CN112271475B - Cable connecting device, multi-path server and four-path server - Google Patents
Cable connecting device, multi-path server and four-path server Download PDFInfo
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- CN112271475B CN112271475B CN202010951841.6A CN202010951841A CN112271475B CN 112271475 B CN112271475 B CN 112271475B CN 202010951841 A CN202010951841 A CN 202010951841A CN 112271475 B CN112271475 B CN 112271475B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R29/00—Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The application relates to a cable connecting device, a multi-path server and a four-path server, wherein when a surface of a first circuit board provided with a first connector and a surface of a second circuit board provided with a second connector are relatively close to each other, the first connector and the second connector are contacted and electrically connected. Therefore, the first circuit board, the first connector, the second circuit board and the cable connecting part are electrically connected in sequence. The cable connection device may be provided on a motherboard having a plurality of processors. The first circuit board may be electrically connected to the processor. When a multi-server system is required, two main boards having cable connection devices may be electrically connected to each other through cable connection portions. Two processors are arranged on the main boards, and when two paths of servers are needed, the connecting cables between the two main boards are disconnected through the cable connecting parts. When four paths of servers are needed, the processors of the two mainboards are connected with each other through the cable connecting part of each mainboard, and the use is flexible and convenient.
Description
Technical Field
The present application relates to the field of electrical technology, and in particular, to a cable connection device, a multi-server, and a four-server.
Background
With the development of science and technology, the use of the multi-path server is more and more extensive. The number of processors (CPUs) in a motherboard or chassis of a multi-server is often referred to as a multi-server.
At present, the mode of realizing the four-way server is to arrange four processors which are connected with each other on the same mainboard, so that the requirements of customers on the two-way server cannot be compatible. In addition, four paths of servers are arranged on one mainboard, and due to structural limitation, links among some processors are long, so that the energy consumption on the links is high, and the problems of line crosstalk and the like are easily caused. To solve the above problems, a link material with low power consumption is required, which increases the cost of the product.
Disclosure of Invention
In view of the above, it is necessary to provide a cable connection device, a multi-server, and a four-server in order to solve the above problems.
A cable connecting device comprising:
a first circuit board;
the first connector is arranged on the first circuit board and is electrically connected with the first circuit board;
a second circuit board;
the second connector is arranged on the surface of the second circuit board and is electrically connected with the second circuit board; and
and the cable connecting part is arranged on the surface of the second connector far away from the second circuit board and is electrically connected with the second connector, the first circuit board is arranged on the surface of the first connector and the second circuit board is arranged on the surface of the second connector, and when the surface of the second connector is relatively close to the first connector and the second connector are contacted and electrically connected.
In one embodiment, the connector further comprises a fixing member, and when the first circuit board and the second circuit board are close to each other so that the first connector and the second connector are electrically connected, the fixing member is disposed between the first circuit board and the second circuit board and fixes the first circuit board and the second circuit board.
In this embodiment, the fixing member fixes the first circuit board and the second circuit board, so that the problem that the first connector and the second connector are separated due to vibration and other factors or contact failure can be avoided.
In one embodiment, the first circuit board is provided with a mounting hole, the second circuit board is provided with a through hole, and the fixing member penetrates through the through hole and enters the mounting hole to fix the first circuit board and the second circuit board.
In this embodiment, the fixing member penetrates through the through hole to enter the mounting hole to fix the first circuit board and the second circuit board, and the fixing member is simple in structure and convenient to operate.
In one embodiment, a buffer structure is disposed in the mounting hole.
In this embodiment, the buffer structure may remind the operator to pay attention to reduce the force, so as to avoid damage caused by excessive pressure between the first connector and the second connector due to excessive screwing.
In one embodiment, the first connector is soldered to the first circuit board in a ball grid array package, and/or
The second connector is soldered to the second circuit board in a ball grid array package.
In this embodiment, the grid array package technology can accommodate more pins than other packaging methods.
