CN112254580A - Bulletproof flashboard with edge-covering structure and manufacturing method thereof - Google Patents
Bulletproof flashboard with edge-covering structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN112254580A CN112254580A CN202010992919.9A CN202010992919A CN112254580A CN 112254580 A CN112254580 A CN 112254580A CN 202010992919 A CN202010992919 A CN 202010992919A CN 112254580 A CN112254580 A CN 112254580A
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- heat
- woven cloth
- edge
- bulletproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2571/00—Protective equipment
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
Abstract
The bulletproof flashboard with the edge covering structure comprises first woven cloth, a ceramic plate, second woven cloth and an ultrahigh molecular weight polyethylene plate which are sequentially arranged, wherein the edge part of the first woven cloth is coated on the edge end face of the ceramic plate. The bulletproof flashboard with the edge-wrapping structure is characterized in that the edge end part of the ceramic plate is wrapped with the woven cloth, so that the surface and the end surface of the ceramic plate are wrapped by the continuous woven cloth, the constraint force of the ceramic plate in the three-dimensional direction is formed, the mechanical strength of the ceramic plate is enhanced, the back projection value of the bulletproof flashboard is effectively reduced, and the bullet resistance and the multi-shot bullet resistance of the bulletproof flashboard are improved.
Description
Technical Field
The application belongs to the technical field of personal protection equipment, particularly relates to a bulletproof material, and particularly relates to a bulletproof flashboard with a covered edge structure and a manufacturing method thereof.
Background
At present, high-performance fibers such as aramid fibers and the like are mostly adopted for the bulletproof flashboard to carry out transverse restraint on the surface of ceramic, so that the functions of crack arrest and sputtering prevention are achieved, but the structure has the problem of poor restraint force of the side face of the ceramic, ceramic cracks are easy to spread to the edge, the integrity of the bulletproof ceramic cannot be guaranteed, and the multiple bullet resistance is not enough.
Patent publication CN110230952A proposes to use integral winding of fibers to perform full-circle constraint on ceramic bulletproof panels, but because the ceramic plates are multi-curved, the method has no ideal winding effect on concave surfaces. Patent publication No. CN 110953933A proposes to use orthogonal nesting of seamless tubular fabric to cover ceramic plates without seams, but because the nesting is larger than the ceramic plates to facilitate the covering of the ceramic plates, the ceramic surfaces covered by this method are prone to wrinkles. In addition, the method respectively coats two layers of fabrics on the concave-convex surface of the ceramic, exceeds the actual requirement, and increases the surface density of the bulletproof flashboard.
Therefore, the improvement of the bulletproof capability of the bulletproof flashboard is always a technical difficulty.
Disclosure of Invention
In view of this, the technical solution disclosed in the embodiments of the present application is to provide a bulletproof gate with a hemmed structure, so as to improve the mechanical strength of a ceramic plate in the bulletproof gate, effectively reduce the back-protruding value of the bulletproof gate, improve the bullet-resistant capability of the bulletproof gate, and improve the protection performance.
In one aspect, some embodiments disclose a bulletproof inserting plate with a covered edge structure, which includes a first woven fabric, a ceramic plate, a second woven fabric, and an ultra-high molecular weight polyethylene plate, which are sequentially disposed, wherein an edge portion of the first woven fabric is covered on an edge end face of the ceramic plate.
Some embodiments disclose the bulletproof inserting plate with the edge covering structure, wherein the length of the edge part of the first woven cloth covering the edge end face of the ceramic plate is not less than the thickness of the edge end face of the ceramic plate.
Some embodiments disclose the bulletproof inserting plate with the edge-covering structure, and the edge part of the first woven cloth is provided with a crack on the end face with the radian of the ceramic plate.
Some embodiments disclose a bulletproof flashboard with a covered edge structure, wherein a first glue film is arranged between a first woven cloth and a ceramic plate, a second glue film is arranged between the ceramic plate and a second woven cloth, and a third glue film is arranged between the second woven cloth and an ultra-high molecular weight polyethylene plate.
In some embodiments of the bulletproof flashboard with the edge-covering structure, the third adhesive film is a heat-absorbing adhesive film, and the heat-absorbing adhesive film can perform decomposition reaction under a heated condition to absorb heat.
Some embodiments disclose the bulletproof inserting plate with the edge-covering structure, wherein the first adhesive film and the second adhesive film are the same adhesive film.
Some embodiments disclose a ballistic panel with a hemmed structure, the heat absorbing glue film comprising:
the adhesive film base body is made of an adhesive film binder;
the heat conduction materials are set to be carbon materials and are uniformly distributed in the adhesive film base body;
the heat absorbing material is set as a powder material and is uniformly distributed on the adhesive film substrate, and the heat absorbing material is subjected to decomposition reaction under a heated condition to absorb heat;
wherein the adhesive film comprises 60-85 parts by mass of an adhesive film base body, 1-20 parts by mass of a heat conducting material and 5-20 parts by mass of a heat absorbing material.
Some embodiments disclose a ballistic insert panel with a hemmed structure, the heat sink material comprising magnesium hydroxide, aluminum hydroxide.
Some embodiments disclose the bulletproof inserting plate with the edge covering structure, the adhesive film binder is phenolic resin and a modifier in a mass ratio of 10-50: 1, or thermoplastic polyurethane hot melt adhesive and an organic silicon leveling agent in a mass ratio of 50:1, or bisphenol A epoxy resin and a liquid nitrile butadiene rubber toughening agent in a mass ratio of 50-10: 1, wherein the molecular weight of the bisphenol A epoxy resin is 4500-6500.
