CN112230452A - Substrate sampling inspection method - Google Patents
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- CN112230452A CN112230452A CN201910637499.XA CN201910637499A CN112230452A CN 112230452 A CN112230452 A CN 112230452A CN 201910637499 A CN201910637499 A CN 201910637499A CN 112230452 A CN112230452 A CN 112230452A
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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Abstract
The invention discloses a substrate sampling inspection method, which comprises the following steps: performing sampling inspection and previous value measurement on a substrate according to preset sampling inspection parameters to obtain a first measurement result of the substrate; binding the substrate to a target process machine according to a preset sequence and executing a corresponding process; performing post-value measurement on the substrate to obtain a second measurement result; and determining the process capability of the target process machine according to the first measurement result and the second measurement result. The substrate sampling inspection method distributes the substrates subjected to the previous value measurement to the target process machines according to the preset sequence, so that the process capability of all the process machines can be monitored in real time, and the risk that some process machines are not monitored regularly due to uneven distribution is effectively avoided.
Description
Technical Field
The invention belongs to the technical field of display panels, and particularly relates to a substrate sampling inspection method.
Background
Currently, liquid crystal display devices are widely used because of their advantages such as thin body, power saving, and no radiation. The lcd generally includes a housing, an lcd panel disposed in the housing, and a Backlight module (Backlight module) disposed in the housing, wherein the lcd panel generally includes a color filter substrate, an array substrate, a liquid crystal disposed between the color filter substrate and the array substrate, and a sealant frame.
The quality of a glass substrate, which is an important component of a liquid crystal display panel, is important for the display effect of the display panel. In the manufacturing process of the substrate, in order to ensure the quality of the substrate, the process quality of the substrate needs to be checked in a sampling manner, and the method for checking the substrate in the prior art comprises the steps of firstly providing a detection device, presetting a sampling frequency on the detection device, and detecting the substrate through the detection machine when the number of the substrates passing through the detection machine reaches the preset sampling frequency; and then, distributing the qualified products detected by the detection machine to a subsequent processing machine for further detection.
However, in the large-scale production process of the substrate, in order to improve the production and the sampling inspection performance, the processing equipment usually has a plurality of chambers or processing machines, which operate simultaneously, so that the process capability of all the processing machines must be detected in real time to ensure that the produced product has no quality problem. However, in the conventional spot inspection method, the product that has been previously measured on the inspection machine in the previous step is then randomly allocated to different subsequent processing machines, and some processing machines may not be allocated to the product to be spot inspected, so that the monitoring of the processing capability of all processing machines cannot be fully satisfied.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a method for sampling a substrate. The technical problem to be solved by the invention is realized by the following technical scheme:
the invention provides a substrate sampling inspection method, which comprises the following steps:
performing sampling inspection and previous value measurement on a substrate according to preset sampling inspection parameters to obtain a first measurement result of the substrate;
binding the substrate to a target process machine according to a preset sequence, and executing a corresponding process;
performing post-value measurement on the substrate to obtain a second measurement result;
and determining the process capability of the target process machine according to the first measurement result and the second measurement result.
In one embodiment of the present invention, performing a spot check and a pre-value measurement on a substrate according to preset spot check parameters to obtain a first measurement result of the substrate includes:
providing a detector, and presetting the sampling frequency of the detector;
performing spot check and previous value measurement on the substrate to be spot checked on the detector according to the spot check frequency to obtain the first measurement result;
and sequentially placing the substrates into corresponding substrate containers after determining that the substrates are qualified according to the first measurement result.
In an embodiment of the present invention, the binding the substrate to the target process tool according to a predetermined sequence includes:
acquiring product information of the substrate and process information entering the next step;
and sequentially binding the substrates to the target processing machine in sequence by taking the substrate container as a unit according to the processing information.
In an embodiment of the invention, sequentially binding the substrates to the target process tool in the unit of the substrate container according to the process information includes:
sequentially numbering the substrate containers and the target process machines respectively;
and binding the substrate in each substrate container to a corresponding target process machine according to the sequence number.