An embodiment of the present application further provides a multi-path server, including:
the system comprises two mainboards, a plurality of processors and a plurality of communication interfaces, wherein each mainboard is provided with the plurality of processors which are mutually and electrically connected;
the two cable connection devices of the above embodiments are respectively disposed on the two motherboards, and for each motherboard, the first circuit board is electrically connected to the plurality of processors.
In one embodiment, the processors and the first circuit board are disposed on the same surface of the motherboard.
According to the embodiment, the processor can be conveniently and electrically connected with the first circuit board, and the length of a connecting circuit is reduced.
In one embodiment, for each motherboard, the second circuit board is disposed on a surface of the first circuit board away from the motherboard, and the first connector and the second connector are in contact and electrically connected.
In this embodiment, the second circuit board and the first circuit board are disposed on the same side of the motherboard, so that the first connector and the second connector can be conveniently disconnected and contacted at any time.
In one embodiment, the electronic device further comprises a connecting cable, two ends of the connecting cable are electrically connected with the two cable connecting parts respectively, and the two cable connecting parts are located on the two main boards respectively.
This embodiment will two through the connecting cable the cable connecting portion electricity is connected, convenient and practical.
The embodiment of the application further provides a four-path server, which comprises the multi-path server, wherein each mainboard is provided with two processors.
An embodiment of the present application further provides a four-way server, including:
the system comprises two mainboards, a processor and a control module, wherein each mainboard is provided with two processors;
the two first connectors are respectively arranged on the two mainboards, and for each mainboard, each first connector is electrically connected with the two processors;
and the two second connectors which are electrically connected with each other are respectively arranged on the two mainboards and are electrically connected with the two first connectors in a one-to-one correspondence manner.
The cable connecting device, the multichannel server and the four-channel server that this application embodiment provided include cable connecting device includes first circuit board, first connector, second circuit board, second connector and cable connecting portion. The first connector is disposed on the first circuit board. The first connector is electrically connected with the first circuit board. The second connector is arranged on the surface of the second circuit board. The second connector is electrically connected with the second circuit board. The cable connecting part is arranged on the surface of the second circuit board far away from the second connector. The cable connecting portion is electrically connected to the second connector through the second circuit board. When the surface of the first circuit board provided with the first connector and the surface of the second circuit board provided with the second connector are relatively close to each other, the first connector and the second connector are contacted and electrically connected. Therefore, the first circuit board, the first connector, the second circuit board, and the cable connection portion are electrically connected in sequence. The cable connection device can be arranged on a mainboard with a plurality of processors. The first circuit board may be electrically connected with the processor. When a multi-server system is required, two of the main boards having the cable connection device may be electrically connected to each other through the cable connection portion. The distance between the two main boards is adjusted as required, so that the length of a connecting cable of the cable connecting part for connecting the two main boards can be reduced. Furthermore, two processors are arranged on the main boards, and when two paths of servers are needed, the connecting cables between the two main boards are disconnected through the cable connecting parts. When four paths of servers are needed, the processors of the two mainboards are connected with each other through the cable connecting part of each mainboard, and the use is flexible and convenient.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a top view of a cable connection device according to an embodiment of the present application.
Fig. 2 is a cross-sectional view of a cable connection device provided in an embodiment of the present application, taken along the line a-a of fig. 1.
Fig. 3 is a top view of a second circuit board according to an embodiment of the present application.
Fig. 4 is a cross-sectional view of a second circuit board provided in one embodiment of the present application, taken along the direction B-B in fig. 3.
Fig. 5 is a schematic diagram of a multi-server according to an embodiment of the present application.
Fig. 6 is a schematic diagram of two cable connection portions of a multi-server according to another embodiment of the present application.
