CN112215046A - Optical fingerprint identification module and forming method thereof - Google Patents
Optical fingerprint identification module and forming method thereof Download PDFInfo
- Publication number
- CN112215046A CN112215046A CN201910630496.3A CN201910630496A CN112215046A CN 112215046 A CN112215046 A CN 112215046A CN 201910630496 A CN201910630496 A CN 201910630496A CN 112215046 A CN112215046 A CN 112215046A
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- image sensor
- circuit board
- printed circuit
- sensor chip
- optical fingerprint
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- 230000003287 optical effect Effects 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 78
- 239000003292 glue Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 238000004026 adhesive bonding Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000002313 adhesive film Substances 0.000 claims description 8
- 239000006260 foam Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
Abstract
The invention provides an optical fingerprint identification module and a forming method thereof, wherein the optical fingerprint identification module comprises: the image sensor chip is suspended in the hollow area of the printed circuit board and is only electrically connected to the printed circuit board through a metal wire. The optical fingerprint identification module is lower than the existing module in overall thickness, can be applied to a portable electronic device, ensures the imaging effect, reduces the height of the module, and realizes high integration and high density of electronic devices.
Description
Technical Field
The invention relates to the field of image processing, in particular to an optical fingerprint identification module and a forming method thereof.
Background
The current fingerprint identification schemes include optical technology, silicon technology (capacitive/radio frequency type), ultrasonic technology, etc.
The optical technology uses an optical image capturing device based on the principle of total reflection of light (FTIR). The light strikes the glass surface with the fingerprint pressed thereon, the reflected light is obtained by the image sensor, and the amount of reflected light depends on the depth of the ridges and valleys of the fingerprint pressed on the glass surface, and the oil and moisture between the skin and the glass. The light is reflected to the image sensor by the interface between the glass and the air after the light is emitted to the center of the valley through the glass, and the light emitted to the ridge is not reflected by the total reflection but is absorbed by the contact surface between the ridge and the glass or reflected to the periphery in a diffused manner, so that the image of the fingerprint is formed on the image sensor.
However, the thickness of the current optical fingerprint identification module is large, and when the module is applied to portable electronic equipment such as a mobile phone, the problems of large occupied space, occupation of space of other components such as a battery and high reliability risk of the module are solved.
Referring to fig. 1, fig. 1 is a prior art optical fingerprint module, including: the image sensor chip 200, the printed circuit board 100, and the support plate 110 are further provided on one side of the printed circuit board 100. The image sensor chip is adhered to the supporting plate 110 by a glue, the metal wires are electrically connected to the pads of the printed circuit board 100 from the pads of the chip 200, and the supporting plate is generally made of a steel sheet. The one side that image sensor chip is connected with the metal suspension wire highly is higher than printed circuit board 100 and has the one side of metal suspension wire among the prior art, leads to the whole high too high of optics fingerprint module, is unfavorable for the trend of current portable electronic device miniaturization, high integration, and in addition, chip 200 directly bonds on backup pad 110, falls in the in-service use process, vibration etc. easily leads to the chip damage, has higher reliability risk.
Disclosure of Invention
The invention aims to provide an optical fingerprint identification module and a forming method thereof
Satisfy the requirement of more meticulous optical fingerprint identification module, when guaranteeing the imaging effect, reduce the module height, realize electron device's high integration, high densification.
In view of the above, the present invention provides a method for forming an optical fingerprint recognition module,
the optical fingerprint identification module includes: the image sensor chip is suspended in the hollow area of the printed circuit board and is electrically connected to the printed circuit board only through a metal wire.
Preferably, the first end of the metal wire is connected to a pad of the image sensor chip, and the second end of the metal wire is connected to a pad of the printed circuit board, and provides a supporting force for the image sensor chip through the metal wire.
Preferably, the metal wire has a bent structure from the first end to the second end, so as to absorb external force applied to the image sensor chip.
Preferably, the curved structure is a longitudinal or transverse S-like structure.
Preferably, the second end of the metal wire is reinforced and connected to the pad of the printed circuit board by welding or sealing.
Preferably, the first end of the metal wire is reinforced and connected to the pad of the chip by adopting a glue sealing mode.
Preferably, the metal wire is located on at least two sides of the image sensor chip.