In another aspect, some embodiments disclose a method of making a ballistic panel with a hemmed structure, the method comprising:
the ultrahigh molecular weight polyethylene plate, the second woven cloth, the ceramic plate and the first woven cloth are sequentially stacked, so that the edge part of the first woven cloth is uniformly arranged outside the edge of the ceramic plate;
putting the bulletproof flashboard to be compounded into a vacuum bag, and vacuumizing;
putting the vacuum bag containing the bulletproof flashboard to be compounded into an autoclave, heating and pressurizing for compounding;
and polishing the composited bulletproof inserting plate to obtain the bulletproof inserting plate with the edge-covered structure.
According to the bulletproof flashboard with the edge-wrapping structure disclosed by the embodiment of the application, the edge end part of the ceramic plate is wrapped with the woven cloth, so that the surface and the end surface of the ceramic plate are wrapped by the continuous woven cloth, the constraint force of the ceramic plate in the three-dimensional direction is formed, the mechanical strength of the ceramic plate is enhanced, and the back-projecting value of the bulletproof flashboard is effectively reduced; the bulletproof flashboard compounded with the heat absorption glue film contains the heat absorption material, and the heat absorption material can be decomposed after being heated and simultaneously absorb a large amount of heat, so that the woven cloth material in the bulletproof flashboard is prevented from being seriously ablated, the energy absorption effect of the bulletproof flashboard is effectively maintained, and the back projection value of the bulletproof flashboard is reduced. Therefore, the bulletproof flashboard disclosed by the embodiment of the application improves the mechanical strength of the ceramic plate and effectively absorbs high heat caused by high-speed bullets, so that the back projection value of the bulletproof flashboard is effectively reduced, and the bullet resistance and the multi-bullet resistance of the bulletproof flashboard are improved.
Drawings
Figure 1 is a schematic diagram of a bulletproof flashboard structure with a covered edge structure
FIG. 2 is a schematic view showing the arrangement of the ceramic plate and the first woven cloth
FIG. 3 is a schematic view of the first woven cloth wrapping
Reference numerals
1 first woven cloth 2 ceramic plate
3 second weaving cloth 4 ultra-high molecular weight polyethylene board
10 first woven cloth edge 11 first woven cloth edge crack
51 first adhesive film 52 second adhesive film
53 third glued membrane H ceramic plate thickness
L length of edge part of first woven cloth
Detailed Description
The word "embodiment" as used herein, is not necessarily to be construed as preferred or advantageous over other embodiments, including any embodiment illustrated as "exemplary". Performance index tests in the examples of this application, unless otherwise indicated, were performed using routine experimentation in the art. It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; other test methods and techniques not specifically mentioned in the present application are those commonly employed by those of ordinary skill in the art.
The terms "substantially" and "about" are used herein to describe small fluctuations. For example, they may mean less than or equal to ± 5%, such as less than or equal to ± 2%, such as less than or equal to ± 1%, such as less than or equal to ± 0.5%, such as less than or equal to ± 0.2%, such as less than or equal to ± 0.1%, such as less than or equal to ± 0.05%. Numerical data represented or presented herein in a range format is used merely for convenience and brevity and thus should be interpreted flexibly to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited. For example, a numerical range of "1 to 5%" should be interpreted to include not only the explicitly recited values of 1% to 5%, but also include individual values and sub-ranges within the indicated range. Thus, included in this numerical range are individual values, such as 2%, 3.5%, and 4%, and sub-ranges, such as 1% to 3%, 2% to 4%, and 3% to 5%, etc. This principle applies equally to ranges reciting only one numerical value. Moreover, such an interpretation applies regardless of the breadth of the range or the characteristics being described.
In this document, including the claims, all conjunctions such as "comprising," including, "" carrying, "" having, "" containing, "" involving, "" containing, "and the like are to be understood as being open-ended, i.e., to mean" including but not limited to. Only the conjunctions "consisting of … …" and "consisting of … …" are closed conjunctions.
In the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present disclosure. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In the examples, some methods, means, instruments, apparatuses, etc. known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.
On the premise of no conflict, the technical features disclosed in the embodiments of the present application may be combined arbitrarily, and the obtained technical solution belongs to the content disclosed in the embodiments of the present application.
In some embodiments, the bulletproof insert plate with a covered edge structure comprises a first woven fabric, a ceramic plate, a second woven fabric and an ultra-high molecular weight polyethylene plate which are arranged in sequence, wherein an edge part of the first woven fabric is covered on an edge end face of the ceramic plate. The first woven cloth is generally shaped the same as the ceramic plate so that the first woven cloth is closely attached to the surface of the ceramic plate while the area of the first woven cloth is larger than the area of the ceramic plate, and after the first woven cloth is attached to the ceramic plate, the edge portion of the first woven cloth protrudes from the end surface portion of the ceramic plate so that the edge portion of the first woven cloth is bent toward the ceramic plate to be attached to the end surface of the ceramic plate. The first woven cloth is tightly pasted on the surface and the end face of the ceramic plate and wraps the ceramic plate in the three-dimensional direction to form three-dimensional wrapping of the ceramic plate; usually, a first adhesive film is arranged between the first woven fabric and the ceramic plate so as to tightly adhere the first woven fabric and the ceramic plate, and in order to enable the first woven fabric to be attached to the surface and the end face of the ceramic plate, the shape, the area and the size of the first adhesive film are equivalent to those of the first woven fabric.
Generally, a second adhesive film is arranged between the ceramic plate and the second woven cloth so as to tightly bond and tightly attach the ceramic plate and the second woven cloth, and a third adhesive film is arranged between the second woven cloth and the ultra-high molecular weight polyethylene plate so as to tightly bond and tightly attach the second woven cloth and the ultra-high molecular weight polyethylene plate.
As an alternative embodiment, the length of the edge portion of the first woven cloth coated on the edge end surface of the ceramic plate is not less than the thickness of the edge end surface of the ceramic plate. The length of the edge part of the first weaving cloth is usually larger than or equal to the thickness of the edge end face of the ceramic plate, so that the end face of the ceramic plate is completely covered to realize complete coating.