In an embodiment of the present invention, binding each substrate container to a corresponding target process tool according to the sequence number includes:
acquiring the operating parameters of the target process machine;
judging whether the target processing machine operates normally, if so, binding, and if not, binding the substrate in the substrate container to another processing machine of the same type as the target processing machine according to the sequence label;
and recording and storing the binding information of the substrate and the processing machine.
In an embodiment of the invention, after the substrate is bound to the target process tool according to a predetermined sequence, the method further includes:
and performing intermediate measurement on the substrate subjected to the previous value measurement before conveying the substrate to the corresponding target processing machine.
In one embodiment of the present invention, a corresponding process is performed, comprising:
judging whether the substrates in the same substrate container are bound to the same target processing machine;
if yes, transferring the substrate container to the target processing machine;
if not, the substrate container is transmitted to the target processing machine platform correspondingly bound with the substrate with the largest quantity in the substrate container.
In one embodiment of the present invention, the transferring the substrate container to the target process tool bound to correspond to the largest number of substrates in the substrate container comprises:
and when target substrates with the same quantity and different bound target process machines exist in the same substrate container, transmitting the substrate container to the target process machines corresponding to the target substrates positioned at the lower layer in the substrate container.
In an embodiment of the invention, the target process machine is an etcher, the front value measurement is used for obtaining a first film thickness of the substrate before entering the etcher, and the back value measurement is used for obtaining a second film thickness of the substrate after passing through the etcher.
In an embodiment of the invention, determining the process capability of the target process tool according to the first measurement result and the second measurement result comprises:
obtaining the etching thickness of the substrate by the etching machine according to the first film thickness and the second film thickness;
and comparing the etching thickness with a set etching threshold value to determine the processing capacity of the etching machine.
Compared with the prior art, the invention has the beneficial effects that:
the substrate sampling inspection method can monitor the processing capacity of all processing machines in real time by distributing the substrates subjected to the previous value measurement to the target processing machines according to the preset sequence, thereby effectively avoiding the risk that some processing machines are not regularly monitored due to uneven distribution.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic diagram of a conventional substrate sampling method;
FIG. 2 is a flowchart illustrating a method for performing a substrate sampling inspection according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a binding process of a substrate spot inspection method according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a binding process of another substrate sampling method according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a target process tool allocation process according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating another target process tool allocation process according to an embodiment of the present invention;
fig. 7 is a detailed flowchart of a substrate sampling method according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, a substrate sampling method according to the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element.
Example one
As described above, in the conventional spot inspection method, the substrate having the previous value measurement performed on the inspection machine in the previous step is randomly allocated to different subsequent processing machines, and some processing machines may not be allocated to the substrate to be spot inspected, so that the real-time monitoring of the processing capability of all processing machines cannot be fully satisfied. Specifically, referring to fig. 1, fig. 1 is a schematic diagram of a conventional substrate sampling method. FIG. 1 illustrates A, B, C, D four substrate containers (also known as clips) each containing substrates for pre-value measurements, which are randomly assigned to a processing tool, where the conventional distribution method does not ensure that each processing tool can be assigned to a clip to be spot inspected. As shown in FIG. 1, for example, the A, B, D card is assigned to the processing tool number 1, the C card is assigned to the processing tool number 3, and the processing tool number 2 is not assigned to the card, and the etching capability of the processing tool number 2 cannot be monitored. If the No. 2 processing machine is abnormal, the abnormal condition can not be found in a short time, and a large batch of abnormal products are likely to be caused. Therefore, the conventional substrate spot inspection method cannot ensure that each process machine can be monitored, and if a problem occurs in the process machine, the product abnormality cannot be found in time, so that the product yield is reduced, and the productivity, manpower and material resources are wasted.
In order to solve the technical problem, the present embodiment provides a substrate sampling method, which can sequentially allocate the substrates subjected to the previous value measurement to the target process machines, so as to control the process capability of all the subsequent process machines, thereby effectively avoiding the risk that some process machines are not regularly monitored due to uneven allocation.