Preferably, the surface of the image sensor chip to which the metal wire is connected is lower than the surface of the printed circuit board.
Preferably, a support plate is provided, said support plate being located on a side of the printed circuit board remote from the connecting metal leads.
Preferably, an auxiliary substrate is provided;
temporarily gluing the printed circuit board, the image sensor chip and the auxiliary substrate;
the image sensor chip is electrically connected with the printed circuit board through a metal wire;
and removing the auxiliary substrate by glue release, and suspending the image sensor chip in the printed circuit board.
Preferably, the image sensor chip and the auxiliary substrate are temporarily glued to form a glue body;
attaching the printed circuit board and the glue body to an adhesive film;
the image sensor chip is electrically connected with the printed circuit board through a metal wire;
and removing the temporary gluing, separating the image sensor chip from the auxiliary substrate and separating the printed circuit board from the adhesive film to form the optical fingerprint identification module, and suspending the image sensor chip on the printed circuit board.
Preferably, the temporary gluing mode is as follows: photosensitive glue and thermosensitive glue are adopted.
Preferably, the optical fingerprint identification module is assembled in portable electronic device, the image sensor chip of optical fingerprint identification module is unsettled, and the chip keeps having air gap with last structural plane or/and lower structural plane, avoids the chip damage that external impact leads to, portable electronic device's center is arranged in to the backup pad, printed circuit board's upper portion is provided with the bubble cotton.
Another aspect of the present invention provides an optical fingerprint identification module, which includes: an image sensor chip, a printed circuit board; the image sensor chip is suspended in the hollow area of the printed circuit board and is electrically connected to the printed circuit board only through a metal wire.
Preferably, the first end of the metal wire is connected to a pad of the image sensor chip, and the second end of the metal wire is connected to a pad of the printed circuit board, and provides a supporting force for the image sensor chip through the metal wire.
Preferably, the metal wire is located on at least two sides of the image sensor chip.
Preferably, the surface of the image sensor chip to which the metal wire is connected is lower than the surface of the printed circuit board.
Preferably, the optical fingerprint identification module is assembled in portable electronic device, the image sensor chip of optical fingerprint identification module is unsettled, and the chip keeps having air gap with last structural plane or/and lower structural plane, avoids the chip damage that external impact leads to, and on portable electronic device's center was arranged in to the backup pad, printed circuit board's upper portion was provided with the bubble cotton.
The optical fingerprint identification module and the forming method thereof are characterized in that a chip is suspended in a hollow position of a printed circuit board, is supported by metal wires around the chip and is assembled in a portable electronic device, gaps are reserved on the upper surface and the lower surface of the chip, experiments prove that the metal wires adopt proper diameters, lengths and shapes and are sufficient for supporting the chip with the self weight less than 0.1 g, and the two ends of the metal wires are reinforced in a welding or sealing glue mode, so that the impact force with the acceleration more than 5g can be absorbed, the chip is prevented from being directly damaged by external force impact, and the reliability risk of the module is reduced. Moreover, the overall thickness of the module is lower than that of the existing module, so that the module can be applied to a portable electronic device, the fingerprint identification effect is ensured, meanwhile, a larger space is reserved for other components such as a battery, and the high integration and high density of electronic devices are realized.
Drawings
Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of an optical fingerprint recognition module according to the prior art;
FIGS. 2-6 are schematic process diagrams illustrating a method for forming an optical fingerprint recognition module according to a first embodiment of the present invention;
FIGS. 7-12 are schematic process diagrams illustrating a second embodiment of a method for forming an optical fingerprint identification module according to the present invention;
FIG. 13 is a diagram illustrating an optical fingerprint recognition module according to an embodiment of the present invention.
FIG. 14 is a diagram illustrating an optical fingerprint recognition module according to another embodiment of the present invention;
FIG. 15 is a top view of the optical fingerprint recognition module of the present invention.
In the drawings, like or similar reference numbers indicate like or similar devices (modules) or steps throughout the different views.
Detailed Description
To solve the above problems in the prior art, the present invention provides an optical fingerprint identification module and a method for forming the same.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments according to the invention. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
The invention is further illustrated below with reference to specific examples.
Referring to fig. 2 to 6, fig. 2 to 6 are schematic process diagrams of a method for forming an optical fingerprint identification module according to a first embodiment of the present invention.
