CN112213565B - Electromagnetic field passive probe and detection system - Google Patents
Electromagnetic field passive probe and detection system Download PDFInfo
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- CN112213565B CN112213565B CN202010817266.0A CN202010817266A CN112213565B CN 112213565 B CN112213565 B CN 112213565B CN 202010817266 A CN202010817266 A CN 202010817266A CN 112213565 B CN112213565 B CN 112213565B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0807—Measuring electromagnetic field characteristics characterised by the application
- G01R29/0814—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
Abstract
The invention relates to the technical field of electromagnetic detection, and discloses an electromagnetic field passive probe and a detection system. And obtaining a first radio frequency signal by utilizing the first detection loop measurement, and obtaining a second radio frequency signal by utilizing the second detection loop measurement. Since the first detection loop and the second detection loop are located at different positions on the electromagnetic field passive probe, the first radio frequency signal and the second radio frequency signal measured by the first detection loop and the second detection loop are signals at different positions in a magnetic field respectively. And transmitting the first radio frequency signal and the second radio frequency signal in a preset characteristic impedance form through the signal transmission part. The external analysis equipment receives the first radio frequency signal and the second radio frequency signal, and can analyze the first radio frequency signal and the second radio frequency signal obtained by measurement at different magnetic field positions, and calculate and obtain more accurate magnetic field parameters.
Description
Technical Field
The invention relates to the technical field of electromagnetic detection, in particular to an electromagnetic field passive probe and a detection system.
Background
With the development of technology, the electronic device has a more compact, high frequency and high density structure, which can reduce the occupied space of the electronic device, but also cause EMC (Electro Magnetic Compatibility) problem, resulting in low electromagnetic reliability of the electronic device. Interference image reconstruction based on near field scanning is the most effective method today to deal with EMC design issues, while the key tool for near field scanning is the probe.
For high bandwidth design problems, any impedance mismatch problem may cause the probe to have reduced detection capability, and good transmission and interface design is the key to solving such problems. However, the existing broadband near-field composite probe has low bandwidth, poor sensitivity and low electromagnetic field isolation.
Disclosure of Invention
Therefore, it is necessary to provide an electromagnetic field passive probe and a detection system for solving the problems of low bandwidth, poor sensitivity and low electromagnetic field isolation of the existing broadband near-field composite probe.
An electromagnetic field passive probe comprises an LTCC substrate, wherein the LTCC substrate comprises a first ground layer, a first signal layer, a second ground layer, a second signal layer and a third ground layer which are sequentially superposed; the LTCC substrate comprises a signal detection part and a signal transmission part; the signal detection part comprises a first detection loop and a second detection loop which are arranged on corresponding wiring layers for wiring, and the first detection loop and the second detection loop are respectively used for detecting the magnetic field of the circuit board to be detected to obtain a first radio frequency signal and a second radio frequency signal; the first detection loop comprises a first coil, a first ground layer signal via hole, a first signal layer and a second ground layer signal via hole which are sequentially and electrically connected, and the second detection loop comprises a second coil, a second ground layer signal via hole, a second signal layer and a third ground layer signal via hole which are sequentially and electrically connected; the first ground layer signal via hole is distributed on the first ground layer, the second ground layer signal via hole is distributed on the second ground layer, the third ground layer signal via hole is distributed on the third ground layer, and the first ground layer signal via hole, the second ground layer signal via hole and the third ground layer signal via hole are corresponding in position and are electrically connected through respective metal hole walls in sequence; the first coil is arranged between the first ground layer and the second ground layer, one end of the first coil is electrically connected with the metal hole wall of the first ground layer signal via hole, and the other end of the first coil is electrically connected with the first signal layer; the second coil is arranged between the second ground layer and the third ground layer, one end of the second coil is electrically connected with the metal hole wall of the signal via hole of the second ground layer, and the other end of the second coil is electrically connected with the second signal layer; the signal transmission part is used for transmitting the first radio frequency signal and the second radio frequency signal in a preset ohm impedance mode.
The electromagnetic field passive probe obtains a first radio frequency signal by utilizing the first detection loop and obtains a second radio frequency signal by utilizing the second detection loop. Since the first detection loop and the second detection loop are located at different positions on the electromagnetic field passive probe, the first radio frequency signal and the second radio frequency signal measured by the first detection loop and the second detection loop are signals at different positions in a magnetic field, respectively. And transmitting the first radio frequency signal and the second radio frequency signal in a preset characteristic impedance form through the signal transmission part. The external analysis equipment receives the first radio frequency signal and the second radio frequency signal, and can analyze the first radio frequency signal and the second radio frequency signal obtained by measurement at different magnetic field positions, and calculate and obtain more accurate magnetic field parameters.
