CN112247740A

CN112247740A - Polishing device, polishing method, polishing assisting device, polishing assisting system and polishing assisting method

Info

Publication number: CN112247740A
Application number: CN202011027679.5A
Authority: CN
Inventors: 杨元坤; 徐晓明; 张汉杰; 龙波; 黎海军; 钟春明
Original assignee: Shenzhenshi Yuzhan Precision Technology Co Ltd
Current assignee: Shenzhenshi Yuzhan Precision Technology Co Ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2021-01-22
Also published as: TW202206221A; US20220097204A1; TWI818319B

Abstract

The application provides a polishing system, which is used for polishing a workpiece and comprises a sensing module and a processor, wherein the sensing module is used for sensing the stress condition of the workpiece to form a pressure sequence; forming guide information, wherein the guide information is used for guiding a polishing head to polish the workpiece with a preset track; forming a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; and forming an adjusting instruction according to the deviation sequence so as to adjust the position of the polishing head.

Description

Polishing device, polishing method, polishing assisting device, polishing assisting system and polishing assisting method

Technical Field

The application relates to the technical field of polishing, in particular to a polishing device, a polishing method, a polishing-assisted device, a polishing system and a polishing-assisted method.

Background

With the progress of the technology, the quality requirements of the workpieces, especially the touch feeling, the smoothness and other properties of the workpieces, are higher and higher, wherein the grinding process is an important link for improving the properties.

The workpiece stress information of the traditional grinding process cannot be quantized, the grinding track and the grinding position of the grinding head cannot be accurately controlled, the workpiece after grinding is whitened, uneven in lines, different in depth and the like, the problem that the workpiece is clamped or damaged by a grinding device when a chamfer (for example, the R angle of a 3C workpiece such as a mobile phone) is ground is easily caused, and the use experience of the workpiece is influenced.

Disclosure of Invention

In view of the above, it is desirable to provide a polishing device, a polishing method, a polishing-assisted device, a polishing system and a polishing method, so as to solve the above problems.

The present application provides in a first aspect a grinding system for grinding a workpiece, comprising:

the sensing module is used for sensing the stress condition of the workpiece to form a pressure sequence;

a processor, coupled to the sensing module, for: receiving the pressure sequence; forming guide information for guiding the polishing head to polish the workpiece with a preset track; forming a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; and forming an adjusting instruction according to the deviation sequence so as to adjust the position of the polishing head.

Further, the guiding information comprises a predetermined position and a conversion relationship, the predetermined position is a calculated position of the polishing head for polishing the workpiece, the conversion relationship is a conversion formula of the pressure of the polishing head and the deformation information of the polishing material on the polishing head, and the processor is further configured to: determining the conversion relationship according to the rigidity parameter of the grinding material on the grinding head; forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relation; and forming the deviation sequence according to the deformation information and the preset position.

Further, wherein the processor is further configured to: forming an adjusted pressure sequence by a filter according to the pressure sequence; and determining the deviation sequence according to the adjusted pressure sequence and the guide information.

Further, wherein the guiding information comprises a first track, the processor is further configured to: forming the guidance information, including: determining that the device combination for polishing the workpiece comprises a machine component and the polishing head; the device combination based on the workpiece polishing comprises the machine component and the polishing head to form the first running track, wherein the first running track is the running track of the polishing head; the processor is further configured to form the deviation sequence according to the pressure sequence and the first operation trajectory.

Further, wherein the processor is further configured to: forming a basic track and a first adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a running track of the polishing head formed on a plane formed in a first direction and a third direction, the first adjustment quantity is an adjustment sequence loaded on the basic track on the plane formed in a second direction and the third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction of the polishing head towards the workpiece; and forming the first running track according to the basic track and the first adjustment quantity.

Further, wherein the processor is further configured to: forming a basic track and a second adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the second adjustment quantity is a carrier signal superposed on the basic track in the second direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction in which the polishing head faces the workpiece; and forming the first running track according to the basic track and the second adjustment quantity.

Further, wherein the processor is further configured to: forming a basic track and a third adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the third adjustment quantity is a fixed value superposed on the basic track in the first direction, the first direction is vertical to the third direction, and the first direction is a direction of the polishing head towards the workpiece; and forming the first running track according to the basic track and the third adjustment quantity.

Further, wherein the processor is further configured to: forming a base track and a fourth adjustment quantity based on a device combination for polishing the workpiece, wherein the base track is a moving track formed on a plane formed by a first direction and a third direction, the fourth adjustment quantity is a variation value superposed on the base track in the first direction, the first direction is vertical to the third direction, and the first direction is a direction of the polishing head towards the workpiece; and forming the first running track according to the basic track and the fourth adjustment quantity.

Further, wherein the guiding information further comprises a second trajectory, the processor is further configured to: forming the guidance information, further comprising: determining that the device assembly further comprises a bearing module, wherein the bearing module is used for bearing the workpiece and can rotate or move the workpiece; based on the device combination, the device combination also comprises a bearing module group, and a second running track is formed and is the running track of the workpiece; the processor is further configured to form the deviation sequence according to the pressure sequence, the first trajectory and the second trajectory.

Further, wherein the guiding information further comprises chamfering information, the processor is further configured to: determining the chamfering information based on the device combination further comprising a bearing module; calculating a chamfering track corresponding to the first running track and the chamfering information according to the chamfering information; and forming the second running track according to the chamfering track.

Further, wherein the processor is further configured to: adjusting the first running track to be a third running track according to the second running track and the chamfering track; and forming the deviation sequence according to the pressure sequence, the third running track and the second running track.

A second aspect of the present application provides a grinding method for controlling a grinding head on a machine assembly to grind a workpiece, comprising: receiving a pressure sequence, wherein the pressure sequence is formed by sensing the stress condition of the workpiece by a sensing module; forming guide information for guiding the polishing head to polish the workpiece with a preset track; forming a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; and forming an adjusting instruction according to the deviation sequence so as to adjust the position of the polishing head.

Further, the guiding information includes a predetermined position and a conversion relationship, the predetermined position is a calculated position of the polishing head for polishing the workpiece, and the conversion relationship is a conversion formula of the pressure of the polishing head and the deformation information of the polishing material on the polishing head, further including: determining the conversion relationship according to the rigidity parameter of the grinding material on the grinding head; forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relation; and forming the deviation sequence according to the deformation information and the preset position.

Further wherein the step of forming a deviation sequence of the pressure sequence comprises: forming an adjusted pressure sequence by a filter according to the pressure sequence; and determining the deviation sequence according to the adjusted pressure sequence and the guide information.

Further, wherein the guidance information comprises a first trajectory, the step of forming the guidance information comprises: determining that the combination of the apparatus for polishing the workpiece comprises the machine component and the polishing head; the device combination based on the workpiece polishing comprises the machine component and the polishing head to form the first running track, wherein the first running track is the running track of the polishing head; the step of forming the deviation sequence of the pressure sequence includes forming the deviation sequence according to the first operation track and the pressure sequence.

Further, the step of forming the first trajectory comprises: forming a basic track and a first adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a running track of the polishing head formed on a plane formed in a first direction and a third direction, the first adjustment quantity is an adjustment sequence loaded on the basic track on the plane formed in a second direction and the third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction of the polishing head towards the workpiece; and forming the first running track according to the basic track and the first adjustment quantity.

Further, the step of forming the first trajectory comprises: forming a basic track and a second adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the second adjustment quantity is a carrier signal superposed on the basic track in the second direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction in which the polishing head faces the workpiece; and forming the first running track according to the basic track and the second adjustment quantity.

Further, the step of forming the first trajectory comprises: forming a basic track and a third adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the third adjustment quantity is a fixed value superposed on the basic track in the first direction, the first direction is vertical to the third direction, and the first direction is a direction of the polishing head towards the workpiece; and forming the first running track according to the basic track and the third adjustment quantity.

Further, the step of forming the first trajectory comprises: forming a base track and a fourth adjustment quantity based on a device combination for polishing the workpiece, wherein the base track is a moving track formed on a plane formed by a first direction and a third direction, the fourth adjustment quantity is a variation value superposed on the base track in the first direction, the first direction is vertical to the third direction, and the first direction is a direction of the polishing head towards the workpiece; and forming the first running track according to the basic track and the fourth adjustment quantity.

Further, wherein the guiding information further includes a second moving track, the second moving track being a moving track of the workpiece, the step of forming the deviation sequence further includes: determining that the device assembly further comprises a bearing module, wherein the bearing module is used for bearing the workpiece and can rotate or move the workpiece; forming a second running track based on the device combination and further comprising a bearing module; and forming the deviation sequence according to the pressure sequence, the first running track and the second running track.

