CN112206004B - Ultrasonic probe and method of manufacturing the same - Google Patents
Ultrasonic probe and method of manufacturing the same Download PDFInfo
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- CN112206004B CN112206004B CN202011021052.9A CN202011021052A CN112206004B CN 112206004 B CN112206004 B CN 112206004B CN 202011021052 A CN202011021052 A CN 202011021052A CN 112206004 B CN112206004 B CN 112206004B
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- laminated structure
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/753—Medical equipment; Accessories therefor
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- Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
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- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
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- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a preparation method of an ultrasonic probe and the ultrasonic probe, and the preparation method of the ultrasonic probe comprises the following steps: providing a flexible piezoelectric layer, wherein a positive electrode is arranged on a first side of the flexible piezoelectric layer; cutting the positive electrode to form a plurality of grooves; attaching a flexible circuit board to a first side of the positive electrode far away from the piezoelectric layer to form a laminated structure; providing a backing comprising an arcuate surface; and providing a forming die having a forming surface that presses against the laminated structure onto the cambered surface so that the laminated structure is bent and bonded onto the cambered surface; the opening of each groove faces the flexible circuit board, and the shape of the molding surface is matched with the shape of the cambered surface.
Description
Technical Field
The present invention relates to an ultrasonic diagnostic apparatus and a method of manufacturing the same.
Background
The ultrasonic diagnostic apparatus irradiates an ultrasonic signal from a surface of a subject toward a target region of the subject, and receives an ultrasonic signal (ultrasonic echo signal) reflected from the target region, thereby atraumatically acquiring a cross-sectional image of a soft tissue of the subject or an image of a blood vessel of the subject based on ultrasonic echo signal information. Compared with other medical imaging apparatuses such as an X-ray diagnostic apparatus, an X-ray Computed Tomography (CT), a Magnetic Resonance Imaging (MRI) apparatus, and a nuclear medicine diagnostic apparatus, an ultrasonic diagnostic apparatus has advantages of compactness, low price, and capability of displaying images in real time. In addition, since there is no risk of exposing the patient to radiation such as X-rays or the like, the ultrasonic diagnostic apparatus has high safety. Because of these advantages, ultrasonic diagnostic apparatuses are widely used for diagnosing heart, abdomen, and the like.
An ultrasonic diagnostic apparatus includes a transducer for transmitting an ultrasonic signal to a subject and receiving an ultrasonic echo signal reflected back from the subject, thereby obtaining an ultrasonic image of the subject.
The transducer may include a piezoelectric layer that converts an electrical signal into an acoustic signal or converts an acoustic signal into an electrical signal according to vibration of a piezoelectric material; a matching layer for reducing a difference in acoustic impedance between the piezoelectric layer and the object, thereby enabling a main portion of ultrasonic waves generated from the piezoelectric layer to be transmitted to the object; a lens layer for focusing the ultrasonic wave transmitted forward from the piezoelectric layer to a specific region; and a substrate layer for preventing backward transmission of ultrasonic waves from the piezoelectric layer, thereby preventing image distortion.
When the prior wide-angle transducer (also called as a wide-angle ultrasonic probe) is manufactured, the method comprises the steps of forming a laminated element, cutting a piezoelectric layer in the laminated element to form an element array with a plurality of elements, and attaching the element array to an arc surface of a backing main body through a die. Because the upper parts of a plurality of primitives formed by cutting are separated from each other, when the die is pressed and molded, the upper parts of the primitives are stressed and easily collapse towards two sides, so that the primitives are not tangential to the arc surface, or the centers of the primitives are not directed to the center of the arc, and the primitive array arrangement is disordered, thereby affecting the synthesis of images, causing unclear synthesized images and even artifacts, and causing misdiagnosis of doctors.
Disclosure of Invention
The invention aims to provide a structure suitable for a wide-angle arc probe to solve the problem that primitives at two end areas of the prior wide-angle arc probe can collapse during arc bending,
in order to achieve one of the above objects, an embodiment of the present invention provides a method for preparing an ultrasonic probe, including:
providing a flexible piezoelectric layer, wherein a positive electrode is arranged on a first side of the flexible piezoelectric layer;
cutting the positive electrode to form a plurality of grooves;
attaching a flexible circuit board to a first side of the positive electrode far away from the piezoelectric layer to form a laminated structure;
providing a backing comprising an arcuate surface; and
providing a forming die, wherein the forming die is provided with a forming surface, and the forming surface presses the laminated structure onto the cambered surface, so that the laminated structure is bent and combined onto the cambered surface;
the opening of each groove faces the flexible circuit board, and the shape of the molding surface is matched with the shape of the cambered surface.
As an optional technical scheme, a first adhesive layer is arranged on the cambered surface, and the first adhesive layer adheres the bent laminated structure to the cambered surface.