As an alternative embodiment, the first woven cloth is provided with slits at the edge portion on the end surface of the ceramic plate having a curvature. Usually, the ceramic plate has certain shape, on its terminal surface that has the radian, for example on the corner that is the acute angle, arc convex surface, arc concave surface etc. region or position, when first weaving cloth edge portion is crooked to the ceramic plate direction, phenomenons such as folding can take place usually, lead to the edge portion to form multilayer fold, the thickness at edge position changes, can set up the crack at the position that can take place to fold for this reason, cut the edge portion of first weaving cloth, the edge portion after cutting apart does not influence each other, can effectively prevent the formation of multilayer fold.
Fig. 1 is a schematic structural diagram of a bulletproof insert plate with a covered edge structure, which is disclosed in some embodiments, in fig. 1, a first woven fabric 1 is arranged at the bottom layer, and a first glue film 51, a ceramic plate 2, a second glue film 52, a second woven fabric 3, a third glue film 53 and an ultra-high molecular weight polyethylene plate 4 are sequentially arranged upwards, wherein the ceramic plate 2, the second glue film 52, the second woven fabric 3, the third glue film 53 and the ultra-high molecular weight polyethylene plate 4 have the same shape and area, the first woven fabric 1 has the same shape and area as the first glue film 51, the area of the first woven fabric 1 is larger than that of the ceramic plate 2, and the edge of the first woven fabric 1 protrudes out of the ceramic plate 2, so that the edge of the first woven fabric 1 can be folded upwards to cover the end face of the ceramic plate 2 and cover the ceramic plate 2; at the top corner position of the ceramic plate 2, the first woven fabric 1 and the first adhesive film 51 are cut and split to form a first woven fabric edge part crack 10; fig. 2 is a schematic view showing the arrangement relationship of a first woven cloth 1 and a ceramic plate 2, in fig. 2, four sides of the first woven cloth 1 having a quadrangular shape as a whole are protruded from the ceramic plate 2, and the length of the protruded edge of the first woven cloth 1, i.e., the length of the edge portion of the first woven cloth is L; as shown in fig. 3, the first woven cloth covering setting diagram shows that the end face of the ceramic plate 2 has a thickness H, the ceramic plate 2 is provided with the first woven cloth 1, the edge of the first woven cloth 1 protrudes from the end face of the ceramic plate 2 and is folded and covered on the end face of the ceramic plate 2, and the length of the edge 10 of the first woven cloth is L, where L is not less than H.
Usually, the first woven cloth includes aramid woven cloth, carbon fiber woven cloth, or polyparaphenylene benzobisoxazole fiber woven cloth; the second woven cloth comprises aramid woven cloth, carbon fiber woven cloth or poly-p-phenylene benzobisoxazole fiber woven cloth.
As an alternative embodiment, the third adhesive film is a heat-absorbing adhesive film, and the heat-absorbing adhesive film can undergo a decomposition reaction under a heated condition to absorb heat.
As an alternative embodiment, the heat absorbing adhesive film includes: the adhesive film base body is made of an adhesive film binder; the heat conduction materials are carbon materials and are uniformly distributed in the adhesive film substrate; the heat absorbing material is set as a powder material and is uniformly distributed in the adhesive film matrix; the adhesive film comprises an adhesive film base body, a heat-absorbing material and a film base body, wherein the adhesive film base body comprises 60-85 parts by mass, the heat-conducting material comprises 1-20 parts by mass, and the heat-absorbing material comprises 5-20 parts by mass, and is subjected to decomposition reaction under a heating condition to absorb heat.
The heat conduction materials in the heat absorption adhesive film are uniformly distributed in the adhesive film base body of the heat absorption adhesive film, so that the heat received by the heat absorption adhesive film can be transferred, the heat conduction performance of the heat absorption adhesive film is improved, the situation that a large amount of instantaneous heat is gathered at a specific part to cause ablation of a high polymer material at the part, the molecular structure is damaged, and the energy absorption effect of the high polymer material is reduced. Generally, the heat conducting material may be a carbon material, and as an alternative embodiment, the heat conducting material includes any combination of graphene, carbon nanotubes or carbon fibers, which does not damage the strength of the adhesive film. The graphene, the carbon nanotubes and the carbon fibers are nano-scale or micron-scale carbon materials and have a multilayer structure based on the graphene, for example, the graphene is a two-dimensional nano material, the carbon nanotubes are one-dimensional nano carbon materials, and the carbon fibers are micron-scale or nano-scale one-dimensional carbon materials and have excellent heat resistance and heat transfer performance. As alternative embodiments, graphene, carbon nanotubes or carbon fibers may be used in any combination as the heat conductive material, for example, any one of graphene, carbon nanotubes or carbon fibers may be used as the heat conductive material, or a combination of two of them may be used as the heat conductive material, or a combination of three of them may be used as the heat conductive material.
The existence of heat conduction material can influence the physicochemical properties of heat absorption glued membrane inevitable usually, reduces its bonding effect, for this reason need rationally set up the content of heat conduction material to prevent to harm its performance, can have reasonable content simultaneously, form reasonable distribution, keep good heat conduction effect, the mass content of heat conduction material is 1 ~ 20 usually. In an alternative embodiment, the mass content of the heat conductive material is between 3% and 10%, for example, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc.