Further, wherein the guiding information further comprises chamfering information, the step of forming the second trajectory comprises: determining the chamfering information based on the device combination further comprising a bearing module; calculating a chamfering track corresponding to the first running track and the chamfering information according to the chamfering information; and forming the second running track according to the chamfering track.

Further, wherein the step of forming the deviation sequence further comprises: adjusting the first running track to be a third running track according to the second running track and the chamfering track; and forming the deviation sequence according to the pressure sequence, the third running track and the second running track.

The third aspect of the present application provides an auxiliary polishing device for carrying and sensing a polished workpiece, comprising: a bearing portion for bearing a workpiece and bearing at least one of a force and a moment from the workpiece; the sensing module is connected with the bearing part; the connecting part is arranged between the bearing part and the sensing module; the base is connected with the mounting part and comprises a first hollow part which is communicated with the first channel; the mounting part is arranged between the sensing module and the base, the mounting part is of a hollow structure, and the hollow part is arranged as a first channel; the sensing module is also connected with a cable, and the cable is used for coupling with the sensing module through the first hollow part and the first channel; the sensing module is used for sensing at least one of the force and the moment to form a pressure value, and transmitting the pressure value to the polishing device through the cable.

Further, the bearing part comprises a first hole; the sensing module comprises a second hollow part; the connecting part is of a hollow structure, and a hollow part is arranged as a second channel; the air pumping module comprises an air pipe which is coupled with the first hole and is used for penetrating through at least one of the first hollow part, the first channel, the second hollow part and the second channel so as to form the combination force of the workpiece arranged on the bearing part and the bearing part through the first hole.

Further wherein the base comprises: the sealing cover is connected with the mounting part and comprises a second hole; an inner cavity containing the first hollow part; the second hole is arranged between the first hollow part and the first channel; a moving part connected with the inner cavity; the inner cavity further comprises a sealing part which is arranged between the moving part and the first hollow part.

The present application fourth aspect provides an auxiliary polishing system for an auxiliary polishing device polishing a workpiece, comprising: the communicator is used for acquiring a first track and a second track; a processor, coupled to the communicator, configured to: controlling a bearing module to execute at least one of pause, movement and rotation along the first track, wherein the bearing module is used for bearing the workpiece; acquiring a trigger signal, and determining that the trigger signal reaches a trigger condition; and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the triggering signal reaching the triggering condition.

Further, wherein the trigger signal is a time at which the workpiece has been polished along the first trajectory, the system further comprises: a timer coupled to the processor for acquiring the time; the processor is further configured to: determining that the time is equal to a preset time; and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the time equal to the preset time.

Further wherein the trigger signal is a speed of polishing the workpiece along the first trajectory, the system further comprising: a detector, coupled to the processor, for detecting the velocity; the processor is further configured to: determining that the speed is less than or equal to a preset speed; and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the speed being less than or equal to the preset speed.

A fifth aspect of the present application provides a method of assisting polishing for controlling an assisting polishing system to polish a workpiece in cooperation with a polishing apparatus, comprising: acquiring a first track and a second track; controlling a bearing module to execute at least one of pause, movement and rotation along the first track, wherein the bearing module is used for bearing the workpiece; acquiring a trigger signal, and determining that the trigger signal reaches a trigger condition; and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the triggering signal reaching the triggering condition.

Further, wherein the trigger signal is a time at which the workpiece has been polished along the first trajectory, the step of acquiring the trigger signal, determining that the trigger signal meets a trigger condition, comprises: acquiring the time; determining that the time is equal to a preset time; and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the time equal to the preset time.

Further, wherein the trigger signal is a speed of polishing the workpiece along the first trajectory, the step of obtaining the trigger signal and determining that the trigger signal meets a trigger condition comprises: detecting the speed; determining that the speed is less than or equal to a preset speed; and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the speed being less than or equal to the preset speed.

The application provides a system and method of polishing through the atress information of sensing work piece to based on the orbit of this atress information adjustment polishing head, through the orbit of control polishing head in order to realize the atress condition of each polishing point of quantization control polishing process work piece, with the quality that promotes the work piece of polishing.

Drawings

Fig. 1 presents a schematic view of a sanding system according to one or more embodiments of the present application.

Fig. 2 shows a schematic view of a state of a sanding system according to one or more embodiments of the present application.

FIG. 3 shows a schematic of a trajectory according to one or more embodiments of the present application.

Fig. 4 shows a schematic view of a grinding method according to one or more embodiments of the present application.

Fig. 5 shows a schematic view of a grinding method according to one or more embodiments of the present application.

Fig. 6 shows a schematic view of a grinding method according to one or more embodiments of the present application.

Fig. 7 shows a perspective view of an apparatus for assisting in sanding, according to one or more embodiments of the present application.

Fig. 8 illustrates a cross-sectional view of an apparatus for assisting in sanding, according to one or more embodiments of the present application.

Fig. 9 shows a schematic view of a system for assisting in sanding, according to one or more embodiments of the present application.

Fig. 10 shows a schematic view of a method of assisting sanding according to one or more embodiments of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element or component is referred to as being "connected" to another element or component, it can be directly connected to the other element or component or intervening elements or components may also be present. When an element or component is referred to as being "disposed on" another element or component, it can be directly on the other element or component or intervening elements or components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Various embodiments of the present application may take the form of an entirely or partially hardware embodiment, an entirely or partially software embodiment, or a combination of software and hardware (e.g., a firmware embodiment). Furthermore, as described herein, various embodiments (e.g., systems and methods) of the present application may take the form of a computer program product including a computer-readable non-transitory storage medium having computer-accessible instructions (e.g., computer-readable and/or computer-executable instructions) such as computer software encoded or embodied in such storage medium.

Which may be read or accessed and executed by one or more processors to perform or enable the performance of the operations described herein. The instructions may be provided in any suitable form, such as source code, compiled code, interpreted code, executable code, static code, dynamic code, assembly code, combinations of the foregoing, and the like. Any suitable computer-readable non-transitory storage medium may be used to form the computer program product. For example, a computer-readable medium may include any tangible, non-transitory medium for storing information in a form readable or otherwise accessible by one or more computers or processors functionally coupled thereto. The non-transitory storage medium may be embodied as or may contain ROM; a RAM; a magnetic disk storage medium; an optical storage medium; flash memory, etc.

At least some embodiments of the operating environment and techniques are described herein with reference to block diagrams and flowchart illustrations of methods, systems, devices, and computer program products. It will be understood that each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, respectively, can be implemented by computer-accessible instructions. In some implementations, computer-accessible instructions may be loaded onto or incorporated into a general purpose computer, special purpose computer, or other programmable information processing apparatus to produce a particular machine, such that the operations or functions specified in the flowchart block or blocks may be implemented in response to execution at the computer or processing apparatus.

Unless expressly stated otherwise, any arrangement, procedure, process, or technique presented herein is not to be construed as requiring that its actions or steps be performed in a particular order. Thus, when a process or method claim does not actually recite an order to be followed by its acts or steps, or it is not otherwise specifically recited in the claims or descriptions of the subject disclosure that the steps are to be limited to a specific order, it is no way intended that an order be inferred, in any respect. This applies to any possible non-explicit basis for interpretation, including: logical matters regarding arrangement of steps or operation flows; plain meaning from grammatical organization or punctuation; the number or type of embodiments described in the specification or drawings, and the like.

As used in this application, the terms "environment," "system," "engine," "module," "component," "architecture," "interface," "unit," and the like refer to a computer-related entity or an entity associated with an operating device having one or more defined functionalities. The terms "environment," "system," "engine," "module," "component," "architecture," "interface," and "unit" may be used interchangeably and generally refer to a functional element. Such entities may be hardware, a combination of hardware and software, or software in execution. For example, a module may be implemented as a process running on a processor, an object, an executable portion of software, a thread of execution, a program, and/or a computing device. Also for example, a software application executing on a computing device and the computing device may both be implemented as a module. Also for example, one or more modules may reside within a process and/or thread of execution. A module may be located on one computing device or distributed between two or more computing devices. As disclosed herein, modules may execute from various computer readable non-transitory storage media having various data structures stored thereon. Modules may communicate via local and/or remote processes in accordance with, for example, a signal (analog or digital) having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, and/or across a signal) with another component on, for example, a wide area network having other systems.

