CN112276384A - Air floating platform for semiconductor wafer laser cutting - Google Patents
Air floating platform for semiconductor wafer laser cutting Download PDFInfo
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- CN112276384A CN112276384A CN202011543361.2A CN202011543361A CN112276384A CN 112276384 A CN112276384 A CN 112276384A CN 202011543361 A CN202011543361 A CN 202011543361A CN 112276384 A CN112276384 A CN 112276384A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Abstract
The invention relates to an air floating platform for laser cutting of semiconductor wafers, wherein an X-axis guide rail I and an X-axis guide rail II are arranged on a marble base, an X-axis air floating guide moving part is matched with the X-axis guide rail I, an air floating horizontal positive pressure orifice I is arranged on the bottom surface of the X-axis air floating guide moving part, and an air floating lateral positive pressure orifice I is arranged on the side surface of a groove of the X-axis air floating guide moving part; the X-axis air floatation guide moving part is connected with the Y-axis SiC crossbeam through a flexible connecting piece, the first X-axis guide rail is provided with a first X-axis magnetic steel, one end of the Y-axis SiC crossbeam is provided with a first X-axis coil, the second X-axis guide rail is provided with a second X-axis magnetic steel, and the other end of the Y-axis SiC crossbeam is provided with a second X-axis coil; the Y-axis air floatation guide moving part is matched with the Y-axis SiC cross beam, a negative pressure cavity I is arranged in the middle of the bottom surface, and an air floatation horizontal positive pressure throttling hole II is arranged on the bottom surface; an air floatation lateral positive pressure orifice II is arranged on the side surface of the slotted hole of the Y-axis air floatation guide movement part; and an X-axis air-floatation horizontal guide piece is arranged on the bottom surface of the Y-axis SiC cross beam. The operation is stable, and the precision is high.
Description
Technical Field
The invention relates to an air floating platform for semiconductor wafer laser cutting, and belongs to the technical field of laser processing.
Background
The precise positioning platform is one of the key parts in precise mechanical equipment, and provides a carrying platform capable of realizing precise positioning and precise movement for the fields of microlithography, numerical control processing, biotechnology, nanometer surface topography measurement and the like. A precise air floating platform based on air floating supporting and linear motor linear driving technology is a hot point for researching high-precision technology at home and abroad. The linear driving air floating platform is an electromechanical integrated system, and integrates a linear driving technology, a numerical control technology, dynamic and static characteristic analysis and optimization, an automatic control principle, testing, experimental analysis and other technologies into a whole. In the field of semiconductor wafer cutting, with the continuous improvement of the integration degree of large-scale integrated circuits, the requirements of the semiconductor industry on the size of a silicon wafer are higher and higher, the requirements on the processing precision of the silicon wafer are also stricter, and the wafer-level processing positioning platform is used as an extremely critical part in wafer manufacturing equipment and has higher and higher requirements on the performance of the wafer-level processing positioning platform.
At present, a precise positioning platform mainly takes linear guide rails and linear motor linear driving as main parts, and a cross superposition form is adopted in the structure. The processing breadth is mainly concentrated on 8-inch wafers and below, and the processing breadth of 12-inch wafers is not large in platforms. Meanwhile, the positioning accuracy of the platform is about +/-1 um, and the repeated positioning accuracy is about +/-0.5 um. In addition, when the dynamic precision of the platform is in uniform linear motion of 600mm/s, the dynamic linearity of the motion carrying platform in a 12-inch wafer processing width is in the order of +/-1 um. Since the refractive index of a silicon wafer is about 4 times that of air, the straightness error is amplified by 4 times, i.e., +/-4 um inside the wafer. For silicon wafer products with thinner wafer thicknesses, such error levels affect the processing quality of the product. Therefore, it is urgently needed to design a high-precision positioning platform to meet the cutting requirements of the wafer products.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an air floating platform for laser cutting of a semiconductor wafer.
The purpose of the invention is realized by the following technical scheme:
the air-bearing platform for semiconductor wafer laser cutting is characterized in that: the marble device comprises a marble base, an X-axis guide rail I and an X-axis guide rail II which are arranged on the marble base in parallel along the X-axis direction, wherein an X-axis air-floatation guide moving part is matched with the X-axis guide rail I through a groove of the X-axis air-floatation guide moving part; the X-axis air floatation guide motion part is connected with the Y-axis SiC cross beam through a flexible connecting piece, a first X-axis magnetic steel is arranged on the first X-axis guide rail along the X-axis direction, a first X-axis coil matched with the first Y-axis SiC cross beam is arranged at one end of the first Y-axis guide rail, a second X-axis magnetic steel is arranged on the second X-axis guide rail along the X-axis direction, and a second X-axis coil matched with the second Y-axis guide rail is arranged at the other end of the first;
the Y-axis air floatation guide moving part is matched with the Y-axis SiC cross beam through a slotted hole of the Y-axis air floatation guide moving part, a first negative pressure cavity facing the marble base is arranged on the bottom surface of the Y-axis air floatation guide moving part, a first air floatation horizontal negative pressure orifice is communicated with the first negative pressure cavity, and a second air floatation horizontal positive pressure orifice facing the marble base is arranged on the bottom surface of the Y-axis air floatation guide moving part on one side part of the first negative pressure cavity; two inner side surfaces of the slotted hole of the Y-axis air floatation guide movement part are respectively provided with an air floatation lateral positive pressure throttling hole II facing the Y-axis SiC cross beam; y-axis magnetic steel is arranged on the Y-axis SiC cross beam along the Y-axis direction, and a Y-axis coil matched with the Y-axis magnetic steel is arranged on the Y-axis air floatation guide motion part;
an X-axis air-floatation horizontal guide piece is arranged on the bottom surface of the Y-axis SiC cross beam, a second negative pressure cavity right opposite to the marble base is arranged on the bottom surface of the X-axis air-floatation horizontal guide piece, a second negative pressure orifice in the air-floatation horizontal direction is communicated with the second negative pressure cavity, and a third positive pressure orifice in the air-floatation horizontal direction facing the marble base is arranged on the bottom surface of the X-axis air-floatation horizontal guide piece on the side part of the second negative pressure cavity.