In one embodiment, the electromagnetic field passive probe further comprises a first SMA connector and a second SMA connector, the signal detection part is electrically connected with one end of the first SMA connector and one end of the second SMA connector through the signal transmission part, and the other end of the first SMA connector and the other end of the second SMA connector are used for connecting an external analysis device; the first SMA connector and the second SMA connector are respectively used for transmitting the first radio frequency signal and the second radio frequency signal to the external analysis equipment for analysis to obtain magnetic field parameters.
In one embodiment, the first ground layer is further provided with a first SMA conversion through hole and a second SMA conversion through hole, and the third ground layer is also provided with a first SMA conversion through hole and a second SMA conversion through hole; the first SMA conversion through holes on the first ground layer and the third ground layer correspond to each other in position and are electrically connected through metal hole walls; and the positions of the second SMA conversion through holes on the first ground layer and the third ground layer correspond to each other and are electrically connected through metal hole walls.
In one embodiment, the signal transmission section includes a first transmission structure and a second transmission structure; the first transmission structure comprises a first strip line formed by a first ground layer and a first signal layer which are sequentially and electrically connected, and the second transmission structure comprises a second strip line formed by a second signal layer and a third ground layer which are sequentially and electrically connected; one end of the first signal layer is electrically connected with the first SMA connector through the metal hole wall of the first SMA conversion through hole, and the other end of the first signal layer is electrically connected with the first coil through the metal hole wall of the second ground layer signal through hole; one end of the second signal layer is electrically connected with the second SMA connector through the metal hole wall of the second SMA conversion through hole, and the other end of the second signal layer is electrically connected with the second coil through the metal hole wall of the third ground layer signal through hole.
In one embodiment, the first SMA connector, the second SMA connector, the first ribbon wire and the second ribbon wire have the same characteristic impedance.
In one embodiment, the first ground plane and the third ground plane are respectively two irregular structures with the same size, each structure is composed of a body part and an extension part, and the extension part is a part extending from the body part; the first SMA conversion through hole and the second SMA conversion through hole are respectively arranged on the body part of the corresponding layer; the first ground layer signal via hole and the third ground layer signal via hole are respectively arranged on the extending parts of the corresponding layers; the first strip line extends from the body part of the first ground layer to the extension part of the first ground layer; the second stripline extends from the body portion of the third ground layer to an extended portion of the third ground layer.
In one embodiment, the detection bandwidth of the electromagnetic field passive probe is 100kHz-10GHz.
A detection system comprises an analysis device and the electromagnetic field passive probe of any one of the above, wherein the first SMA connector and the second SMA connector are connected with the analysis device; the first SMA connector and the second SMA connector respectively output a first radio frequency signal and a second radio frequency signal to the analysis equipment, the analysis equipment respectively carries out vector analysis on the first radio frequency signal output by the first SMA connector and the second radio frequency signal output by the second SMA connector, correspondingly obtains first electric signal data and second electric signal data, and obtains magnetic field parameters according to the first electric signal data and the second electric signal data.
In one embodiment, the detection system further comprises a mobile control platform, and the electromagnetic field passive probe is arranged on the mobile control platform.
In one embodiment, the analysis device comprises a vector network analyzer and a computer device, wherein the vector network analyzer is respectively connected with the first SMA connector, the second SMA connector and the computer device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the description of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the description below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of the connection of an electromagnetic field passive probe according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first ground layer according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a first signal layer according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second ground layer according to an embodiment of the invention;
FIG. 5 is a diagram illustrating a second signal layer according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a third ground plane according to an embodiment of the invention;
FIG. 7 is a schematic connection diagram of a detection system according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may comprise additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. In addition, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", and the like if there is a transfer of electrical signals or data between the connected objects.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.
As technology develops, electronic devices become more miniaturized, high frequency and high density, and such technological progress causes electromagnetic reliability problems of products to become more serious. Disturbance image reconstruction based on near-field measurements is today the most efficient way to deal with EMC design issues. When electronic products work, electromagnetic interference emitted by a radiation source generally has a wide spectrum range, so that a broadband near-field probe is a key of near-field scanning and is one of indispensable tools for solving the problem of electromagnetic reliability. At present, four key problems mainly exist in the design of a passive probe: the first problem is the mutual interference problem of the detection of the double-physical-quantity broadband probe; the second is the problem of spatial resolution; the third is the problem of electric field interference suppression; the fourth is the problem of how to improve the transmission efficiency. For high bandwidth design problems, any impedance mismatch will cause the probe to have reduced detection capability, and good transmission and interface design is the key to solving such problems.
