CN112246565A - Heat-conducting paste coating method and device, computer equipment and readable storage medium - Google Patents
Heat-conducting paste coating method and device, computer equipment and readable storage medium Download PDFInfo
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- CN112246565A CN112246565A CN202011062655.3A CN202011062655A CN112246565A CN 112246565 A CN112246565 A CN 112246565A CN 202011062655 A CN202011062655 A CN 202011062655A CN 112246565 A CN112246565 A CN 112246565A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
- B05B12/122—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to presence or shape of target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
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Abstract
The invention relates to a heat-conducting paste coating method, which comprises the following steps: acquiring outer contour data of a chip bottom plate and establishing a model; calculating a coating dot matrix based on the outer contour model; and spraying heat-conducting paste based on the coating dot matrix. Through the technical scheme, the quantity of the sprayed heat-conducting paste can be compensated according to the warping degree of the chip base plate, dynamic adjustment can be realized according to the warping difference of each chip base plate, the heat-conducting paste between the chip base plate and the contact surface of the external radiator is not of the same thickness, the heat-conducting paste is properly compensated at the position where the chip base plate and the contact surface cannot be contacted, and the heat-conducting paste can be directly conducted between the chip base plate and the contact surface at the position where the chip base plate and the contact surface can be contacted, so that the heat-conducting paste between the chip base plate and the contact surface can be just filled in a gap seen by two planes without influencing the parts of the two planes which are in close contact, the heat resistance between the chip base plate and the contact surface of the external radiator is small, the heat-conducting effect.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to a method and a device for coating heat-conducting paste, computer equipment and a readable storage medium.
Background
The heat dissipation of the existing high-power IGBT (Insulated Gate Bipolar Transistor) chip is often realized by a large-area chip base plate and an external radiator, the heat generated by the IGBT chip is transferred to the external radiator via the chip base plate, and because the contact surface of the chip base plate and the external radiator has a certain roughness, the direct matching of two rough planes inevitably leads to the existence of a gap. In practical application, a proper amount of thermal conductive paste is required to be applied between the chip bottom plate and the contact surface of the external radiator to fill the gap, reduce the thermal conduction resistance of the interface and improve the heat transfer efficiency.
The heat conduction effect of the existing heat conduction paste is actually lower than that of the chip bottom plate, so that the thicker the thickness of the heat conduction paste is, the better the heat conduction effect is in actual production. In the current production process of the IGBT chip, the chip base plate is subjected to a pre-bending process in advance to counteract the warping of the chip base plate caused by the mismatching of the thermal expansion coefficients of different materials in the welding process, and the warping of the chip base plate generated on each IGBT chip has certain difference. Often, a layer of heat conducting paste is uniformly coated on a chip bottom plate or a contact surface of an external radiator by adopting a printing or spraying method, so that the situations that the heat conducting paste at the central part of the contact surface is too much and the heat conducting paste at the periphery is too little occur in the process of tightly fixing the IGBT chip and the external radiator, and thus the situations that the heat conducting resistance is increased and the heat conducting effect is reduced occur.
Disclosure of Invention
Therefore, it is necessary to provide a method for coating a thermal conductive paste, which has the advantages of small thermal resistance between a chip substrate and a contact surface of an external heat sink and good thermal conduction effect, in order to solve the above technical problems.
A heat conductive paste coating method includes the following steps:
acquiring outer contour data of a chip bottom plate and establishing a model;
calculating a coating dot matrix based on the outer contour model;
and spraying heat-conducting paste based on the coating dot matrix.
In one embodiment, the obtaining an outer contour model of the chip tray includes:
scanning the chip base plate to obtain profile data, wherein the profile data comprises height and position information of the chip base plate;
and establishing a three-dimensional coordinate system, and drawing the equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system.
In one embodiment, after the establishing a three-dimensional coordinate system and drawing an equivalent three-dimensional curved surface of the chip substrate based on the profile data and the three-dimensional coordinate system, the method further includes:
and smoothing the equivalent three-dimensional curved surface to remove curved surface burrs.