Further, the air flotation platform for laser cutting of the semiconductor wafer is characterized in that a theta-axis air flotation rotating unit is mounted on the Y-axis air flotation guiding moving part and comprises a rotating shaft connecting top plate, a rotating shaft inner rotor, a rotating shaft outer stator, a rotating shaft connecting bottom plate, a rotating shaft coil and rotating shaft magnetic steel, the rotating shaft outer stator is fixed on the rotating shaft connecting bottom plate, a round hole used for accommodating the rotating shaft inner rotor is formed in the middle of the rotating shaft outer stator, a rotating shaft coil is mounted on the outer circle of the rotating shaft outer stator in the circumferential direction, the rotating shaft connecting top plate is connected with the rotating shaft inner rotor, the rotating shaft inner rotor is arranged in the round hole in the middle of the rotating shaft outer stator, and rotating shaft magnetic steel used for;
the inner wall of the round hole of the outer stator of the rotating shaft is provided with an air-flotation radial positive pressure throttling hole facing the inner rotor of the rotating shaft, the upper top surface of the outer stator of the rotating shaft is provided with an air-flotation axial positive pressure throttling hole facing the rotating shaft and connected with the top plate, the upper top surface of the outer stator of the rotating shaft is provided with a negative pressure cavity III facing the rotating shaft and connected with the top plate, and the air-flotation axial negative pressure throttling hole is.
Further, according to the air flotation platform for semiconductor wafer laser cutting, two equal-height coplanar X-axis air flotation horizontal guide pieces are symmetrically arranged on the left and right of the bottom surface of the Y-axis SiC cross beam.
Further, in the above air bearing platform for laser cutting of semiconductor wafers, the flexible connecting member is a cylindrical structure, the upper and lower parts of the flexible connecting member are respectively provided with a plurality of open slots along the radial direction, and two end faces of the flexible connecting member are provided with threaded holes.
Further, the air flotation platform for laser cutting of the semiconductor wafer is characterized in that a second air flotation horizontal negative pressure orifice is formed in the center of the second negative pressure cavity and communicated to a negative pressure gas system through a negative pressure gas flow channel;
the bottom surface of the X-axis air-floatation horizontal guide piece is provided with a plurality of air-floatation horizontal positive pressure orifices III at intervals, the plurality of air-floatation horizontal positive pressure orifices III are positioned on a rectangular track, the plurality of air-floatation horizontal positive pressure orifices III are communicated in series through positive pressure gas guide grooves, and the air-floatation horizontal positive pressure orifices III are communicated to a positive pressure gas system through positive pressure gas flow channels.
Further, in the air floating platform for semiconductor wafer laser cutting, the tail ends of the air floating horizontal negative pressure orifice II and the air floating horizontal positive pressure orifice III are both provided with a hole restrictor, the hole restrictor is made of ruby, and the inner edge center of the hole restrictor is provided with a vent hole which is communicated with the air path and has a diameter of 0.1 mm.
Further, in the air flotation platform for laser cutting of the semiconductor wafer, a first air flotation horizontal negative pressure orifice is formed in the central part of the first negative pressure cavity and communicated to a negative pressure gas system through a negative pressure gas flow passage;
a plurality of air floatation horizontal positive pressure orifices II are arranged on the bottom surface of the Y-axis air floatation guide motion part at intervals, two positions of the plurality of air floatation horizontal positive pressure orifices are positioned on a rectangular track, the air floatation horizontal positive pressure orifices II are communicated in series through a positive pressure gas guide groove, and the air floatation horizontal positive pressure orifices II are communicated to a positive pressure gas system through a positive pressure gas flow passage;
and the air floatation lateral positive pressure throttling hole II is communicated to the positive pressure gas system through a positive pressure gas flow passage.
Further, in the air floating platform for semiconductor wafer laser cutting, the ends of the first air floating horizontal negative pressure orifice, the second air floating horizontal positive pressure orifice and the second air floating lateral positive pressure orifice are respectively provided with a hole restrictor, the hole restrictor is made of ruby, and the center of the inner edge of the hole restrictor is provided with a vent hole with the diameter of 0.1mm, and the vent hole is communicated with the air path.
Furthermore, the air floating platform for laser cutting of the semiconductor wafer is characterized in that a plurality of air floating horizontal positive pressure orifices I are arranged on the bottom surface of the X-axis air floating guide motion part at intervals, the plurality of air floating horizontal positive pressure orifices I are positioned on a rectangular track, the air floating horizontal positive pressure orifices I are communicated in series through a positive pressure gas guide groove, and the air floating horizontal positive pressure orifices are communicated to a positive pressure gas system through a positive pressure gas flow passage;
the air-floating lateral positive pressure throttling hole is communicated to the positive pressure gas system through a positive pressure gas flow passage.
Further, in the air floating platform for laser cutting of the semiconductor wafer, the tail ends of the first air floating lateral positive pressure orifice and the first air floating horizontal positive pressure orifice are provided with hole throttlers, the hole throttlers are made of ruby, and the inner edge center of the hole throttlers is provided with vent holes which are communicated with the air path and have the diameter of 0.1 mm.
Further, in the air floating platform for semiconductor wafer laser cutting, the tail ends of the air floating radial positive pressure orifice, the air floating axial positive pressure orifice and the air floating axial negative pressure orifice are respectively provided with a hole restrictor, the hole restrictor is made of ruby, and the center of the inner edge of the hole restrictor is provided with a vent hole which is communicated with the air path and has a diameter of 0.1 mm.
Further, according to the air floating platform for semiconductor wafer laser cutting, the X-axis air floating guide moving part is connected with the U-shaped structural part, and two ends of the U-shaped structural part are fixedly connected with two side portions of the groove of the X-axis air floating guide moving part.
Further, the air floating platform for semiconductor wafer laser cutting is characterized in that a first X-axis grating ruler is mounted on the first X-axis guide rail, a second X-axis grating ruler is mounted on the second X-axis guide rail, and a Y-axis grating ruler is mounted on the Y-axis SiC cross beam.
Further, in the above-mentioned air-bearing platform for laser cutting of semiconductor wafer, the first X-axis grating ruler, the second X-axis grating ruler and the Y-axis grating ruler are all renisha absolute grating rulers with a resolution of 5 nm.
Further, in the air floating platform for laser cutting of the semiconductor wafer, the Y-axis air floating guide moving part is of a zigzag structure.