Description of reference numerals:
the cable connection device 10, the first circuit board 100, the first connector 110, the mounting hole 120, the buffer structure 122, the second circuit board 200, the second connector 210, the through hole 220, the cable connection portion 230, the fixing member 310, the motherboard 400, the processor 410, the connection cable 420, and the multi-server 20.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, 2, 3 and 4, the present embodiment provides a cable connecting device 10. The cable connection device 10 includes a first circuit board 100, a first connector 110, a second circuit board 200, a second connector 210, and a cable connection portion 230. The first connector 110 is disposed on the first circuit board 100. The first connector 110 is electrically connected to the first circuit board 100. The second connector 210 is disposed on a surface of the second circuit board 200. The second connector 210 is electrically connected to the second circuit board 200. The cable connection portion 230 is disposed on a surface of the second circuit board 200 away from the second connector 210. The cable connection part 230 is electrically connected to the second connector 210 through the second circuit board 200. When the surface of the first circuit board 100 on which the first connector 110 is disposed and the surface of the second circuit board 200 on which the second connector 210 is disposed are relatively close to each other, the first connector 110 and the second connector 210 are in contact and electrically connected.
The first circuit board 100 and the second circuit board 200 may be printed circuit boards. The first circuit board 100 may be used to electrically connect with a processor 410 provided on the main board 400. The first connector 110 may be packaged on the first circuit board 100 and electrically connected to the first circuit board 100. It is understood that the first connector 110 may have connection pins. The surface of the first circuit board 100 may be provided with a soldering pad. The first connector 110 is fixedly connected to the soldering pad of the first circuit board 100 through the pin. The processor 410 may be connected to the first processor 410 through the first circuit board 100.
The second connector 210 may be packaged on a surface of the second circuit board 200 and electrically connected to the second circuit board 200. The second connector 210 may also have connection pins. The surface of the second circuit board 200 may also be provided with solder pads. The second connector 210 may be fixedly connected with the soldering pad of the second circuit board 200 through the connection pin.
The cable connection part 230 and the second connector 210 may be respectively disposed on two opposite surfaces of the second circuit board 200. The second circuit board 200 may be provided with a printed circuit. The cable connection part 230 and the second connector 210 may be connected through the printed circuit. The cable connection part 230 may be used to externally connect the connection cable 420.
The second circuit board 200 and the first circuit board 100 may have the same shape. In one embodiment, the first circuit board 100 and the second circuit board 200 may be both rectangular. When it is required to connect the first connector 110 and the second connector 210 to each other, a surface of the first circuit board 100 where the first connector 110 is disposed and a surface of the second circuit board 200 where the second connector 210 is disposed may be opposed and brought close to each other. The first connector 110 and the second connector 210 are close to and in contact with each other. At this time, the first connector 110 and the second connector 210 are electrically connected.
It is understood that the first connector 110 may have a socket and the second connector 210 may have a plug. The plug may be inserted into the socket such that the first connector 110 and the second connector 210 are electrically connected. In one embodiment, the second connector 210 may have the socket, and the first connector 110 may have the plug. The insertion of the plug into the socket electrically connects the first connector 110 and the second connector 210.
The first circuit board 100 may be used to electrically connect with a processor 410 on the motherboard 400. A plurality of the processors 410 may be disposed on the main board 400. The plurality of processors 410 may be electrically connected to each other. When the first connector 110 and the second connector 210 are in contact and electrically connected, the processor 410, the first circuit board 100, the first connector 110, and the second connector 210 are electrically connected in sequence. The second connector 210 is electrically connected to the cable connection part 230 through the second circuit board 200. Thus, the processor 410 is electrically connected to the cable connection portion.
It is understood that there may be a plurality of said motherboards 400. A plurality of the processors 410 may be disposed on each of the main boards 400. One first circuit board 100 may be further disposed on each of the main boards 400. The first connector 110 on the first circuit board 100 and the second connector 210 on the second circuit board 200 are electrically connected. That is, the same first circuit board 100, second circuit board 200, first connector 110, second connector 210, and cable connection portion 230 may be provided on each of the main boards 400. When the number of the processors 410 of one of the main boards 400 is not enough to form the multi-server 20, the processors 410 of two of the main boards 400 may be connected to each other through the cable connection part 230. In one embodiment, two processors 410 may be provided per the motherboard 400. When a four-way server is required, the cable connection parts 230 on the two main boards 400 may be electrically connected to each other. At this time, the processors 410 of each of the main boards 400 are electrically connected to each other through the cable connection part 230, constituting the four-way server.