The heat absorbing material of the heat absorbing adhesive film can absorb heat and then carry out chemical reaction, and a large amount of heat can be absorbed during reaction, so that the heat absorbing function can be realized. The heat-absorbing material is uniformly distributed in the glue film matrix of the heat-absorbing glue film and can be fully contacted with the heat-conducting material uniformly distributed in the glue film matrix, so that heat transferred by the heat-conducting material is effectively absorbed, a heat-absorbing decomposition reaction is carried out after the decomposition temperature is reached, the heat is quickly absorbed, the local heat of the bulletproof material is quickly dispersed, and a heat-absorbing effect is achieved. The heat-absorbing material needs to be kept stable in the processes of compounding heat-absorbing glue films, compounding bulletproof flashboards and the like, and cannot be decomposed in the preparation process, so that the actual use effect of the heat-absorbing material is influenced. On one hand, the heat absorbing material can absorb heat, and meanwhile, the existence of the heat absorbing material inevitably affects the use performance of the adhesive film, for example, the adhesive property of the adhesive film can be reduced. The heat absorbing material is usually an ultrafine powder, and the smaller the particle size, the better the heat absorbing performance as a heat absorbing material, and the particle size is usually less than 2 μm, for example, 0.8 to 2 μm, or 0.1 to 0.8 μm. As an alternative embodiment, the heat sink material comprises magnesium hydroxide or aluminium hydroxide. Magnesium hydroxide generally has decomposition reaction at about 380 ℃ to generate magnesium oxide and water, a large amount of heat can be absorbed in the decomposition process, and meanwhile, the generated water volatilizes and also takes away the heat, thereby realizing the technical effect of heat absorption. The aluminum hydroxide generally has a decomposition reaction at 300 ℃ to generate aluminum oxide and water, a large amount of heat can be absorbed in the decomposition process, and meanwhile, the generated water volatilizes and can also take away the heat, so that the technical effect of heat absorption is realized. The mass content of the heat absorbing material is usually 5-20%. In an alternative embodiment, the mass content of the heat absorbing material is 5 to 10%, for example, 5%, 6%, 7%, 8%, 9%, 10%, or the like. The heat sink material may be used as a single component or may be used in the form of a composition.
According to an optional embodiment, the adhesive film binder is phenolic resin and a modifier in a mass ratio of 10-50: 1, and the obtained heat absorption adhesive film can be called as a phenolic resin-based heat absorption adhesive film. In general, phenolic resins have excellent mechanical strength and dimensional stability, are suitable for application in ballistic materials, but have poor toughness and low elongation at break, and therefore phenolic resins can be modified with modifiers. As alternative embodiment, modifier can adopt vegetable oil such as cashew nut shell oil, tung oil, linseed oil, epoxy soybean oil, etc., or modifier such as silane; in a more preferred embodiment, the modifier is polyvinyl butyral, the polyvinyl butyral is a thermoplastic polymer, the polyvinyl butyral has a large number of hydroxyl groups in its molecule, and has high reactivity, and the polyvinyl butyral and the phenolic resin are subjected to a crosslinking reaction to toughen and modify the phenolic resin.
As an alternative embodiment, the adhesive film binder is a thermoplastic polyurethane hot melt adhesive and an organic silicon leveling agent in a mass ratio of 50:1, and the obtained heat-absorbing adhesive film can be called a polyurethane-based heat-absorbing adhesive film.
As an optional embodiment, the glue film binder of the bulletproof flashboard with the edge-wrapping structure is bisphenol A type epoxy resin and a liquid nitrile butadiene rubber toughening agent in a mass ratio of 50-10: 1, wherein the molecular weight of the bisphenol A type epoxy resin is 4500-6500, and the obtained heat-absorbing glue film can be called as an epoxy resin-based heat-absorbing glue film.
As an alternative embodiment, the first adhesive film comprises a thermoplastic polyurethane adhesive film, an epoxy adhesive film or a phenolic adhesive film. The second adhesive film comprises a thermoplastic polyurethane adhesive film, an epoxy resin adhesive film or a phenolic resin adhesive film. The first adhesive film and the second adhesive film are usually made of the same material.
As an alternative embodiment, the heat absorbing material of the bulletproof insert with a hemmed structure comprises magnesium hydroxide, aluminum hydroxide.
As an alternative embodiment, the ceramic plates of the bulletproof insert with a hemmed structure comprise boron carbide ceramic, silicon carbide ceramic or alumina ceramic.
In another aspect, some embodiments disclose a method of making a ballistic panel with a hemmed structure, the method comprising:
the ultrahigh molecular weight polyethylene plate, the second woven cloth, the ceramic plate and the first woven cloth are sequentially stacked, so that the edge part of the first woven cloth is uniformly arranged outside the edge of the ceramic plate; generally, glue films are arranged between adjacent layers of the ultra-high molecular weight polyethylene, the second woven cloth, the ceramic plate and the first woven cloth so as to tightly bond the adjacent layers; usually, a first adhesive film is arranged between the first woven cloth and the ceramic plate, a second adhesive film is arranged between the ceramic plate and the second woven cloth, and a third adhesive film is arranged between the second woven cloth and the ultra-high molecular weight polyethylene plate;
putting the bulletproof flashboard to be compounded into a vacuum bag, and vacuumizing; in the process of vacuumizing, the edge part of the first woven cloth can be bent towards the ceramic plate and is attached to the end face of the ceramic plate under the action of negative pressure;
putting the vacuum bag containing the bulletproof flashboard to be compounded into an autoclave, heating and pressurizing for compounding; after compounding, the edge part of the first woven cloth can be tightly wrapped on the end part of the ceramic plate, so that the end surface of the ceramic plate can be wrapped;
and polishing the composited bulletproof inserting plate to obtain the bulletproof inserting plate with the edge covering layer.
