CN112251709A - Laminated heat-resistant electronic film and preparation method thereof - Google Patents

Laminated heat-resistant electronic film and preparation method thereof Download PDF

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CN112251709A
CN112251709A CN202011130145.5A CN202011130145A CN112251709A CN 112251709 A CN112251709 A CN 112251709A CN 202011130145 A CN202011130145 A CN 202011130145A CN 112251709 A CN112251709 A CN 112251709A
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layer
metal film
coating
heat
thickness
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张立东
李居尚
战荫泽
姜丽丽
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Changchun University of Science and Technology College of Optical and Electronical Information
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Changchun University of Science and Technology College of Optical and Electronical Information
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C23C4/073—Metallic material containing MCrAl or MCrAlY alloys, where M is nickel, cobalt or iron, with or without non-metal elements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • C23C4/11—Oxides

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a laminated heat-resistant electronic film, which comprises: a substrate layer, one side surface of which is subjected to corona pretreatment; the insulating layer is coated on one side surface of the substrate layer subjected to corona pretreatment; a metal film layer sprayed on the insulating layer; a heat resistant composite layer; which is sprayed on the surface of the metal film layer. The invention also discloses a preparation method of the laminated heat-resistant electronic film, which comprises the following steps: preparing a substrate from a polyimide raw material, and performing corona pretreatment on the surface of one side of the substrate; secondly, coating an insulating layer on the surface of one side subjected to corona pretreatment; step three, preparing a metal film coating by a supersonic plasma spray gun, and spraying the metal film coating on the insulating layer; and step four, preparing a heat-resistant composite coating by using a supersonic plasma spray gun, and spraying the heat-resistant composite coating on the metal film layer.

Description

Laminated heat-resistant electronic film and preparation method thereof
Technical Field
The invention relates to the technical field of microelectronic films, in particular to a laminated heat-resistant electronic film and a preparation method thereof.
Background
Polyimide (sometimes abbreviated as PI) refers to a polymer having an imide ring (-CO-N-CO-) in its main chain, and is one of organic polymer materials having the best overall performance. The high-temperature-resistant insulating material has high temperature resistance of more than 400 ℃, a long-term use temperature range of-200-300 ℃, no obvious melting point at part, high insulating property, dielectric constant of 4.0 at 103 Hz and dielectric loss of only 0.004-0.007, and belongs to F-H grade insulation.
Polyimides can be classified into aliphatic, semi-aromatic and aromatic polyimides according to the chemical structure of the repeating unit. The crosslinking type and the non-crosslinking type are classified according to the interaction force between chains.
Polyimide is used as a special engineering material and has been widely applied to the fields of aviation, aerospace, microelectronics, nano-scale, liquid crystal, separation membranes, laser and the like. In the last 60 th century, the research, development and utilization of polyimide was listed as one of the most promising engineering plastics in 21 st century in all countries. Polyimide, because of its outstanding characteristics in terms of performance and synthesis, whether as a structural material or as a functional material, has great potential for applications that have been fully recognized and is known as "problem-solving" and is considered "without polyimide, there is no current microelectronics technology".
However, the simple polyimide film has its own defects, which limits its large-scale application, and the composite laminated film technology is widely used to further improve the application performance of the polyimide film.
Disclosure of Invention
Based on the technical problems, the invention designs and develops a laminated heat-resistant electronic film, and aims to provide a heat-resistant composite laminated electronic film based on a polyimide film.
The invention also discloses a preparation method of the laminated heat-resistant electronic film, and aims to provide a preparation method of the heat-resistant composite laminated electronic film based on the polyimide film.
The technical scheme provided by the invention is as follows:
a laminated heat resistant electronic film comprising:
a substrate layer, one side surface of which is subjected to corona pretreatment;
the insulating layer is coated on one side surface of the substrate layer subjected to corona pretreatment;
a metal film layer sprayed on the insulating layer;
a heat resistant composite layer; which is sprayed on the surface of the metal film layer.