Referring to fig. 2, fig. 2 is a flowchart of a substrate sampling method according to an embodiment of the present invention. The substrate sampling inspection method comprises the following steps:
s1: performing sampling inspection and previous value measurement on a substrate according to preset sampling inspection parameters to obtain a first measurement result of the substrate;
generally, in the array process of glass substrates, the steps of cleaning, film forming, plate preparation by photolithography, etching, film stripping and the like are performed, in which the cleaned glass substrate is first sent to a sputtering machine to be coated with a transparent conductive film of an ITO indium tin oxide semiconductor, then the substrate is subjected to photolithography and etching to prepare a region pattern, and then the glass substrate is stripped and cleaned by a photoresist to complete the preparation process. In each step, the film quality of the glass substrate on the production line needs to be subjected to spot inspection so as to ensure the subsequent yield and even the finished product yield. In this embodiment, a user can set the sampling inspection parameters (sampling inspection frequency) of the glass substrate in advance in the operation interface of the manufacturing execution system, so as to facilitate unified management and centralized control.
Specifically, the S1 includes:
s11: providing a detector, and presetting the sampling frequency of the detector;
in this embodiment, the parameter of the glass substrate to be inspected is set in the manufacturing execution system of the display panel, and the parameter to be inspected is transmitted to the line control system, which can receive and store the parameter to be inspected. The sampling inspection parameters are determined according to the manufacturing links of the glass substrate and mainly comprise sampling inspection frequency. The production line control system generates a sampling inspection control signal according to the sampling inspection parameters and sends the sampling inspection control signal to the detection machine, so that the detection machine can conveniently execute sampling inspection operation according to the sampling inspection control signal, namely, the sampling inspection is carried out on the selected glass substrate.
S12: performing sampling inspection and previous value measurement on the substrate to be sampled and inspected on the inspection machine according to the sampling inspection frequency to obtain a first measurement result;
specifically, after receiving the sampling control signal, the detection machine executes sampling operation, and performs sampling operation on the glass substrate according to a corresponding sampling rate. That is, the substrate in the manufacturing process is inspected and pre-measured according to the predetermined inspection parameters to obtain the pre-measurement result, for example, the film thickness of the substrate is pre-measured to obtain the film thickness value.
S13: and sequentially placing the substrates into corresponding substrate containers after determining that the substrates are qualified according to the first measurement result.
Specifically, whether the substrate is qualified or not is judged according to the first measurement result, if not, unqualified substrates are removed, and if yes, the qualified substrates are sequentially placed in corresponding substrate containers for the next process.
In each step of panel preparation, the film quality of the glass substrate on the production line needs to be subjected to spot inspection so as to ensure the subsequent yield and even the finished product yield. Specifically, according to the result of the previous value measurement, for example, the film thickness of the substrate, it can be determined whether the substrate is qualified in the previous preparation process, if the substrate is determined to be unqualified, the unqualified product has no need for subsequent detection, otherwise, the determination of the result of the subsequent detection may be affected, so that the unqualified product is removed to ensure the accuracy of the subsequent detection process and the yield of the finished product; and if the substrate is judged to be qualified, sequentially placing the qualified products into corresponding substrate containers for the next process. In this embodiment, the substrate container is the special clip that holds the base plate, can parallel placement a plurality of base plates in every clip, and spaced apart between the adjacent base plate to prevent to collide with and wear and tear.
S2: binding the substrate to a target process machine according to a preset sequence, and executing a corresponding process;
as described above, after the pre-value measurement is completed in the previous process, the qualified substrates are placed in the clips for transportation to the target process tool of the next process. In this step, the substrate is sequentially bound to the target process tool by using the clips as a unit.
Specifically, the step of binding the substrate to the target process machine according to the preset sequence includes:
a 1: obtaining product information of the substrate subjected to the previous value measurement and process information entering the next step;
a 2: and sequentially binding the substrates to the target processing machine in sequence by taking the substrate container as a unit according to the processing information.