Also for example, a module may be implemented as or may comprise a device having a defined functionality provided by mechanical components operated by electrical or electronic circuitry controlled by a software application or a firmware application executed by a processor. Such a processor may be internal or external to the device, and may execute at least a portion of a software or firmware application. As another example, a module may be embodied as or may contain a device that provides a defined function through electronic components without mechanical components. The electronic component may include a processor to execute software or firmware that allows or at least partially facilitates the functionality of the electronic component. In some implementations, modules may communicate via local and/or remote processes in accordance with, for example, a signal (analog or digital) having one or more data packets (e.g., data from a component interacting with another component in a local system, distributed system, and/or via a signal with another component on, for example, a wide area network having other systems). Additionally, or in other embodiments, the modules may communicate or otherwise be coupled by thermal, mechanical, electrical, and/or electromechanical coupling mechanisms (e.g., conduits, connectors, combinations thereof, etc.). An interface may include Input/Output (I/O) components as well as associated processors, applications, and/or other programming components.

As used in this application, the term "communicator" may refer to any type of communication circuit or device. The communicator may be embodied as or may comprise several types of network elements, including base stations; a router device; a switching device; a server device; an aggregator apparatus; a bus architecture; combinations of the foregoing; or the like. The one or more bus architectures CAN include an industrial bus architecture such as an ethernet-based industrial bus, a Controller Area Network (CAN) bus, Modbus, other types of fieldbus architectures, and the like.

As used in this application, the term "processor" may refer to any type of processing circuit or device. A processor may be implemented as a combination of Processing circuits or computational Processing units (e.g., (Central Processing Unit, CPU), (Graphics Processing Unit, GPU), or a combination of both). Thus, for purposes of description, a processor may refer to a single core processor; a single processor with software multi-threaded execution capability; a multi-core processor; a multi-core processor having software multi-thread execution capability; a multi-core processor having hardware multithreading; a parallel processing (or computing) platform; and a parallel computing platform with distributed shared memory. Additionally, or for another example, a Processor may refer to an Integrated Circuit (IC), an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), a Programmable Logic Controller (PLC), a Complex Programmable Logic Device (CPLD), a discrete Gate or transistor Logic, a discrete hardware component, or any combination thereof designed or configured (e.g., manufactured) to perform the functions described herein. In some embodiments, processors may use nanoscale architectures in order to optimize space usage or enhance performance of systems, devices, or other electronic devices according to the present application. For example, the processor may include molecular transistors and/or quantum dot based transistors, switches, and gates.

Furthermore, in the present specification and drawings, terms such as "store," "memory," "data store," "memory," "repository," and substantially any other information storage means associated with the operation and function of the components of the present application refer to memory means, entities implemented in one or more memory devices, or means forming a memory device. It should be noted that the memory means or memory apparatus described herein implements or includes a non-transitory computer storage medium readable or accessible by a computing device. Such media may be implemented in any method or technology for storing information, such as machine-accessible instructions (e.g., computer-readable instructions), information structures, program modules, or other information objects.

Furthermore, in the present specification and drawings, terms such as "store," "memory," "data store," "memory," "repository," and substantially any other information storage means associated with the operation and function of the components of the present application refer to memory means, entities implemented in one or more memory devices, or means forming a memory device. The memory means or memory device may be implemented as volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. Further, the memory component or memory device may be removable or non-removable, and/or internal or external to the computing apparatus or component. Examples of various types of non-transitory storage media may include hard disk drives, zip drives, CD-ROMs, Digital Versatile Disks (DVDs) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, flash memory cards or other types of memory cards, magnetic cassettes, or any other non-transitory medium suitable for retaining the desired information and accessible by a computing device. For example, the nonvolatile Memory may include a Read-Only Memory (ROM), a Programmable ROM (PROM), an Electrically Programmable ROM (EPROM), an Electrically Erasable Programmable ROM (EEPROM), or a flash Memory. Volatile Memory can include Random Access Memory (RAM), which acts as external cache Memory. By way of illustration and not limitation, RAM can take many forms, such as Synchronous RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DRRAM). The disclosed memory devices or memories of an operating or computing environment described herein are intended to comprise one or more of these and/or any other suitable types of memory.

Conditional language such as "may," "can," "might," or "may" is generally intended to convey that certain implementations may include certain features, elements, and/or operations, while other implementations do not, unless specifically stated otherwise or understood otherwise in the context of usage. Thus, such conditional language is not generally intended to imply that features, elements, and/or operations are in any way required for one or more implementations or that one or more implementations must contain logic for deciding, with or without user input or prompting, whether such features, elements, and/or operations are contained or are to be performed in any particular implementation.

The computer-readable program instructions of the present application may be downloaded to a corresponding computing/processing device from a computer-readable storage medium or an external computer or external storage device via a network (e.g., the internet, a local area network, a wide area network, and/or a wireless network). The network may include copper transmission cables, optical transmission fibers, wireless transmissions, routers, firewalls, switches, gateway computers and/or edge servers. The network adapter card or network interface in each computing/processing device receives computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable non-transitory storage medium within the respective computing/processing device. What has been described in this specification and the accompanying drawings includes examples of systems, apparatus, techniques, and computer program products that, individually and in combination, allow for tracking and tracing of components of products manufactured in industrial facilities. It is, of course, not possible to describe every conceivable combination of components and/or methodologies for purposes of describing the various elements of the present application, but many further combinations and permutations of the disclosed elements are possible. It is therefore evident that various modifications may be made thereto without departing from the scope or spirit of the application. In addition, or in the alternative, other embodiments of the present application may be apparent from consideration of the specification and drawings and practice of the present application as presented herein.

The examples set forth in the specification and figures are to be considered in all respects as illustrative and not restrictive. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Referring to fig. 1, in one or more embodiments of the present application, a polishing system 700 is provided, the polishing system 700 being used for polishing a workpiece 12, the polishing system 700 including a sensor module 30 and a first processor 720.

The sensing module 30 is used for sensing the stress condition of the workpiece 12 to form a pressure sequence.

The first processor 720 is coupled to the sensing module 30, and the first processor 720 is configured to receive the pressure sequence and form the index information, wherein the index information is used to index the polishing head 10 to polish the workpiece 12 with a predetermined trajectory. Forming a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; based on the deviation sequence, adjustment instructions are formed to adjust the position of the sanding head 10.

It is understood that in other embodiments, the sensing module 30 may include a 6-axis force sensor, and may also include a single-axis force sensor, as long as the force condition of the workpiece 12 can be directly sensed. The sensing module 30 may also be a force sensor with a protection rating above IP65 to meet the safety requirements for polishing the workpiece 12.

Thus, referring to fig. 2, the sensing module 30 may be disposed on the carrying module 80 carrying the workpiece 12 to sense a stress condition of the workpiece 12, wherein the stress condition includes stress conditions of a plurality of points of the polishing portion 410 of the workpiece 12, and the stress conditions of the plurality of points form a pressure sequence.

The sensing module 30 sends the pressure sequence to the first processor 720, and the first processor 720 receives the pressure sequence and forms guiding information, wherein the guiding information is used for guiding a moving track of the polishing head 10 for polishing the workpiece 12, for example, the moving track is consistent with the shape of the part to be polished of the workpiece 12, such as a circle, a square or a ring, or the moving track is a composite moving track of the polishing head 10 moving along the circular or square or ring motion process and simultaneously moving along the direction perpendicular to the ring motion direction.

The first processor 720 timely adjusts or pre-configures the force applied by the sanding head 10 to the workpiece 12 during operation, i.e., forms a deviation sequence, based on the motion profile and the force applied to the workpiece 12 in the motion profile, i.e., the received pressure sequence.

The first processor 720 forms an adjustment instruction according to the deviation sequence, so that when the polishing head 10 is adjusted to polish the workpiece 12, the polishing head 10 corresponds to different positions at different portions to be polished of the workpiece 12, so that the stress condition of each point of the polishing portion of the workpiece 12 conforms to a preset pressure sequence, and the force application condition of the polishing head 10 for polishing different portions of the workpiece 12 is quantitatively controlled.

Illustratively, an adjustment quantity of a running track can be formed through a deviation sequence, the preset running track is overlapped or adjusted in other modes to form an adjusted running track, the adjusted running track is converted into a force application control sequence when the workpiece 12 is polished through a conversion relation, the force application control sequence is an adjustment instruction, according to the adjustment instruction, the process that the polishing head 10, which meets the polishing precision requirement and is adaptive to the current scene and working condition, polishes the workpiece 12, and the workpiece 12 meeting the polishing precision requirement is obtained.

Further, the guiding information includes a preset position and a conversion relation, where the preset position is a calculated position where the polishing head 10 polishes the workpiece 12, that is, position information where the polishing head 10 is located when polishing different polishing points of the workpiece 12. The conversion relationship is a conversion between the pressure of the polishing head 10 and the deformation information of the polishing material on the polishing head 10, and the first processor 720 is further configured to: determining a conversion relation according to the rigidity parameters of the polishing material on the polishing head 10;

forming deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relation;

and forming a deviation sequence according to the deformation information and the preset position.