As an optional technical solution, the method further includes: providing a first matching layer, and attaching the first matching layer to a second side of the flexible piezoelectric layer; the molding surface is pressed against the first matching layer, so that the molding surface is bent and molded; wherein the first side and the second side of the flexible piezoelectric layer are opposite.
As an alternative solution, the second side includes a negative electrode, and the negative electrode covers the second side entirely.
As an optional technical solution, the method further includes: providing a second adhesive layer formed on one side of the negative electrode facing the first matching layer, and fixing the first matching layer to the bent laminated structure.
As an optional technical solution, the method further includes:
providing a third adhesive layer formed on one side of the first matching layer away from the piezoelectric layer;
providing a second matching layer, and attaching the second matching layer to the third adhesive layer;
and providing the forming die, and pressing the forming surface against the second matching layer so that the forming die is bent and formed.
Alternatively, the depth of the groove is 0.001-0.002 mm.
As an optional technical solution, the method further includes:
providing a piezoelectric ceramic piece;
cutting the piezoelectric ceramic sheet to form a plurality of cells, wherein the cells are arranged in an array, and a gap part is formed between any two adjacent cells;
and pouring resin into the gap part, and curing to form a resin layer, wherein the resin layer is connected with the plurality of elements.
As an alternative technical scheme, the material of the resin is selected from epoxy resin, polyethylene, rubber, nylon, polyurethane or a combination thereof.
The invention also provides an ultrasonic probe which is prepared by adopting the preparation method of the ultrasonic probe.
Compared with the prior art, the preparation method of the ultrasonic probe and the ultrasonic probe provided by the invention adopt the laminated structure formed by the flexible piezoelectric layers, and because the primitives in the flexible piezoelectric layers are fixed by the flexible resin material to form a whole, each primitive can be ensured to be orderly arranged when the laminated structure is formed by bending, the collapse of individual primitives, particularly the primitives in the two end areas, is avoided, the primitives are orderly arranged after the bending, the coordinated operation can be realized, and clear and accurate images are ensured.
Drawings
FIG. 1 is a schematic diagram of a piezoelectric layer in an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a piezoelectric layer in an embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of the piezoelectric layer of fig. 2 after a kerf is formed in the positive electrode.
Fig. 4 is a schematic cross-sectional view of the piezoelectric layer of fig. 3 after bonding to a flexible circuit board.
Fig. 5 is a schematic cross-sectional view of the laminated element of fig. 4 after being bent.
Fig. 6 is an enlarged schematic view at a broken line a in fig. 5.
Fig. 7 is a schematic cross-sectional view of the laminated element of fig. 5 after being bent to form a matching layer.
Fig. 8 is a perspective view of an ultrasonic probe in an embodiment of the invention.
Fig. 9 is a flowchart of a method of manufacturing an ultrasonic probe in an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the invention and structural, methodological, or functional modifications of these embodiments that may be made by one of ordinary skill in the art are included within the scope of the invention.
As shown in fig. 1 to 9, the present invention aims to provide a method for manufacturing an ultrasonic probe and an ultrasonic probe manufactured by the same.
Preferably, the method for manufacturing the ultrasonic probe of the present invention is particularly suitable for manufacturing the ultrasonic probe 100 with a circular arc having a wide viewing angle.
As shown in fig. 9, the method for preparing the ultrasonic probe includes: providing a flexible piezoelectric layer, wherein a positive electrode is arranged on a first side of the flexible piezoelectric layer;
specifically:
as shown in fig. 1, the flexible piezoelectric layer 10 includes a plurality of cells 11 arranged in an array with a gap portion between any cells 11; the resin layer 12 fills in the gap portion; the plurality of cells are connected as a unit by the resin layer 12.
The preparation process of the flexible piezoelectric layer 10 includes: providing a piezoelectric ceramic piece; cutting the piezoelectric ceramic sheet to form a plurality of cells 11, wherein the cells 11 are arranged in an array, and a gap part is formed between any adjacent cells 11; resin is poured into the gap portion, and after curing, a resin layer 12 is formed, the resin layer 12 connecting the plurality of cells 11 as a whole.
Wherein the piezoelectric ceramic sheet is cut along a first direction and a second direction perpendicular to each other, forming a plurality of elements 11 of rectangular parallelepiped structure. The resin may be cast into the gap portions of the plurality of cells 11 in a split casting or one casting manner, that is, the piezoelectric ceramic sheet is cut in the first direction to form first cuts, and the resin is cast into the first cuts; cutting the piezoelectric ceramic sheet along a second direction perpendicular to the first direction to form a second cutting groove, and pouring resin into the second cutting groove; or cutting the piezoelectric ceramic sheet along the first direction to form a first cutting groove; cutting the piezoelectric ceramic sheet along a second direction perpendicular to the first direction to form a second cutting groove; finally, the resin is poured into the first and second slits, and cured to form the resin layer 12.