In one embodiment, the calculating a coating dot matrix based on the outer contour model includes:
dividing the equivalent three-dimensional curved surface into a plurality of coating units;
and calculating the volume of the heat conduction paste required in each coating unit, so that the upper surface of the heat conduction paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conduction paste is coated in each coating unit.
In one embodiment, dividing the equivalent three-dimensional curved surface into a plurality of coating units comprises:
presetting the side length of a first unit and the side length of a second unit;
and dividing the equivalent three-dimensional curved surface into grids based on the first unit side length and the second unit side length, and enabling the equivalent three-dimensional curved surface in the grids to be one coating unit.
In one embodiment, the volume of the thermal paste required in the coating unit is obtained based on the following formula:
V＝a*b*(h0-h)+A；
wherein V is the volume of the heat-conducting paste required in the corresponding coating unit;
a is the first unit side length, and b is the second unit side length;
h0the height of the highest point of the equivalent three-dimensional curved surface is obtained;
h is the average height of the equivalent three-dimensional curved surface in the coating unit;
a is a correction constant.
In one embodiment, the spraying of the thermal paste based on the coating dot matrix includes:
acquiring the center position coordinates of each coating unit;
and controlling the injection valve to move to the central position of each coating unit, and controlling the injection time of the injection valve in each coating unit based on the volume of the heat-conducting paste in each coating unit.
The present invention also provides a thermal paste coating apparatus, the apparatus including:
the contour acquisition module is used for acquiring the outer contour data of the chip baseplate and establishing a model;
the dot matrix calculation module is used for calculating a coating dot matrix based on the outer contour model;
and the spraying module is used for spraying the heat-conducting paste based on the coating dot matrix.
In one embodiment, the contour acquisition module includes: the scanning module is used for scanning the chip bottom plate to obtain profile data, and the profile data comprises height and position information of the chip bottom plate; the model establishing module is used for establishing a three-dimensional coordinate system and drawing an equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system;
the lattice calculation module comprises: the coating unit dividing module is used for dividing the equivalent three-dimensional curved surface into a plurality of coating units; and the heat conduction paste volume calculation module is used for calculating the volume of the heat conduction paste required in each coating unit so that the upper surface of the heat conduction paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conduction paste is coated in each coating unit.
The invention also provides a computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the steps of the method of any one of the above when executing the computer program.
The invention also provides a computer-readable storage medium, on which a computer program is stored, which computer program, when being executed by a processor, carries out the steps of the method of any of the above.
Has the advantages that:
through the technical scheme, the quantity of the sprayed heat-conducting paste can be compensated according to the warping degree of the chip base plate, dynamic adjustment can be realized according to the warping difference of each chip base plate, the heat-conducting paste between the chip base plate and the contact surface of the external radiator is not of the same thickness, the heat-conducting paste is properly compensated at the position where the chip base plate and the contact surface cannot be contacted, and the heat-conducting paste can be directly conducted between the chip base plate and the contact surface at the position where the chip base plate and the contact surface can be contacted, so that the heat-conducting paste between the chip base plate and the contact surface can be just filled in a gap seen by two planes without influencing the parts of the two planes which are in close contact, the heat resistance between the chip base plate and the contact surface of the external radiator is small, the heat-conducting effect.
Drawings
FIG. 1 is a flow chart of a thermal paste coating method according to an embodiment of the present invention;
fig. 2 is an internal structural diagram of a computer device in one embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on methods or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The heat dissipation of the existing high-power IGBT (Insulated Gate Bipolar Transistor) chip is often realized by a large-area chip base plate and an external radiator, the heat generated by the IGBT chip is transferred to the external radiator via the chip base plate, because the contact surface of the chip base plate and the external radiator has a certain roughness, and the direct cooperation of two rough planes inevitably leads to the existence of a gap, in the practical application process, a proper amount of heat-conducting paste needs to be applied between the contact surfaces of the chip base plate and the external radiator, so as to fill the gap, reduce the conduction thermal resistance of the interface, and improve the heat transfer efficiency.
