CN112238562A - Method for manufacturing keyboard substrate device - Google Patents
Method for manufacturing keyboard substrate device Download PDFInfo
- Publication number
- CN112238562A CN112238562A CN201910644557.1A CN201910644557A CN112238562A CN 112238562 A CN112238562 A CN 112238562A CN 201910644557 A CN201910644557 A CN 201910644557A CN 112238562 A CN112238562 A CN 112238562A
- Authority
- CN
- China
- Prior art keywords
- thermoplastic resin
- resin layer
- substrate device
- carbon fiber
- fiber sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/767—Printing equipment or accessories therefor
- B29L2031/7676—Keyboards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Push-Button Switches (AREA)
Abstract
A manufacturing method of a substrate device for a keyboard comprises the steps of providing a carbon fiber sheet, coating a thermoplastic resin material to form a thermoplastic resin layer, punching the carbon fiber sheet to form a plurality of positioning holes, placing the carbon fiber sheet in a female die, and enabling the thermoplastic resin layer to face a male die. And then combining the male die and the female die, wherein the male die and the female die are matched to define a plurality of cavities, and each cavity is matched with a respective positioning hole to form a forming area. One of the male die and the female die comprises a plurality of runners respectively communicated with the molding area. And controlling the temperature of the female die to be between 90 and 120 ℃, and extruding the plastic material with the temperature higher than 150 ℃ into the forming area through the runner to generate a plurality of positioning blocks. The positioning block, the carbon fiber sheet, and the thermoplastic resin layer are integrally bonded to form a keyboard substrate device, and the keyboard substrate device is taken out.
Description
Technical Field
The present invention relates to a keyboard, and more particularly, to a method of manufacturing a substrate device for a keyboard.
Background
Referring to fig. 1, a conventional keyboard includes a substrate unit 11 and a key unit 12.
The substrate unit 11 includes a plate body 111 made of an aluminum sheet, and a plurality of positioning blocks 112 made of plastic and disposed on the plate body 111. The key unit 12 includes a plurality of key groups 121 detachably engaged with the positioning block 112.
However, as technology advances, electronic products are designed to be thinner and lighter, but the conventional keyboard is limited in that the board 111 is made of aluminum sheet and cannot be made thinner and lighter.
Referring to fig. 1 and 2, in addition, when manufacturing the plate body 111 and the positioning block 112, an aluminum sheet needs to be punched, a plurality of fastening portions 113 are added at predetermined positions to manufacture the plate body 111, then a mold set 13 is used to form the positioning block 112 by insert molding, and the positioning block 112 is fastened to the corresponding fastening portions 113, wherein the processing cost for adding the fastening portions 113 is high, and therefore, the manufacturing process is still to be improved.
Disclosure of Invention
The invention aims to provide a manufacturing method of a keyboard substrate device which can reduce processing cost and can manufacture thinner and thinner.
The invention relates to a method for manufacturing a substrate device for a keyboard, which comprises the following steps:
(A) providing a carbon fiber sheet, and coating a thermoplastic resin material on at least one plate surface of the carbon fiber sheet to form a thermoplastic resin layer.
(B) And punching the carbon fiber sheet to form a plurality of positioning holes penetrating through the carbon fiber sheet and the thermoplastic resin layer.
(C) The carbon fiber sheet is placed in a female mold, and the thermoplastic resin layer is faced to a male mold.
(D) And combining the male die with the female die, wherein the male die and the female die are matched to define a plurality of recesses which are respectively communicated with the positioning holes. Each cavity is matched with a respective positioning hole to form a forming area. One of the male die and the female die comprises a plurality of runners respectively communicated with the molding area.
(E) Controlling the temperature of the female die to be between 90 and 120 ℃, and respectively extruding plastic materials with the temperature higher than 150 ℃ into the forming areas through the flow passages to generate a plurality of positioning blocks combined with the thermoplastic resin layer. The positioning block, the carbon fiber sheet, and the thermoplastic resin layer are integrally bonded to form a keyboard substrate device.
(F) And taking out the keyboard substrate device.
In the manufacturing method of the substrate device for a keyboard of the present invention, the temperature of the plastic material in the step (E) is between 210 degrees celsius and 260 degrees celsius.
In the method of manufacturing a substrate device for a keyboard of the present invention, the thermoplastic resin material applied in the step (a) is made of a polycarbonate resin material.