The invention provides a high-bandwidth electromagnetic field passive probe, which has higher bandwidth and better sensitivity. Fig. 1 is a schematic connection diagram of an electromagnetic field passive probe according to an embodiment of the present invention, where the electromagnetic field passive probe includes an LTCC substrate 10, and the LTCC substrate 10 includes a first ground plane 11, a first signal plane 12, a second ground plane 13, a second signal plane 14, and a third ground plane 15, which are sequentially stacked. Fig. 2 to 6 are schematic structural diagrams of a first ground layer, a first signal layer, a second ground layer, a second signal layer and a third ground layer according to an embodiment of the invention. The first ground layer 11 is a solid line portion in fig. 2, and is an irregularly-shaped circuit board, and a plurality of first ground layer signal vias 212 are distributed on the circuit board. The first signal layer 12 is a solid line portion in fig. 3 and is a long conductive line. The second ground plane 13 is a solid line portion in fig. 4, and is a rectangular circuit board, and a plurality of second ground plane signal vias 213 are distributed on the circuit board. The second signal layer 14 is a solid line portion in fig. 5 and is a long conductive line. The third ground layer 15 is a solid line portion in fig. 6, and is an irregularly-shaped circuit board, and a plurality of third ground layer signal vias 215 are distributed on the circuit board. The LTCC substrate 10 includes a signal transmitting part 100 and a signal detecting part 200. The signal detection part 200 includes a first detection loop 210 and a second detection loop 220 disposed on the corresponding wiring layers, and the first detection loop 210 and the second detection loop 220 are respectively used for detecting the magnetic field of the circuit board to be detected to obtain a first radio frequency signal and a second radio frequency signal. The signal transmission unit 100 is configured to transmit the first rf signal and the second rf signal in a form of a predetermined characteristic impedance.
The first detection loop 210 includes a first coil 211, a first ground plane signal via 212, a first signal layer 12 and a second ground plane signal via 213, which are electrically connected in sequence, and the second detection loop includes a second coil 214, a second ground plane signal via 213, a second signal layer 14 and a third ground plane signal via 215, which are electrically connected in sequence. The first ground plane signal via hole 212 is disposed on the first ground plane 11, the second ground plane signal via hole 213 is disposed on the second ground plane 13, the third ground plane signal via hole 215 is disposed on the third ground plane 15, the first ground plane signal via hole 212, the second ground plane signal via hole 213 and the third ground plane signal via hole 215 are disposed at positions corresponding to each other and electrically connected through respective metal hole walls in sequence, and in fig. 1, the cylindrical through holes connected among the first ground plane signal via hole 212, the second ground plane signal via hole 213 and the third ground plane signal via hole 215 are the metal hole walls.
The first ground plane signal via 212, the second ground plane signal via 213, and the third ground plane signal via 215 are all metal through holes penetrating through the layers where the first ground plane signal via, the second ground plane signal via 213, and the third ground plane signal via 215 are located, and can be used for implementing internal interconnection. The positions of the first ground plane signal via 212, the second ground plane signal via 213 and the third ground plane signal via 215 correspond to each other, which means that the arrangement position of the first ground plane signal via 212 on the first ground plane 11 is the same as the mapping position of the second ground plane signal via 213 on the second ground plane 13, and the arrangement position of the second ground plane signal via 213 is the same as the mapping position of the third ground plane signal via 215 on the third ground plane. Specifically, the layers are insulated from each other except for electrical connections between the metallized holes.
The first coil 211 is disposed between the first ground layer 11 and the second ground layer 13 and is located outside the coverage area of the first ground layer 11 and the second ground layer 13. One end of the first coil 211 is electrically connected to the metal hole wall of the first ground plane signal via 212, and the other end is electrically connected to the first signal layer 12. The second coil 214 is disposed between the second ground layer 13 and the third ground layer 15, and is located outside the coverage area of the second ground layer 13 and the third ground layer 15. One end of the second coil 214 is electrically connected to the metal hole wall of the second ground plane signal via 213, and the other end is electrically connected to the second signal layer 14. The first coil 211 and the second coil 214 are used for detecting a magnetic field. The first detection loop 210 may form a first radio frequency signal based on changes in the magnetic flux in the first coil 211 and the second detection loop 220 may form a second radio frequency signal based on changes in the magnetic flux in the second coil 214. The first coil 211 and the second coil 214 are both disposed at the top end of the electromagnetic field passive probe and extend out of the covered area of the ground layer, so that the first coil 211 and the second coil 214 are not covered and shielded by the first ground layer 11, the second ground layer 13, and the third ground layer 15 during probing, thereby improving efficiency of probing electromagnetic fields.