The heat conduction effect of the existing heat conduction paste is actually lower than that of the chip base plate, and the heat conduction coefficient of the common heat conduction paste on the market is usually within 15W/mk, which is far less than the heat conduction coefficient 380W/mk existing in the chip base plate. This means that, instead of the thermal conductive paste having a greater thickness, having a greater thermal conductivity, there is a thickness that causes the thermal resistance in the cross-section to cancel out, and the heat transfer effect is optimal. In the current production process of the IGBT chip, a chip bottom plate is subjected to a pre-bending process in advance to counteract the warpage of the chip bottom plate caused by the mismatching of the thermal expansion coefficients of different materials in the welding process, and finally, the chip bottom plate of the finished IGBT module is also provided with a certain warpage which shows that the central part of the chip bottom plate protrudes outwards, and the contact surface of an external radiator does not have the warpage. For such a contact surface, ideally, the thermal paste should have a three-dimensional structure with a thin middle and a thick periphery. However, in the current technology, a printing or spraying method is often adopted, and a layer of heat conducting paste is uniformly coated on a contact surface of a chip bottom plate or an external radiator, so that the situations that too much heat conducting paste is at the center of the contact surface and too little heat conducting paste is at the periphery in the process of tightly fixing an IGBT chip and the external radiator, and chip bottom plate warpage generated on each IGBT chip has a certain difference, and the existing heat conducting paste coating technology is more difficult to face, so that the situations of thermal conduction resistance increase and heat transfer effect decrease occur.
In order to reduce the thermal resistance between the chip base plate and the contact surface of the external radiator and have better heat transfer effect, as shown in fig. 1, the invention provides a heat-conducting paste coating method, which comprises the following steps:
step S10: acquiring outer contour data of a chip bottom plate and establishing a model;
step S20: calculating a coating dot matrix based on the outer contour model;
step S30: and spraying heat-conducting paste based on the coating dot matrix.
Through the technical scheme, the quantity of the sprayed heat-conducting paste can be compensated according to the warping degree of the chip base plate, dynamic adjustment can be realized according to the warping difference of each chip base plate, the heat-conducting paste between the chip base plate and the contact surface of the external radiator is not of the same thickness, the heat-conducting paste is properly compensated at the position where the chip base plate and the contact surface cannot be contacted, and the heat-conducting paste can be directly conducted between the chip base plate and the contact surface at the position where the chip base plate and the contact surface can be contacted, so that the heat-conducting paste between the chip base plate and the contact surface can be just filled in a gap seen by two planes without influencing the parts of the two planes which are in close contact, the heat resistance between the chip base plate and the contact surface of the external radiator is small, the heat-conducting effect.
For step S10, in an alternative embodiment, specifically, the method includes the following steps:
step S101: scanning the chip base plate to obtain profile data, wherein the profile data comprises height and position information of the chip base plate;
step S102: and establishing a three-dimensional coordinate system, and drawing the equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system.
Specifically, the height and position information of the outline of the chip bottom plate can be obtained by scanning the chip bottom plate through the outline scanner, the information is transmitted to the computer, the computer establishes a three-dimensional coordinate system according to the received information, and the equivalent three-dimensional curved surface of the chip bottom plate is drawn in the three-dimensional coordinate system according to the height and position information of the outline of the chip bottom plate, so that the 3D model of the chip bottom plate is obtained.
In an optional embodiment, step S102 is followed by:
step S103: and smoothing the equivalent three-dimensional curved surface to remove the burrs of the curved surface.
The operations of deburring, smoothing and the like can effectively reduce interference factors and reduce errors, thereby improving the accurate control of the spraying amount of the heat-conducting paste.