Referring to fig. 2, an image sensor chip 200 and an auxiliary substrate 600 are provided, and the image sensor chip 200 and the auxiliary substrate 600 are temporarily glued to form a glue body; referring to fig. 3 and 4, a printed circuit board 100 and an adhesive film 700 are provided, and the printed circuit board 100 and a glue body may be attached to the adhesive film 700; in this embodiment, the printed circuit board 100 is first attached to the adhesive film 700, and then the adhesive body is attached.
In fig. 5, the image sensor chip 200 is electrically connected to the printed circuit board 100 through a metal wire 300; the first end 310 of the metal wire is connected to the pad of the image sensor chip, and the second end 320 of the metal wire is connected to the pad of the printed circuit board and provides a supporting force for the image sensor chip through the metal wire; the metal wire 300 has a bending structure from the first end to the second end, so as to absorb an external acting force on the image sensor chip, the bending structure is a longitudinal or transverse S-shaped structure, the second end 320 of the metal wire is fixedly connected to the pad of the printed circuit board by welding or adhesive sealing, and the first end 310 of the metal wire is fixedly connected to the pad of the chip by adhesive sealing.
With reference to fig. 6, the temporary adhesion is removed, the image sensor chip 200 is separated from the auxiliary substrate 600, the printed circuit board 100 is separated from the adhesive film 700, and the optical fingerprint recognition module is formed, wherein the image sensor chip 200 is suspended on the printed circuit board 100. The temporary gluing mode is as follows: photosensitive glue and thermosensitive glue are adopted. The surface of the image sensor chip connected with the metal wire is lower than the surface of the printed circuit board; the image sensor chip 200 is electrically connected to the printed circuit board 100 through a metal wire 300; the first end 310 of the metal wire is connected to the pad of the image sensor chip, and the second end 320 of the metal wire is connected to the pad of the printed circuit board and provides a supporting force for the image sensor chip through the metal wire; the metal wire 300 has a bending structure from the first end to the second end, so as to absorb an external acting force on the image sensor chip, the bending structure is a longitudinal or transverse S-shaped structure, the second end 320 of the metal wire is fixedly connected to the pad of the printed circuit board by welding or adhesive sealing, and the first end 310 of the metal wire is fixedly connected to the pad of the chip by adhesive sealing. In another embodiment, the printed circuit board 100 includes a support plate 110 on a side thereof remote from the metal wires.
Referring to fig. 7-12, fig. 7-12 are schematic process diagrams of a method for forming an optical fingerprint identification module according to a second embodiment of the present invention.
Fig. 7, 8, and 9 show the image sensor chip 200, the printed circuit board 100, and the auxiliary substrate 600.
Fig. 10 temporarily glues the printed circuit board 100, the image sensor chip 200, and the auxiliary substrate 600.
In fig. 11, the image sensor chip 200 is electrically connected to the printed circuit board 100 through a metal wire 300; the first end 310 of the metal wire is connected to the pad of the image sensor chip, and the second end 320 of the metal wire is connected to the pad of the printed circuit board and provides a supporting force for the image sensor chip through the metal wire; the metal wire 300 has a bending structure from the first end to the second end, so as to absorb an external acting force on the image sensor chip, the bending structure is a longitudinal or transverse S-shaped structure, the second end 320 of the metal wire is fixedly connected to the pad of the printed circuit board by welding or adhesive sealing, and the first end 310 of the metal wire is fixedly connected to the pad of the chip by adhesive sealing.
Referring to fig. 12, the temporary gluing is removed, the image sensor chip 200, the printed circuit board 100 and the auxiliary substrate 600 are separated to form an optical fingerprint recognition module, and the image sensor chip 200 is suspended in the printed circuit board 100. The temporary gluing mode is as follows: photosensitive glue and thermosensitive glue are adopted. The surface of the image sensor chip connected with the metal wire is lower than the surface of the printed circuit board; the image sensor chip 200 is electrically connected to the printed circuit board 100 through a metal wire 300; the first end 310 of the metal wire is connected to the pad of the image sensor chip, and the second end 320 of the metal wire is connected to the pad of the printed circuit board and provides a supporting force for the image sensor chip through the metal wire; the metal wire 300 has a bending structure from the first end to the second end, so as to absorb an external acting force on the image sensor chip, the bending structure is a longitudinal or transverse S-shaped structure, the second end 320 of the metal wire is fixedly connected to the pad of the printed circuit board by welding or adhesive sealing, and the first end 310 of the metal wire is fixedly connected to the pad of the chip by adhesive sealing. In another embodiment, the printed circuit board 100 includes a support plate 110 on a side thereof away from the metal wires for reinforcing the support.
