CN112271154A - Adjustable high-precision wafer edging carrying platform and use method - Google Patents
Adjustable high-precision wafer edging carrying platform and use method Download PDFInfo
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- CN112271154A CN112271154A CN202011347903.9A CN202011347903A CN112271154A CN 112271154 A CN112271154 A CN 112271154A CN 202011347903 A CN202011347903 A CN 202011347903A CN 112271154 A CN112271154 A CN 112271154A
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- 238000007688 edging Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 235000012431 wafers Nutrition 0.000 claims description 47
- 239000004973 liquid crystal related substance Substances 0.000 claims description 16
- 238000001179 sorption measurement Methods 0.000 claims description 13
- 238000005086 pumping Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 abstract description 6
- 230000001360 synchronised effect Effects 0.000 abstract 2
- 230000008569 process Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
Abstract
The invention relates to an adjustable high-precision wafer edging carrying platform and a using method thereof, and the adjustable high-precision wafer edging carrying platform comprises a bearing fixing piece arranged on a base, wherein the bearing fixing piece comprises a clamping device and two negative pressure carrying platforms symmetrically arranged at the front side and the rear side of the clamping device; the clamping device comprises a rotating arm and a cylinder vertically arranged on the base, the tail end of a cylinder rod of the cylinder is connected with the middle part of the rotating arm, and pressing plates are arranged at two ends of the rotating arm; the negative pressure microscope carrier is including installing the vertical lead screw slip table on the support, the symmetry is provided with two slip tables A of synchronous in opposite directions or back-to-back motion on the vertical lead screw slip table, install horizontal lead screw slip table on the slip table A, the symmetry is provided with two slip tables B of synchronous in opposite directions or back-to-back motion on the horizontal lead screw slip table, install the negative pressure on the slip table B and adsorb the platform, the edging microscope carrier can freely adjust the size of vacuum microscope carrier in order to adapt to the wafer processing of various models size, increase the clamping reliability, reduce the processing vibration, can realize array processing, improve product processingquality and machining efficiency, and the.
Description
Technical Field
The invention relates to an adjustable high-precision wafer edging carrying platform and a using method in the technical field of wafer tools.
Background
The liquid crystal panel wafer is respectively a horizontal polarizer, a color filter, liquid crystal, TFT glass and a vertical polarizer from outside to inside, and in addition, a driving IC and a printed circuit board are arranged on the edge of the liquid crystal panel and are mainly used for controlling the rotation of liquid crystal molecules in the liquid crystal panel and the transmission of display signals. The liquid crystal panel is thin and semi-transparent under the condition of no electricity, and is roughly constructed like a sandwich, and liquid crystal is clamped between the lower TFT glass and the upper color filter. The full-automatic liquid crystal panel edge grinding and chamfering machine is used for processing special-shaped chamfers, edges, holes and the like of liquid crystal panels, TFTs (thin film transistors), LCDs (liquid crystal displays), cover plate glass and the like, and is mainly applied to production of products such as smart watches, mobile phones, tablet computers, vehicle-mounted displays and the like.
A machining carrier used by an existing edge grinding and chamfering machine of an enterprise uses a single vacuum carrier, positioning is carried out by using a cross MAC mark on a wafer, and fixing machining is carried out by using the negative pressure of the vacuum carrier. Because electronic products are updated very fast, the edge grinding chamfering machine needs to adapt to the sizes of different types of wafers, a fixed vacuum carrier cannot adapt to the processing of various types of wafers, and the existing method of enterprises is to replace carriers of different types aiming at different processed products, so that the workload is increased, the working efficiency is low, and the cost is increased.
Secondly, because cooling water can often spray on vacuum microscope carrier surface, use single negative pressure to fix, can often appear the condition such as sliding during processing, fixed unreliable leads to the product precision that processes out low, and the wafer surface appears the condition that the limit collapses, even the interior collapses.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an adjustable high-precision wafer edging carrying platform and a using method thereof.