Further, the above-mentioned aerostatic platform for semiconductor wafer laser cutting, wherein, the flatness of the both sides face of Y axle SiC crossbeam is less than 1um, and the depth of parallelism of both sides face is less than 1.5 um.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:
the invention has unique design and novel structure, the structural layout of the air floatation platform is H-shaped, the X-axis adopts double-drive synchronous control, the Y-axis adopts single-drive control, and the theta-axis air floatation rotation unit adopts air floatation and direct drive modes; the precision is obviously improved compared with the traditional cross-shaped superposition platform;
the H-shaped structural form enables the weight of the platform deck to be directly borne by the whole marble base, the supporting mode of the platform deck is not changed all the time in the X-Y two-dimensional processing range, the gravity center of the platform deck is not changed, and the stability of the whole platform is greatly improved; in the traditional cross-shaped superposed platform, when the carrying platform is processed in a full-width mode, the gravity center of the carrying platform is changed at any time, and the stability is not enough;
the rotation directions of the X axis, the Y axis and the theta axis adopt air floatation guiding, two parts moving relatively are not in contact by utilizing gas buoyancy, and a moving part and a guide rail can never be abraded; compared with the traditional linear guide rail guide, the guide rail device has the advantages of more stable operation and high quick response;
the air-floatation precise motion platform reaches a hundred-nanometer level, the X-axis air-floatation guide motion part is connected with the Y-axis SiC cross beam through the flexible connecting piece, so that the X, Y-axis orthogonality is conveniently adjusted, and the orthogonality reaches 0.0005 degrees; and small-hole throttling holes are adopted, so that the moving rigidity and the moving stability of the platform are improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: the invention discloses a structural schematic diagram of an air floating platform;
FIG. 2: the structure schematic diagram of the first X-axis guide rail and the second X-axis guide rail;
FIG. 3: a schematic structural view of a Y-axis SiC beam portion;
FIG. 4: a structural schematic diagram of a theta axis air-floating rotation unit;
FIG. 5: the structure of the stator outside the rotating shaft is shown schematically;
FIG. 6: the structure schematic diagram of the flexible connecting piece;
FIG. 7: a schematic bottom view of the X-axis air-floating horizontal guide;
FIG. 8: FIG. 7 is a schematic cross-sectional view D-D;
FIG. 9: a schematic structural diagram of a Y-axis SiC beam;
FIG. 10: schematic diagram of initial position of Y-axis SiC beam;
FIG. 11: schematic of the Y-axis SiC beam deflection 2 ° around the flex connector.
The meaning of the respective reference numerals in the figures:
1. a marble base; 2. an X-axis guide rail I; 3. A second X-axis guide rail; 4. an X-axis air-bearing guide movement member; 5. a Y-axis SiC beam; 6. an X-axis air-flotation horizontal guide member; 7. a Y-axis air-bearing guide movement member; 8. a theta axis air-floating rotation unit; 9. an air floatation lateral positive pressure orifice I; 10. air floatation positive pressure orifice I in the horizontal direction; 11. x-axis magnet steel I; 12. an X-axis coil I; 13. a flexible connector; 14. a third air floatation positive pressure orifice in the horizontal direction; 15. a second negative pressure throttling hole in the air floatation horizontal direction; 16. an X-axis coil II; 17. a second X-axis magnetic steel; 18. an air floatation lateral positive pressure orifice II; 19. negative pressure throttling holes I in the air floatation horizontal direction; 20. a second air-floatation positive-pressure orifice in the horizontal direction; 21. a Y-axis coil; 22. y-axis magnetic steel; 23. the rotating shaft is connected with the bottom plate; 24. a rotating shaft outer stator; 25. a rotating shaft inner rotor; 26. the rotating shaft is connected with the top plate; 27. A rotating shaft coil; 28. a rotating shaft magnetic steel; 29. air floatation radial positive pressure throttling hole; 30. air floatation axial positive pressure throttling hole; 31. air floatation axial negative pressure throttling hole; 32. a U-shaped structural member; 33. an open slot; 34. a threaded hole; 35. a positive pressure gas flow channel; 36. a negative pressure gas flow channel; 37. a positive pressure gas diversion trench; A. a first negative pressure cavity; B. a second negative pressure cavity; C. and a negative pressure cavity III.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 and 2, the air floating platform for laser cutting of semiconductor wafers comprises a marble base 1, a first X-axis guide rail 2 and a second X-axis guide rail 3 which are arranged on the marble base in parallel along the X-axis direction, wherein an X-axis air floating guide moving part 4 is matched with the first X-axis guide rail 2 through a groove of the X-axis air floating guide moving part, a first air floating horizontal positive pressure orifice 10 facing the marble base 1 is arranged at the bottom surface of the X-axis air floating guide moving part 4, and first air floating lateral positive pressure orifices 9 facing the first X-axis guide rail 2 are arranged on two inner side surfaces of the groove of the X-axis air; the X-axis air floatation guide motion part 4 is connected with the Y-axis SiC crossbeam 5 through a flexible connecting part 13, X-axis magnetic steel I11 is arranged on the X-axis guide rail I2 along the X-axis direction, an X-axis coil I12 matched with the Y-axis SiC crossbeam is arranged at one end of the Y-axis SiC crossbeam 5, an X-axis magnetic steel II 17 is arranged on the X-axis guide rail II 3 along the X-axis direction, and an X-axis coil II 16 matched with the Y-axis SiC crossbeam 5 is arranged at the other end of the Y-axis SiC crossbeam 5;
the bottom surface of the Y-axis SiC crossbeam 5 is bilaterally symmetrically provided with two X-axis air-floatation horizontal guide parts 6 which are equal in height and coplanar, the middle part of the bottom surface of the X-axis air-floatation horizontal guide part 6 is provided with a negative pressure cavity II B opposite to the marble base 1, an air-floatation horizontal negative pressure orifice II 15 is communicated with the negative pressure cavity II B, and the bottom surface of the X-axis air-floatation horizontal guide part 6 at the side part of the negative pressure cavity II B is provided with an air-floatation horizontal positive pressure orifice III 14 facing the marble base 1.
The X-axis air-floatation guiding movement part 4 is connected with a U-shaped structural part 32, and two ends of the U-shaped structural part 32 are fixedly connected with two side parts of the groove of the X-axis air-floatation guiding movement part 4.
An X-axis grating ruler I is installed on the X-axis guide rail I2, an X-axis grating ruler II is installed on the X-axis guide rail II 3, and a Y-axis grating ruler is installed on the Y-axis SiC cross beam 5. The first X-axis grating ruler, the second X-axis grating ruler and the Y-axis grating ruler are all Renysha absolute grating rulers with the resolution ratio of 5 nm.