Referring to fig. 13, fig. 13 is a schematic view of an optical fingerprint identification module according to an embodiment of the present invention, in which an image sensor chip 200 of the optical fingerprint identification module is suspended in a hollow area of a printed circuit board 100 and is electrically connected to the printed circuit board only through a metal wire 300, and an infrared optical cut-off filter is formed on a surface of the image sensor chip 200.
Referring to fig. 14, fig. 14 is a schematic view of an optical fingerprint identification module according to another embodiment of the present invention, the optical fingerprint identification module is mounted in a portable electronic device, an image sensor chip 200 of the optical fingerprint identification module is suspended, an air gap is maintained between the chip 200 and an upper structural surface or/and a lower structural surface, so as to prevent the chip from being damaged due to external impact, the printed circuit board 100 is directly or indirectly disposed on a middle frame 400 of the portable electronic device through a supporting plate 110, and a foam 500 is disposed on an upper portion of the printed circuit board.
FIG. 15 is a top view of the optical fingerprint recognition module of the present invention. The metal wires 300 are positioned at least at both sides of the image sensor chip 200.
The optical fingerprint identification module and the forming method thereof are characterized in that a chip is suspended in a hollow position of a printed circuit board, is supported by metal wires around the chip and is assembled in a portable electronic device, gaps are reserved on the upper surface and the lower surface of the chip, experiments prove that the metal wires adopt proper diameters, lengths and shapes and are sufficient for supporting the chip with the self weight less than 0.1 g, and the two ends of the metal wires are reinforced in a welding or sealing glue mode, so that the impact force with the acceleration more than 5g can be absorbed, the chip is prevented from being directly damaged by external force impact, and the reliability risk of the module is reduced. Moreover, the overall thickness of the module is lower than that of the existing module, so that the module can be applied to a portable electronic device, the fingerprint identification effect is ensured, meanwhile, a larger space is reserved for other components such as a battery, and the high integration and high density of electronic devices are realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. Furthermore, it will be obvious that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Several elements recited in the apparatus claims may also be implemented by one element. The terms first, second, etc. are used to denote names, but not any particular order.
Claims (18)
1. A method for forming an optical fingerprint recognition module is characterized in that,
the optical fingerprint identification module includes: an image sensor chip, a printed circuit board;
the image sensor chip is suspended in the hollow area of the printed circuit board and is electrically connected to the printed circuit board only through a metal wire.
2. The method as claimed in claim 1, wherein the metal wire has a first end connected to a pad of the image sensor chip and a second end connected to a pad of the printed circuit board, and the metal wire provides a supporting force for the image sensor chip.
3. The method as claimed in claim 2, wherein the metal wire has a bent structure from the first end to the second end, so as to absorb an external force applied to the image sensor chip.
4. The method as claimed in claim 3, wherein the curved structure is a longitudinal or transverse S-shaped structure.
5. The method as claimed in claim 2, wherein the second end of the metal wire is soldered or sealed to a pad of the printed circuit board.
6. The method as claimed in claim 2, wherein the first end of the metal wire is bonded to the pad of the chip by an adhesive.
7. The method as claimed in claim 1, wherein the metal wires are disposed on at least two sides of the image sensor chip.
8. The method as claimed in claim 1, wherein the surface of the image sensor chip connected with the metal wires is lower than the surface of the printed circuit board.
9. The method as claimed in claim 1, wherein a support plate is provided, the support plate is located on a surface of the printed circuit board away from the metal wires.
10. The method of claim 1, wherein the optical fingerprint sensor module is formed by a process,
providing an auxiliary substrate;
temporarily gluing the printed circuit board, the image sensor chip and the auxiliary substrate;
the image sensor chip is electrically connected with the printed circuit board through a metal wire;
and removing the auxiliary substrate by glue release, and suspending the image sensor chip in the printed circuit board.