The invention solves the technical problem by adopting the scheme that the adjustable high-precision wafer edging carrying platform comprises at least one group of bearing fixing pieces which are arranged on a base at intervals, wherein each bearing fixing piece comprises a clamping device and two negative pressure carrying platforms which are symmetrically arranged at the front side and the rear side of the clamping device; the clamping device comprises a rotating arm and a cylinder vertically arranged on the base, the tail end of a cylinder rod of the cylinder is connected with the middle part of the rotating arm, and pressing plates are arranged at two ends of the rotating arm; the negative pressure carrying platform comprises a longitudinal screw rod sliding table arranged on the support, two sliding tables A which move synchronously in opposite directions or in opposite directions are symmetrically arranged on the longitudinal screw rod sliding table, a transverse screw rod sliding table is arranged on the sliding table A, two sliding tables B which move synchronously in opposite directions or in opposite directions are symmetrically arranged on the transverse screw rod sliding table, and a negative pressure adsorption table is arranged on the sliding tables B.
Further, the negative pressure adsorption platform comprises a base installed on the sliding table B, a vacuum groove is formed in the upper surface of the base, a carrying table is covered on the upper surface of the base, a plurality of bee holes communicated with the vacuum groove are formed in the carrying table, a vacuum generator is installed on the support, a vacuum pumping hole communicated with the vacuum groove is formed in the base, and the vacuum pumping hole is connected with the vacuum generator through a guide pipe.
Furthermore, a sealing ring is arranged between the carrying platform and the base, and the carrying platform is locked with the base through a bolt.
Furthermore, vacuum pumping holes and vacuum generators on the two sliding tables B positioned on the same side on the two transverse screw rod sliding tables are respectively connected with a Y-shaped three-way pipe joint through pipes.
Furthermore, the air cylinder is arranged on the base through a rack, a vertical cam column is arranged above the air cylinder on the rack, a guide sleeve is sleeved on the vertical cam column and fixedly arranged on the rack, a guide chute is formed in the outer surface of the vertical cam column, a cam guide pin is arranged on the guide sleeve and is located in the guide chute, the lower end of the vertical cam column is sleeved at the tail end of an air cylinder rod of the air cylinder and is in rotating fit with the air cylinder rod, and the upper end of the vertical cam column is connected with the middle of the rotating arm.
Further, the direction spout is including the spiral groove portion and the perpendicular groove portion that from top to bottom connect gradually, and vertical cam post can carry out 90 degrees rotations under the effect of direction spout and cam guide pin to drive the swinging of swinging boom, indulge when the swinging boom is located the low level and put, transversely when being located the high position.
Further, a double-row angular contact ball bearing is sleeved between the vertical cam column and the tail end of a cylinder rod of the cylinder, the lower end of an inner ring of the double-row angular contact ball bearing is fixed with a shaft shoulder of the cylinder rod 27, the upper end of the inner ring of the double-row angular contact ball bearing is locked by a nut installed on the cylinder rod, the upper end of an outer ring of the double-row angular contact ball bearing is fixed with a hole shoulder on the vertical cam column, the lower end of the outer ring of the.
A use method of an adjustable high-precision wafer edging carrying platform comprises the following steps:
(1) according to the size of the liquid crystal panel wafers to be processed in batches, the relative positions of 4 negative pressure adsorption tables on the negative pressure loading platform are adjusted by the transverse screw rod sliding table and the longitudinal screw rod sliding table respectively, so that the wafers to be processed can be stably supported;
(2) and placing the liquid crystal panel wafer to be processed on the negative pressure carrying platform, and starting the vacuum generator to enable the negative pressure adsorption platform to generate negative pressure to tightly adsorb the wafer to be processed.
(3) The vertical cam column is driven to descend by the air cylinder, the vertical cam column drives the rotating arm to be converted from the transverse direction to the longitudinal direction under the action of the guide sliding groove and the cam guide pin, so that the pressing plate is positioned above the wafer to be processed, then the air cylinder continues to drive the vertical cam column to descend, so that the pressing plate tightly presses the wafer to be processed, and clamping is completed;
(4) carrying out edge grinding processing on a wafer to be processed;
(5) after the processing is finished, the rotating arm is lifted and reset under the action of the air cylinder, the vacuum generator is closed, and the processed wafer can be taken out.
Compared with the prior art, the invention has the following beneficial effects: simple structure, reasonable in design, the size that can freely adjust the vacuum microscope carrier is in order to adapt to the wafer processing of various models size, increases the clamping reliability, reduces the processing vibration, bears the mounting through setting up the multiunit, can realize array processing, improves product processingquality and machining efficiency, reduces the manufacturing cost of enterprise.