Preferably, the substrate layer is a polyimide film and has a thickness of 20 to 50 μm.
Preferably, the insulating layer is made of polyimide resin and has a thickness of 10 to 20 μm.
Preferably, the material of the metal film layer is NiCrAlY or one of CoCrAlY and NiCrAl, and the spraying thickness is 5-15 μm.
Preferably, the material of the heat-resistant composite layer is CaO-ZrO2Or MgO-ZrO2、CeO-ZrO2One of the spraying thicknesses is 20-40 μm.
A method of making a laminated heat resistant electronic film comprising the steps of:
preparing a substrate from a polyimide raw material, and performing corona pretreatment on the surface of one side of the substrate;
secondly, coating an insulating layer on the surface of one side subjected to corona pretreatment;
step three, preparing a metal film coating by a supersonic plasma spray gun, and spraying the metal film coating on the insulating layer;
and step four, preparing a heat-resistant composite coating by using a supersonic plasma spray gun, and spraying the heat-resistant composite coating on the metal film layer.
Preferably, in the third step, the flow rate Q of the argon gas flow of the supersonic plasma torch is controlled1Is composed of
Figure BDA0002734879760000021
In the formula, Q0Standard set point of argon gas flow for spraying metal film coating, q1Flow rate of powder supply q for coating with metallic film1_0Powder feeding airflow for spraying metal film coatingStandard set point of quantity, d2Is the thickness of the insulating layer, d3Is the thickness of the metal film layer, d1_0Is a standard set value of the thickness of the substrate layer, d2_0Is a standard set value of the thickness of the insulating layer, W1Amount of powder fed for coating with metallic film, W1_0The powder feeding amount is a standard set value of the powder feeding amount of the sprayed metal film coating, and the lambda is an adjusting coefficient and ranges from 2.09 to 2.23.
Preferably, in said step three, Q0Is 240L/min, q1_0Is 5L/min, d1_0Is 35 μm, d2_0Is 18 μm, W1_020g/min, lambda 2.13.
Preferably, in the third step, the pressure of the powder feeding gas in the spraying parameters of the spray gun is set to be 0.4-0.55 Mpa.
Preferably, in the fourth step, the spraying parameters of the spray gun are set as follows:
the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min.
Compared with the prior art, the invention has the following beneficial effects: the laminated heat-resistant electronic film with high temperature resistance can be obtained by spraying the metal film layer and the heat-resistant composite layer on the imide film.
Drawings
Fig. 1 is a schematic view of a laminated heat-resistant electronic film according to the present invention.
Detailed Description
The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
As shown in fig. 1, the present invention provides a laminated heat-resistant electronic film, the body including a base layer 110, an insulating layer 120, a metal film layer 130, and a heat-resistant composite layer 140; wherein, one side surface of the substrate layer 110 is corona-pretreated, the insulating layer 120 is coated on the one side surface of the substrate layer 110 corona-pretreated, the metal film layer 130 is sprayed on the insulating layer 120, and the heat-resistant composite layer 140 is sprayed on the surface of the metal film layer 130(ii) a Preferably, the substrate layer 110 is a polyimide film with a thickness of 20 μm to 50 μm, the insulating layer 120 is made of polyimide resin, the insulating layer 120 is coated with a thickness of 10 μm to 20 μm, the metal film layer 130 is made of NiCrAlY or one of CoCrAlY and NiCrAll, the metal film layer 130 is sprayed with a thickness of 5 μm to 15 μm, and the heat-resistant composite layer 140 is made of CaO-ZrO2Or MgO-ZrO2、CeO-ZrO2In one of them, the spray thickness of the heat-resistant composite layer 140 is 20 μm to 40 μm.