11. The method of claim 1, wherein the optical fingerprint sensor module is formed by a process,
forming a gluing body by temporarily gluing the image sensor chip and the auxiliary substrate;
attaching the printed circuit board and the glue body to an adhesive film;
the image sensor chip is electrically connected with the printed circuit board through a metal wire;
and removing the temporary gluing, separating the image sensor chip from the auxiliary substrate and separating the printed circuit board from the adhesive film to form the optical fingerprint identification module, and suspending the image sensor chip on the printed circuit board.
12. The method for forming an optical fingerprint identification module according to claim 10 or 11, wherein the temporary gluing manner is: photosensitive glue and thermosensitive glue are adopted.
13. The method as claimed in claim 9, wherein the optical fingerprint recognition module is mounted in a portable electronic device, the image sensor chip of the optical fingerprint recognition module is suspended, an air gap is maintained between the chip and the upper structural surface or/and the lower structural surface, damage to the chip caused by external impact is avoided, the supporting plate is disposed on a middle frame of the portable electronic device, and foam is disposed on an upper portion of the printed circuit board.
14. An optical fingerprint recognition module is characterized in that,
the optical fingerprint identification module includes: an image sensor chip, a printed circuit board;
the image sensor chip is suspended in the hollow area of the printed circuit board and is electrically connected to the printed circuit board only through a metal wire.
15. The optical fingerprint recognition module of claim 14 wherein the metal wires have first ends connected to pads of the image sensor chip and second ends connected to pads of the printed circuit board and provide a supporting force for the image sensor chip via the metal wires.
16. The optical fingerprint recognition module of claim 14 wherein the metal wires are located on at least two sides of the image sensor chip.
17. The optical fingerprint recognition module of claim 14 wherein the surface of the image sensor chip to which the metal wires are attached is lower than the surface of the printed circuit board.
18. The optical fingerprint identification module of claim 14, wherein the optical fingerprint identification module is mounted in a portable electronic device, the image sensor chip of the optical fingerprint identification module is suspended, an air gap is maintained between the chip and the upper structural surface or/and the lower structural surface, damage to the chip caused by external impact is avoided, the supporting plate is disposed on a middle frame of the portable electronic device, and foam is disposed on an upper portion of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910630496.3A CN112215046A (en) | 2019-07-12 | 2019-07-12 | Optical fingerprint identification module and forming method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910630496.3A CN112215046A (en) | 2019-07-12 | 2019-07-12 | Optical fingerprint identification module and forming method thereof |
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| CN112215046A true CN112215046A (en) | 2021-01-12 |
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| CN201910630496.3A Pending CN112215046A (en) | 2019-07-12 | 2019-07-12 | Optical fingerprint identification module and forming method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0401017A2 (en) * | 1989-05-31 | 1990-12-05 | Texas Instruments Incorporated | Method of producing a post molded cavity package with internal dam bar for integrated circuit |
| JP2003318208A (en) * | 2003-05-23 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Fabrication method for resin molded semiconductor device |
| CN109348105A (en) * | 2018-10-30 | 2019-02-15 | 维沃移动通信（杭州）有限公司 | Camera module and mobile terminal |
| CN109473532A (en) * | 2018-11-20 | 2019-03-15 | 合肥京东方光电科技有限公司 | A kind of production method of Micro LED display base plate |
| CN210666807U (en) * | 2019-07-12 | 2020-06-02 | 格科微电子（上海）有限公司 | Optical fingerprint identification module |
-
2019
- 2019-07-12 CN CN201910630496.3A patent/CN112215046A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0401017A2 (en) * | 1989-05-31 | 1990-12-05 | Texas Instruments Incorporated | Method of producing a post molded cavity package with internal dam bar for integrated circuit |
| JP2003318208A (en) * | 2003-05-23 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Fabrication method for resin molded semiconductor device |
| CN109348105A (en) * | 2018-10-30 | 2019-02-15 | 维沃移动通信（杭州）有限公司 | Camera module and mobile terminal |
| CN109473532A (en) * | 2018-11-20 | 2019-03-15 | 合肥京东方光电科技有限公司 | A kind of production method of Micro LED display base plate |
| CN210666807U (en) * | 2019-07-12 | 2020-06-02 | 格科微电子（上海）有限公司 | Optical fingerprint identification module |
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