As shown in fig. 3, the Y-axis air-floating guiding movement member 7 is of a zigzag structure, the Y-axis air-floating guiding movement member 7 is matched with the Y-axis SiC beam 5 through a slotted hole thereof, a first negative pressure cavity a facing the marble base 1 is arranged in the middle of the bottom surface of the Y-axis air-floating guiding movement member 7, a first air-floating horizontal negative pressure orifice 19 is communicated with the first negative pressure cavity a, and a second air-floating horizontal positive pressure orifice 20 facing the marble base 1 is arranged on the bottom surface of the Y-axis air-floating guiding movement member 7 at the side of the first negative pressure cavity a; two inner side surfaces of a slotted hole of the Y-axis air floatation guide movement part 7 are respectively provided with an air floatation lateral positive pressure throttling hole II 18 facing the Y-axis SiC cross beam 5; y-axis magnetic steel 22 is arranged on the Y-axis SiC crossbeam 5 along the Y-axis direction, and a Y-axis coil 21 matched with the Y-axis magnetic steel is arranged on the Y-axis air floatation guide movement part 7.
As shown in fig. 4 and 5, the Y-axis air-floating guide motion element 7 is provided with a θ -axis air-floating rotation unit 8, the θ -axis air-floating rotation unit 8 includes a rotation axis connection top plate 26, a rotation axis inner rotor 25, a rotation axis outer stator 24, a rotation axis connection bottom plate 23, a rotation axis coil 27 and rotation axis magnetic steel 28, the rotation axis outer stator 24 is fixed on the rotation axis connection bottom plate 23, the middle part of the rotation axis outer stator 24 is provided with a circular hole for accommodating the rotation axis inner rotor 25, the outer circle of the rotation axis outer stator 24 is provided with the rotation axis coil 27 along the circumferential direction, the rotation axis connection top plate 26 is connected with the rotation axis inner rotor 25, the rotation axis 25 is disposed in the circular hole in the middle part of the rotation axis outer stator 24;
an air-floatation radial positive pressure orifice 29 facing the rotary shaft inner rotor 25 is arranged on the inner wall of the circular hole of the rotary shaft outer stator 24, an air-floatation axial positive pressure orifice 30 facing the rotary shaft connecting top plate 26 is arranged on the upper top surface of the rotary shaft outer stator 24, a negative pressure cavity III facing the rotary shaft connecting top plate 26 is arranged on the upper top surface of the rotary shaft outer stator 24, and an air-floatation axial negative pressure orifice 31 is communicated with the negative pressure cavity III;
the tail ends of the air-flotation radial positive pressure throttling hole 29, the air-flotation axial positive pressure throttling hole 30 and the air-flotation axial negative pressure throttling hole 31 are all provided with hole throttlers, the hole throttlers are made of ruby, and the inner edge of each hole throttler is provided with a vent hole which is communicated with the air path and has the diameter of 0.1 mm.
As shown in fig. 6, the flexible connecting member 13 is a cylindrical structure, and has a plurality of open slots 33 formed in the upper and lower ends thereof along the radial direction, and threaded holes 34 formed in both ends thereof.
As shown in fig. 7 and 8, in a more preferable design, a second negative pressure orifice 15 in the air floatation horizontal direction is formed in the center of the second negative pressure cavity B of the X-axis air floatation horizontal guide 6 and communicated to the negative pressure gas system through a negative pressure gas flow passage 36; a plurality of air-flotation horizontal positive pressure orifices three 14 are arranged at intervals on the bottom surface of the X-axis air-flotation horizontal guide piece 6, the plurality of air-flotation horizontal positive pressure orifices three 14 are positioned on a rectangular track, the plurality of air-flotation horizontal positive pressure orifices three 14 are communicated in series through a positive pressure gas guide groove 37, and the air-flotation horizontal positive pressure orifices three 14 are communicated with a positive pressure gas system through a positive pressure gas flow passage 35. The tail ends of the air floatation horizontal direction negative pressure throttling hole II 15 and the air floatation horizontal direction positive pressure throttling hole III 14 are respectively provided with a hole throttling device, the hole throttling devices are made of ruby, and the inner edge centers of the hole throttling devices are provided with air holes which are communicated with the air path and have the diameter of 0.1 mm.
Correspondingly, a first air-floatation horizontal negative pressure throttling hole 19 is formed in the central part of a first negative pressure cavity A of the Y-axis air-floatation guide moving part 7 and communicated to a negative pressure gas system through a negative pressure gas flow passage; a plurality of air-floatation horizontal positive-pressure orifices two 20 are arranged at intervals on the bottom surface of the Y-axis air-floatation guide motion part 7, the plurality of air-floatation horizontal positive-pressure orifices two 20 are positioned on a rectangular track, the air-floatation horizontal positive-pressure orifices two 20 are communicated in series through a positive-pressure gas guide groove, and the air-floatation horizontal positive-pressure orifices two 20 are communicated to a positive-pressure gas system through positive-pressure gas flow channels; the air floatation lateral positive pressure throttling hole II 18 is communicated to the positive pressure gas system through a positive pressure gas flow passage. The tail ends of the air floatation horizontal negative pressure throttling hole I19, the air floatation horizontal positive pressure throttling hole II 20 and the air floatation lateral positive pressure throttling hole II 18 are all provided with perforated throttlers, the perforated throttlers are made of ruby, and vent holes with the diameter of 0.1mm are formed in the centers of the inner edges of the perforated throttlers and communicated with the air path.
Correspondingly, a plurality of air-floatation horizontal positive-pressure orifices 10 are arranged at intervals on the bottom surface of the X-axis air-floatation guide moving part 4, the plurality of air-floatation horizontal positive-pressure orifices 10 are positioned on a rectangular track, the air-floatation horizontal positive-pressure orifices 10 are communicated in series through a positive-pressure gas guide groove, and the air-floatation horizontal positive-pressure orifices 10 are communicated to a positive-pressure gas system through positive-pressure gas flow channels; the air floatation lateral positive pressure throttling hole I9 is communicated to the positive pressure gas system through a positive pressure gas flow passage. And the tail ends of the air floatation lateral positive pressure orifice I9 and the air floatation horizontal positive pressure orifice I10 are respectively provided with a hole restrictor, the hole restrictor is made of ruby, and the center of the inner edge of the hole restrictor is provided with a vent hole which is communicated with the air path and has a diameter of 0.1 mm.