Further, step a2 includes:
sequentially numbering the substrate containers and the target process machines respectively; and binding the substrate in each substrate container to a corresponding target process machine according to the sequence number.
Referring to fig. 3, fig. 3 is a schematic process diagram of a substrate sampling method according to an embodiment of the present invention. As shown in fig. 3, it is assumed that a substrate having performed previous value measurement is placed in A, B, C, D four clips, each clip is loaded with a plurality of substrates, and process tools to perform the same process include a process tool No. 1, a process tool No. 2, and a process tool No. 3, at this time, the substrates are sequentially bound to the process tools by using the clip as a unit through the pipeline control system according to the sequence number, specifically, all the substrates of the a clip are bound to the process tool No. 1, all the substrates of the B clip are bound to the process tool No. 2, all the substrates of the C clip are bound to the process tool No. 3, and all the substrates of the D clip are bound to the process tool No. 1, so that each process tool has a clip input. Therefore, if one of the processing machines is abnormal, the abnormal processing machines can be found in a short time to stop using or maintain, and a large quantity of abnormal products are avoided.
Further, binding the substrate in each substrate container to a corresponding target process machine according to the sequence number includes:
acquiring the operating parameters of the target process machine;
judging whether the target processing machine normally operates, if so, binding, and if not, binding the substrate in the substrate container to another processing machine of the same type as the target processing machine according to the sequence label;
and recording and storing the binding information of the substrate and the processing machine.
Specifically, referring to fig. 4, fig. 4 is a schematic diagram of a binding process of another substrate sampling method according to an embodiment of the present invention. As shown, it is assumed that the substrates having been subjected to the previous value measurement are placed in A, B, C, D four clips, each of which is loaded with a plurality of substrates, and the processing machines to be performed include a number 1 processing machine, a number 2 processing machine and a number 3 processing machine. In the binding process, firstly, the operation parameters and records of each processing machine are respectively obtained, and if the No. 2 processing machine is found to be stopped or works abnormally, the No. 2 processing machine is excluded during binding. In actual operation, the pipeline control system completely binds the substrates of the A clamp to the No. 1 processing machine, the substrates of the B clamp bypass the No. 2 processing machine and are completely bound to the No. 3 processing machine, the substrates of the C clamp are completely bound to the No. 1 processing machine, and the substrates of the D clamp are completely bound to the No. 3 processing machine, so that the substrates are prevented from being bound and transmitted to abnormal processing machines, and each normal processing machine has clamp input.
In this embodiment, before the substrate is transferred to the corresponding target process tool, other intermediate measurements may be performed on the substrate subjected to the previous value measurement.
In an actual process, after performing the previous value measurement and the target process machine is bound to the substrate, the substrate may not be immediately transmitted to the target process machine for performing the process, but may be transferred to another task of performing a selective inspection, i.e., performing some intermediate measurements, and then performing the process on the target process machine, at this time, the substrate previously bound to the same target process machine and placed in the same clamp may be placed in different clamps, in other words, the substrate in the same clamp may be bound to different process machines.
Further, the step S2 of executing the corresponding process includes:
judging whether the substrates in the same substrate container are bound to the same target processing machine; if yes, transferring the substrate container to the target processing machine; if not, the substrate container is transmitted to the target processing machine platform correspondingly bound with the substrate with the largest quantity in the substrate container.
Specifically, referring to fig. 5, fig. 5 is a schematic diagram illustrating a target process tool allocation process according to an embodiment of the present invention. As described above, before entering the target process machine, the substrate may be transferred to another spot check, so that the substrate in the same clamp may be bound to a different process machine, and therefore, before entering the process machine, it is first determined whether the substrate in the current clamp is bound to the same target process machine, and if so, the current substrate container is transferred to the bound target process machine. If the substrates in the current clip are bound to different target process machines, as shown in fig. 5, the process machines to be executed include the process machine No. 1 and the process machine No. 2, and there are 3 substrates bound to the process machine No. 1 and 2 substrates bound to the process machine No. 2 in the current clip a, the clip is transmitted to the process machine No. 1 under the control of the pipeline control system, because the number of overtime bound to the process machine No. 1 is large.