The electromagnetic field passive probe measures a first radio frequency signal with the first detection loop 210 and a second radio frequency signal with the second detection loop 220. Since the first detection loop 210 and the second detection loop 220 are located at different positions on the electromagnetic field passive probe, the first radio frequency signal and the second radio frequency signal measured by the first detection loop 210 and the second detection loop 220 are magnetic field signals at different positions in a magnetic field, respectively. The first rf signal and the second rf signal are transmitted through the signal transmission unit 100 in a predetermined characteristic impedance. The external analysis equipment obtains the first radio frequency signal and the second radio frequency signal through impedance matching, and the external analysis equipment can analyze the first radio frequency signal and the second radio frequency signal obtained by measurement at different magnetic field positions, and calculate and obtain more accurate magnetic field parameters. The magnetic field parameter is a parameter characterizing the magnitude of the magnetic field, for example, the magnetic field parameter may be a magnitude, a phase, or the like. The electromagnetic field passive probe provided by the invention has higher bandwidth and better sensitivity, and can carry out high-bandwidth and high-precision electromagnetic field distribution measurement on a local magnetic field on a circuit board to be measured (including an integrated circuit on the board).
In one embodiment, the electromagnetic field passive probe further includes a first SMA connector 20 (not shown) and a second SMA connector 30 (not shown), the signal detection unit 200 electrically connects one end of the first SMA connector 20 and one end of the second SMA connector 30 through the signal transmission unit 100, and the other end of the first SMA connector 20 and the other end of the second SMA connector 30 are used for connecting an external analysis device. The first SMA connector 20 and the second SMA connector 30 are respectively configured to transmit the first radio frequency signal and the second radio frequency signal to the external analysis device for analysis to obtain a magnetic field parameter.
The electromagnetic field passive probe measures a first radio frequency signal with the first detection loop 210 and a second radio frequency signal with the second detection loop 220. Since the first detection loop 210 and the second detection loop 220 are located at different positions on the electromagnetic field passive probe, the first radio frequency signal and the second radio frequency signal are magnetic field signals at different positions in a magnetic field, respectively. The first rf signal and the second rf signal are transmitted to the first SMA connector 20 and the second SMA connector 30, respectively, through the signal transmission unit 100. The first SMA connector 20 and the second SMA connector 30 are connectors matched with the characteristic impedance of an external analysis device, and the first radio frequency signal and the second radio frequency signal are transmitted to the external analysis device through the first SMA connector 20 and the second SMA connector 30. After the external analysis equipment acquires the first radio frequency signal and the second radio frequency signal, the first radio frequency signal and the second radio frequency signal obtained by measurement at different magnetic field positions are analyzed, and more accurate magnetic field parameters are calculated and acquired.
In one embodiment, referring to fig. 2 and fig. 6, a first SMA conversion through hole 310 and a second SMA conversion through hole 320 are further disposed on the first ground layer 11, and a first SMA conversion through hole 310 and a second SMA conversion through hole 320 are also disposed on the third ground layer 15. The first SMA conversion through holes 310 on the first ground plane 11 correspond to the first SMA conversion through holes 310 on the third ground plane 15, and the two first SMA conversion through holes 310 are connected through a conductive metal hole wall. The second SMA conversion through holes 320 on the first ground plane 11 also correspond to the second SMA conversion through holes 320 on the third ground plane 15, and the two second SMA conversion through holes 320 are connected through a conductive metal hole wall.
One end of the first SMA connector 20 is connected to a metal hole wall between the two first SMA conversion through holes 310, and the other end of the first SMA connector 20 is connected to an external analysis device; one end of the second SMA connector 30 is connected to a metal hole wall between the two second SMA conversion through holes 320, and the other end of the second SMA connector 30 is connected to an external analysis device. The first SMA conversion through hole 310 may be configured to convert a signal transmission manner of the electromagnetic field passive probe into a transmission manner matched with the first SMA connector 20, and the second SMA conversion through hole 320 may be configured to convert the signal transmission manner of the electromagnetic field passive probe into a transmission manner matched with the second SMA connector 30, so as to ensure minimum transmission reflection and impedance matching, and suppress transmission resonance. Through reasonable structural design of the conversion through hole, the electromagnetic field passive probe provided by the embodiment of the invention can transmit radio-frequency signals in a 50-ohm impedance mode, and the low loss and low reflection of the signals are ensured in the transmission process. By arranging the first SMA conversion through hole 310 and the second SMA conversion through hole 320, the transmission characteristic impedance matching of the probe can be ensured, the signal attenuation and the transmission resonance can be inhibited, and the detection efficiency of an electric field can be improved.