Drawings
The invention is further described with reference to the following figures.
FIG. 1 is an assembly view of an edging stage;
FIG. 2 is a schematic structural view of a screw rod sliding table;
FIG. 3 is an assembly view of a vacuum stage of the edging stage and a full sectional view thereof;
fig. 4 is an assembly view of the clamping device of the edging stage and a full sectional view thereof.
In the figure: 1-a negative pressure carrying platform; 2-a clamping device; 3-vertical cam posts; 4-a rotating arm; 5, pressing a plate; 6-a scaffold; 7-a transverse screw rod sliding table; 8-a longitudinal screw rod sliding table; 9-negative pressure adsorption platform; 10-a vacuum generator; 11-a frame mount; 12-a screw rod; 13-a hand wheel; 14-a stop clamp; 15-left-hand fitting of nuts; 16-right-handed mating nuts; 17-a slide table; 18-a guide rail; 19-a slide block; 20-a base; 21-a stage; 22-a sealing ring; 23-bee holes; 24-vacuum hole drawing; 25-cylinder; 26-a cylinder rod; 27-a guide sleeve; 28-cam guide pins; 29-a guide chute; 30-double row angular contact ball bearings; 31-a nut; 32-end caps; 33-frame.
Detailed Description
The invention is further described with reference to the following figures and detailed description.
As shown in fig. 1-4, an adjustable high-precision wafer edging platform comprises at least one set of bearing fixing members mounted on a base at intervals, and each processing position on each set of bearing fixing members can be processed only by once tool setting, so that array processing is realized, and the processing efficiency is improved, wherein each bearing fixing member comprises a clamping device 2 and two negative pressure platforms 1 symmetrically arranged at the front side and the rear side of the clamping device; the clamping device comprises a rotating arm 4 and a cylinder 25 vertically arranged on the base, the tail end of a cylinder rod 26 of the cylinder is connected with the middle part of the rotating arm, pressing plates 5 are arranged at two ends of the rotating arm, the size of each pressing plate can be changed to match the use of the negative pressure carrying platform, so that the clamping position is close to the machining position as far as possible, and the effects of reducing machining vibration and improving precision are achieved; the negative pressure microscope carrier comprises a longitudinal screw rod sliding table 7 installed on a support 6, two sliding tables A which move synchronously in opposite directions or in opposite directions are symmetrically arranged on the longitudinal screw rod sliding table, a transverse screw rod sliding table 8 is installed on the sliding table A, two sliding tables B which move synchronously in opposite directions or in opposite directions are symmetrically arranged on the transverse screw rod sliding table, and a negative pressure adsorption table 9 is installed on the sliding table B.
In the embodiment, the longitudinal screw rod sliding table and the transverse screw rod sliding table are identical in structure and respectively comprise a frame base 11, the frame base of the transverse screw rod sliding table is fixedly arranged on a support, the frame base of the longitudinal screw rod sliding table is fixedly arranged on a sliding table A, a screw rod 12 is arranged on the frame base, a hand wheel 13 is arranged at one end of the screw rod, a locking clamp 14 for fixing the screw rod to prevent the screw rod from rotating is arranged on the frame base, the clamp can be locked and fixed when the sliding tables move to a target position, a left-handed screw thread is arranged on one side of the screw rod, a right-handed screw thread is arranged on the other side of the screw rod, a left-handed matching nut 15 is arranged on the side of the left-handed screw thread, a right-handed matching nut 16 is arranged on the side of the right-handed screw thread, sliding tables A are arranged on the left-handed matching nut and the right-handed matching nut of the transverse screw rod sliding table, sliding tables B, the guide rail is provided with a slide block 19 which is fixedly arranged on the lower surface of the sliding table on the frame seat.
In this embodiment, the negative pressure adsorption platform is including installing base 20 on slip table B, and the vacuum groove has been seted up to the base upper surface, and the base upper surface lid is equipped with microscope carrier 21, sets up bee hole 23 in a plurality of intercommunication vacuum grooves on the microscope carrier, installs vacuum generator 10 on the support, sets up the vacuum exhaust hole 24 in intercommunication vacuum groove on the base, and the vacuum exhaust hole is through pipe connection vacuum generator, and vacuum generator passes through the air in pipe extraction vacuum groove, treats by bee hole on the microscope carrier and processes the part and produce the negative pressure finally.