Further, the transferring the substrate container to the target process tool associated with the largest number of the substrates in the substrate container comprises:
and when target substrates with the same quantity and different bound target process machines exist in the same substrate container, transmitting the substrate container to the target process machines corresponding to the target substrates positioned at the lower layer in the substrate container.
Specifically, referring to fig. 6, fig. 6 is a schematic diagram illustrating another target process tool allocation process according to an embodiment of the present invention. Before entering a processing machine, whether the substrate in the current clamp is bound to the same target processing machine is judged, and if yes, the current substrate container is transmitted to the bound target processing machine. If the target process machines bound to the maximum number of substrates include No. 31 process machines, No. 2 process machines and No. 3 process machines, and if the target process machines bound to the maximum number of substrates are multiple, as shown in fig. 6, the process machines to be processed include No. 1 process machine, No. 2 substrate bound to No. 2 process machine and No. 3 process machine, that is, the number of substrates bound to No. 1 process machine is the same as the number of substrates bound to No. 2 process machine, and at this time, the current substrate container is transferred to the target process machine corresponding to the substrate which is bound to the lowest layer and has the largest number of process machines, that is, controlled by the pipeline control system, the card is transmitted to the process tool No. 2 because the two substrates bound to the process tool No. 2 are located at the lower layer. Typically, the processing tools are configured to extract the substrate from the bottom up while extracting the substrate from the clip, and thus the clip is transferred to the processing tool No. 2 where the lower level substrate is bound.
S4: measuring the post value of the substrate passing through the target process machine to obtain a second measurement result;
in this embodiment, the target processing machine is an etcher for performing surface etching of a glass substrate in an array process of the glass substrate. The former value measurement is used for obtaining the first film thickness of the substrate before entering the etching machine, and the latter value measurement is used for obtaining the second film thickness of the substrate after passing through the etching machine.
S5: and analyzing the process capability of the target process machine according to the first measurement result and the second measurement result.
Specifically, the etching thickness of the substrate by the etching machine is obtained according to the first film layer thickness and the second film layer thickness; and comparing the etching thickness with a set etching threshold value, and analyzing the processing capacity of the etching machine.
In practice, the thickness of the substrate etched in the etcher can be obtained by subtracting the thickness of the second film from the thickness of the first film, and then the process capability of the current etcher can be analyzed according to experience or a previously set threshold range, so as to perform shutdown maintenance on the abnormal process machine. The substrate method of the embodiment can sequentially bind the clips to all the processing machines, so that the processing capacity of each processing machine can be detected by the method, and the risk that some processing machines are not regularly monitored due to uneven distribution is effectively avoided.
Next, referring to fig. 7, fig. 7 is a detailed flowchart of a substrate sampling method according to an embodiment of the invention. In the specific process of the substrate, firstly, the substrate is subjected to sampling inspection according to a preset sampling inspection frequency, and the pre-value measurement is carried out on the sampled substrate; and then, sequentially binding the substrates subjected to the previous value measurement to a target process machine table by taking a substrate container, namely a clamp as a unit, judging whether the target process machine table is abnormal or not in the binding process, if so, sequentially binding the substrates in the same clamp to another process machine table of the same type as the target process machine table, and if not, directly binding in sequence. Then, the substrate is transported to the target process machine by taking the clamp as a unit for processing, at this time, whether the substrates in the clamp are all bound to the same process machine is judged, if yes, directly transmitting to the bound processing machine, if not, judging whether the different substrate numbers of the target machine are the same, if not, if the substrates bound with the same target processing machine are the most, the clamp is transmitted to the target processing machine bound with the substrate with the most in the clamp, that is, two groups of substrates with the largest number of bound target process machines are respectively present, the clips are transmitted to the target process machines which are bound with the largest number of substrates in the same process machine and are corresponding to the substrates on the lower layer, and then, the process is performed on the target process machine, and then the post-value measurement is performed, so that the process capability of the target process machine can be analyzed according to the results of the pre-value measurement and the post-value measurement.