Regarding step S20, in an alternative embodiment, step S20 specifically includes the following steps:
step S201: dividing the equivalent three-dimensional curved surface into a plurality of coating units;
step S202: and calculating the volume of the heat conducting paste required in each coating unit so that the upper surface of the heat conducting paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conducting paste is coated in each coating unit.
In an alternative embodiment, for step S201, the following steps are included:
step S2011: presetting the side length of a first unit and the side length of a second unit;
step S2012: and dividing the equivalent three-dimensional curved surface into grids based on the first unit side length and the second unit side length, and enabling the equivalent three-dimensional curved surface in the grids to be a coating unit.
Specifically, the drawn equivalent three-dimensional curved surface may be divided into grids, each rectangular grid is a coating unit, and in an alternative embodiment, the side length of the first unit is equal to that of the second unit, that is, the grids are squares.
In an alternative embodiment, for step S202, the volume of thermal paste required in the coating unit is obtained based on the following formula:
V＝a*b*(h0-h)+A；
wherein V is the volume of the heat-conducting paste required in the corresponding coating unit;
a is the first unit side length, and b is the second unit side length;
h0the height of the highest point of the equivalent three-dimensional curved surface;
h is the average height of the equivalent three-dimensional curved surface in the coating unit;
a is a correction constant.
Specifically, the numerical calculation can be carried out through a computer, so that the highest point of the three-dimensional curved surface is found out, the highest point is recorded, and the highest point is recorded as h0And calculating the average height in each coating unit, and recording the average height as h, wherein the side length of the first unit and the side length of the second unit are preset values, so the average height is known data, A is correction data, and the value is obtained by experimental data. In the embodiment where the second unit side length is equal to the first unit side length, the volume formula of the thermal paste required in the coating unit is specified as follows: a is2*(h0-h)+A。
For step S30, the method specifically includes the following steps:
step S301: acquiring the center position coordinates of each coating unit;
step S302: and controlling the injection valve to move to the central position of each coating unit, and controlling the injection time of the injection valve in each coating unit based on the volume of the heat-conducting paste in each coating unit.
Specifically, the central position of each grid is obtained through computer calculation, and the central position is the central position of each coating unit, namely the position where the injection valve is to perform injection work. And transmitting the central position information of each coating unit and the volume of the heat conducting paste required by the central position information correspondingly to the heat conducting paste spraying mechanism. The heat-conducting paste spraying mechanism controls the spraying valves to move to the central positions of the grids in sequence according to the received information, namely the spraying positions of the coating units, and controls the volume of the sprayed heat-conducting paste by controlling the spraying positions, so that the heat-conducting paste required to be sprayed by the coating units is sprayed to the specified positions.
By the heat conducting paste coating method, the quantity of the sprayed heat conducting paste can be compensated according to the warping degree of the chip base plate, and dynamic adjustment can be realized according to the warping difference of each chip base plate, so that the heat conducting paste between the chip base plate and the contact surface can just fill the gap between the two planes without influencing the parts of the two planes which are in close contact, the heat resistance between the chip base plate and the contact surface of an external radiator is small, the heat conducting effect is good, and the optimization of the heat conducting effect is realized.
The present invention also provides a thermal paste coating apparatus, the apparatus comprising: the contour acquisition module is used for acquiring the outer contour data of the chip baseplate and establishing a model; the dot matrix calculation module is used for calculating a coating dot matrix based on the outer contour model; and the spraying module is used for spraying the heat-conducting paste based on the coating dot matrix.
In an alternative embodiment, the contour acquisition module comprises: the scanning module is used for scanning the chip base plate to obtain profile data, and the profile data comprises height and position information of the chip base plate; and the model establishing module is used for establishing a three-dimensional coordinate system and drawing the equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system. Specifically, the height and position information of the outline of the chip bottom plate can be obtained by scanning the chip bottom plate through the outline scanner, the information is transmitted to the computer, the computer establishes a three-dimensional coordinate system according to the received information, and the equivalent three-dimensional curved surface of the chip bottom plate is drawn in the three-dimensional coordinate system according to the height and position information of the outline of the chip bottom plate, so that the 3D model of the chip bottom plate is obtained.