Some embodiments disclose a method for manufacturing a heat absorbing adhesive film, comprising:
mixing the adhesive film binder, the heat conducting material and the heat absorbing material with a proper amount of defoaming agent and solvent, and performing ball milling to obtain casting slurry; wherein the adhesive film binder is phenolic resin and a modifier thereof, or thermoplastic polyurethane hot melt adhesive and an organic silicon leveling agent; for example, the raw material components are usually mixed and ball-milled on a ball mill, so that the crosslinking reaction of the phenolic resin and the polyvinyl butyral can be realized in the ball-milling process, the modification of the phenolic resin can be realized, and the components can be fully dissolved and uniformly dispersed in a solvent to obtain slurry with appropriate viscosity, so as to meet the requirement of the next step of casting; for example, the viscosity of the slurry can be controlled to be generally 1000 to 10000 mPa-s; in a more preferred embodiment, the viscosity of the slurry is controlled to be 3000 to 6000mPa-s, and further, the viscosity of the slurry is 3500 to 4500 mPa-s;
carrying out tape casting on the tape casting slurry to obtain an adhesive film; usually, a tape casting process is adopted to manufacture an adhesive film, so that the adhesive film with the thickness of 10-1000 mu m can be obtained;
drying the adhesive film to obtain a heat-absorbing adhesive film; the adhesive film can be dried by controlling proper conditions such as temperature, humidity, ventilation and the like, so that redundant solvents and defoaming agents in the heat-absorbing adhesive film are volatilized.
As an optional embodiment, in the manufacturing method of the heat-absorbing adhesive film, by mass, 60-85 parts of adhesive film binder, 1-20 parts of heat-conducting material, 5-20 parts of heat-absorbing material, 40-90 parts of solvent and 0.1-10 parts of defoaming agent are used.
As an optional embodiment, in the manufacturing method of the heat absorption adhesive film, the casting speed is set to be 0.01-1 m/min, and the height of a scraper is 100-5000 μm.
As an alternative embodiment, in the manufacturing method of the heat absorption adhesive film, the defoaming agent is n-butanol.
In an alternative embodiment, in the manufacturing method of the heat absorbing adhesive film, the solvent includes an inorganic solvent or an organic solvent. Generally, an adhesive film binder, a heat conducting material, a heat absorbing material and the like need to be dissolved or dispersed under the action of a solvent so as to be fully and uniformly mixed, on one hand, uniform modification of the binder is realized to obtain a homogeneous liquid binder, on the other hand, the heat conducting material and the heat absorbing material are uniformly dispersed in the dissolved adhesive film binder to form homogeneous casting slurry, and a heat absorbing adhesive film with a uniform internal structure is formed in a casting process. If hydrophilic raw materials such as hydrophilic phenolic resin, polyvinyl butyral, heat conducting materials, heat absorbing materials and the like are selected, water can be selected as a solvent; if lipophilic raw materials such as lipophilic phenolic resin, polyvinyl butyral, heat conduction materials, heat absorption materials and the like are selected, ethanol, acetone and the like can be selected as solvents; if the thermoplastic polyurethane hot melt adhesive and the organic silicon leveling agent are selected, acetone is selected as a solvent.
As a solvent of the heat-absorbing adhesive film, it is generally required to have the characteristics of low boiling point and easy volatilization, and the heat-absorbing adhesive film can volatilize from the heat-absorbing adhesive film in the drying process of the heat-absorbing adhesive film, so as to prevent the heat-absorbing adhesive film from affecting the use performance of the heat-absorbing adhesive film in the bulletproof materials such as the bulletproof flashboards and the like.
Some embodiments disclose a method for manufacturing a heat absorbing adhesive film, comprising:
mixing bisphenol A epoxy resin, a liquid nitrile rubber toughening agent, a heat conduction material, a heat absorption material and a solvent; bisphenol A type epoxy resin with the molecular weight of 4500-6500 is generally selected, liquid nitrile rubber is used as a toughening agent, and the mass ratio of the bisphenol A type epoxy resin to the liquid nitrile rubber is 5-10: 1, the solvent can be acetone; the heat conduction material can be carbon material, such as graphene, carbon nanotube, carbon fiber and the like; the heat absorbing material can be selected from superfine powder such as magnesium hydroxide, aluminum hydroxide and the like;
after uniformly mixing, adding a curing agent to obtain slurry; generally, mixing the raw material components, uniformly stirring, and adding a curing agent, wherein the curing agent can be maleic anhydride, tetrahydrofurfuryl alcohol, methyl tetrahydrophthalic anhydride or ethanolamine, and the mass of the curing agent is 1-5% of that of bisphenol A epoxy resin;
and coating the base film with the slurry, and curing to obtain the heat-absorbing adhesive film. Usually, the curing agent is added and then evenly stirred to obtain slurry, the qualified slurry is coated on the base film and then cured to obtain the heat absorption adhesive film. The curing temperature is usually set between 90 ℃ and 130 ℃, and the curing time is set to be 2-10 h. Optionally, the base film is a PET release film and can withstand the temperature of 120 ℃.
The technical details are further illustrated in the following examples.
Example 1
Manufacturing method of bulletproof flashboard with edge-covering structure
Mixing 50g of phenolic resin, 5g of polyvinyl butyral, 0.2g of defoaming agent n-butyl alcohol and 50g of solvent ethanol in a ball milling tank, and carrying out ball milling for 2 hours to obtain casting slurry; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm;
casting the casting slurry on a casting machine to form a film, wherein the casting speed is 1m/min, and the height of a scraper is 1 mm;
setting the temperature of a drying zone to be 60 ℃, and carrying out tape casting, film forming and drying to obtain a phenolic resin-based common adhesive film;
sequentially stacking an ultra-high molecular weight polyethylene plate, a phenolic resin-based common adhesive film, second aramid woven cloth, a phenolic resin-based common adhesive film, a boron carbide ceramic plate, a phenolic resin-based common adhesive film and first aramid woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein, the ultra-high molecular weight polyethyleneThe thickness of the olefin plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm; the edge of the first aramid woven cloth is 1.5cm longer than the end face of the boron carbide ceramic plate;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof inserting plate, and removing redundant parts of corners to obtain the bulletproof inserting plate with the edge-covering structure.