In this embodiment, a sealing ring 23 is disposed between the carrier and the base, and the carrier is locked to the base by a bolt.
In this embodiment, the vacuum pumping hole and the vacuum generator on the two sliding tables B located on the same side on the two horizontal screw rod sliding tables are respectively connected to the Y-shaped three-way pipe joint through a pipe.
In this embodiment, the cylinder is mounted on the base through a frame 33, a vertical cam post 3 is arranged above the cylinder on the frame, a guide sleeve 27 is sleeved on the vertical cam post, the guide sleeve is fixedly mounted on the frame, a guide chute 29 is formed on the outer surface of the vertical cam post, a cam guide pin 28 is mounted on the guide sleeve, the cam guide pin is located in the guide chute, the lower end of the vertical cam post is sleeved at the tail end of a cylinder rod of the cylinder and is in rotating fit with the tail end, and the upper end of the vertical cam post is connected with the middle part of the rotating arm.
In this embodiment, the direction spout is including the spiral groove portion and the perpendicular groove portion that from top to bottom connect gradually, and vertical cam post can carry out 90 degrees rotations under the effect of direction spout and cam guide pin to drive the swinging boom, indulge when the swinging boom is located the low level and put, transversely put when being located the high position, the interference of processing cutter and clamping device has been avoided in such design.
In this embodiment, a double-row angular contact ball bearing 30 is sleeved between the vertical cam column and the tail end of a cylinder rod of the cylinder, the lower end of an inner ring of the double-row angular contact ball bearing is fixed with a shaft shoulder of the cylinder rod, the upper end of the inner ring of the double-row angular contact ball bearing is locked by a nut 31 installed on the cylinder rod, the upper end of an outer ring of the double-row angular contact ball bearing is fixed with a hole shoulder on the vertical cam column, the lower end of the outer ring of.
A use method of an adjustable high-precision wafer edging carrying platform comprises the following steps:
(1) according to the size of the liquid crystal panel wafers to be processed in batches, the relative positions of 4 negative pressure adsorption tables on the negative pressure loading platform are adjusted by the transverse screw rod sliding table and the longitudinal screw rod sliding table respectively, so that the wafers to be processed can be stably supported;
(2) and placing the liquid crystal panel wafer to be processed on the negative pressure carrying platform, and starting the vacuum generator to enable the negative pressure adsorption platform to generate negative pressure to tightly adsorb the wafer to be processed.
(3) The vertical cam column is driven to descend by the air cylinder, the vertical cam column drives the rotating arm to be converted from the transverse direction to the longitudinal direction under the action of the guide sliding groove and the cam guide pin, so that the pressing plate is positioned above the wafer to be processed, then the air cylinder continues to drive the vertical cam column to descend, so that the pressing plate tightly presses the wafer to be processed, and clamping is completed;
(4) carrying out edge grinding processing on a wafer to be processed;
(5) after the processing is finished, the rotating arm is lifted and reset under the action of the air cylinder, the vacuum generator is closed, and the processed wafer can be taken out.
If this patent discloses or refers to parts or structures that are fixedly connected to each other, the fixedly connected may be understood as: a detachable fixed connection (for example using a bolt or screw connection) can also be understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).
In the description of this patent, it is to be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the patent, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
The above-mentioned preferred embodiments, further illustrating the objects, technical solutions and advantages of the present invention, should be understood that the above-mentioned are only preferred embodiments of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a high accuracy wafer edging microscope carrier with adjustable which characterized in that: the device comprises at least one group of bearing fixing pieces which are arranged on a base at intervals, wherein each bearing fixing piece comprises a clamping device and two negative pressure carrying platforms which are symmetrically arranged on the front side and the rear side of the clamping device; the clamping device comprises a rotating arm and a cylinder vertically arranged on the base, the tail end of a cylinder rod of the cylinder is connected with the middle part of the rotating arm, and pressing plates are arranged at two ends of the rotating arm; the negative pressure carrying platform comprises a longitudinal screw rod sliding table arranged on the support, two sliding tables A which move synchronously in opposite directions or in opposite directions are symmetrically arranged on the longitudinal screw rod sliding table, a transverse screw rod sliding table is arranged on the sliding table A, two sliding tables B which move synchronously in opposite directions or in opposite directions are symmetrically arranged on the transverse screw rod sliding table, and a negative pressure adsorption table is arranged on the sliding tables B.