In one embodiment, the signal transmission section 100 includes a first transmission structure 110 and a second transmission structure 120. The first transmission structure 110 includes a first strip line formed by a first ground layer 11 and a first signal layer 12 electrically connected in sequence, and the second transmission structure 120 includes a second strip line formed by a second signal layer 14 and a third ground layer 15 electrically connected in sequence. The strip line is composed of two grounding metal strips and a middle rectangular section conductor strip with width omega and thickness t. Because the upper and lower sides are provided with the grounding metal strips, the impedance is easy to control, and the shielding is better. Specifically, the conductor strip of the first strip line as the first signal layer 11 and the conductor strip of the second strip line as the second signal layer 14 are both wired on the LTCC substrate and can be used for signal transmission. The grounding metal strips of the first strip line are the first grounding layer 11 and the second grounding layer 13 of the LTCC substrate, respectively; the grounding metal strips of the second stripline are the second grounding layer 13 and the third grounding layer 15 of the LTCC substrate, respectively, and the grounding metal strips can be used for shielding interference and controlling the transmission characteristic impedance of the stripline conductor strips.
One end of the first signal layer 12 is electrically connected to the first SMA connector 20 through the metal hole wall of the first SMA conversion through hole 310, and the other end is electrically connected to the first coil 211 through the metal hole wall of the second ground layer signal through hole 213. One end of the second signal layer 14 is electrically connected to the second SMA connector 30 through the metal hole wall of the second SMA conversion through hole 320, and the other end is electrically connected to the second coil 214 through the metal hole wall of the third ground layer signal via hole 215. That is, after the first detection loop 210 forms a first rf signal according to the change of the magnetic flux in the first coil 211, the first transmission structure 110 is used to transmit the first rf signal to the first SMA transducer 20, and the first rf signal is transmitted to the external analysis device through the first SMA transducer 20. After the second detection loop 220 forms a second rf signal according to the change of the magnetic flux in the second coil 214, the second transmission structure 120 is utilized to transmit the second rf signal to the second SMA transducer 30, and the second rf signal is transmitted to the external analysis device through the second SMA transducer 30. The first transmission structure 110 and the second transmission structure 120 are used for transmitting the first radio frequency signal and the second radio frequency signal inside the electromagnetic field passive probe, so that transmission characteristic impedance matching can be ensured, and signal attenuation and transmission resonance can be inhibited.
In one embodiment, the characteristic impedances of the first SMA connector 20, the second SMA connector 30, the first stripline and the second stripline are all the same. The impedance of each wire in the electromagnetic field passive probe determines the magnitude of the rf current or rf voltage measured at the output terminal, and the spacing between layers of the LTCC substrate 10 and the size and material of the wire determine the impedance of the wire. In practical applications, factors such as the layer-to-layer spacing, the wire size and the material required for calculating a certain set characteristic impedance can be designed by means of a plurality of mature commercial software. The first SMA connector 20, the second SMA connector 30, the first strip line and the second strip line are designed to have the same characteristic impedance through reasonable design. Since the characteristic impedance of the peripheral analysis device is generally 50 ohms, the characteristic impedance is selected to be 50 ohms in the present embodiment, which facilitates impedance matching with the peripheral analysis device. In the invention, the first SMA connector 20, the second SMA connector 30, the first strip line and the second strip line are all set to have the same characteristic impedance and are transmitted to the peripheral analysis equipment in a form of 50 ohms, so that low signal loss and low signal reflection in the transmission process can be ensured.