Example 2
Manufacturing method of bulletproof flashboard with heat absorption glue film and edge covering structure
Mixing 50g of phenolic resin, 5g of polyvinyl butyral, 10g of graphene, 10g of magnesium hydroxide with the granularity of 10000 meshes, 0.2g of n-butyl alcohol serving as a defoaming agent and 50g of ethanol serving as a solvent in a ball milling tank, and carrying out ball milling for 2 hours to obtain casting slurry; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm;
casting the casting slurry on a casting machine to form a film, wherein the casting speed is 1m/min, and the height of a scraper is 1 mm;
setting the temperature of the drying zone to be 60 ℃, and carrying out tape casting, film forming and drying to obtain a phenolic resin-based heat absorption adhesive film;
sequentially stacking an ultra-high molecular weight polyethylene plate, a phenolic resin-based heat-absorbing adhesive film, second aramid woven cloth, a phenolic resin-based common adhesive film, a boron carbide ceramic plate, a phenolic resin-based common adhesive film and first aramid woven cloth to obtain a material to be compounded, and putting the material into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm; the edge of the first aramid woven cloth is 1.5cm longer than the end face of the boron carbide ceramic plate;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof flashboard, and removing redundant parts of corners to obtain the bulletproof flashboard containing the phenolic resin-based heat-absorbing adhesive film and having the edge-covering structure.
Comparative example 1
Manufacturing method of bulletproof plugboard containing phenolic resin-based common glue film
Mixing 50g of phenolic resin, 5g of polyvinyl butyral, 0.2g of defoaming agent n-butyl alcohol and 50g of solvent ethanol in a ball milling tank, and carrying out ball milling for 2 hours to obtain casting slurry; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm;
casting the casting slurry on a casting machine to form a film, wherein the casting speed is 1m/min, and the height of a scraper is 1 mm;
setting the temperature of a drying zone to be 60 ℃, and carrying out tape casting, film forming and drying to obtain a phenolic resin-based common adhesive film;
sequentially stacking an ultra-high molecular weight polyethylene plate, a phenolic resin-based common adhesive film, second aramid woven cloth, a phenolic resin-based common adhesive film, a boron carbide ceramic plate, a phenolic resin-based common adhesive film and first aramid woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof flashboard, and removing redundant parts of corners to obtain the bulletproof flashboard containing the phenolic resin base common glue film.
The performance of the ballistic insert panels obtained from examples 1, 2 and comparative example 1 was tested.
The actual bulletproof performance of the bulletproof flashboard is determined by testing the back projection value of the bulletproof flashboard in a target shooting mode. The test results are tabulated in Table 1, examples 1, 2, comparative example 1 maximum backprojection values.
And (3) carrying out 5 groups of target practice tests, beating 3 guns for each bulletproof flashboard, and taking the maximum back projection value as the test result of the group.
And (3) testing conditions are as follows: 7.62mm NATO FMJ M80 projectile with a shooting distance of 15 meters and 3 shots shot at the projectile velocity of 847 +/-9M/s; high temperature conditions: at 55 ℃.
TABLE 1 tabulation of maximum backprojection values for examples 1, 2, comparative example 1
Example 3
Manufacturing method of bulletproof flashboard with edge-covering structure
50g of bisphenol A epoxy resin with the molecular weight of 4500-6500, 10g of liquid nitrile rubber toughening agent and 50g of solvent acetone are mixed in a ball milling tank, 0.5g of maleic anhydride is added after ball milling is carried out for 2 hours, and then ball milling is continued for 10 minutes to obtain coating slurry; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm; coating the sizing agent on a base film by using a coating machine, wherein the curing temperature is 110 ℃, and the curing time is 6 hours, so as to prepare an epoxy resin-based common adhesive film;
sequentially stacking an ultrahigh molecular weight polyethylene plate, an epoxy resin common glue film, second aramid woven cloth, an epoxy resin common glue film, a boron carbide ceramic plate, an epoxy resin common glue film and first aramid woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm; the edge of the first aramid woven cloth is 1.5cm longer than the end face of the boron carbide ceramic plate;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof inserting plate, and removing redundant parts of corners to obtain the bulletproof inserting plate with the edge-covering structure.
Example 4
Manufacturing method of bulletproof flashboard containing epoxy resin-based heat-absorbing adhesive film and having edge-covering structure
50g of bisphenol A epoxy resin with the molecular weight of 4500-6500, 10g of liquid nitrile rubber toughening agent, 5g of carbon nano tube, 5g of magnesium hydroxide with the granularity of 10000 meshes, and 50g of acetone solvent are mixed in a ball milling tank, 0.5g of maleic anhydride is added after ball milling is carried out for 2 hours, and then the ball milling is continued for 10 minutes to obtain coating slurry; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm; coating the sizing agent on a base film by using a coating machine, wherein the curing temperature is 110 ℃, and the curing time is 6 hours, so as to prepare an epoxy resin-based heat-absorbing adhesive film;
sequentially stacking an ultrahigh molecular weight polyethylene plate, an epoxy resin-based heat-absorbing adhesive film, second aramid fiber woven cloth, an epoxy resin-based common adhesive film, a boron carbide ceramic plate, an epoxy resin-based common adhesive film and first aramid fiber woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm; the edge of the first aramid woven cloth is 1.5cm longer than the end face of the boron carbide ceramic plate;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof flashboard, and removing redundant parts of corners to obtain the bulletproof flashboard with the edge-wrapping structure and the epoxy resin-based heat-absorbing adhesive film.