Thus, the first processor 720 determines the conversion relationship based on the stiffness parameter of the polishing material on the polishing head 10, wherein the stiffness parameter mainly determines the hardness and softness of the material (such as sandpaper) to be pressed (similar to the concept of elastic coefficient) to provide the force/position conversion relationship in the control calculation. The first processor 720 forms deformation information corresponding to the pressure sequence according to the transformation relation and the pressure sequence, wherein the deformation information is set by a material coefficient s (determining the hardness/rigidity of the stressed material, similar to an elastic coefficient, with unit of mm/N) in the force control parameter.

For example, the sanding head 10 is stuck with sandpaper, 0.1mm is pressed into the workpiece 12, and then the material coefficient s of the sandpaper can be obtained by looking at how much the force is increased by N. Thus, the deformation information is force ·. The first processor 720 forms a deviation sequence according to the deformation information and the preset position of the polishing head 10, where the deviation sequence is adjustment information of the polishing head 10 based on the deformation information and the preset position, for example, if the deformation amount of the polishing head 10 is 0.2mm due to the application of the preset pressure 10N, the polishing head 10 needs to move 0.2mm based on the preset position and the deformation direction.

Further, the first processor 720 is further configured to:

forming an adjusted pressure sequence by a filter according to the pressure sequence;

and determining the deviation sequence according to the adjusted pressure sequence and the guide information.

In this way, the pressure sequence is adjusted by a filter to eliminate high-frequency interference, such as interference caused by vibration of the air mill, wherein the filter can be a virtual filter or an object filter. For example, a virtual filter implemented based on LabVIEW Express programming to remove noise.

Further, wherein the guiding information comprises a first track, the first processor 720 is further configured to:

forming the guidance information, including:

the combination of the apparatus for determining the sanding of the workpiece 12 includes a machine assembly and the sanding head 10;

the first travel path is formed based on the combination of the device for polishing the workpiece 12 including the machine component and the polishing head 10, and the first travel path is the travel path of the polishing head 10;

the first processor 720 is further configured to form the deviation sequence according to the pressure sequence and the first operation trajectory.

Illustratively, the forming of the guidance information includes: it is first determined that the combination of means for abrading a workpiece 12 comprises a machine assembly, which may be a robotic arm, connected to the abrading head 10 for controlling the movement of the abrading head 10 in accordance with control commands, and the abrading head 10, although the machine assembly may alternatively be other drive assemblies, so long as the abrading head 10 is driven in motion.

The movement track of the polishing head 10 driven by the machine assembly is a first movement track, which is exemplarily a polishing track preset according to the finished product requirement of the workpiece 12, so that the workpiece 12 meeting the precision requirement is obtained after the workpiece 12 is polished by the first movement track.

The first processor 720 forms the deviation sequence according to the pressure sequence and the first operation trajectory, for example, when the polishing head 10 polishes a straight edge of the frame-shaped workpiece 12, the workpiece 12 is fixed by the carrier module 80, and the machine assembly drives the polishing head 10 to move to polish the workpiece 12.

Specifically, as shown in fig. 2, two coordinate systems are included, a work coordinate system and a tool coordinate system, wherein the work coordinate system is a three-dimensional coordinate system established based on the sensing module 30 or based on the workpiece 12 on the carrying module 80, and wherein the tool coordinate system is a three-dimensional coordinate system established based on the polishing head 10.

The first direction is schematically an X-axis direction of a work coordinate system, the second direction is a Z-axis direction of the work coordinate system, and the third direction is a Y-axis direction of the work coordinate system (fig. 2 is a two-dimensional view, not shown, but the Y-axis direction can be understood as a direction perpendicular to the paper).

The basic trajectory is schematically a movement trajectory (for example, a translation trajectory) of the polishing head 10 formed on an XY plane of a work coordinate system, and for convenience of description, the compound movement of the polishing head 10 in the tool coordinate system is decomposed into a movement of rubbing the workpiece 12 on the XY plane, the ZY plane, and the XZ plane. As shown in fig. 2, the tool coordinate system moves along with the sanding head 10, and the tool coordinate system is shown to be transformed to match the first state or the second state and to become the tool 1 coordinate system or the tool 2 coordinate system when different sanding heads 10 move at different positions (e.g., the first state and the second state).

Further, the first processor 720 is further configured to:

forming a basic track and a first adjustment quantity based on the combination of the device for polishing the workpiece 12 and the polishing head 10, wherein the basic track is a running track of the polishing head 10 formed on a plane formed in a first direction and a third direction, the first adjustment quantity is an adjustment sequence loaded on the basic track on a plane formed in a second direction and the third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction of the polishing head 10 towards the workpiece 12;

and forming the first running track according to the basic track and the first adjustment quantity.

The first adjustment amount of the polishing head 10 according to the XY plane of the tool coordinate system may be at least one of a straight line, a circle, an ellipse, and a diamond, or other twisting movement trajectories of other planes set according to the polishing surface requirement of the polishing head 10, so that the movement trajectories of the polishing head 10 may be adjusted according to the first adjustment amount to polish the workpiece 12 into different shapes.

Further, wherein the first processor 720 is further configured to:

forming a basic track and a second adjustment quantity based on the combination of the device for polishing the workpiece 12 and the polishing head 10, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the second adjustment quantity is a carrier signal superposed on the basic track in the second direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction of the polishing head 10 towards the workpiece 12;

and forming the first running track according to the basic track and the second adjustment quantity.

Specifically, referring to fig. 2 again, the second adjustment amount is to apply a carrier signal with frequency and amplitude, which may be a sine wave, a square wave, or the like, or other axial swinging movement tracks set according to the requirement of the polishing surface of the polishing head 10, along the Y-axis direction of the tool coordinate system, so as to make the polishing head 10 realize axial swinging. In this manner, by adjusting the second adjustment amount so that the polishing head 10 can customize the polishing of the workpiece 12, for example, the shape, finish, etc. of the polished workpiece 12 can be controlled to enhance the generalization of the workpiece 12.

Further, wherein the first processor 720 is further configured to:

forming a basic track and a third adjustment amount based on a combination of the device for polishing the workpiece 12 and the polishing head 10, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the third adjustment amount is a fixed value superimposed on the basic track in the first direction, the first direction is perpendicular to the third direction, and the first direction is a direction of the polishing head 10 toward the workpiece 12;

and forming the first running track according to the basic track and the third adjustment quantity.

Specifically, referring again to fig. 2, the third adjustment amount is an increment of pressing the sanding head 10 into the workpiece 12 along the Z-axis of the tool coordinate system, such that the sanding head 10 is brought into close proximity with the workpiece 12 along the sanding direction, i.e., the Z-axis of the tool coordinate system, by the third increment to control the quality of sanding of the workpiece 12 by the sanding head 10.

Further, the first processor 720 is further configured to:

forming a base trajectory and a fourth adjustment amount based on a combination of the device for polishing the workpiece 12 and the polishing head 10, the base trajectory being a movement trajectory formed on a plane formed by a first direction and a third direction, the fourth adjustment amount being a variation value superimposed on the base trajectory in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction of the polishing head 10 toward the workpiece 12;

and forming the first running track according to the basic track and the fourth adjustment quantity.

Specifically, referring to fig. 2 again, the fourth adjustment amount is a variation value applied along the Z-axis direction of the tool coordinate system, and it can be understood that, in the actual polishing process, there are two polishing manners, one is that the overpressure amount of the polishing head 10 pressing against the workpiece 12 is a fixed value (e.g., a third adjustment amount), for example, the polishing surface of the polishing head 10 is covered with sand paper, when the workpiece 12 is polished with the sand paper, the sand paper is divided into two regions, one is an unpolished region and the other is a polished region, and the overpressure amount is a fixed value, which means that the polishing overpressure amounts of the two regions are both fixed values, for example, 0.1mm, so as to facilitate control of the polishing relationship; another polishing mode is that the overpressure amount is a variable value (e.g., a fourth adjustment amount), and when the polished area of the sandpaper is shifted to the non-polished area, the overpressure amount gradually increases, for example, from 0.05mm to 0.1mm, so that the polishing loss of the sandpaper is more uniform, the service life of the sandpaper is prolonged, and the polishing precision of the sandpaper is better controlled. It will be appreciated that the workpiece 12 may also be sanded directly by the sanding surface of the sanding head 10.

Further, wherein the guiding information further includes a second track, the first processor 720 is further configured to: forming the guidance information, further comprising:

determining that the apparatus assembly further comprises a carrying module 80, wherein the carrying module 80 is used for carrying the workpiece 12 and can rotate or move the workpiece 12;

based on the apparatus assembly further comprising a carrying module 80, forming the second moving track, which is the moving track of the workpiece 12;

the first processor 720 is further configured to form the deviation sequence according to the pressure sequence, the first trajectory and the second trajectory.