The cable connection device 10 provided by the embodiment of the present application includes a first circuit board 100, a first connector 110, a second circuit board 200, a second connector 210, and a cable connection portion 230. The first connector 110 is disposed on the first circuit board 100. The first connector 110 is electrically connected to the first circuit board 100. The second connector 210 is disposed on a surface of the second circuit board 200. The second connector 210 is electrically connected to the second circuit board 200. The cable connection portion 230 is disposed on a surface of the second circuit board 200 away from the second connector 210. The cable connection part 230 is electrically connected to the second connector 210 through the second circuit board 200. When the surface of the first circuit board 100 on which the first connector 110 is disposed and the surface of the second circuit board 200 on which the second connector 210 is disposed are relatively close to each other, the first connector 110 and the second connector 210 are in contact and electrically connected. Accordingly, the first circuit board 100, the first connector 110, the second connector 210, the second circuit board 200, and the cable connection part 230 are electrically connected in sequence. The cable connection device 10 may be disposed on a motherboard 400 having a plurality of processors 410. The first circuit board 100 may be electrically connected to the processor 410. When the multiplex server 20 is required, two main boards 400 having the cable connection device 10 may be electrically connected to each other through the cable connection part 230. The distance between the two main boards 400 is adjusted as necessary, and the length of the connection cable 420 connecting the cable connection portions 230 of the two main boards 400 can be reduced. Further, two processors 410 are disposed on the main board 400, and when two servers are required, the cable connection portion 230 between the connection cables 420 between the two main boards 400 is insulated. When four paths of servers are needed, the processors 410 of the two main boards 400 are connected with each other through the cable connecting part 230 of each main board 400, so that the use is flexible and convenient.
In one embodiment, the first connector 110 and the second connector 210 may be array connectors.
In one embodiment, the cable connection part 230 may be a pad disposed on the second circuit board 200. One end of the connection cable 420 may be soldered to a pad of the second circuit board 200 for connection.
Referring to fig. 2, in one embodiment, the cable connecting device 10 further includes a fixing member 310. The first circuit board 100 and the second circuit board 200 are close to each other so that the fixing member 310 may be disposed between the first circuit board 100 and the second circuit board 200 when the first connector 110 and the second connector 210 are electrically connected. The fixing member 310 may fix the first circuit board 100 and the second circuit board 200. It is understood that when it is required to electrically connect the first connector 110 and the second connector 210, the surface of the first circuit board 100 on which the first connector 110 is disposed and the surface of the second circuit board 200 on which the second connector 210 is disposed may be brought close to each other so that the first connector 110 and the second connector 210 are in contact. The fixing member 310 fixes the first circuit board 100 and the second circuit board 200, so that the first connector 110 and the second connector 210 may be prevented from being separated due to vibration or the like, or from being in poor contact.
In one embodiment, the fixing member 310 may be a mechanical connection structure, and fixes the first circuit board 100 and the second circuit board 200. The fixing member 310 may also include a locking hole disposed on the first circuit board 100 and a locking tongue disposed on the second circuit board 200. The first circuit board 100 and the second circuit board 200 can be fixed by the cooperation of the locking hole and the locking tongue. The fixing member 310 may also be a bolt, a screw, or the like. The fixing member 310 may be an adhesive member, and may adhere and fix the first circuit board 100 and the second circuit board 200.