The invention also provides a preparation method of the laminated heat-resistant electronic film, which comprises the following steps:
preparing a substrate layer 110 from a polyimide raw material, preparing the substrate layer with the thickness of 20-50 microns, and performing corona pretreatment on one side surface of the substrate layer 110;
coating an insulating layer 120 on the surface of one side subjected to corona pretreatment to prepare the material with the thickness of 10-20 microns;
step three, preparing a metal film layer 130 by a supersonic plasma spray gun, spraying the metal film layer on the insulating layer 120 to prepare the metal film layer with the thickness of 5-15 microns, and setting the spraying parameters of the spray gun as follows:
the flow rate of argon gas flow is 220-260L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.45-0.55 Mpa, the flow rate of the powder conveying gas is 5-7L/min, and the powder conveying amount is 20-24 g/min;
step four, preparing the heat-resistant composite layer 140 by using a supersonic plasma spray gun, spraying the heat-resistant composite layer on the metal film layer 130 to prepare the heat-resistant composite layer with the thickness of 20-40 microns, wherein the spraying parameters of the spray gun are set as follows:
the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min.
In another embodiment, in step three, the flow Q of the argon gas flow of the supersonic plasma torch is precisely controlled1Is composed of
Figure BDA0002734879760000041
In the formula, Q0Standard set point of argon gas flow for spraying metal film coating, q1Flow rate of powder supply q for coating with metallic film1_0Standard set value of the flow of the powder feed gas for spraying a metal film coating, d2Is the thickness of the insulating layer, d3Is the thickness of the metal film layer, d1_0Is a standard set value of the thickness of the substrate layer, d2_0Is a standard set value of the thickness of the insulating layer, W1Amount of powder fed for coating with metallic film, W1_0The powder feeding amount is a standard set value of the powder feeding amount of the sprayed metal film coating, and the lambda is an adjusting coefficient and ranges from 2.09 to 2.23.
Example 1
Preparing a substrate layer 110 from a polyimide raw material, preparing the substrate layer with the thickness of 20 microns, and performing corona pretreatment on one side surface of the substrate layer 110; coating an insulating layer 120 on the surface of one side subjected to corona pretreatment to prepare a material with the thickness of 10 microns; preparing a metal film layer 130 by a supersonic plasma spray gun, spraying the metal film layer on the insulating layer 120 to prepare the metal film layer with the thickness of 5 microns, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 220-260L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.45-0.55 Mpa, the flow rate of the powder conveying gas is 5-7L/min, and the powder conveying amount is 20-24 g/min; preparing a heat-resistant composite layer 140 by a supersonic plasma spray gun, spraying the heat-resistant composite layer on the metal film layer 130 to prepare the metal film with the thickness of 20 microns, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min.
Example 2
Preparing a substrate layer 110 from a polyimide raw material, preparing the substrate layer with the thickness of 35 microns, and performing corona pretreatment on one side surface of the substrate layer 110; coating an insulating layer 120 on the surface of one side subjected to corona pretreatment to prepare a material with the thickness of 15 microns; preparing a metal film layer 130 by a supersonic plasma spray gun, spraying the metal film layer on the insulating layer 120 to prepare the metal film layer with the thickness of 10 microns, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 220-260L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.45-0.55 Mpa, the flow rate of the powder conveying gas is 5-7L/min, and the powder conveying amount is 20-24 g/min; preparing a heat-resistant composite layer 140 by a supersonic plasma spray gun, spraying the heat-resistant composite layer on the metal film layer 130 to prepare a layer with a thickness of 30 μm, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min.
Example 3
Preparing a substrate layer 110 from a polyimide raw material, preparing the substrate layer with the thickness of 50 microns, and performing corona pretreatment on one side surface of the substrate layer 110; coating an insulating layer 120 on the surface of one side subjected to corona pretreatment to prepare a film with the thickness of 20 microns; preparing a metal film layer 130 by a supersonic plasma spray gun, spraying the metal film layer on the insulating layer 120 to prepare the metal film layer with the thickness of 15 microns, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 220-260L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.45-0.55 Mpa, the flow rate of the powder conveying gas is 5-7L/min, and the powder conveying amount is 20-24 g/min; preparing a heat-resistant composite layer 140 by a supersonic plasma spray gun, spraying the heat-resistant composite layer on the metal film layer 130 to prepare the heat-resistant composite layer with the thickness of 40 microns, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min.