Specifically, referring to fig. 2 again, the carrying module 80 is a rotatable fixture, which can carry the workpiece 12 and drive the workpiece 12 to rotate, and of course, the carrying module 80 can also be other mechanisms as long as the workpiece 12 can be rotated or moved.

Further, wherein the guiding information further comprises chamfering information, the first processor 720 is further configured to:

based on the device assembly further comprising a carrying module 80, determining the chamfering information;

calculating a chamfering track corresponding to the first running track and the chamfering information according to the chamfering information;

and forming the second running track according to the chamfering track.

Further, the first processor 720 is further configured to:

adjusting the first running track to be a third running track according to the second running track and the chamfering track;

and forming the deviation sequence according to the pressure sequence, the third running track and the second running track.

Illustratively, when the polishing head 10 polishes the corner of the workpiece 12, the polishing head 10 and the carrying module 80 carrying the workpiece 12 both move, and the carrying module 80 carrying the workpiece 12 moves, so that the polishing head 10 keeps the Z direction based on the tool coordinate system unchanged through the cooperation of the polishing head 10 and the carrying module 80, and the polishing quality of the workpiece 12 is controllable.

Specifically, when the polishing head 10 polishes the corner of the workpiece 12, when the polishing head 10 operates along the first operation track, the bearing module 80 drives the workpiece 12 to operate along the second operation track, in order to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, the first operation track is adjusted again, the set of adjustment amounts in the operation process is a deviation sequence, the first operation track (for example, the a track in fig. 3) is adjusted to be the third operation track (for example, the B track in fig. 3) through the deviation sequence, so that the Z direction of the polishing head 10 based on the tool coordinate system is kept unchanged, and the polishing quality of the polished workpiece 12 is controllable.

For example, referring to fig. 3, fig. 3 is a schematic diagram of a running track in one or more embodiments, where track a is a first track, track B is a third track, both track a and track B are running tracks of the polishing head 10 and have the same moving direction, the second running track is a track that the carrying module 80 drives the workpiece 12 to move, the second running track is opposite to the moving direction of the tracks a and B, and the running track of the polishing head 10 is adjusted according to the track that the carrying module 80 drives the workpiece 12 to move and the chamfering track of the workpiece 12, so that when the polishing head 10 polishes a chamfer of the workpiece 12, the polishing head 10 is unchanged relative to the carrying module 80 along the Z-axis direction of the tool coordinate system, so as to ensure the quality of the chamfer of the workpiece 12 polished by the polishing head 10.

Specifically, the chamfer (e.g., the R corner of a 3C product such as a mobile phone) is any one of the four corners of the frame-shaped workpiece 12, and the chamfer information is the arc length of the R corner. Dividing the angle R into a combination of 5 arc lengths, calculating to obtain the angle of rotation along the Z axis of the tool coordinate system when the machine component moves along the 5 equal arcs, which can be an equal or unequal arc length combination, such as 0-10-30-55-80-90 degrees, and then using the negative values of the angles, such as 0, -10, -30, -55, -80, -90, as the track interpolation points of the bearing module 80 to control the rotation of the bearing module 80 along the Z axis of the work coordinate system, so that the bearing module 80 cooperates with the polishing head 10, the bearing module 80 and the polishing head 10 respectively move along different tracks, so that the polishing head 10 keeps still on the Z axis of the tool coordinate system during polishing and only moves in the XY axis plane of the tool coordinate system, thereby effectively preventing the occurrence of dead angles when the polishing head 10 polishes the workpiece 12 and preventing the machine component from being stuck, the control process can also be simplified.

Referring to fig. 4, a polishing method for controlling a polishing head 10 of a machine assembly to polish a workpiece 12 is provided in one or more embodiments of the present application, and may be used in the above-described polishing system, and is exemplified by the polishing system. The polishing method comprises the following steps:

step 1002, receive a pressure sequence.

Wherein, the pressure sequence is formed by a sensing module for sensing the stress condition of the workpiece 12.

Step 1004, forming the guide information.

Wherein the guide information is used to guide the polishing head 10 to polish the workpiece 12 with a predetermined trajectory.

Step 1006, forming a deviation sequence of the pressure sequence according to the pressure sequence and the guiding information.

Based on the deviation sequence, an adjustment command is formed 1008 to adjust the position of the sanding head 10.

Referring to fig. 4 again, the sensing module 30 senses a stress condition of the workpiece 12, wherein the stress condition includes stress conditions of a plurality of points of the portion of the workpiece 12 to be polished, and the stress conditions of the plurality of points form a pressure sequence.

Based on the received pressure sequence, and form guide information for guiding a travel path of the polishing head 10 for polishing the workpiece 12, such as a travel path that coincides with the shape of the polishing portion of the workpiece 12, a circle or a square, or a composite travel path in which the polishing head 10 travels in a circular or square, circular motion while traveling in a direction perpendicular to the circular motion direction.

Based on the motion trail and the stress condition of the workpiece 12 in the motion trail, i.e. the pressure sequence, the condition of the applied force to the workpiece 12 during the operation process of the polishing head 10 is timely adjusted or pre-configured, i.e. a deviation sequence is formed.

According to the deviation sequence, an adjustment instruction is formed so as to enable the polishing head 10 to correspond to different positions at different parts to be polished of the workpiece 12 when the polishing head 10 is adjusted to polish the workpiece 12, so that the stress condition of each point of the polishing part of the workpiece 12 conforms to a preset pressure sequence, and the force application condition of the polishing head 10 for polishing different parts of the workpiece 12 is controlled in a quantized mode.

Further, the guiding information includes a preset position and a conversion relation, where the preset position is a calculated position where the polishing head 10 polishes the workpiece 12, that is, position information where the polishing head 10 is located when polishing different polishing points of the workpiece 12. The conversion relationship is a conversion expression of the pressure of the polishing head 10 and the deformation information of the polishing material on the polishing head 10. Referring to fig. 5, the polishing method further includes the following steps.

Step 1010, determining the conversion relationship according to the rigidity parameters of the polishing material on the polishing head 10;

step 1012, forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the transformation relationship;

and 1014, forming the deviation sequence according to the deformation information and the preset position.

Thus, the conversion relationship is determined based on the stiffness parameter of the polishing material on the polishing head 10, wherein the stiffness parameter mainly determines the hardness and softness of the material (such as sandpaper) to be pressed into (similar to the concept of elastic coefficient) to provide the force/position conversion relationship in the control calculation. And forming deformation information corresponding to the pressure sequence according to the conversion relation and the pressure sequence, wherein the deformation information is set according to a material coefficient s (which determines the hardness/rigidity of the stressed material and is similar to an elastic coefficient and has the unit of mm/N) in the force control parameter.

Further, the step of forming a deviation sequence of the pressure sequence in step 1006 specifically includes:

Further, the step of forming the guiding information, as shown in fig. 6, includes:

step 1020, determining that the combination of devices for abrading the workpiece 12 includes the machine component and the abrading head 10;

step 1022, forming the first motion trajectory based on the combination of the device for polishing the workpiece 12 including the machine component and the polishing head 10, wherein the first motion trajectory is a motion trajectory of the polishing head 10;

step 1024, forming a deviation sequence of the pressure sequence, including forming the deviation sequence according to the first operation track and the pressure sequence.

Illustratively, the combination of means for determining the polishing of the workpiece 12 includes a machine assembly, which may be a robotic arm, connected to the polishing head 10 for controlling the movement of the polishing head 10 in accordance with control commands, and the polishing head 10, although the machine assembly may be other drive assemblies as long as the polishing head 10 is driven to move.

The movement track of the polishing head 10 driven by the machine assembly is a first movement track, which is exemplarily a polishing track preset according to the finished product requirement of the workpiece 12, so that the workpiece 12 meeting the precision requirement is obtained after the workpiece 12 is polished by the first movement track. The deviation sequence is formed according to the pressure sequence and the first travel path, for example, when the polishing head 10 polishes a straight edge of the frame-shaped workpiece 12, the workpiece 12 is fixed by the carrier module 80, and the machine assembly drives the polishing head 10 to move to polish the workpiece 12.

Referring again to fig. 2, two coordinate systems are included, a work coordinate system and a tool coordinate system, wherein the work coordinate system is a three-dimensional coordinate system established based on the sensing module 30 or based on the workpiece 12 on the carrying module 80, and the tool coordinate system is a three-dimensional coordinate system established based on the polishing head 10.