Referring to fig. 2 and fig. 6, in one embodiment, the first ground plane 11 and the third ground plane 15 have the same size and are both irregular structures formed by a body portion and an extension portion. The extension part is a part extending from the body part, and the size of the body part is larger than that of the extension part; in fig. 2 and 6, the extension portions are left half portions each having a smaller size, and the body portions are right half portions each having a larger size. The first SMA conversion through hole 310 and the second SMA conversion through hole 320 are respectively disposed on the body portion of the corresponding layer, and the first ground layer signal via hole 212 and the third ground layer signal via hole 215 are respectively disposed on the extension portion of the corresponding layer. The first coil 211 and the second coil 214 are disposed outside the extension portion, which is away from one side of the body portion. The shapes of the first coil 211 and the second coil 215 mentioned in the embodiments of the present invention may be rectangular, polygonal, circular, etc., and may be specifically adjusted according to actual detection requirements and processing requirements. The first coil 211 and the second coil 215 may each generate a magnetic field rf signal, i.e., the first rf signal and the second rf signal, according to a change in magnetic flux. When the electromagnetic field passive probe is used for detecting, the first coil 211 and the second coil 215 which are positioned at the top end of the electromagnetic field passive probe are close to a circuit board to be detected, so that the first coil 211 and the second coil 215 respectively detect and generate the first radio frequency signal and the second radio frequency signal by inducing the change of the internal magnetic flux thereof.
The first strip line extends from the body portion of the first ground layer 11 to the extended portion of the first ground layer 11, one end of the first strip line is connected to the first coil 211 at the end of the extended portion, and the other end of the first strip line is connected to the first SMA conversion via 310 of the body portion. The second stripline extends from the body portion of the third ground plane 15 to an extended portion of the third ground plane 15, and has one end connected to the second coil 214 at the end of the extended portion and the other end connected to the second SMA conversion via 320 of the body portion. The first strip line transmits the first radio frequency signal acquired by the detection of the first detection loop 210 to the first SMA conversion through hole 310, and transmits the first radio frequency signal to an external analysis device through the first SMA converter 20 to analyze the first radio frequency signal. The second strip line transmits the second radio frequency signal acquired by the detection of the second detection loop 220 to the second SMA conversion through hole 320, and transmits the second radio frequency signal to an external analysis device through the second SMA converter 30 to analyze the second radio frequency signal.
In one embodiment, the detection bandwidth of the electromagnetic field passive probe is 100kHz-10GHz. The application frequency range of the electromagnetic field passive probe provided by the invention is determined by the overall design, including the application of materials and the design of a structure, and the frequency application range can be calibrated by a certain method. In the embodiment, the detection bandwidth of the electromagnetic field passive probe is 100kHz-10GHz, so that the high-bandwidth electromagnetic field detection on the local part of the PCB (including the integrated circuit on the PCB) to be detected is realized.
When the high-bandwidth electromagnetic field passive probe provided by the embodiment of the application is used for measuring the radio frequency electromagnetic near field, the output ends of the two SMA converters of the probe are required to be connected to the input end of the spectrum analyzer, and then the measurement of radio frequency signals is carried out. The structure of the electromagnetic field passive probe can adopt different sizes, and the external connector can also adopt different types. And obtaining the magnetic field intensity Hx (or Hy) according to the first radio frequency signal and the second radio frequency signal acquired by the electromagnetic field passive probe, and calculating and calibrating the magnetic field intensity Hx (or Hy) to obtain the magnitude of the magnetic field signal. The spatial resolution of the electromagnetic field passive probe can be calibrated by scanning the width of the known microstrip line. Specifically, a calibration system of the electromagnetic field passive probe can be built by using a network analyzer and a microstrip line. The microstrip line for calibration can be considered as an external standard that can be used to transmit a standard field. The microstrip line can generate a certain quasi-TEM (Transverse Electric and Magnetic Field) radio frequency Electric Field, and the electromagnetic Field passive probe is used for scanning the standard component in the Y direction (perpendicular to the microstrip line routing direction), so that the spatial resolution of the electromagnetic Field passive probe can be obtained. The specific scanning method comprises the following steps: and detecting at different positions by using a probe, detecting the field intensity, drawing a relation graph of the field intensity at different positions along with the positions, and further obtaining the spatial resolution. By means of the calibration system and the scanning method, detection calibration can be carried out on the measurement result of the electromagnetic field passive probe.
The present invention further provides a detection system, and fig. 7 is a connection schematic diagram of the detection system according to an embodiment of the present invention, wherein in an embodiment of the detection system, the detection system includes an analysis device and the electromagnetic field passive probe according to any of the above embodiments, and the first SMA connector 20 and the second SMA connector 30 are connected to the analysis device. The first SMA connector 20 and the second SMA connector 30 respectively output a first radio frequency signal and a second radio frequency signal to the analysis device, the analysis device respectively performs vector analysis on the first radio frequency signal output by the first SMA connector 20 and the second radio frequency signal output by the second SMA connector 30 to correspondingly obtain first electrical signal data and second electrical signal data, and obtains a magnetic field parameter according to the first electrical signal data and the second electrical signal data.