In one embodiment, the first circuit board 100 is provided with mounting holes 120. The second circuit board 200 is provided with a through hole 220. The fixing member 310 passes through the through hole 220 and enters the mounting hole 120 to fix the first circuit board 100 and the second circuit board 200. The number of the mounting holes 120 and the through holes 220 is not limited. In one embodiment, one of the mounting holes 120 may be disposed at each of four corners of the first circuit board 100. The four corners of the second circuit board 200 may be respectively provided with a through hole 220. The mounting holes 120 and the through holes 220 may be provided in one-to-one correspondence. The fixing member 310 may be a bolt. The through hole 220 and the inner wall of the mounting hole 120 may have internal threads. The bolts may be inserted into the through holes 220 and the mounting holes 120 to fix the first circuit board 100 and the second circuit board 200. In one embodiment, the mounting hole 120 may be a blind hole or a stepped hole.
In one embodiment, a buffer structure 122 is disposed in the mounting hole 120. The cushioning structure 122 may be an elastic material. In one embodiment, the buffer structure 122 may be disposed at the bottom of the mounting hole 120 in a pie-shaped structure. It is understood that the mounting hole 120 may have a circular cross-section. The buffer structure 122 may be made of a rubber material. It can be understood that when the first connector 110 contacts the second connector 210, if the force is too large, the stress between the first connector 110 and the second connector 210 is too large, so that the first connector 110 and the second connector 210 are damaged. When the fixing member 310 is a bolt, the bolt enters the mounting hole 120 and then contacts the buffer structure 122, and an operator can feel elasticity, that is, the bolt is about to contact the bottom of the mounting hole 120. The operator can be reminded to reduce the force, so as to avoid damage caused by excessive screwing and excessive pressure between the first connector 110 and the second connector 210.
In one embodiment, the first connector 110 is soldered to the first circuit board 100 in a ball grid array package. The second connector 210 is also soldered to the first circuit board 100 in a ball grid array package.
In one embodiment, the first connector 110 is soldered to the first circuit board 100 by a ball grid array package, and the second connector 210 is soldered to the first circuit board 100 by a different form than a ball grid array package.
In one embodiment, the second connector 210 is soldered to the first circuit board 100 in a ball grid array package. The first connector 110 is soldered to the first circuit board 100 by a form other than a ball grid array package.
It is understood that the ball grid array package technology can accommodate more pins than other packaging methods, i.e., the first connector 110 can be connected to the first circuit board 100 through more pins. The second connector 210 may be connected to the second circuit board 200 through more pins. I.e. there may be more signal paths between the first connector 110 and the first circuit board 100. There may be more signal paths between the second connector 210 and the second circuit board 200.
Referring to fig. 5 and 6, an embodiment of the present application further provides a multi-way server 20. The multi-server 20 includes two main boards 400 and the cable connection device 10 according to the above embodiment. The cable connection devices 10 are respectively disposed on the two main boards 400. For each of the motherboards 400. The first circuit board 100 is electrically connected to the plurality of processors 410. The processor 410 may be a central processing unit 410 (CPU). The processors 410 may communicate with each other. In one embodiment, for each of the motherboards 400, the processors 410 may be interconnected via a common system interface (QPI), a 10Gb media independent interface (XGMII), a hyper-threading (HT), or other high speed bus. It is to be understood that the processors 410 may be understood as two of the processors 410 or more than two of the processors 410.
One of the cable connection devices 10 may be provided for each of the main boards 400. That is, each of the main boards 400 may be provided with a first circuit board 100, a first connector 110, a second circuit board 200, a second connector 210, and the cable connection part 230. The first circuit board 100 may be directly disposed on the main board 400. The first circuit board 100 may be disposed on a surface of the main board 400. The surface of the main board 400 may have a circuit. The processor 410 may be electrically connected to the first circuit board 100 through the circuit of the main board 400. The surface of the first circuit board 100 away from the main board 400 may be provided with the first connector 110.
In one embodiment, the processors 410 and the first circuit board 100 are disposed on the same surface of the main board 400. Therefore, the electrical connection of the processor 410 to the first circuit board 100 can be facilitated, and the length of the connection circuit can be reduced.
In one embodiment, for each motherboard 400, the second circuit board 200 is disposed on a surface of the first circuit board 100 away from the motherboard 400. The first connector 110 and the second connector 210 are in contact and electrically connected. Therefore, the second circuit board 200 and the first circuit board 100 are disposed on the same side of the main board 200, which facilitates to control the disconnection and contact of the first connector 110 and the second connector 210 at any time.