Further, in step 1022, the step of forming the first trajectory includes:

forming a basic track and a third adjustment amount based on a combination of the device for polishing the workpiece 12 and the polishing head 10, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the third adjustment amount is a fixed value superimposed on the basic track in the first direction, the first direction is perpendicular to the third direction, and the first direction is a direction of the polishing head 10 toward the workpiece 12; and forming the first running track according to the basic track and the third adjustment quantity.

Specifically, referring again to fig. 2, the trajectory of the sanding head 10 is formed on the YZ plane of the Z axis and the Y axis of the tool coordinate system, the sanding head 10 rubs the workpiece 12 on the YZ plane, and the third adjustment amount is an increment of pressing the sanding head 10 into the workpiece 12 along the Z axis of the tool coordinate system, such that the sanding head 10 is brought into close proximity with the workpiece 12 along the sanding direction, i.e., the Z axis of the tool coordinate system, by the third increment to control the quality of sanding of the workpiece 12 by the sanding head 10.

Further, in step 1022, the step of forming the first trajectory includes:

forming a base trajectory and a fourth adjustment amount based on a combination of the device for polishing the workpiece 12 and the polishing head 10, the base trajectory being a movement trajectory formed on a plane formed by a first direction and a third direction, the fourth adjustment amount being a variation value superimposed on the base trajectory in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction of the polishing head 10 toward the workpiece 12; and forming the first running track according to the basic track and the fourth adjustment quantity.

Further, wherein the guiding information further comprises a second operation track, the second operation track is the operation track of the workpiece 12, the step of forming the deviation sequence further comprises:

based on the device assembly further comprising a carrying module 80, forming the second operation track;

and forming the deviation sequence according to the pressure sequence, the first running track and the second running track.

Further, wherein the guiding information further comprises chamfering information, the step of forming the second trajectory comprises:

and forming the second running track according to the chamfering track.

When the polishing head 10 polishes the corner of the workpiece 12, when the polishing head 10 operates along the first operation track, the bearing module 80 drives the workpiece 12 to operate along the second operation track, in order to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, the first operation track of the polishing head 10 is adjusted, the set of adjustment amounts in the operation process is a deviation sequence, the Z direction of the polishing head 10 based on the tool coordinate system is kept unchanged through the deviation sequence, and the polishing quality of the polished workpiece 12 is controllable.

Further, wherein the step of forming the deviation sequence further comprises:

Referring to fig. 7, an apparatus for assisting grinding is provided in one or more embodiments of the present application for carrying and sensing a workpiece 12 to be ground. The auxiliary polishing device is exemplified by the above-mentioned carrier module 80.

Specifically, the auxiliary polishing device 800 includes a bearing portion 810, a sensing module 30 and a base 830, wherein the bearing portion 810 is used for bearing the workpiece 12 and bearing at least one of force and moment from the workpiece 12; the sensing module 30 is connected to the carrying portion 810, the sensing module 30 is coupled to a polishing device, and the sensing module 30 is used for sensing force and torque, forming a pressure value and outputting the pressure value to the polishing device. The base 830 is connected to the sensing module 30, and the base 830 is used for fixing the sensing module 30.

Therefore, the bearing part 810 bears the workpiece 12, the sensing module 30 senses at least one of force and moment borne by the bearing part 810, wherein the force is acting force between the workpiece 12 and the polishing device when the polishing device polishes the workpiece 12, the acting force is transmitted to the bearing part 810 through the workpiece 12 and is sensed by the sensing module 30, and the sensing module 30 sends the pressure value to the polishing device, so that the polishing device can adjust polishing force and angle according to the force and moment borne by the workpiece 12, and the auxiliary polishing device can polish the workpiece 12.

It will be appreciated that the sensing module 30 may transmit the pressure value to the polishing device by wired or wireless means, such as bluetooth transmission, wireless communication transmission or transmission via cable, etc. However, such transmission needs to solve the problem of shielding signals from the metal surfaces of the sensing module and the connecting part, and the defect of signal transmission can be avoided by adopting a wireless transmission mode with higher penetration capability, which is not described herein again.

Further, the sensing module 30 includes at least one of a force sensor and a torsion meter, so long as the force and the moment can be sensed. The force sensor and the torsion meter can respectively sense the force and the moment from the bearing part, whether polishing is carried out according to a preset track or not can be judged according to a force curve formed by force information, whether inappropriate deflection occurs in a certain direction or not can be judged according to a torque condition formed by the moment information, only the force sensor is needed in a scene with lower polishing precision requirement, but the force and the moment need to be accurately sensed in a scene with higher polishing precision requirement, therefore, the force sensor and the torsion meter are needed to be combined to complete a sensing process, the current or next polishing precision is controlled in a mode of feeding back to the mechanical arm to feed back the mechanical arm in time or adjusting afterwards, and a positive cycle of benign iteration is formed.

Alternatively, the sensing module 30 comprises a 6-axis force sensor. The 6-axis force sensor can sense the components of the X axis, the Y axis and the Z axis of the received force in a work coordinate system, and sense the deflection angles of the received moment around the X axis, the Y axis and the Z axis in the work coordinate system respectively, compared with a combined mode of the force sensor and a torsion meter, the installation is simpler, the precision is higher, and the technical scheme is explained by the 6-axis force sensor, but the method is not limited to the technical scheme.

Further, the sensing module 30 is a force sensor with a protection level above IP 65. The force sensor of the grade can effectively prevent cutting fluid or abrasive dust from invading the sensing module to cause the problems of inaccurate sensing or damage to the sensing module.

Further, the force range of the bearing part 810 is 0 to 100N. Through measurement and calculation, the stress of the bearing part 311 in the calibration process is 1kg of corresponding force, namely about 9.8N, but in the actual polishing process, the highest peak value can reach 10kg of corresponding force, namely about 98N, and some safety margin is added, so that the stress range of the bearing part 311 can be determined to be about 0 to 100N, but can also be adjusted according to the actual situation. This force range is used to limit the force between the sanding head 10 and the carrier 311, and to avoid damage to the sanding head 10 or the carrier 311 due to excessive force, or damage to the workpiece 12 during sanding.

Referring to fig. 8, which is a cross-sectional view of an auxiliary polishing apparatus 800 according to one or more embodiments of the present disclosure, the auxiliary polishing apparatus 800 further includes a mounting portion 840 and a cable 850, the mounting portion 840 is disposed between the sensing module 30 and the base 830, the mounting portion 840 is a hollow structure, and the hollow portion is configured as a first channel 841;

the base 830 includes a first hollow 831, and the first hollow 831 communicates with a first passage 841.

The cable 850 is connected to the sensing module 30, and is used for transmitting the pressure value from the sensing module 30 through the first hollow portion 831 and the first channel 841.

Thus, the cable 850 is accommodated through the first hollow part 831 and the first channel 841, and the pressure value sensed by the sensing module 30 is transmitted to the polishing device through the cable 850, so as to enhance the compactness of the overall structure of the auxiliary polishing device 800, and meanwhile, the cable 850 is hermetically arranged, so that the service life of the cable 850 is prolonged, and the external influence on the transmission pressure value of the cable 850 is reduced.

Further, the device 800 for assisting grinding further includes a connecting portion 820 and an air-extracting module 860, the connecting portion 820 is disposed between the bearing portion 810 and the sensing module 30, the connecting portion 820 is a hollow structure, and a hollow portion of the connecting portion 820 is provided as the second passage 821.

The bearing part 810 comprises a first hole 811, and the sensing module 30 comprises a second hollow part 31;

the pumping module 860 comprises a gas pipe 861, wherein the gas pipe 861 is coupled to the first hole 811 and is configured to penetrate at least one of the first hollow portion 831, the first channel 841, the second hollow portion 31 and the second channel 821, so as to form a coupling force between the workpiece 12 disposed on the supporting portion 810 and the supporting portion 810 through the first hole 811. Thus, the air pumping module 860 pumps air between the workpiece 12 and the carrying portion 810 through the air pipe 861 to improve the bonding force between the carrying portion 810 and the workpiece 12 on the carrying portion 810, i.e. the carrying portion 810 assists or directly fixes the workpiece 12 on the carrying portion 810 by vacuum suction.

Further, the base 830 includes a sealing cover 831, an inner cavity 832 and a moving portion 833. The sealing cap 831 is coupled to the mounting portion 840, and the sealing cap 831 includes a second hole 8311 (not shown). The lumen 832 contains the first hollow 831. The second hole 8311 is disposed between the first hollow 831 and the first passage 841. The moving portion 833 is connected to the inner cavity 832. The inner cavity 832 further includes a sealing portion 8322, the sealing portion 8322 being disposed between the moving portion 833 and the first hollow portion 831. In this way, the sealing cover 831 and the moving portion 833 cooperate to prevent the external dust or leaked polishing liquid from entering the first hollow portion 831 from bottom to top from the moving portion 833.