2. The adjustable high precision wafer edging stage of claim 1, wherein: the negative pressure adsorption platform comprises a base installed on the sliding table B, a vacuum groove is formed in the upper surface of the base, a carrying table is covered on the upper surface of the base, a plurality of bee holes communicated with the vacuum groove are formed in the carrying table, a vacuum generator is installed on the support, a vacuum pumping hole communicated with the vacuum groove is formed in the base, and the vacuum pumping hole is connected with the vacuum generator through a guide pipe.
3. The adjustable high precision wafer edging stage of claim 2, wherein: a sealing ring is arranged between the carrying platform and the base, and the carrying platform is locked with the base through a bolt.
4. The adjustable high precision wafer base edging stage of claim 2, wherein: the vacuum pumping holes and the vacuum generator on the two sliding tables B positioned on the same side on the two transverse screw rod sliding tables are respectively connected with the Y-shaped three-way pipe joint through pipes.
5. The adjustable high precision wafer edging stage of claim 1, wherein: the cylinder is arranged on the base through a rack, a vertical cam column is arranged above the cylinder on the rack, a guide sleeve is sleeved on the vertical cam column and fixedly arranged on the rack, a guide chute is formed in the outer surface of the vertical cam column, a cam guide pin is arranged on the guide sleeve and is positioned in the guide chute, the lower end of the vertical cam column is sleeved at the tail end of a cylinder rod of the cylinder and is in running fit with the tail end of the cylinder rod, and the upper end of the vertical cam column is connected with the middle part of the rotating arm.
6. The adjustable high precision wafer edging stage of claim 5, wherein: the direction spout is including the spiral slot portion that from top to bottom connects gradually and erect groove portion, and vertical cam post can carry out 90 degrees rotations under the effect of direction spout and cam guide pin to drive the swinging boom, indulge when the swinging boom is located the low level and put, transversely put when being located the high position.
7. The adjustable high precision wafer edging stage of claim 6, wherein: the double-row angular contact ball bearing is sleeved between the vertical cam column and the tail end of a cylinder rod of the cylinder, the lower end of an inner ring of the double-row angular contact ball bearing is fixed with a shaft shoulder of the cylinder rod, the upper end of the inner ring of the double-row angular contact ball bearing is locked by a nut installed on the cylinder rod, the upper end of an outer ring of the double-row angular contact ball bearing is fixed with a hole shoulder on the vertical cam column, the lower end of the outer ring.
8. A method of using an adjustable high precision wafer edging stage, using the adjustable high precision wafer edging stage of claim 6, comprising the steps of:
(1) according to the size of the liquid crystal panel wafers to be processed in batches, the relative positions of 4 negative pressure adsorption tables on the negative pressure loading platform are adjusted by the transverse screw rod sliding table and the longitudinal screw rod sliding table respectively, so that the wafers to be processed can be stably supported;
(2) placing a liquid crystal panel wafer to be processed on a negative pressure carrying platform, and starting a vacuum generator to enable a negative pressure adsorption platform to generate negative pressure to tightly adsorb the wafer to be processed;
(3) the vertical cam column is driven to descend by the air cylinder, the vertical cam column drives the rotating arm to be converted from the transverse direction to the longitudinal direction under the action of the guide sliding groove and the cam guide pin, so that the pressing plate is positioned above the wafer to be processed, then the air cylinder continues to drive the vertical cam column to descend, so that the pressing plate tightly presses the wafer to be processed, and clamping is completed;
(4) carrying out edge grinding processing on a wafer to be processed;
(5) after the processing is finished, the rotating arm is lifted and reset under the action of the air cylinder, the vacuum generator is closed, and the processed wafer can be taken out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011347903.9A CN112271154A (en) | 2020-11-26 | 2020-11-26 | Adjustable high-precision wafer edging carrying platform and use method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011347903.9A CN112271154A (en) | 2020-11-26 | 2020-11-26 | Adjustable high-precision wafer edging carrying platform and use method |
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