Example 4
Preparing a substrate layer 110 from a polyimide raw material, preparing the substrate layer with the thickness of 50 microns, and performing corona pretreatment on one side surface of the substrate layer 110; coating an insulating layer 120 on the surface of one side subjected to corona pretreatment to prepare a film with the thickness of 20 microns; preparing a metal film layer 130 by a supersonic plasma spray gun, spraying the metal film layer on the insulating layer 120 to prepare the metal film layer with the thickness of 15 microns, and setting the spraying parameters of the spray gun as follows: the current is 440-460A, the voltage is 120-140V, the pressure of the powder feeding gas is 0.45-0.55 Mpa, the flow rate of the powder feeding gas is 5-7L/min, and the powder feeding amount is 20-24 g/min; preparing a heat-resistant composite layer 140 by a supersonic plasma spray gun, spraying the heat-resistant composite layer on the metal film layer 130 to prepare the heat-resistant composite layer with the thickness of 40 microns, and setting the spraying parameters of the spray gun as follows: the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min;
wherein, when the metal film layer 130 is prepared by the supersonic speed plasma spray gun, the flow rate of the argon gas flow is accurately controlled to be
Figure BDA0002734879760000061
In the formula, Q0Standard set point of argon gas flow for spraying metal film coating, q1Flow rate of powder supply q for coating with metallic film1_0Standard set value of the flow of the powder feed gas for spraying a metal film coating, d2Is the thickness of the insulating layer, d3Is the thickness of the metal film layer, d1_0Is a standard set value of the thickness of the substrate layer, d2_0Is a standard set value of the thickness of the insulating layer, W1Amount of powder fed for coating with metallic film, W1_0The powder feeding amount is a standard set value of the sprayed metal film coating, and lambda is an adjusting coefficient and has a value range of 2.09-2.23;
in the present embodiment, as one preference, Q0Is 240L/min, q1_0Is 5L/min, d1_0Is 35 μm, d2_0Is 18 μm, W1_020g/min, lambda 2.13.
Comparative example
The polyimide film was obtained using a conventional technique, and was prepared to have a thickness of 50 μm.
Results of the experiment
As shown in table 1, the laminated heat-resistant electronic film disclosed by the present invention has good heat resistance, and satisfies the development and application of the heat-resistant electronic film.
Table 1 heat resistance test results
Figure BDA0002734879760000062
Figure BDA0002734879760000071
While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.

Claims (10)

1. A laminated heat resistant electronic film, comprising:
a substrate layer, one side surface of which is subjected to corona pretreatment;
the insulating layer is coated on one side surface of the substrate layer subjected to corona pretreatment;
a metal film layer sprayed on the insulating layer;
a heat resistant composite layer; which is sprayed on the surface of the metal film layer.
2. The laminated heat resistant electronic film of claim 1, wherein the substrate layer is a polyimide film having a thickness of 20 μm to 50 μm.
3. The laminated heat-resistant electronic film according to claim 1, wherein the insulating layer is made of a polyimide resin and has a thickness of 10 μm to 20 μm.
4. The laminated heat-resistant electronic film of claim 1, wherein the metal film layer is NiCrAlY or one of CoCrAlY and NiCrAl, and the sprayed thickness is 5 μm to 15 μm.
5. The laminated heat-resistant electronic film according to claim 1, wherein the heat-resistant composite layer is made of CaO-ZrO2Or MgO-ZrO2、CeO-ZrO2One of the spraying thicknesses is 20-40 μm.