In the method of manufacturing a substrate device for a keyboard of the present invention, the master mold in the step (C) includes an accommodating space having a shape and contour corresponding to the carbon fiber sheet and the thermoplastic resin layer, and being opened in one direction and accommodating the carbon fiber sheet and the thermoplastic resin layer.
In the method of manufacturing a substrate device for a keyboard of the present invention, in the step (D), when the male mold and the female mold are combined, one side of the male mold adjacent to the female mold is bonded to the thermoplastic resin layer. The male mold includes the pocket formed at a side adjacent to the female mold.
In the method of manufacturing a substrate device for a keyboard of the present invention, the flow path in the step (D) is formed in the male mold.
In the method of manufacturing a substrate device for a keyboard of the present invention, the contour of each cavity in the step (D) is larger than the surface of the thermoplastic resin layer of the respective positioning hole and the corresponding portion. Each of the positioning blocks produced in the step (E) has an adhesion face bonded to a surface of a part of the thermoplastic resin layer.
In the manufacturing method of the substrate device for a keyboard of the present invention, the plastic material extruded into the molding region in the step (E) can raise the temperature of the portion of the thermoplastic resin layer contacting the plastic material to generate adhesiveness to be combined with the positioning block.
In the method for manufacturing a substrate device for a keyboard of the present invention, the plastic material extruded into the molding section in the step (E) can raise the temperature of the portion of the thermoplastic resin layer contacting the plastic material to more than 140 ℃.
The invention has the beneficial effects that: by arranging the thermoplastic resin layer and controlling the temperature of the female die and the plastic material, the positioning block can be connected with the thermoplastic resin layer to be fixed on the carbon fiber sheet, and a plurality of buckling parts do not need to be added to the carbon fiber sheet in advance, so that the processing cost can be reduced. The weight can be effectively reduced by arranging the carbon fiber sheet to replace an aluminum sheet, so that the substrate device for the keyboard can be made thinner.
Drawings
FIG. 1 is a partial exploded perspective view of a prior art keyboard;
FIG. 2 is a fragmentary cross-sectional schematic view of a die set and a base unit of the prior art keyboard;
FIG. 3 is a block diagram illustrating a manufacturing method of a substrate device for a keyboard according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart of the embodiment;
fig. 5 is a perspective view of a substrate device for a keyboard manufactured by the embodiment.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 3, 4 and 5, the method for manufacturing a substrate device for a keyboard according to an embodiment of the present invention includes the following steps S1 to S6:
step S1: a carbon fiber sheet 21 is provided, and a thermoplastic resin material is applied to at least one surface of the carbon fiber sheet 21 to form a thermoplastic resin layer 22. In the present embodiment, the thermoplastic resin material is made of a polycarbonate resin material.
Step S2: the carbon fiber sheet 21 is punched to form a plurality of positioning holes 23 penetrating through the carbon fiber sheet 21 and the thermoplastic resin layer 22.
Step S3: the carbon fiber sheet 21 is placed in a female mold 31, and the thermoplastic resin layer 22 is faced to a male mold 32. The master mold 31 includes a receiving space 311 having a shape contour corresponding to the carbon fiber sheet 21 and the thermoplastic resin layer 22 and being opened in one direction and accommodating the carbon fiber sheet 21 and the thermoplastic resin layer 22.
Step S4: the male mold half 32 is combined with the female mold half 31. The male mold 32 is attached to the thermoplastic resin layer 22 on a side adjacent to the female mold 31, and the male mold 32 includes a plurality of cavities 33 formed on a side adjacent to the female mold 31 and respectively corresponding to the positioning holes 23. Each cavity 33 has a contour larger than and corresponding to a portion of the surface of the thermoplastic resin layer 22 of the respective positioning hole 23, and forms a molding region 35 in cooperation with the respective positioning hole 23. In this embodiment, the male mold 32 further includes a plurality of runners 34 respectively connected to the molding regions 35.
Step S5: the temperature of the master mold 31 is controlled to be between 90 ℃ and 120 ℃, and plastic materials with the temperature higher than 150 ℃ are respectively extruded into the forming areas 35 through the runners 34, so that a plurality of positioning blocks 24 combined with the thermoplastic resin layer 22 are generated. Each positioning block 24 has an attachment surface 241 that is bonded to a portion of the surface of the thermoplastic resin layer 22. The positioning block 24, the carbon fiber sheet 21, and the thermoplastic resin layer 22 are integrally bonded to form a keyboard substrate device 2. In this step, the temperature of the plastic material is preferably between 210 ℃ and 260 ℃.