In one embodiment, the number of the processors 410 provided in each of the main boards 400 may be two. That is, each of the main board 400 and the two processors 410 may constitute two servers. When four servers are required, two of the main boards 400 may be prepared. The processor 410 is disposed on a surface of each of the motherboards 400, and one of the second circuit boards 200 is fastened. That is, the surface of the second circuit board 200 on which the second connector 210 is disposed is relatively close to the surface of the main board 400 on which the processor 410 is disposed, so that the first connector 110 and the second connector 210 are in contact with each other. The first connector 110 may be provided with a slot, and the second connector 210 may be provided with a plug, and the plug may be inserted into the socket for electrical connection. Therefore, on the surface of each of the main boards 400, the first connector 110 and the second connector 210 are fitted to each other. Wherein, the cable connection part 230 is disposed on a surface of each second circuit board 200 away from the main board 400. The cable connection portions 230 of the two surfaces of the main board 400 may be connected by a connection cable 420. Thereby realizing interconnection of four processors 410 on two mainboards 400. In one embodiment, the cable connection 230 may be a high speed cable Pad. The high-speed cable Pad can be directly interconnected with the foldable cable by means of welding.
In one embodiment, electrical signal communication may be used between different motherboards 400. In one embodiment, optoelectronic transceiver communication may also be used between different motherboards 400. The opto-electronic transceiver may perform optical-electrical or electrical-optical conversion. The photoelectric transceivers can be interconnected through high-density optical fiber cables.
It is understood that the number of the processors 410 on each of the motherboards 400 is not limited, and two processors 410 are provided on each of the motherboards 400 for illustration.
In one embodiment, the multiplex server 20 further includes a connection cable 420. Both ends of the connection cable 420 are electrically connected to the two cable connection parts 230, respectively. The two cable connection portions 230 are located at the two main boards 400, respectively. Therefore, the processors 410 of the two main boards 400 can be interconnected by the connection cable 420.
The embodiment of the application also provides a four-way server. The four-way server includes the multi-way server 20. Wherein, two processors 410 are disposed on each motherboard 400. Thus, the four processors 410 in two of the motherboards 400 constitute the four-way server.
The embodiment of the application also provides a four-way server. The four-way server includes two of the main boards 400, two of the first connectors 110, and two of the second connectors 210 electrically connected to each other. Two processors 410 are provided for each of the main boards 400. The two first connectors 110 are respectively disposed on the two main boards 400. For each motherboard 400, each first connector 110 is electrically connected to the two processors 410. The two second connectors 210 electrically connected to each other are respectively disposed on the two main boards 400. Two of the second connectors 210 electrically connected to each other are electrically connected to the two first connectors 110 in a one-to-one correspondence.
It is understood that two processors 410 are provided for each motherboard 400, which may constitute two servers. One first connector 110 is provided on each of the main boards 400. The two processors 410 of the motherboard 400 are electrically connected to each other, and the two processors 410 are also electrically connected to the first connector 110, respectively. One of the second connectors 210 is electrically connected to each of the first connectors 110. The second connectors 210 on the two main boards 400 are connected to each other. Therefore, the four processors 410 of the two main boards 400 are electrically connected to each other through the first connector 110 and the second connector 210. The four-way server is implemented. It can be understood that when only two servers are needed, the second connector 210 and the first connector 110 can be separated, and the two second connectors 210 are disconnected, which is convenient and fast.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A cable connecting device, comprising:
a first circuit board; a welding pad is arranged on the surface of the first circuit board;
the first connector is arranged on the first circuit board, is fixed with the welding pad of the first circuit board through a pin and is electrically connected with the first circuit board;
a second circuit board; a welding pad is arranged on the surface of the second circuit board;
the second connector is arranged on the surface of the second circuit board, is fixed with the welding pad of the second circuit board through a pin and is electrically connected with the second circuit board; and
the cable connecting part is arranged on the surface of the second circuit board, which is far away from the second connector, and is electrically connected with the second connector through the second circuit board, and when the surface of the first circuit board, which is provided with the first connector, is relatively close to the surface of the second circuit board, which is provided with the second connector, the first connector is contacted with the second connector and is electrically connected with the second connector;
and the fixing piece is arranged between the first circuit board and the second circuit board and fixes the first circuit board and the second circuit board when the first circuit board and the second circuit board are close to each other so that the first connector and the second connector are electrically connected.