As shown in fig. 9, the Y-axis SiC beam 5 is made of SiC material, and because of the structural design limitation of the beam body, the beam made of marble material cannot be processed into a beam structure, and conventionally is processed by using aluminum alloy material. Compared with aluminum alloy materials, the beam made of SiC materials has the advantages of high hardness, high wear resistance and the like, and meanwhile, the elastic modulus is far higher than that of aluminum alloy materials and is close to that of steel pieces, so that the beam has high mechanical strength, is particularly little influenced by temperature change and is not easy to deform.
The guide surfaces on two sides of the Y-axis SiC beam 5 can reach very high precision in a manual grinding and polishing mode, the planeness of the two side surfaces is smaller than 1um, and the parallelism of the two side surfaces is smaller than 1.5 um. In addition, the change influenced by environmental factors is very small, the cross beam is not deformed, and the precision retentivity is good.
The air supporting platform adopts H type structural configuration, marble base 1 is the mounting base of whole air supporting platform, arrange X axle guide rail 2 and X axle guide rail two 3 on marble base 1, X axle air supporting guiding movement piece 4 is arranged in on X axle guide rail 2, X axle air supporting guiding movement piece 4 passes through flexonics spare 13 and links to each other with Y axle SiC crossbeam 5, H type platform structure makes the wafer product all bear on marble base 1 at the full stroke within range, the focus is unchangeable all the time, the atress is even. Compared with a traditional cross superposition precision platform, the mechanical structure analysis can better ensure higher walking precision, and the H-shaped structure is more scientific and reasonable.
The laser cutting has strict requirements on the orthogonality of the air floatation platform X, Y axis, and the right angle of the two axes is required to be less than 0.0005 DEG within the diameter range of 300 mm. The traditional wafer cutting platform adopts X, Y-axis two-axis superposition to form X, Y two mutually vertical linear axes. At this time, the orthogonality of the two axes is adjusted in the image visual recognition system by the photolithography mask, and since the two axes adopt a cross-shaped overlapping structure, the orthogonality needs to be adjusted by manually loosening and tightening a connection screw of X, Y axes. The adjustment is troublesome, the workload is large, meanwhile, the final adjustment precision is not too high, and the limit can be adjusted to an error of about 0.001 degrees.
As shown in fig. 10 and 11, the air-floating platform of the present invention adopts a flexible connection technology, and the X-axis air-floating guide motion member 4 on the X-axis guide rail i 2 is connected to the Y-axis SiC beam 5 through the flexible connection member 13, so that the Y-axis and the dual-drive X-axis form a flexible connection. When the first X-axis coil 12, the second X-axis coil 16 and the Y-axis coil 21 are not powered on, the Y-axis SiC beam 5 is manually swung, and then the Y-axis SiC beam 5 is deflected around the flexible connector 13 by taking the flexible connector 13 as a center, so that a deflection of about ± 2 ° can be generated for adjusting the orthogonality of the X, Y two axes. Meanwhile, if the manual deflecting force is released, the Y-axis SiC beam 5 is deflected to return to the initial position from the beginning. When the first X-axis coil 12, the second X-axis coil 16 and the Y-axis coil 21 are powered on, through electrical control, the relative motion generated by the first X-axis coil 12 and the first X-axis magnetic steel 11 is opposite to the relative motion generated by the second X-axis coil 16 and the second X-axis magnetic steel 17, so that the Y-axis SiC beam 5 deflects relative to the flexible connecting piece 13, and then through data of a photoetching board in an image visual recognition system, the traveling distance of the X-axis in the one direction and the two directions of the X-axis is controlled, so that the purpose that the orthogonality of the X, Y axes is electrically controlled to meet 0.0005 degrees is achieved. The adjustment is very convenient, the orthogonality compensation can be automatically completed by a control system, meanwhile, the precision is high, the absolute 90 degrees can be achieved, and no error exists.
An X-axis air-floatation guiding movement part 4 is arranged on the X-axis guide rail I2, the X-axis guide rail II 3 is not required to be arranged, the X-axis direction of the air-floatation platform is controlled by double driving, and an X-axis coil I12 and an X-axis magnetic steel I11 generate relative movement, so that the X-axis air-floatation guiding movement part 4 performs single-axis linear reciprocating movement along the X-axis guide rail I2; the second X-axis coil 16 and the second X-axis magnetic steel 17 also generate relative motion. The X-axis adopts air-floating guide to ensure the dynamic rigidity and stability of the platform during movement, and the air-floating technology of orifice throttling has higher rigidity and stability compared with a honeycomb porous air-floating plate. Positive pressure gas is provided for a plurality of air-floatation horizontal positive pressure orifices I10 on the bottom surface of the X-axis air-floatation guide motion part 4, positive pressure gas is provided for air-floatation side positive pressure orifices I9, four linear direction freedom degrees are limited, two sides of an X-axis guide rail I2 are used for limiting two side freedom degrees, and the X-axis guide rail I is realized by utilizing a two-side positive pressure mode; and the vertical downward positive pressure gas is introduced, so that the aim of integrally limiting the left and right lateral degrees of freedom of the X axis is fulfilled.
The bottom surface of the Y-axis SiC crossbeam 5 is provided with two X-axis air-floatation horizontal guide parts 6 which are equal in height and coplanar, the X-axis air-floatation horizontal guide parts are positioned between the Y-axis SiC crossbeam 5 and the marble base 1, the freedom degrees of the X-axis in the upper and lower directions are limited, two air path channels, a positive pressure channel and a negative pressure channel are arranged, positive pressure gas is provided for a plurality of air-floatation positive pressure throttling holes 14 in the horizontal direction on the bottom surface of the X-axis air-floatation horizontal guide part 6, and negative pressure gas is provided for a negative pressure cavity II B through an air; the purpose of the positive pressure is to float the whole Y-axis SiC beam 5, and the purpose of the negative pressure is to tightly adsorb the Y-axis SiC beam 5 that floats up, so that the Y-axis SiC beam 5 is finally in a balanced state, and the degrees of freedom in the upper and lower directions of the X axis are also limited. Through the limitation of the four degrees of freedom, the rigidity of the whole X axis is enhanced, and the movement is more stable. And carrying an absolute double grating ruler for closed loop and synchronous control, wherein the grating ruler adopts the Renyshao brand, and the resolution of the grating ruler reaches 5 nm.