Comparative example 2
Manufacturing method of bulletproof flashboard containing epoxy resin-based common glue film
50g of bisphenol A epoxy resin with the molecular weight of 4500-6500, 10g of liquid nitrile rubber toughening agent and 50g of solvent acetone are mixed in a ball milling tank, 0.5g of maleic anhydride is added after ball milling is carried out for 2 hours, and then ball milling is continued for 10 minutes to obtain coating slurry; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm; coating the sizing agent on a base film by using a coating machine, wherein the curing temperature is 110 ℃, and the curing time is 6 hours, so as to prepare an epoxy resin-based common adhesive film;
mixing ultra-high molecular weight polyethylene plate, epoxy resin-based common adhesive film, second aramid woven cloth, epoxy resin-based common adhesive film, boron carbide ceramic plate and ringSequentially stacking an epoxy resin-based common adhesive film and a first aramid woven cloth to obtain a material to be compounded, and putting the material into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof flashboard, and removing redundant parts of corners to obtain the bulletproof flashboard containing the epoxy resin-based common glue film.
The performance of the ballistic insert panels obtained from examples 3, 4 and comparative example 2 was tested.
The actual bulletproof performance of the bulletproof flashboard is determined by testing the back projection value of the bulletproof flashboard in a target shooting mode. The test results are tabulated in table 2, examples 3, 4, comparative example 2 maximum backprojection values.
And (3) carrying out 5 groups of target practice tests, beating 3 guns for each bulletproof flashboard, and taking the maximum back projection value as the test result of the group.
And (3) testing conditions are as follows: 7.62mm NATO FMJ M80 projectile with a shooting distance of 15 meters and 3 shots shot at the projectile velocity of 847 +/-9M/s; high temperature conditions: at 55 ℃.
TABLE 2 tabulation of maximum backprojection values for examples 3, 4, comparative example 2
Example 5
Manufacturing method of bulletproof flashboard with edge-covering structure
50g of polyurethane hot melt adhesive particles with the melting point of 120 ℃, 1g of organic silicon flatting agent and 50g of solvent acetone are mixed in a ball milling tank, and casting slurry is obtained after ball milling for 2 hours; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm. Casting the casting slurry on a casting machine to form a film, wherein the casting speed is 0.5m/min, and the height of a scraper is 0.8 mm; setting the temperature of the drying zone to be 90 ℃, and drying the adhesive film to obtain a polyurethane-based common adhesive film;
sequentially stacking an ultra-high molecular weight polyethylene plate, a polyurethane-based common adhesive film, second aramid woven cloth, a polyurethane-based common adhesive film, a boron carbide ceramic plate, a polyurethane-based common adhesive film and first aramid woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm; the edge of the first aramid woven cloth is 1.5cm longer than the end face of the boron carbide ceramic plate;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof inserting plate, and removing redundant parts of corners to obtain the bulletproof inserting plate with the edge-covering structure.
Example 6
Manufacturing method of bulletproof flashboard containing polyurethane-based heat-absorbing adhesive film and having edge-covering structure
50g of polyurethane hot melt adhesive particles with the melting point of 120 ℃, 1g of organic silicon flatting agent, 8g of carbon fiber short fibers, 4g of aluminum hydroxide with the granularity of 10000 meshes and 50g of solvent acetone are mixed in a ball milling tank, and casting slurry is obtained after ball milling for 2 hours; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm; casting the casting slurry on a casting machine to form a film, wherein the casting speed is 0.5m/min, and the height of a scraper is 0.8 mm;
setting the temperature of the drying zone to be 90 ℃, and drying the adhesive film to obtain a polyurethane-based heat-absorbing adhesive film;
sequentially stacking an ultra-high molecular weight polyethylene plate, a polyurethane-based heat absorption adhesive film, second aramid woven cloth, a polyurethane-based common adhesive film, a boron carbide ceramic plate, a polyurethane-based common adhesive film and first aramid woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The thickness of the boron carbide ceramic plate is 6 mm; edge ratio boron carbide ceramic plate of first aramid woven clothThe length of the end face part of the steel pipe is 1.5 cm;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof inserting plate, and removing redundant parts of corners to obtain the bulletproof inserting plate with the edge-covering structure.
Comparative example 3
Production of bulletproof flashboard containing polyurethane-based common glue film
50g of polyurethane hot melt adhesive particles with the melting point of 120 ℃, 1g of organic silicon flatting agent and 50g of solvent acetone are mixed in a ball milling tank, and casting slurry is obtained after ball milling for 2 hours; the ball milling speed is set to 300rpm, and the ball milling balls are alumina balls with the mass of 400g and the diameter of 4 mm. Casting the casting slurry on a casting machine to form a film, wherein the casting speed is 0.5m/min, and the height of a scraper is 0.8 mm;
setting the temperature of the drying zone to be 90 ℃, and drying the adhesive film to obtain a polyurethane-based common adhesive film;
sequentially stacking an ultra-high molecular weight polyethylene plate, a polyurethane-based common adhesive film, second aramid woven cloth, a polyurethane-based common adhesive film, a boron carbide ceramic plate, a polyurethane-based common adhesive film and first aramid woven cloth to obtain a material to be compounded, and putting the material to be compounded into a vacuum bag for sealing; wherein the thickness of the ultra-high molecular weight polyethylene plate is 11mm, and the density of the first aramid fiber woven cloth surface is 340g/m2The density of the second aramid fiber woven cloth is 340g/m2The surface density of the polyurethane-based common adhesive film is 12g/m2The thickness of the boron carbide ceramic plate is 6 mm;
vacuumizing the vacuum bag, putting the vacuum bag filled with the material to be compounded into an autoclave, and performing vacuum hot-pressing compounding;
and polishing the composited bulletproof inserting plate, and removing redundant parts of corners to obtain the bulletproof inserting plate with the edge-covering structure.
The performance of the ballistic insert panels obtained from examples 5, 6 and comparative example 3 was tested.
The actual bulletproof performance of the bulletproof flashboard is determined by testing the back projection value of the bulletproof flashboard in a target shooting mode. The test results are tabulated in Table 3, examples 5, 6, comparative example 3, maximum backprojection values.
And (3) carrying out 5 groups of target practice tests, beating 3 guns for each bulletproof flashboard, and taking the maximum back projection value as the test result of the group.