2. The cable connecting apparatus according to claim 1, wherein the first circuit board is provided with a mounting hole, the second circuit board is provided with a through hole, and the fixing member passes through the through hole into the mounting hole to fix the first circuit board and the second circuit board.
3. The cable connection apparatus of claim 2, wherein a buffer structure is provided in the mounting hole.
4. The cable connection device of claim 1, wherein the first connector is soldered to the first circuit board in a ball grid array package, and/or
The second connector is soldered to the second circuit board in a ball grid array package.
5. The cable connection apparatus of claim 1, wherein the fixing member is an adhesive member.
6. A multi-way server, comprising:
the system comprises two mainboards, a plurality of processors and a plurality of communication interfaces, wherein each mainboard is provided with the plurality of processors which are mutually and electrically connected;
two cable connection devices according to any one of claims 1 to 5, respectively arranged on the two motherboards, wherein for each of the motherboards, the first circuit board is electrically connected to the plurality of processors, and the plurality of processors and the first circuit board are arranged on the same surface of the motherboard.
7. The multi-server as claimed in claim 6, wherein for each of the motherboards, the second circuit board is disposed on a surface of the first circuit board remote from the motherboard, and the first connector and the second connector are in contact and electrically connected.
8. The multi-server according to claim 7, further comprising a connection cable, wherein two ends of the connection cable are electrically connected to the two cable connection portions, respectively, and the two cable connection portions are located on the two motherboards, respectively.
9. A four-way server comprising a multi-way server as claimed in any one of claims 6 to 8, wherein two processors are provided for each of said motherboards.
10. A four-way server, comprising:
the system comprises two mainboards, a processor and a control module, wherein each mainboard is provided with two processors;
the two first connectors are respectively arranged on the two mainboards, and for each mainboard, each first connector is electrically connected with the two processors;
the two second connectors which are electrically connected with each other are respectively arranged on the two mainboards and are electrically connected with the two first connectors in a one-to-one correspondence manner;
the two first connectors are respectively arranged on the two first circuit boards and are respectively electrically connected with the first circuit boards, and the two second connectors are respectively arranged on the two second circuit boards and are respectively electrically connected with the two second circuit boards;
and the fixing piece is arranged between the first circuit board and the second circuit board and fixes the first circuit board and the second circuit board when the first circuit board and the second circuit board are close to each other so that the first connector and the second connector are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010951841.6A CN112271475B (en) | 2020-09-11 | 2020-09-11 | Cable connecting device, multi-path server and four-path server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010951841.6A CN112271475B (en) | 2020-09-11 | 2020-09-11 | Cable connecting device, multi-path server and four-path server |
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| Publication Number | Publication Date |
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| CN112271475A CN112271475A (en) | 2021-01-26 |
| CN112271475B true CN112271475B (en) | 2022-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010951841.6A Active CN112271475B (en) | 2020-09-11 | 2020-09-11 | Cable connecting device, multi-path server and four-path server |
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| CN111563058A (en) * | 2020-05-13 | 2020-08-21 | 浪潮商用机器有限公司 | Device for switching PCIE Gen4 in server |
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| US5675723A (en) * | 1995-05-19 | 1997-10-07 | Compaq Computer Corporation | Multi-server fault tolerance using in-band signalling |
| US6347946B1 (en) * | 2000-11-08 | 2002-02-19 | Intel Corporation | Pin grid array socket |
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| CN112271475A (en) | 2021-01-26 |
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