6. A method for preparing a laminated heat-resistant electronic film is characterized by comprising the following steps:
preparing a substrate from a polyimide raw material, and performing corona pretreatment on the surface of one side of the substrate;
secondly, coating an insulating layer on the surface of one side subjected to corona pretreatment;
step three, preparing a metal film coating by a supersonic plasma spray gun, and spraying the metal film coating on the insulating layer;
and step four, preparing a heat-resistant composite coating by using a supersonic plasma spray gun, and spraying the heat-resistant composite coating on the metal film layer.
7. The method of manufacturing a laminated heat-resistant electronic film according to claim 6, wherein in the third step, the flow rate Q of the argon gas flow of the supersonic plasma torch is controlled1Is composed of
Figure FDA0002734879750000011
In the formula, Q0Standard set point of argon gas flow for spraying metal film coating, q1Flow rate of powder supply q for coating with metallic film1_0Standard set value of the flow of the powder feed gas for spraying a metal film coating, d2Is the thickness of the insulating layer, d3Is the thickness of the metal film layer, d1_0Is a standard set value of the thickness of the substrate layer, d2_0Is a standard set value of the thickness of the insulating layer, W1Amount of powder fed for coating with metallic film, W1_0The powder feeding amount is a standard set value of the powder feeding amount of the sprayed metal film coating, and the lambda is an adjusting coefficient and ranges from 2.09 to 2.23.
8. The method for producing a laminated heat-resistant electronic film according to claim 7, wherein in step three, Q0Is 240L/min, q1_0Is 5L/min, d1_0Is 35 μm, d2_0Is 18 μm, W1_020g/min, lambda 2.13.
9. The method of claim 7, wherein in the third step, the pressure of the powder feeding gas in the spray parameters of the spray gun is set to 0.4-0.55 MPa.
10. The method for producing a laminated heat-resistant electronic film according to claim 7, wherein in the fourth step, the spray parameters of the spray gun are set to:
the flow rate of argon gas flow is 105-125L/min, the current is 440-460A, the voltage is 120-140V, the pressure of powder conveying gas is 0.4-0.55 Mpa, the flow rate of powder conveying gas is 4-6L/min, and the powder conveying amount is 20-25 g/min.
CN202011130145.5A 2020-10-21 2020-10-21 Laminated heat-resistant electronic film and preparation method thereof Pending CN112251709A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001046324A2 (en) * 1999-10-25 2001-06-28 Rolls-Royce Corporation Erosion-resistant coatings for organic matrix composites
US20030148078A1 (en) * 2000-04-03 2003-08-07 Masayuki Aida Metallized polyimide film
CN108314795A (en) * 2018-02-11 2018-07-24 中国人民解放军国防科技大学 Polyimide composite material with composite coating coated on surface and preparation method thereof
CN108359926A (en) * 2018-02-11 2018-08-03 中国人民解放军国防科技大学 Antioxidant/heat-insulating integrated composite coating, polyimide composite material with composite coating coated on surface and preparation method of polyimide composite material
CN110273122A (en) * 2019-07-16 2019-09-24 中国航发北京航空材料研究院 The preparation method of the outer adjustment sheet long-life heat insulating coat of composite polyimide material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001046324A2 (en) * 1999-10-25 2001-06-28 Rolls-Royce Corporation Erosion-resistant coatings for organic matrix composites
US20030148078A1 (en) * 2000-04-03 2003-08-07 Masayuki Aida Metallized polyimide film
CN108314795A (en) * 2018-02-11 2018-07-24 中国人民解放军国防科技大学 Polyimide composite material with composite coating coated on surface and preparation method thereof
CN108359926A (en) * 2018-02-11 2018-08-03 中国人民解放军国防科技大学 Antioxidant/heat-insulating integrated composite coating, polyimide composite material with composite coating coated on surface and preparation method of polyimide composite material
CN110273122A (en) * 2019-07-16 2019-09-24 中国航发北京航空材料研究院 The preparation method of the outer adjustment sheet long-life heat insulating coat of composite polyimide material

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