In an optional embodiment, the model building module further has a step of smoothing the equivalent three-dimensional curved surface and removing burrs from the curved surface, and the operations of deburring, smoothing and the like can effectively reduce interference factors and reduce errors, so that the accurate control on the spraying amount of the heat conducting paste is improved.
In an alternative embodiment, the lattice calculation module includes: the coating unit dividing module is used for dividing the equivalent three-dimensional curved surface into a plurality of coating units; and the heat conducting paste volume calculating module is used for calculating the volume of the heat conducting paste required in each coating unit so that the upper surface of the heat conducting paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conducting paste is coated in each coating unit.
Specifically, the coating unit dividing module presets a first unit side length and a second unit side length, divides the equivalent three-dimensional curved surface into grids based on the first unit side length and the second unit side length, and makes the equivalent three-dimensional curved surface in the grids a coating unit. The drawn equivalent three-dimensional curved surface can be divided into grids, each rectangular grid is a coating unit, and in an alternative embodiment, the side length of the first unit is equal to that of the second unit, that is, the grids are squares.
The heat conducting paste volume calculating module obtains the volume of the heat conducting paste required in the coating unit based on the following formula:
V＝a*b*(h0-h)+A；
wherein V is the volume of the heat-conducting paste required in the corresponding coating unit;
a is the first unit side length, and b is the second unit side length;
h0the height of the highest point of the equivalent three-dimensional curved surface;
h is the average height of the equivalent three-dimensional curved surface in the coating unit;
a is a correction constant.
Specifically, the numerical calculation can be carried out through a computer, so that the highest point of the three-dimensional curved surface is found out, the highest point is recorded, and the highest point is recorded as h0And calculating the average height in each coating unit, and recording the average height as h, wherein the side length of the first unit and the side length of the second unit are preset values, so the average height is known data, A is correction data, and the value is obtained by experimental data. In the embodiment where the second unit side length is equal to the first unit side length, the volume formula of the thermal paste required in the coating unit is specified as follows: a is2*(h0-h)+A。
For the spraying module, specifically, the spraying module acquires the coordinates of the center position of each coating unit, then controls the injection valve to move to the center position of each coating unit, and controls the injection time of the injection valve in each coating unit based on the volume of the heat conductive paste in each coating unit. The spraying module comprises a computer and a heat conducting paste spraying mechanism, and the central position of each grid can be obtained through the computer, and the central position is the central position of each coating unit, namely the position where the spraying valve is to perform spraying work. And transmitting the central position information of each coating unit and the volume of the heat conducting paste required by the central position information correspondingly to the heat conducting paste spraying mechanism. The heat-conducting paste spraying mechanism controls the spraying valves to move to the central positions of the grids in sequence according to the received information, namely the spraying positions of the coating units, and controls the volume of the sprayed heat-conducting paste by controlling the spraying positions, so that the heat-conducting paste required to be sprayed by the coating units is sprayed to the specified positions.
The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 2. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a thermal paste coating method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 2 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program: acquiring outer contour data of a chip bottom plate and establishing a model; calculating a coating dot matrix based on the outer contour model; and spraying heat-conducting paste based on the coating dot matrix.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
scanning the chip base plate to obtain profile data, wherein the profile data comprises height and position information of the chip base plate; establishing a three-dimensional coordinate system, and drawing an equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system;
dividing the equivalent three-dimensional curved surface into a plurality of coating units; and the heat conducting paste volume calculating module is used for calculating the volume of the heat conducting paste required in each coating unit so that the upper surface of the heat conducting paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conducting paste is coated in each coating unit.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of: acquiring outer contour data of a chip bottom plate and establishing a model; calculating a coating dot matrix based on the outer contour model; and spraying heat-conducting paste based on the coating dot matrix.