Further, the auxiliary polishing device 800 further comprises a motor 870, a synchronous belt 880 and a speed reducer 890, wherein the synchronous belt 880 is connected with the motor 870. The moving portion 833 includes a pulley 8311 (not shown), and the pulley 8311 is connected to the timing belt 880. Reducer 890 is connected to pulley 8311, reducer 890 is used for conducting the moment from motor 870 to control base 830 to rotate. So, through the motion of motor 870 drive hold-in range 880, hold-in range 880 drives band pulley 8311 and rotates, and band pulley 8311 drives the speed reducer 890 rotation, and then realizes that control base 830 is rotatory.

Further, the device 800 for assisting grinding further comprises a guard 90, and the guard 90 is disposed at the connecting portion 820 and surrounds the sensing module 30. In this way, the cutting fluid or abrasive dust is prevented from entering the sensing module 30 by the guard 90.

Referring to fig. 9, a system 900 for assisting in polishing according to one or more embodiments of the present application, the system 900 for assisting in polishing being used for assisting in polishing a workpiece 12, the system 900 for assisting in polishing comprising a communicator 910 and a second processor 920. When the system 900 for assisting grinding is used in conjunction with the grinding system 700, the second processor 920 may also be the same processor as the first processor 720, and jointly implement the functions of the first processor 720 and the second processor 920.

The communicator 910 is configured to acquire a first track and a second track. The second processor 920 is coupled to the communicator, and the second processor 920 is configured to: controlling the carrying module 80 to perform at least one of pause, movement and rotation along the first track, wherein the carrying module 80 is used for carrying the workpiece 12; acquiring a trigger signal, and determining that the trigger signal reaches a trigger condition; based on the trigger signal reaching the trigger condition, the carrying module 80 is controlled to change to at least one of pause, move and rotate along the second track.

Referring to fig. 7 again, the carrier module 80 carries the workpiece 12, the second processor 920 controls the carrier module 80 to perform at least one of pause, movement and rotation along the first track, that is, the second processor 920 is used to control the carrier module 80 to move, the second processor 920 receives a trigger signal, the trigger signal is a signal that the polishing head 10 is to be triggered to switch from polishing the straight edge of the workpiece 12 to polishing the chamfer (or from polishing the chamfer to polishing the straight edge), the time, speed or position that the polishing head 10 is to switch from polishing the straight edge of the workpiece 12 to polishing the chamfer (or from polishing the chamfer to polishing the straight edge) of the polishing head 10 changes, for example, the speed of the polishing head 10 is 20mm/s when polishing the straight edge along the first track, and the trigger signal is triggered when the assembly is to switch from polishing the straight edge to polishing the polishing chamfer, for example, a position of 20mm is far from the actual start of polishing the chamfer, because the speed of polishing the chamfer is different from the speed of polishing the straight flange, for example, the speed of polishing the chamfer is 15mm/s, when the distance actually begins to polish the chamfer and has a position of 20mm, the speed is automatically adjusted, namely, the speed is gradually reduced to 15mm/s from 20mm/s, and the polishing track is switched from polishing the straight flange along the first track to polishing the chamfer along the second track, so that the purpose of smooth transition polishing is achieved, the time for adjusting the speed is shortened, and the polishing effect is better.

In one embodiment, the trigger signal is a time when the workpiece 12 has been polished along the first trajectory, and the system 900 for assisting in polishing further comprises a timer 930.

The timer 930 is coupled to the second processor 920, and the timer 930 is used for acquiring the time.

The second processor 920 is further configured to:

determining that the time is equal to a preset time;

based on the time being equal to the preset time, the carrying module 80 is controlled to change to at least one of pause, move and rotate along the second track.

For example, when the time that the polishing head 10 polishes the straight edge of the workpiece 12 and the time to be switched from the polishing straight edge to the polishing chamfer is equal to the preset time, for example, 15 seconds is the preset time, the carrying module 80 changes the polishing track, and since the speed of the polishing chamfer is different from the speed of the polishing straight edge, for example, the speed of the polishing chamfer is 15mm/s, and the speed of the polishing straight edge is 20mm/s, there is 15 seconds away from the actual start of polishing chamfer, or the time to polish the straight edge is 15 seconds, but not limited to this, by automatically adjusting the speed, that is, gradually decreasing from 20mm/s to 15mm/s, and switching the polishing track from the polishing straight edge to the polishing chamfer, the smooth transition polishing process is achieved, the time for adjusting the speed is reduced, and the polishing effect is better.

In another embodiment, wherein the trigger signal is a speed of polishing the workpiece 12 along the first trajectory, the system further comprises a detector 940.

A detector 940 is coupled to the second processor 920 for detecting the velocity.

The second processor 920 is further configured to:

determining that the speed is less than or equal to a preset speed;

based on the speed being less than or equal to the preset speed, the carrying module 80 is controlled to change to at least one of pause, movement and rotation along the second track.

When the polishing head 10 polishes a straight edge and a polishing chamfer of the workpiece 12, both the speed and the position of the polishing head 10 are changed, for example, when the polishing head 10 polishes the straight edge along a first track, the speed of the motion along the polishing track (for example, the Y direction under a tool coordinate system) is gradually increased from 0 to 20mm/s, when the machine assembly is about to be switched from the polishing straight edge to the polishing chamfer, the speed is automatically adjusted, namely, the speed is gradually decreased from 20mm/s to 15mm/s, a trigger signal is that the moving speed of the polishing head 10 is smaller than or equal to a preset speed when the speed of the polishing head 10 is smaller than or equal to the preset speed, the polishing track is switched from the polishing straight edge along the first track to the polishing chamfer along a second track, a smooth transition polishing process is achieved, the time for adjusting the speed is reduced.

Referring to fig. 10, the present application also provides an auxiliary polishing method for controlling an auxiliary polishing system 700 to polish a workpiece 12 in cooperation with a polishing apparatus, the auxiliary polishing method comprising the following steps.

And step 1030, acquiring a first track and a second track.

Step 1032, the carrier module 80 is controlled to perform at least one of pause, move and rotate along the first track.

The carrying module 80 is used for carrying the workpiece 12;

step 1034, acquiring a trigger signal, and determining that the trigger signal reaches a trigger condition;

step 1036, controlling the carrying module 80 to change to at least one of pause, move and rotate along the second track based on the triggering signal reaching the triggering condition.

So, through setting for the machine subassembly at the straight flange of polishing and the trigger condition of polishing when the chamfer conversion, switch over the speed of polishing and the orbit of polishing through the trigger condition, reach smooth transition process of polishing from first orbit change to second orbit, reduce the time of adjustment speed, make the effect of polishing better.

Further, wherein the trigger signal is a time at which the workpiece 12 has been polished along the first trajectory, the step of acquiring the trigger signal, determining that the trigger signal meets a trigger condition, comprises:

acquiring the time;

determining that the time is equal to a preset time;

Further, wherein the trigger signal is a speed of polishing the workpiece 12 along the first trajectory, the step of obtaining the trigger signal and determining that the trigger signal meets a trigger condition comprises:

detecting the speed;

determining that the speed is less than or equal to a preset speed;

Illustratively, when the polishing head 10 polishes a straight edge and a polishing chamfer of the workpiece 12, both the speed and the position of the polishing head 10 are changed, for example, when the polishing head 10 polishes the straight edge along a first track, the speed of the motion along the polishing track (for example, the Y direction under the tool coordinate system) is gradually increased from 0 to 20mm/s, when the component is about to be switched from the polishing straight edge to the polishing chamfer, the speed is automatically adjusted, namely, the speed is gradually decreased from 20mm/s to 15mm/s, and a trigger signal is that the moving speed of the polishing head 10 is smaller than or equal to a preset speed when the speed of the polishing head 10 is smaller than or equal to the preset speed, the polishing track is switched from the polishing straight edge along the first track to the polishing chamfer along a second track, so that a smooth transition polishing process is achieved, and the time for adjusting the speed.

In addition, other changes may be made by those skilled in the art within the spirit of the application, and it is understood that such changes are encompassed within the scope of the invention as claimed. The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the exemplary discussions above are not intended to be exhaustive or to limit the application to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching, for example the sequential structure of the flowcharts may be defaulted or adjusted. The embodiments were chosen and described in order to explain the principles of the present application and its practical application to thereby enable others skilled in the art to best utilize the present application and various described embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. An abrading system for abrading a workpiece, comprising:

a processor, coupled to the sensing module, for:

receiving the pressure sequence;

forming guide information, wherein the guide information is used for guiding a polishing head to polish the workpiece with a preset track;

forming a deviation sequence of the pressure sequence according to the pressure sequence and the guide information;

and forming an adjusting instruction according to the deviation sequence so as to adjust the position of the polishing head.