The Y-axis coil 21 and the Y-axis magnetic steel 22 can generate relative motion, so that the Y-axis air-floatation guide motion part 7 can perform linear reciprocating motion along the Y-axis SiC cross beam 5, and single-drive control is realized; the Y-axis air-floating guide movement part 7 is of a structure in a shape like a Chinese character 'hui'. The Y-axis adopts air-float guiding, thereby ensuring the stability of the product in the cutting process and limiting four degrees of freedom during the Y-axis movement. Firstly, two sides of a Y-axis SiC crossbeam limit the degree of freedom of two sides, and the degree of freedom is realized by a mode of positive pressure of two sides; and two air passage channels, namely a positive pressure channel and a negative pressure channel, provide positive pressure air for the second air-floatation horizontal positive pressure throttling holes 20 on the bottom surface of the Y-axis air-floatation guide motion part 7, provide positive pressure air for the second air-floatation side positive pressure throttling holes 18, and provide negative pressure air for the first negative pressure cavity A through the first air-floatation horizontal negative pressure throttling holes 19. The positive pressure aims at floating the whole Y-axis air-floating guide moving part 7 shaped like a Chinese character 'hui', the negative pressure aims at tightly adsorbing the Y-axis air-floating guide moving part 7 which is floated, finally the Y-axis air-floating guide moving part 7 is in a balanced state, the degrees of freedom in the upper direction and the lower direction of a Y axis are limited, and the rigidity of the whole Y-axis SiC cross beam 5 is enhanced and the motion is more stable through the limitation of four degrees of freedom. The Y-axis SiC beam 5 carries an absolute grating ruler for closed-loop control.
The outer stator 24 of the rotating shaft is formed with gas channels of positive and negative pressure, including an annular gas channel, which provides positive and negative pressure of air flotation for limiting three degrees of freedom of the rotating part. When the rotating shaft coil 27 is electrified, the electric energy and the magnetic field act to generate a thrust force of circular motion through the action of the rotating shaft coil 27 and the rotating shaft magnetic steel 28, and the rotating shaft connecting top plate 26 and the rotating shaft inner rotor 25 are driven to generate a rotary motion. When positive pressure gas is introduced, the positive pressure gas is supplied to the air-floating radial positive pressure orifice 29 and the air-floating axial positive pressure orifice 30 through the internal annular gas groove and the gas passage channel, and flows to a circumferential joint surface between the rotating shaft outer stator 24 and the rotating shaft inner rotor 25 and a plane joint surface between the top surface of the rotating shaft outer stator 24 and the bottom surface of the rotating shaft connecting top plate 26, respectively. Ruby hole restrictors are respectively installed at the tail ends of the air floatation radial positive pressure orifice 29 and the air floatation axial positive pressure orifice 30, and a positive pressure air film of about 8-10 um is generated through a small hole with the diameter of 0.1mm in the middle of the ruby hole restrictor, so that the rotating part (a rotating shaft connecting top plate and a rotating shaft inner rotor) performs rotating motion under the air floatation guiding action. The bottom surface of the rotary shaft inner rotor 25 is in floating contact with the top surface of the rotary shaft coupling base plate 23, thus limiting the downward degrees of freedom in the circumferential direction and the vertical direction. When negative pressure gas is introduced, the negative pressure gas is provided to the air floatation axial negative pressure throttling hole 31, flows to the plurality of negative pressure cavities III C on the upper top surface of the outer stator 24 of the rotating shaft, and establishes negative pressure vacuum for limiting the upward degree of freedom of the air floatation rotating part in the vertical direction. Therefore, the three degrees of freedom of the air floatation rotating part are all limited, and the rigidity and the stability of the air floatation rotating part are facilitated. Meanwhile, ruby hole restrictors are arranged at the tail ends of all the air floatation axial negative pressure throttling holes 31, the rotating shaft connecting top plate 26 is tightly adsorbed through vacuum negative pressure generated by small holes with the diameter of 0.1mm in the middle of the ruby hole restrictors, and the thickness of the air film is changed into a positive negative pressure air film with the thickness of about 5 um. The air floatation structure of vacuum positive and negative pressure adsorption is very compact, so that the design of a moving part is simpler and more practical.
Positive pressure and negative pressure gas flow channels are processed in the X-axis air-floatation horizontal guide piece 6, are mutually independent and are not communicated. And a negative pressure cavity II B is processed on the bottom surface of the X-axis air floatation horizontal guide part 6 and is used for establishing a negative pressure environment. When pressure gas is not accessed, the X-axis air-flotation horizontal guide piece 6 is attached to the upper plane of the marble base, and the flatness of the lower bottom surface of the X-axis air-flotation horizontal guide piece 6 can be within 1um, so that the X-axis air-flotation horizontal guide piece and the marble base cannot move, and the X-axis air-flotation horizontal guide piece is similar to the local vacuum generated on the upper plane of the X-axis air-flotation horizontal guide piece 6 and the marble base. When positive pressure gas is supplied to the air floatation horizontal positive pressure throttling hole III 14, high pressure gas with the thickness of about 8-10 um is generated between the X-axis air floatation horizontal guide piece 6 and the upper plane of the marble base through the throttling function of the hole throttler, and the whole moving part is suspended and can move freely. When negative pressure gas is supplied to the negative pressure throttling hole II 15 in the horizontal direction of the air floatation, a vacuum adsorption environment is established in the negative pressure cavity II B, the moving part is adsorbed under the action of vacuum, and the thickness of the air film is thinned under the influence of vacuum negative pressure adsorption due to the introduction of vacuum, so that the thickness of the air film is thinned to be about 5um from the thickness of the previous air film of about 8-10 um. The moving part is always kept with a gas film thickness, and the rigidity and the stability of the moving part are greatly improved due to the limitation of the freedom degrees in the upper direction and the lower direction. The air floatation structure of vacuum positive and negative pressure adsorption is very compact, so that the design of a moving part is simpler and more practical.
The theta axis air-floating rotation unit 8 is arranged on the Y axis air-floating guide movement part 7, the theta axis air-floating rotation unit 8 adopts the mode of combining air-floating rotation guide with direct drive, a porous ceramic sucker is arranged on a rotation axis connecting top plate 26 and is used for adsorbing wafer products, the diameter of each wafer product is 200mm, the thickness of each wafer product is about 0.7mm, the wafer products and the wafers are connected through a steel ring under the action of a layer of film, and then the wafer products are firmly sucked and fixed on the porous ceramic table board under the action of the porous ceramic sucker and a steel ring vacuum suction nozzle. By adopting the rotary air-floating structure, the moving part is not contacted with the fixed part, so that the rotary motion is more stable, and the axial runout of the rotating part can achieve the ultrahigh precision within 1 um. The axial float of the rotation axis that the tradition adopted cylindrical roller bearing direction, owing to receive the pre-compaction of bearing self and the influence of ball diameter error, the error of axial runout is about 3 um. Therefore, the precision advantage of the rotary air-floating structure is more remarkable.
