop external command after receiving the open-loop external command, and sending the open-loop adjustment amount to the adjustment actuator so that the adjustment actuator adjusts the neutral position adjuster 240 according to the open-loop adjustment amount.

To improve the convenience of controlling the air pressure in the process chamber 9, as shown in fig. 3, the step S2 further includes receiving the detected air pressure value of the chamber pressure detecting assembly cyclically after receiving the closed-loop external command, determining a closed-loop adjustment amount according to a difference between the detected air pressure value of the chamber pressure detecting assembly and the target air pressure value, and sending the closed-loop adjustment amount to the adjustment executing mechanism, so that the adjustment executing mechanism adjusts the neutral adjuster 240 according to the closed-loop adjustment amount until the difference between the detected air pressure value of the chamber pressure detecting assembly and the target air pressure value is smaller than a predetermined difference.

In order to improve the safety and stability of the control system and avoid the false opening of the closed-loop control when the valve plate 100 is in the open position or the closed position, preferably, as shown in fig. 3, the control method further includes receiving a detection signal of the valve plate 100 position detection unit after receiving an external command of the closed loop, determining the position of the valve plate 100 according to the detection signal in step S3, and sending an abnormal signal when the valve plate 100 closes the air outlet or opens the air outlet.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and scope of the invention, and such modifications and improvements are also considered to be within the scope of the invention.

Claims

1. A gate valve assembly of a semiconductor device, which is used for being matched with a gas outlet of a process chamber in the semiconductor device, the gate valve assembly comprises a valve plate and a valve plate control mechanism, the valve plate control mechanism is used for controlling the position of the valve plate so that the valve plate can be switched between a position for closing the gas outlet, a position for opening the gas outlet or a position for partially closing the gas outlet, the valve plate control mechanism comprises a middle position adjusting piece, the middle position adjusting piece is used for adjusting the position of the valve plate when the gas outlet is partially closed, the gate valve assembly is characterized by further comprising a regulation control module and a regulation execution mechanism, the regulation control module is used for forming a control signal after receiving an external instruction and sending the control signal to the regulation execution mechanism, and the regulation execution mechanism is used for regulating the middle position adjusting piece according to the received control signal;

wherein, valve plate control mechanism is pneumatic actuator, has three air inlets on its cylinder: the valve plate is used for controlling the valve plate to switch between a position for opening the air outlet, a position for closing the air outlet or a position for partially closing the air outlet;

when the open position air inlet admits air, the closed position air inlet and the middle position air inlet do not admit air, the valve plate moves to a position for opening the air outlet;

when the air inlet at the closed position, the air inlet at the open position and the air inlet at the middle position do not enter the air, the valve plate moves to the position for closing the air outlet;

when the open position air inlet and the middle position air inlet admit air and the closed position air inlet does not admit air, the valve plate moves to a position partially closing the air outlet.

2. The gate valve assembly of claim 1, wherein the external command comprises an open-loop external command, and wherein the trim control module is configured to determine an open-loop adjustment based on the open-loop external command after receiving the open-loop external command and send the open-loop adjustment to the trim actuator to cause the trim actuator to adjust the neutral adjuster based on the open-loop adjustment.

3. The gate valve assembly of claim 1, further comprising a chamber pressure sensing assembly for sensing a gas pressure inside the process chamber, the external command comprising a closed loop external command, the closed loop external command comprising a target gas pressure value for the process chamber;

the adjusting control module is used for circularly receiving the detected air pressure value of the chamber pressure detection assembly after receiving the closed-loop external instruction, determining a closed-loop adjusting quantity according to the difference value between the detected air pressure value of the chamber pressure detection assembly and the target air pressure value, and sending the closed-loop adjusting quantity to the adjusting execution mechanism so that the adjusting execution mechanism adjusts the middle-position adjusting piece according to the closed-loop adjusting quantity until the difference value between the detected air pressure value detected by the chamber pressure detection assembly and the target air pressure value is smaller than a preset difference value.

4. The gate valve assembly of claim 3, wherein the closed-loop adjustment amount is positively correlated to a difference between the sensed gas pressure value and the target gas pressure value.

5. The door valve assembly of claim 3, wherein the valve plate control mechanism further comprises a valve plate position detecting unit for detecting a position of the valve plate, and the throttle control module is further configured to receive a detection signal of the valve plate position detecting unit after receiving the external command, determine a position of the valve plate according to the detection signal, and issue an abnormal signal when the valve plate closes the air outlet or opens the air outlet.

6. The door valve assembly according to any one of claims 1 to 5, wherein the adjustment actuator includes an adjustment amount feedback unit for detecting an actual adjustment amount of the adjustment actuator, and the adjustment control module is further configured to receive the actual adjustment amount detected by the adjustment amount feedback unit after each transmission of a control signal to the adjustment actuator, and to perform a next step when the actual adjustment amount is the same as a target adjustment amount corresponding to the control signal.

7. The door valve assembly of claim 6, wherein the neutral position adjuster is an adjuster bolt, the adjustment actuator includes a motor having an output shaft coupled to one end of the adjuster bolt, and the control signal includes a rotational angle of the adjuster bolt.

8. The door valve assembly of claim 7 wherein said adjustment actuator includes a motor control module;

the actual regulating quantity comprises a rotating angle of an output shaft of the motor, the regulating quantity feedback unit comprises an encoder, the encoder is arranged on the motor and used for recording the rotating angle of the output shaft of the motor and sending the rotating angle to the motor control module.

9. A semiconductor device comprising a process chamber and a gate valve assembly for closing, opening or partially closing an outlet of the process chamber, wherein the gate valve assembly is as claimed in any one of claims 1 to 8, and further comprising a host computer for receiving manual input information, generating an external command according to the manual input information, and sending the external command to a throttle control module in the gate valve assembly.

10. A control method of a door valve assembly, applied to the door valve assembly of any one of claims 1 to 8, comprising:

s1, the adjusting control module receives the external instruction and forms a control signal according to the external instruction;

and S2, the adjusting control module sends the control signal to the adjusting execution mechanism instructed by the external instruction so that the adjusting execution mechanism adjusts the middle position adjusting part according to the control signal.