The substrate spot inspection method of the embodiment allocates the substrate subjected to the previous value measurement to the target process machine in a sequential binding manner, so that the process capability of all subsequent process machines can be monitored in real time, and the risk that some process machines are not monitored regularly due to uneven allocation is effectively avoided.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A substrate sampling method is characterized by comprising the following steps:
performing sampling inspection and previous value measurement on a substrate according to preset sampling inspection parameters to obtain a first measurement result of the substrate;
binding the substrate to a target process machine according to a preset sequence, and executing a corresponding process;
performing post-value measurement on the substrate to obtain a second measurement result;
and determining the process capability of the target process machine according to the first measurement result and the second measurement result.
2. The method of claim 1, wherein the performing a spot check and a pre-value measurement on the substrate according to a predetermined spot check parameter to obtain a first measurement result of the substrate comprises:
providing a detector, and presetting the sampling frequency of the detector;
performing spot check and previous value measurement on the substrate to be spot checked on the detector according to the spot check frequency to obtain the first measurement result;
and sequentially placing the substrates into corresponding substrate containers after determining that the substrates are qualified according to the first measurement result.
3. The method of claim 2, wherein the step of binding the substrate to the target process tool in a predetermined order comprises:
acquiring product information of the substrate and process information entering the next step;
and sequentially binding the substrates to the target processing machine in sequence by taking the substrate container as a unit according to the processing information.
4. The method of claim 2, wherein sequentially binding the substrates to the target processing tools in sequence in units of the substrate container according to the processing information comprises:
sequentially numbering the substrate containers and the target process machines respectively;
and binding the substrate in each substrate container to a corresponding target process machine according to the sequence number.
5. The method of claim 4, wherein binding each of the substrate containers to a corresponding target process tool according to the sequence number comprises:
acquiring the operating parameters of the target process machine;
judging whether the target processing machine operates normally, if so, binding, and if not, binding the substrate in the substrate container to another processing machine of the same type as the target processing machine according to the sequence label;
and recording and storing the binding information of the substrate and the processing machine.
6. The method of claim 1, further comprising, after the substrate is bound to the target process tool in a predetermined order:
and performing intermediate measurement on the substrate subjected to the previous value measurement before conveying the substrate to the corresponding target processing machine.
7. The method of claim 2, wherein performing the corresponding process comprises:
judging whether the substrates in the same substrate container are bound to the same target processing machine;
if yes, transferring the substrate container to the target processing machine;
if not, the substrate container is transmitted to the target processing machine platform correspondingly bound with the substrate with the largest quantity in the substrate container.
8. The method of claim 7, wherein transferring the substrate container to the target process tool associated with the largest number of substrates in the substrate container comprises:
and when target substrates with the same quantity and different bound target process machines exist in the same substrate container, transmitting the substrate container to the target process machines corresponding to the target substrates positioned at the lower layer in the substrate container.
9. The method of claim 1, wherein the target process tool is an etcher, the pre-value measurement is used to obtain a first film thickness of the substrate before entering the etcher, and the post-value measurement is used to obtain a second film thickness of the substrate after passing through the etcher.
10. The method of claim 9, wherein determining a process capability of the target process tool based on the first measurement and the second measurement comprises:
obtaining the etching thickness of the substrate by the etching machine according to the first film thickness and the second film thickness;
and comparing the etching thickness with a set etching threshold value to determine the processing capacity of the etching machine.
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| CN107258011A (en) * | 2014-10-31 | 2017-10-17 | 维克精密表面处理有限责任公司 | The system and method for performing wet etching process |
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| WO2018006841A1 (en) * | 2016-07-06 | 2018-01-11 | 北京金山安全软件有限公司 | Qr code information transmission method, device and apparatus |
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