And (3) testing conditions are as follows: 7.62mm NATO FMJ M80 projectile with a shooting distance of 15 meters and 3 shots shot at the projectile velocity of 847 +/-9M/s; high temperature conditions: at 55 ℃.
Table 3 lists of maximum backprojection values for examples 5 and 6 and comparative example 3
The experiment result shows that the maximum back projection value of the bulletproof flashboard with the edge-covering structure is obviously smaller than that of a common bulletproof flashboard, which shows that the continuous edge covering of the end part of the ceramic plate by the woven cloth has the effect of enhancing the mechanical strength of the ceramic plate, further, the back projection value of the bulletproof flashboard with the heat-absorbing glue film is further improved, and the heat-absorbing function of the heat-absorbing layer can effectively absorb the high temperature caused by the local bullet in the bulletproof flashboard, thereby preventing the damage of the high molecular material in the bulletproof flashboard, fully playing the energy-absorbing function of the high molecular material, reducing the maximum back projection value and improving the bulletproof performance of the bulletproof flashboard.
According to the bulletproof flashboard with the edge-wrapping structure disclosed by the embodiment of the application, the edge end part of the ceramic plate is wrapped with the woven cloth, so that the surface and the end surface of the ceramic plate are wrapped by the continuous woven cloth, the constraint force of the ceramic plate in the three-dimensional direction is formed, the mechanical strength of the ceramic plate is enhanced, and the back-projecting value of the bulletproof flashboard is effectively reduced; the bulletproof flashboard compounded with the heat absorption glue film contains the heat absorption material, and the heat absorption material can be decomposed after being heated and simultaneously absorb a large amount of heat, so that the woven cloth material in the bulletproof flashboard is prevented from being seriously ablated, the energy absorption effect of the bulletproof flashboard is effectively maintained, and the back projection value of the bulletproof flashboard is reduced. Therefore, the bulletproof flashboard disclosed by the embodiment of the application improves the mechanical strength of the ceramic plate and effectively absorbs high heat caused by high-speed bullets, so that the back projection value of the bulletproof flashboard is effectively reduced, and the bullet resistance and the multi-bullet resistance of the bulletproof flashboard are improved.
The technical solutions and the technical details disclosed in the embodiments of the present application are only examples to illustrate the inventive concept of the present application, and do not constitute limitations on the technical solutions of the present application, and all the inventive changes, substitutions, or combinations that are made to the technical details disclosed in the present application without creativity are the same as the inventive concept of the present application and are within the protection scope of the claims of the present application.
Claims (10)
1. The bulletproof flashboard with the edge covering structure is characterized by comprising first woven cloth, a ceramic plate, second woven cloth and an ultrahigh molecular weight polyethylene plate which are sequentially arranged, wherein the edge part of the first woven cloth is coated on the edge end face of the ceramic plate.
2. The bulletproof insert plate having a hemming structure according to claim 1, wherein the length of the edge portion of the first woven fabric coated on the edge face of the ceramic plate is not less than the thickness of the edge face of the ceramic plate.
3. The bulletproof insert plate having a hemmed structure as set forth in claim 1, wherein the first woven fabric is provided with slits at edge portions thereof on the end faces of the ceramic plates having a curvature.
4. The bulletproof inserting plate with a covered edge structure as claimed in claim 1, wherein a first glue film is arranged between the first woven cloth and the ceramic plate, a second glue film is arranged between the ceramic plate and the second woven cloth, and a third glue film is arranged between the second woven cloth and the ultra-high molecular weight polyethylene plate.
5. The bulletproof inserting plate with a covered edge structure as claimed in claim 4, wherein the third adhesive film is a heat-absorbing adhesive film, and the heat-absorbing adhesive film can be decomposed under a heated condition to absorb heat.
6. The bulletproof insert plate with a hemmed structure as recited in claim 4, wherein the first glue film and the second glue film are the same glue film.
7. The ballistic panel with a hemmed structure of claim 5, wherein the heat absorbing glue film comprises:
the adhesive film base body is made of an adhesive film binder;
the heat conduction materials are set to be carbon materials and are uniformly distributed in the adhesive film base body;
the heat absorbing material is set as a powder material and is uniformly distributed in the adhesive film matrix, and the heat absorbing material is subjected to decomposition reaction under a heated condition to absorb heat;
the adhesive film comprises an adhesive film base body, a heat-conducting material and a heat-absorbing material, wherein the adhesive film base body comprises 60-85 parts by mass, the heat-conducting material comprises 1-20 parts by mass, and the heat-absorbing material comprises 5-20 parts by mass.
8. A ballistic protection panel with a hemmed structure according to claim 7, wherein the heat sink material comprises magnesium hydroxide, aluminium hydroxide.
9. The bulletproof inserting plate with the edge covering structure as claimed in claim 7, wherein the adhesive film binder is phenolic resin and a modifier in a mass ratio of 10-50: 1, or thermoplastic polyurethane hot melt adhesive and an organic silicon leveling agent in a mass ratio of 50: 1; or the adhesive film binder is bisphenol A epoxy resin and a liquid nitrile butadiene rubber toughening agent in a mass ratio of 50-10: 1, wherein the molecular weight of the bisphenol A epoxy resin is 4500-6500.
10. The method for manufacturing the bulletproof flashboard with the hemming structure of any claim 1 to 9, comprising:
the ultrahigh molecular weight polyethylene plate, the second woven cloth, the ceramic plate and the first woven cloth are sequentially stacked, so that the edge part of the first woven cloth is uniformly arranged outside the edge of the ceramic plate;
putting the bulletproof flashboard to be compounded into a vacuum bag, and vacuumizing;
putting the vacuum bag containing the bulletproof flashboard to be compounded into an autoclave, heating and pressurizing for compounding;
and polishing the composited bulletproof inserting plate to obtain the bulletproof inserting plate with the edge-covered structure.
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Cited By (1)
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