In one embodiment, the computer program when executed by the processor further performs the steps of:
scanning the chip base plate to obtain profile data, wherein the profile data comprises height and position information of the chip base plate; establishing a three-dimensional coordinate system, and drawing an equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system;
dividing the equivalent three-dimensional curved surface into a plurality of coating units; and the heat conducting paste volume calculating module is used for calculating the volume of the heat conducting paste required in each coating unit so that the upper surface of the heat conducting paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conducting paste is coated in each coating unit.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware related to instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A method for coating heat-conducting paste is characterized by comprising the following steps:
acquiring outer contour data of a chip bottom plate and establishing a model;
calculating a coating dot matrix based on the outer contour model;
and spraying heat-conducting paste based on the coating dot matrix.
2. The method of claim 1, wherein the obtaining the outline model of the die pad comprises:
scanning the chip base plate to obtain profile data, wherein the profile data comprises height and position information of the chip base plate;
and establishing a three-dimensional coordinate system, and drawing the equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system.
3. The method of claim 2, wherein after the establishing a three-dimensional coordinate system and drawing an equivalent three-dimensional curved surface of the die pad based on the profile data and the three-dimensional coordinate system, the method further comprises:
and smoothing the equivalent three-dimensional curved surface to remove curved surface burrs.
4. The thermal paste coating method according to claim 2, wherein the calculating a coating dot matrix based on the outer contour model comprises:
dividing the equivalent three-dimensional curved surface into a plurality of coating units;
and calculating the volume of the heat conduction paste required in each coating unit, so that the upper surface of the heat conduction paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conduction paste is coated in each coating unit.
5. The method of claim 4, wherein the dividing the equivalent three-dimensional curved surface into the plurality of coating units comprises:
presetting the side length of a first unit and the side length of a second unit;
and dividing the equivalent three-dimensional curved surface into grids based on the first unit side length and the second unit side length, and enabling the equivalent three-dimensional curved surface in the grids to be one coating unit.
6. The thermal paste coating method according to claim 5, wherein the volume of the thermal paste required in the coating unit is obtained based on the following formula:
V＝a*b*(h0-h)+A；
wherein V is the volume of the heat-conducting paste required in the corresponding coating unit;
a is the first unit side length, and b is the second unit side length;
h0the height of the highest point of the equivalent three-dimensional curved surface is obtained;
h is the average height of the equivalent three-dimensional curved surface in the coating unit;
a is a correction constant.
7. The method of claim 4, wherein the spraying of the thermal paste based on the coating dot matrix comprises:
acquiring the center position coordinates of each coating unit;
and controlling the injection valve to move to the central position of each coating unit, and controlling the injection time of the injection valve in each coating unit based on the volume of the heat-conducting paste in each coating unit.
8. A thermal paste coating apparatus, comprising:
the contour acquisition module is used for acquiring the outer contour data of the chip baseplate and establishing a model;
the dot matrix calculation module is used for calculating a coating dot matrix based on the outer contour model;
and the spraying module is used for spraying the heat-conducting paste based on the coating dot matrix.
9. The thermal paste coating apparatus of claim 8,
the contour acquisition module includes: the scanning module is used for scanning the chip bottom plate to obtain profile data, and the profile data comprises height and position information of the chip bottom plate; the model establishing module is used for establishing a three-dimensional coordinate system and drawing an equivalent three-dimensional curved surface of the chip bottom plate based on the contour data and the three-dimensional coordinate system;
the lattice calculation module comprises: the coating unit dividing module is used for dividing the equivalent three-dimensional curved surface into a plurality of coating units; and the heat conduction paste volume calculation module is used for calculating the volume of the heat conduction paste required in each coating unit so that the upper surface of the heat conduction paste is flush with the highest point of the equivalent three-dimensional curved surface after the heat conduction paste is coated in each coating unit.
10. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the steps of the method of any of claims 1 to 7 are implemented by the processor when executing the computer program.
11. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.
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