The detection system comprises the electromagnetic field passive probe, and similarly, the first detection loop 210 is used for measuring to obtain a first radio frequency signal, and the second detection loop 220 is used for measuring to obtain a second radio frequency signal. Through the signal transmission part 100, the first SMA connector 20 and the second SMA connector 30, the first radio frequency signal and the second radio frequency signal are transmitted to the analysis device, and the analysis device can analyze the first radio frequency signal and the second radio frequency signal obtained by measurement at different magnetic field positions so as to calculate and obtain more accurate magnetic field parameters. The detection system has a higher bandwidth measurement range and better sensitivity when performing electromagnetic field measurement, and can perform high-bandwidth and high-precision electromagnetic field distribution measurement on a local magnetic field on a circuit board to be measured (including an integrated circuit on the board).
In one embodiment, the detection system further comprises a mobile control platform (not shown), and the electromagnetic field passive probe is arranged on the mobile control platform. The mobile control platform is used for controlling the electromagnetic field passive probe to move so as to realize electromagnetic field detection on different position points of the circuit board to be detected, and the use is convenient.
In one embodiment, the analysis device includes a vector network analyzer (not shown) and a computer device (not shown), and the vector network analyzer is connected to the first SMA connector 20, the second SMA connector 30 and the computer device, respectively. The vector network analyzer is configured to perform vector analysis on the first radio frequency signal output by the first SMA connector 20 and the second radio frequency signal output by the second SMA connector 30, respectively, perform detection calibration on the measurement result, and obtain first electrical signal data and second electrical signal data correspondingly. And the computer equipment is used for calculating according to the first electric signal data and the second electric signal data to obtain the magnetic field parameters. The vector network analyzer and the computer equipment are comprehensively used for carrying out vector analysis on the acquired magnetic field parameters, and the processing effect is good. Specifically, the first SMA connector 20 and the second SMA connector 30 are connected to the vector network analyzer by a screw thread.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The electromagnetic field passive probe is characterized by comprising an LTCC substrate, wherein the LTCC substrate comprises a first ground layer, a first signal layer, a second ground layer, a second signal layer and a third ground layer which are sequentially superposed; the LTCC substrate comprises a signal detection part and a signal transmission part;
the signal detection part comprises a first detection loop and a second detection loop which are arranged on corresponding wiring layers for wiring, and the first detection loop and the second detection loop are respectively used for detecting the magnetic field of the circuit board to be detected to obtain a first radio frequency signal and a second radio frequency signal;
the first detection loop comprises a first coil, a first ground layer signal via hole, a first signal layer and a second ground layer signal via hole which are sequentially and electrically connected, the second detection loop comprises a second coil, a second ground layer signal via hole, a second signal layer and a third ground layer signal via hole which are sequentially and electrically connected, and the first coil and the second coil are both arranged at the top end of the electromagnetic field passive probe and extend out of the covered area of the ground layer;
the first ground layer signal via hole is distributed on the first ground layer, the second ground layer signal via hole is distributed on the second ground layer, the third ground layer signal via hole is distributed on the third ground layer, and the first ground layer signal via hole, the second ground layer signal via hole and the third ground layer signal via hole are corresponding in position and are electrically connected through respective metal hole walls in sequence;
the first coil is arranged between the first ground layer and the second ground layer, one end of the first coil is electrically connected with the metal hole wall of the first ground layer signal via hole, and the other end of the first coil is electrically connected with the first signal layer; the second coil is arranged between the second ground layer and the third ground layer, one end of the second coil is electrically connected with the metal hole wall of the signal via hole of the second ground layer, and the other end of the second coil is electrically connected with the second signal layer;
the signal transmission part is used for transmitting the first radio frequency signal and the second radio frequency signal in a preset characteristic impedance mode, and the first radio frequency signal and the second radio frequency signal are magnetic field signals at different positions in a magnetic field respectively.
2. The electromagnetic field passive probe of claim 1, further comprising a first SMA connector and a second SMA connector, wherein the signal detection part electrically connects one end of the first SMA connector and one end of the second SMA connector through the signal transmission part, and the other end of the first SMA connector and the other end of the second SMA connector are used for connecting an external analysis device; the first SMA connector and the second SMA connector are respectively used for transmitting the first radio frequency signal and the second radio frequency signal to the external analysis equipment for analysis to obtain magnetic field parameters.