Through actual measurement, the positioning precision of the air floating platform is as follows: ± 0.2um × 0.0009 °, repeat positioning accuracy: ± 0.15um × ±. 0.13um × ±. 0.0005 °, integrated flatness: 4um (12 inch wafer range), X-Y axis orthogonality: 0.0005 deg. to the hundred nanometer level.
In conclusion, the air floating platform is unique in design and novel in structure, the structural layout of the air floating platform is H-shaped, the X-axis direction adopts double-drive synchronous control, the Y-axis direction adopts single-drive control, and the theta-axis air floating rotation unit adopts air floating and direct drive modes; compared with the traditional cross-shaped stacking platform, the precision is obviously improved.
The H-shaped structural form enables the weight of the platform deck to be directly borne by the whole marble base, the supporting mode of the platform deck is not changed all the time in the X-Y two-dimensional processing range, the gravity center of the platform deck is not changed, and the stability of the whole platform is greatly improved; in the traditional cross-shaped superposed platform, when the carrying platform is processed on the whole width, the gravity center of the carrying platform is changed at any time, and the stability is not enough.
The rotation directions of the X axis, the Y axis and the theta axis adopt air floatation guidance, two parts which move relatively are not in contact by utilizing gas buoyancy, and a moving part and a guide rail can never be abraded; compare in the direction of traditional linear guide, it is more steady to operate, and quick response nature is high.
The air floatation precision motion platform reaches the level of hundreds of nanometers, the X-axis air floatation guide motion part is connected with the Y-axis SiC cross beam through the flexible connecting piece, so that the X, Y-axis orthogonality is conveniently adjusted, and the orthogonality reaches 0.0005 degrees; and small-hole throttling holes are adopted, so that the moving rigidity and the moving stability of the platform are improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (16)
1. The air-bearing platform for semiconductor wafer laser cutting is characterized in that: the marble device comprises a marble base (1), and a first X-axis guide rail (2) and a second X-axis guide rail (3) which are arranged on the marble base in parallel along the X-axis direction, wherein the X-axis air-floatation guiding moving part (4) is matched with the first X-axis guide rail (2) through a groove of the X-axis air-floatation guiding moving part, an air-floatation horizontal positive-pressure orifice I (10) facing the marble base (1) is arranged on the bottom surface of the X-axis air-floatation guiding moving part (4), and air-floatation lateral positive-pressure orifices I (9) facing the first X-axis guide rail (2) are arranged on two inner side surfaces of; the X-axis air-floatation guide movement part (4) is connected with a Y-axis SiC cross beam (5) through a flexible connecting piece (13), a first X-axis magnetic steel (11) is arranged on a first X-axis guide rail (2) along the X axial direction, a first X-axis coil (12) matched with the first Y-axis SiC cross beam is arranged at one end of the Y-axis SiC cross beam (5), a second X-axis magnetic steel (17) is arranged on a second X-axis guide rail (3) along the X axial direction, and a second X-axis coil (16) matched with the second Y-axis SiC cross beam is arranged at the other end of the Y;
the Y-axis air floatation guide motion part (7) is matched with the Y-axis SiC cross beam (5) through a slotted hole of the Y-axis air floatation guide motion part, a first negative pressure cavity (A) right opposite to the marble base (1) is arranged on the bottom surface of the Y-axis air floatation guide motion part (7), a first air floatation horizontal direction negative pressure throttling hole (19) is communicated with the first negative pressure cavity (A), and a second air floatation horizontal direction positive pressure throttling hole (20) facing the marble base (1) is arranged on the bottom surface of the Y-axis air floatation guide motion part (7) on the side portion of the first negative pressure cavity (A); two inner side surfaces of a slotted hole of the Y-axis air floatation guide movement part (7) are respectively provided with an air floatation lateral positive pressure throttling hole II (18) facing the Y-axis SiC cross beam (5); y-axis magnetic steel (22) is arranged on the Y-axis SiC crossbeam (5) along the Y-axis direction, and a Y-axis coil (21) matched with the Y-axis magnetic steel is arranged on the Y-axis air floatation guide movement part (7);
an X-axis air floatation horizontal guide piece (6) is arranged on the bottom surface of the Y-axis SiC cross beam (5), a negative pressure cavity II (B) right opposite to the marble base (1) is arranged on the bottom surface of the X-axis air floatation horizontal guide piece (6), an air floatation horizontal direction negative pressure throttling hole II (15) is communicated with the negative pressure cavity II (B), and an air floatation horizontal direction positive pressure throttling hole III (14) facing the marble base (1) is arranged on the bottom surface of the X-axis air floatation horizontal guide piece (6) on the side portion of the negative pressure cavity II (B).
2. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: a theta axis air-float rotating unit (8) is arranged on the Y axis air-float guiding movement piece (7), the theta axis air-float rotating unit (8) comprises a rotating shaft connecting top plate (26), a rotating shaft inner rotor (25), a rotating shaft outer stator (24), a rotating shaft connecting bottom plate (23), a rotating shaft coil (27) and rotating shaft magnetic steel (28), wherein the rotating shaft outer stator (24) is fixed on the rotating shaft connecting bottom plate (23), the middle part of the rotating shaft outer stator (24) is provided with a round hole for accommodating the rotating shaft inner rotor (25), a rotating shaft coil (27) is arranged on the outer circle of the rotating shaft along the circumferential direction, a rotating shaft connecting top plate (26) is connected with a rotating shaft inner rotor (25), the rotating shaft inner rotor (25) is arranged in a round hole in the middle of a rotating shaft outer stator (24), a rotating shaft magnetic steel (28) matched with the rotating shaft coil (27) is arranged on the outer edge of the rotating shaft connecting top plate (26) along the circumferential direction;
an air-floatation radial positive pressure throttling hole (29) facing the rotary shaft inner rotor (25) is formed in the inner wall of a circular hole of the rotary shaft outer stator (24), an air-floatation axial positive pressure throttling hole (30) facing the rotary shaft connecting top plate (26) is formed in the upper top surface of the rotary shaft outer stator (24), a negative pressure cavity III (C) facing the rotary shaft connecting top plate (26) is formed in the upper top surface of the rotary shaft outer stator (24), and the air-floatation axial negative pressure throttling hole (31) is communicated with the negative pressure cavity III (C).
3. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: the bottom surface of the Y-axis SiC crossbeam (5) is symmetrically provided with two X-axis air-floatation horizontal guide pieces (6) with equal heights and coplanarity.
4. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: the flexible connecting piece (13) is of a cylindrical structure, the upper part and the lower part of the flexible connecting piece are respectively provided with a plurality of open grooves along the radial direction, and two end faces of the flexible connecting piece are provided with threaded holes (34).
5. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: a second air-floatation horizontal negative pressure orifice (15) is formed in the central part of the second negative pressure cavity (B) and communicated to a negative pressure gas system through a negative pressure gas flow passage (36);
the bottom surface of the X-axis air-floatation horizontal guide piece (6) is provided with a plurality of air-floatation horizontal positive-pressure orifices III (14) at intervals, the plurality of air-floatation horizontal positive-pressure orifices III (14) are positioned on a rectangular track, the plurality of air-floatation horizontal positive-pressure orifices III (14) are communicated in series through positive-pressure gas guide grooves (37), and the air-floatation horizontal positive-pressure orifices III (14) are communicated with a positive-pressure gas system through positive-pressure gas flow channels (35).
6. The air bearing table for laser dicing of a semiconductor wafer according to claim 1 or 5, wherein: and the tail ends of the air floatation horizontal negative pressure orifice II (15) and the air floatation horizontal positive pressure orifice III (14) are provided with hole throttlers, the hole throttlers are made of ruby, and the centers of the inner edges of the hole throttlers are provided with vent holes with the diameters of 0.1mm communicated with the air path.
7. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: a first air-floatation horizontal negative pressure orifice (19) is formed in the central part of the first negative pressure cavity (A) and communicated to a negative pressure gas system through a negative pressure gas flow passage;
a plurality of air-floatation horizontal positive-pressure orifices II (20) are arranged at intervals on the bottom surface of the Y-axis air-floatation guide motion part (7), the air-floatation horizontal positive-pressure orifices II (20) are positioned on a rectangular track, the air-floatation horizontal positive-pressure orifices II (20) are communicated in series through a positive-pressure gas guide groove, and the air-floatation horizontal positive-pressure orifices II (20) are communicated to a positive-pressure gas system through positive-pressure gas flow channels;
and the air floatation side positive pressure throttling hole II (18) is communicated to the positive pressure gas system through a positive pressure gas flow passage.
8. The air bearing table for laser dicing of a semiconductor wafer according to claim 1 or 7, wherein: and the tail ends of the air floatation horizontal negative pressure throttling hole I (19), the air floatation horizontal positive pressure throttling hole II (20) and the air floatation lateral positive pressure throttling hole II (18) are respectively provided with a hole throttling device, the hole throttling devices are made of ruby, and the inner edge center of the hole throttling device is provided with a vent hole which is communicated with the air path and has the diameter of 0.1 mm.
9. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: a plurality of air-floatation horizontal positive-pressure orifices I (10) are arranged on the bottom surface of the X-axis air-floatation guide motion part (4) at intervals, the air-floatation horizontal positive-pressure orifices I (10) are positioned on a rectangular track, the air-floatation horizontal positive-pressure orifices I (10) are communicated in series through a positive-pressure gas guide groove, and the air-floatation horizontal positive-pressure orifices I (10) are communicated to a positive-pressure gas system through positive-pressure gas flow channels;
the air floatation lateral positive pressure throttling hole I (9) is communicated to the positive pressure gas system through a positive pressure gas flow passage.
10. The air bearing table for laser dicing of a semiconductor wafer according to claim 1 or 9, wherein: and the tail ends of the air floatation lateral positive pressure orifice I (9) and the air floatation horizontal positive pressure orifice I (10) are respectively provided with a hole restrictor, the hole restrictor is made of ruby, and the center of the inner edge of the hole restrictor is provided with a vent hole which is communicated with the air passage and has the diameter of 0.1 mm.
11. The air bearing platform for laser dicing of a semiconductor wafer according to claim 2, wherein: the tail ends of the air-flotation radial positive pressure throttling hole (29), the air-flotation axial positive pressure throttling hole (30) and the air-flotation axial negative pressure throttling hole (31) are respectively provided with a hole restrictor, the hole restrictor is made of ruby, and the center of the inner edge of the hole restrictor is provided with a vent hole which is communicated with the air path and has the diameter of 0.1 mm.
12. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: the X-axis air-floatation guiding movement piece (4) is connected with a U-shaped structural piece (32), and two ends of the U-shaped structural piece (32) are fixedly connected with two side parts of the groove of the X-axis air-floatation guiding movement piece (4).
13. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: the X-axis guide rail I (2) is provided with an X-axis grating ruler I, the X-axis guide rail II (3) is provided with an X-axis grating ruler II, and the Y-axis SiC cross beam (5) is provided with a Y-axis grating ruler.
14. The air bearing platform for laser dicing of a semiconductor wafer according to claim 13, wherein: the first X-axis grating ruler, the second X-axis grating ruler and the Y-axis grating ruler are all Renysha absolute grating rulers with the resolution ratio of 5 nm.
15. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: the Y-axis air-floating guide movement piece (7) is of a square-shaped structure.
16. The air bearing platform for laser dicing of a semiconductor wafer according to claim 1, wherein: the planeness of two side faces of the Y-axis SiC beam (5) is less than 1um, and the parallelism of the two side faces is less than 1.5 um.
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| CN113192873A (en) * | 2021-04-22 | 2021-07-30 | 上海御微半导体技术有限公司 | Flexible connection mechanism, micro-motion platform mechanism and semiconductor equipment |
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| CN114309925A (en) * | 2021-12-31 | 2022-04-12 | 河南通用智能装备有限公司 | Wafer recessive cutting device |
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| CN115547916A (en) * | 2022-12-01 | 2022-12-30 | 上海隐冠半导体技术有限公司 | Rotating platform and moving device |
| CN117072561A (en) * | 2023-10-18 | 2023-11-17 | 无锡星微科技有限公司 | Combinable multi-shaft structure and linear motion platform with same |
| CN117108633A (en) * | 2023-10-23 | 2023-11-24 | 上海隐冠半导体技术有限公司 | Air floating table |
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