Step S6: the keyboard substrate device 2 is taken out.
The substrate device 2 for a keyboard can be produced by the above-described sequential steps.
It is noted that, since the resin material generally exhibits adhesiveness at a temperature exceeding 140 degrees centigrade, controlling the temperature of the master mold 31 to be between 90 degrees celsius and 120 degrees celsius in the aforementioned step S5 enables the thermoplastic resin layer 22 to be maintained at about 90 degrees celsius to 120 degrees celsius, when the plastic material with the temperature higher than 150 ℃ is extruded into the molding area 35 through the flow channel 34, since the contour of each recess 33 is larger than the respective positioning hole 23 and corresponds to a portion of the surface of the thermoplastic resin layer 22, the plastic material contacts a portion of the surface of the thermoplastic resin layer 22, the thermoplastic resin layer 22 is bonded to the bonding surface 241 of the positioning block 24 by increasing the temperature of the portion contacting the plastic material to more than 140 degrees celsius to cause adhesion. The temperature of the thermoplastic resin layer 22 is raised to about 90 to 120 degrees centigrade first, which not only can avoid the situation of embrittlement caused by excessive temperature difference when contacting the plastic material, but also can avoid the situation of poor molding caused by too high temperature of the thermoplastic resin layer 22 not contacting the plastic material, which can also avoid the adhesion caused by too high temperature.
In this way, the positioning block 24 can be connected to the carbon fiber sheet 21 while the positioning block 24 is manufactured, and a plurality of fastening parts (not shown) do not need to be added to the carbon fiber sheet 21, so that the processing cost can be effectively reduced.
In addition, since the carbon fiber sheet 21 has the characteristics of high hardness, high strength, and light weight, the keyboard substrate device 2 made of the carbon fiber sheet 21 instead of an aluminum sheet can be effectively reduced in weight, so that the keyboard substrate device 2 can be made thinner.
As described above, by providing the thermoplastic resin layer 22 and controlling the temperature of the female mold 31 and the plastic material, the positioning block 24 can be fixed to the carbon fiber sheet 21 by connecting the thermoplastic resin layer thereto, and the fastening portion does not need to be added to the carbon fiber sheet 21, so that the processing cost can be reduced. The weight of the keyboard substrate device 2 made of the carbon fiber sheet 21 instead of the aluminum sheet can be effectively reduced, so that the keyboard substrate device 2 can be made thinner, thereby achieving the object of the present invention.
Claims (9)
1. A method for manufacturing a substrate device for a keyboard, comprising the steps of:
(A) providing a carbon fiber sheet, and coating a thermoplastic resin material on at least one plate surface of the carbon fiber sheet to form a thermoplastic resin layer;
(B) punching the carbon fiber sheet to form a plurality of positioning holes penetrating through the carbon fiber sheet and the thermoplastic resin layer;
(C) placing the carbon fiber sheet in a female mold, and facing the thermoplastic resin layer to a male mold;
(D) combining the male die with the female die, wherein the male die and the female die are matched to define a plurality of recesses respectively communicated with the positioning holes, each recess is matched with the respective positioning hole to form a forming area, and one of the male die and the female die comprises a plurality of runners respectively communicated with the forming areas;
(E) controlling the temperature of the female die to be between 90 and 120 ℃, and respectively extruding plastic materials with the temperature higher than 150 ℃ into the forming areas through the flow passages to generate a plurality of positioning blocks combined with the thermoplastic resin layer, wherein the positioning blocks, the carbon fiber sheet and the thermoplastic resin layer are combined into a whole to form the substrate device for the keyboard;
(F) and taking out the keyboard substrate device.
2. The method for manufacturing a keyboard substrate device according to claim 1, wherein: the temperature of the plastic material in step (E) is between 210 and 260 degrees celsius.
3. The method of manufacturing a keyboard substrate device according to claim 2, wherein: the thermoplastic resin material coated in the step (A) is made of a polycarbonate resin material.
4. The method for manufacturing a keyboard substrate device according to claim 1, wherein: the female die in the step (C) comprises an accommodating space which is corresponding to the carbon fiber sheet and the thermoplastic resin layer in shape and outline, is opened in one direction and is used for placing the carbon fiber sheet and the thermoplastic resin layer.
5. The method of manufacturing a keyboard substrate device according to claim 4, wherein: and (D) bonding the male mold to the female mold, wherein the male mold is attached to the thermoplastic resin layer at a side adjacent to the female mold, and the male mold includes the recess formed at a side adjacent to the female mold.