3. The passive electromagnetic field probe of claim 2, wherein the first ground plane further has a first SMA conversion via and a second SMA conversion via disposed thereon, and the third ground plane also has a first SMA conversion via and a second SMA conversion via disposed thereon; the first ground layer and the first SMA conversion through holes on the second ground layer correspond in position and are electrically connected through metal hole walls; and the positions of the second SMA conversion through holes on the first ground layer and the second ground layer correspond to each other and are electrically connected through metal hole walls.
4. The electromagnetic field passive probe of claim 3, wherein the signal transmitting portion includes a first transmission structure and a second transmission structure;
the first transmission structure comprises a first strip line formed by a first ground layer and a first signal layer which are sequentially and electrically connected, and the second transmission structure comprises a second strip line formed by a second signal layer and a third ground layer which are sequentially and electrically connected; one end of the first signal layer is electrically connected with the first SMA connector through the metal hole wall of the first SMA conversion through hole, and the other end of the first signal layer is electrically connected with the first coil through the metal hole wall of the second ground layer signal through hole; one end of the second signal layer is electrically connected with the second SMA connector through the metal hole wall of the second SMA conversion through hole, and the other end of the second signal layer is electrically connected with the second coil through the metal hole wall of the third ground layer signal through hole.
5. The electromagnetic field passive probe of claim 4, wherein the characteristic impedances of the first SMA connector, the second SMA connector, the first stripline, and the second stripline are all the same.
6. The electromagnetic field passive probe of claim 5, wherein the first ground plane and the third ground plane are respectively two irregular structures of the same size, each structure being composed of a body portion and an extension portion, the extension portion being a portion extending from the body portion; the first SMA conversion through hole and the second SMA conversion through hole are respectively arranged on the body parts of the corresponding layers; the first ground layer signal via hole and the third ground layer signal via hole are respectively arranged on the extending parts of the corresponding layers; the first strip line extends from the body part of the first ground layer to the extension part of the first ground layer; the second stripline extends from the body portion of the third ground layer to an extended portion of the third ground layer.
7. The electromagnetic field passive probe of claim 1, wherein a detection bandwidth of the electromagnetic field passive probe is 100kHz-10GHz.
8. A detection system comprising an analytical apparatus and an electromagnetic field passive probe of any of claims 1 to 7, a first SMA connector and a second SMA connector connected to the analytical apparatus;
the first SMA connector and the second SMA connector respectively output a first radio frequency signal and a second radio frequency signal to the analysis equipment, the analysis equipment respectively carries out vector analysis on the first radio frequency signal output by the first SMA connector and the second radio frequency signal output by the second SMA connector, correspondingly obtains first electric signal data and second electric signal data, and obtains magnetic field parameters according to the first electric signal data and the second electric signal data.
9. The detection system of claim 8, further comprising a mobile control platform, wherein the electromagnetic field passive probe is disposed on the mobile control platform.
10. A detection system according to claim 8, wherein the analysis device comprises a vector network analyzer and a computer device, the vector network analyzer being connected to the first SMA connector, the second SMA connector, and the computer device, respectively.
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| US5132607A (en) * | 1990-05-15 | 1992-07-21 | Shah Shirsh J | Electrical field strength sensing probe |
| JP2006003114A (en) * | 2004-06-15 | 2006-01-05 | Canon Inc | Reference signal detecting method in apparatus for measuring distribution of electromagnetic-field vector |
| JP2011257383A (en) * | 2010-05-13 | 2011-12-22 | Murata Mfg Co Ltd | Electric field probe |
| US9279880B2 (en) * | 2014-07-15 | 2016-03-08 | Applied Signals Intelligence, Inc. | Electrically small, range and angle-of-arrival RF sensor and estimation system |
| CN108226656B (en) * | 2017-12-28 | 2020-04-03 | 中国电子产品可靠性与环境试验研究所 | Electromagnetic field composite passive probe |
| CN109061320B (en) * | 2018-07-27 | 2020-12-08 | 中国电子产品可靠性与环境试验研究所（工业和信息化部电子第五研究所、中国赛宝实验室） | Electromagnetic field composite probe and detection system |
| CN109596897A (en) * | 2018-11-15 | 2019-04-09 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | The compound passive probe of electromagnetic field |
| CN109655770B (en) * | 2019-01-30 | 2023-05-23 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Differential magnetic field probe |
| CN110045171B (en) * | 2019-04-02 | 2021-04-20 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Radio frequency voltage current composite probe |
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