2. The polishing system of claim 1, wherein the index information includes a predetermined position and a translation relationship, the predetermined position being a calculated position at which the polishing head polishes the workpiece, the translation relationship being a function of pressure at the polishing head and deformation information for polishing material on the polishing head, the processor further configured to:

determining the conversion relation according to the rigidity parameter of the grinding material on the grinding head;

forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relation;

and forming the deviation sequence according to the deformation information and the preset position.

3. The polishing system of claim 1, wherein the processor is further configured to:

forming an adjusted pressure sequence through a filter according to the pressure sequence;

and determining the deviation sequence according to the adjusted pressure sequence and the guiding information.

4. The polishing system of claim 1, wherein the guidance information comprises a first travel trajectory, the processor further configured to:

forming the guidance information, including:

the device combination for determining the grinding of the workpiece comprises a machine component and the grinding head;

forming the first running track based on a device combination for polishing the workpiece, wherein the machine assembly and the polishing head are combined to form the first running track, and the first running track is the running track of the polishing head;

the processor is further configured to form the deviation sequence according to the pressure sequence and the first operation trajectory.

5. The polishing system of claim 4, wherein the processor is further configured to:

forming a basic track and a first adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a running track of the polishing head formed on a plane formed in a first direction and a third direction, the first adjustment quantity is an adjustment sequence loaded on the basic track on the plane formed in a second direction and the third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction in which the polishing head faces the workpiece;

and forming the first running track according to the basic track and the first adjustment amount.

6. The polishing system of claim 4, wherein the processor is further configured to:

forming a basic track and a second adjustment quantity based on the device combination for polishing the workpiece, wherein the basic track is a moving track formed on a plane formed by a first direction and a third direction, the second adjustment quantity is a carrier signal superposed on the basic track in the second direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is a direction in which the polishing head faces the workpiece;

and forming the first running track according to the basic track and the second adjustment amount.

7. The polishing system of claim 4, wherein the processor is further configured to:

forming a base track and a third adjustment amount based on a device combination for polishing the workpiece, wherein the base track is a moving track formed on a plane formed by a first direction and a third direction, the third adjustment amount is a fixed value superposed on the base track in the first direction, the first direction is perpendicular to the third direction, and the first direction is a direction in which the polishing head faces the workpiece;

and forming the first running track according to the basic track and the third adjustment amount.

8. The polishing system of claim 4, wherein the processor is further configured to:

forming a base track and a fourth adjustment amount based on a device combination for polishing the workpiece, wherein the base track is a movement track formed on a plane formed by a first direction and a third direction, the fourth adjustment amount is a variation value superposed on the base track in the first direction, the first direction is perpendicular to the third direction, and the first direction is a direction in which the polishing head faces the workpiece;

and forming the first running track according to the basic track and the fourth adjustment amount.

9. The polishing system of any one of claims 4-8, wherein the guidance information further comprises a second travel path, the processor further configured to:

forming the direction information, further comprising:

determining that the device combination further comprises a carrying module which is used for carrying the workpiece and can rotate or move the workpiece;

forming a second running track based on the device combination and further comprising a bearing module, wherein the second running track is the running track of the workpiece;

the processor is further configured to form the deviation sequence according to the pressure sequence, the first operation trajectory and the second operation trajectory.

10. The polishing system of claim 9, wherein the indexing information further comprises chamfer information, the processor further configured to:

determining the chamfering information based on the device combination further comprising a bearing module;

and forming the second running track according to the chamfering track.

11. The polishing system of claim 10, wherein the processor is further configured to:

12. A method of controlling a sanding head on a machine assembly to sand a workpiece, comprising:

receiving a pressure sequence, wherein the pressure sequence is formed by sensing the stress condition of the workpiece by a sensing module;

forming guide information for guiding the polishing head to polish the workpiece with a preset track;

13. The polishing method as recited in claim 12, wherein the index information includes a preset position and a conversion relationship, the preset position being a calculated position where the polishing head polishes the workpiece, the conversion relationship being a conversion of a pressure of the polishing head to deformation information of a polishing material on the polishing head, further comprising:

14. The sanding method of claim 12, wherein the step of forming a biased sequence of the pressure sequence comprises:

15. The grinding method of claim 12, wherein the guide information includes a first travel path, the step of forming the guide information including:

determining a device combination for abrading said workpiece comprising said machine assembly and said abrading head;

the step of forming a deviation sequence of the pressure sequence comprises forming the deviation sequence according to the first running track and the pressure sequence.

16. The grinding method of claim 15, wherein the step of forming the first travel path comprises:

17. The grinding method of claim 15, wherein the step of forming the first travel path comprises:

18. The grinding method of claim 15, wherein the step of forming the first travel path comprises:

19. The grinding method of claim 15, wherein the step of forming the first travel path comprises:

20. The grinding method of any one of claims 15-19, wherein the guidance information further includes a second travel path, the second travel path being a travel path of the workpiece, the step of forming the deviation sequence further comprising:

forming the second running track based on the device combination and further comprising a bearing module;

21. The grinding method of claim 20, wherein the guide information further includes chamfer information, and the step of forming the second travel path includes:

and forming the second running track according to the chamfering track.

22. The grinding method of claim 21, wherein the step of forming the deviation sequence further comprises:

23. An auxiliary polishing device for carrying and sensing a workpiece being polished, comprising:

a bearing portion for bearing a workpiece and bearing at least one of a force and a moment from the workpiece;

the sensing module is connected with the bearing part;

the connecting part is arranged between the bearing part and the sensing module;

a base connected to the mounting portion and including a first hollow portion, the first hollow portion being in communication with the first channel;

the mounting part is arranged between the sensing module and the base, the mounting part is of a hollow structure, and the hollow part is set as a first channel;

the sensing module is also connected with a cable, and the cable is used for connecting the sensing module through the first hollow part and the first channel;

the sensing module is used for sensing at least one of the force and the moment to form a pressure value, and the pressure value is transmitted to the polishing device through the cable.

24. The apparatus of claim 23, wherein

The bearing part comprises a first hole;

the sensing module comprises a second hollow part;

the connecting part is of a hollow structure, and a hollow part is arranged as a second channel;

and the air pipe is coupled with the first hole and is used for penetrating through at least one of the first hollow part, the first channel, the second hollow part and the second channel so as to form the bonding force between the workpiece arranged on the bearing part and the bearing part through the first hole.

25. The apparatus of claim 23, wherein the base comprises:

the sealing cover is connected with the mounting part and comprises a second hole;

an inner cavity containing the first hollow portion;

the second hole is arranged between the first hollow part and the first channel;

a moving part connected with the inner cavity;

the inner cavity further comprises a sealing part, and the sealing part is arranged between the moving part and the first hollow part.

26. A system for assisting in abrading a workpiece with an abrading device, comprising:

the communicator is used for acquiring a first track and a second track;

a processor, coupled to the communicator, to:

controlling a bearing module to execute at least one of pause, movement and rotation along the first track, wherein the bearing module is used for bearing the workpiece;

acquiring a trigger signal, and determining that the trigger signal reaches a trigger condition;

and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the triggering signal reaching the triggering condition.

27. The system of claim 26, wherein the trigger signal is a time at which the workpiece has been abraded along the first trajectory, the system further comprising:

a timer, coupled to the processor, for obtaining the time;

the processor is further configured to:

determining that the time is equal to a preset time;

and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the time equal to the preset time.

28. The system of claim 26, wherein the trigger signal is a speed of polishing the workpiece along the first trajectory, the system further comprising:

a detector, coupled to the processor, for detecting the velocity;

the processor is further configured to:

determining that the speed is less than or equal to a preset speed;

and controlling the bearing module to change to execute at least one of pause, movement and rotation along the second track based on the speed being less than or equal to the preset speed.

29. A method of auxiliary grinding for controlling an auxiliary grinding system to cooperate with a grinding device to grind a workpiece, comprising:

acquiring a first track and a second track;

30. The method of assisting in abrading of claim 29, wherein the trigger signal is a time at which the workpiece has been abraded along the first trajectory, the step of acquiring the trigger signal, determining that the trigger signal meets a trigger condition, comprises:

acquiring the time;

determining that the time is equal to a preset time;

31. The method of auxiliary grinding as claimed in claim 29, wherein said trigger signal is a speed of grinding said workpiece along said first trajectory, said step of acquiring a trigger signal, determining that said trigger signal meets a trigger condition, comprises:

detecting said speed;

determining that the speed is less than or equal to a preset speed;