6. The method of manufacturing a keyboard substrate device according to claim 5, wherein: the runner in the step (D) is formed in the male mold.
7. The method of manufacturing a keyboard substrate device according to claim 6, wherein: the contour of each recess in the step (D) is larger than the respective positioning hole and corresponds to a portion of the surface of the thermoplastic resin layer, and each positioning block produced in the step (E) has an adhesion face bonded to a portion of the surface of the thermoplastic resin layer.
8. The method for manufacturing a keyboard substrate device according to claim 1, wherein: the plastic material extruded into the molding zone in the step (E) can raise the temperature of the portion of the thermoplastic resin layer contacting the plastic material to generate adhesion to be combined with the positioning block.
9. The method of manufacturing a keyboard substrate device according to claim 8, wherein: the plastic material extruded into the molding zone in the step (E) can raise the temperature of the part of the thermoplastic resin layer contacting the plastic material to more than 140 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910644557.1A CN112238562A (en) | 2019-07-17 | 2019-07-17 | Method for manufacturing keyboard substrate device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910644557.1A CN112238562A (en) | 2019-07-17 | 2019-07-17 | Method for manufacturing keyboard substrate device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112238562A true CN112238562A (en) | 2021-01-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910644557.1A Pending CN112238562A (en) | 2019-07-17 | 2019-07-17 | Method for manufacturing keyboard substrate device |
Country Status (1)
| Country | Link |
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| CN (1) | CN112238562A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225870A (en) * | 1997-11-26 | 1999-08-18 | 出光石油化学株式会社 | Fiber-reinforced resin molded article and method of manufacturing the same |
| US20070102110A1 (en) * | 2005-11-08 | 2007-05-10 | Fujitsu Component Limited | Casing formed from thermoplastic resin and method for fabricating the casing |
| CN200953129Y (en) * | 2006-09-20 | 2007-09-26 | 精元电脑股份有限公司 | Light-weight keyboard |
| CN101533732A (en) * | 2008-03-13 | 2009-09-16 | 梁徽湖 | Method for directly combining keyboard base plate and keyboard pedestal |
| CN101941271A (en) * | 2010-06-23 | 2011-01-12 | 深圳富泰宏精密工业有限公司 | Compound of metal and plastic and manufacturing method thereof |
| CN103895152A (en) * | 2012-12-29 | 2014-07-02 | 深圳富泰宏精密工业有限公司 | Complex and preparation method thereof |
| CN104039534A (en) * | 2011-12-20 | 2014-09-10 | 朴章远 | Method for manufacturing thermoplastic synthetic resin products |
| CN105308144A (en) * | 2013-01-29 | 2016-02-03 | 赢创德固赛有限公司 | Fibre-composite-hybrid components |
| CN106155334A (en) * | 2015-04-17 | 2016-11-23 | 致伸科技股份有限公司 | Keysheet module |
-
2019
- 2019-07-17 CN CN201910644557.1A patent/CN112238562A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225870A (en) * | 1997-11-26 | 1999-08-18 | 出光石油化学株式会社 | Fiber-reinforced resin molded article and method of manufacturing the same |
| US20070102110A1 (en) * | 2005-11-08 | 2007-05-10 | Fujitsu Component Limited | Casing formed from thermoplastic resin and method for fabricating the casing |
| CN200953129Y (en) * | 2006-09-20 | 2007-09-26 | 精元电脑股份有限公司 | Light-weight keyboard |
| CN101533732A (en) * | 2008-03-13 | 2009-09-16 | 梁徽湖 | Method for directly combining keyboard base plate and keyboard pedestal |
| CN101941271A (en) * | 2010-06-23 | 2011-01-12 | 深圳富泰宏精密工业有限公司 | Compound of metal and plastic and manufacturing method thereof |
| CN104039534A (en) * | 2011-12-20 | 2014-09-10 | 朴章远 | Method for manufacturing thermoplastic synthetic resin products |
| CN103895152A (en) * | 2012-12-29 | 2014-07-02 | 深圳富泰宏精密工业有限公司 | Complex and preparation method thereof |
| CN105308144A (en) * | 2013-01-29 | 2016-02-03 | 赢创德固赛有限公司 | Fibre-composite-hybrid components |
| CN106155334A (en) * | 2015-04-17 | 2016-11-23 | 致伸科技股份有限公司 | Keysheet module |
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Application publication date: 20210119 |
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