In this embodiment, the material of the resin layer 12 is selected from epoxy, polyethylene, rubber, nylon, polyurethane, or a combination thereof.
As shown in fig. 2, the flexible piezoelectric layer 10 further includes a positive electrode 30 formed on a first side thereof and a negative electrode 20 formed on a second side thereof, the first side and the second side of the flexible piezoelectric layer 10 being opposite. Positive electrode 30 and negative electrode 20 may be formed entirely on opposite first and second sides of flexible piezoelectric layer 10 by coating and sputtering.
As shown in fig. 9, the method for preparing the ultrasonic probe includes: cutting the positive electrode to form a plurality of grooves;
specifically:
as shown in fig. 3, a plurality of grooves 31 are formed on the positive electrode 30 side by laser etching or the like, and each groove preferably has a depth of about 0.01 to 0.02 mm.
In the present embodiment, the plurality of grooves 31 form a plurality of electrically isolated positive electrode structures for the positive electrode 30 when it is formed entirely. Wherein a first side of the flexible piezoelectric layer 10 is exposed from the plurality of grooves 31, respectively.
As shown in fig. 9, the method for preparing the ultrasonic probe includes: attaching a flexible circuit board to a first side of the positive electrode far away from the piezoelectric layer to form a laminated structure;
specifically:
as shown in fig. 4, a flexible circuit board 40 is attached to one side of the positive electrode 30, wherein the opening of each groove 31 on the positive electrode 30 is directed to the flexible circuit board 40 side.
In this embodiment, a conductive adhesive layer (not shown) may be coated on the side of the flexible circuit board 40 facing the positive electrode 30, and the flexible circuit board 40 is fixed to the positive electrode 30 and is electrically connected to the positive electrode 30.
As shown in fig. 9, the method for preparing the ultrasonic probe includes: providing a backing comprising an arcuate surface; and providing a forming die having a forming surface that presses against the laminated structure onto the cambered surface so that the laminated structure is bent and bonded onto the cambered surface;
specifically:
as shown in fig. 5, a backing 60 is provided, the backing 60 including a cambered surface 61; providing a forming die 50, wherein the forming die 50 comprises a forming surface 51; the shape of the arc surface 61 and the shape of the molding surface 51 are mutually adapted. In this embodiment, the cambered surface 61 is a convex surface, the molding surface 51 is a concave surface, and the convex surface can be embedded in the concave surface.
The laminated structure shown in fig. 4 is placed in the curved surface 61 of the backing 60, and the forming die 50 is moved so that the forming face 51 of the forming abrasive 50 is pressed against the negative electrode 20 of the laminated structure, so that the laminated structure is bent into shape.
As shown in fig. 6, in the bending forming process of the laminated structure, since the element 11 and the resin layer 12 in the flexible piezoelectric layer form an integral structure, a plurality of grooves 31 with shallower depth are formed only on one side of the positive electrode 30, so that the element 11 will not collapse even in the large-angle bending forming process, the alignment can be maintained, the accuracy of the positions of the elements can be ensured, the elements can be accurately coordinated and divided to cooperate, the performance of the probe is improved, and the image synthesis is more accurate and clear.
As shown in fig. 5, the temperature for forming the laminated structure by bending the laminated structure using the forming die 50 may be set at: 50-70 ℃.
In addition, a first adhesive layer may be disposed between the flexible circuit board 40 and the cambered surface 61 of the backing 60, and the first adhesive layer fixes the laminated structure after bending to the cambered surface 61.
In other embodiments of the present invention, at least one matching layer may also be applied to one side of the negative electrode 20 of the laminate structure after the laminate structure is bent (or, alternatively, formed by an arc).
Specifically, a second adhesive layer (not shown) is coated on a surface of the negative electrode 20 remote from the backing 60, the first matching layer 70 is attached to the second adhesive layer, and then the molding surface 51 of the molded abrasive 50 is pressed against the first matching layer 70, so that the first matching layer 70 is molded and fixed on one side of the negative electrode 20.
Similarly, a third adhesive layer (not shown) is coated on the surface of the first matching layer 70 on the side remote from the backing 60, the second matching layer 80 is attached to the third adhesive layer, and then the molding surface 51 of the molding grinder 50 is pressed against the second matching layer 80, so that the second matching layer 80 is molded and fixed on one side of the first matching layer 70.
It should be noted that the number of the matching layers can be set according to the actual use requirement, and the number and the material of the matching layers are not particularly limited in the present invention.
In addition, in the invention, the lamination structure bending forming is performed before the attaching process of the matching layer and the lamination structure, so that the lamination structure formed by bending has thinner thickness, is beneficial to reducing the stress of the bending forming, and is convenient for bending without collapse, dislocation and the like of the element.
As shown in fig. 8, the present invention also provides a wide-angle cambered surface ultrasonic probe 100, which is preferably manufactured by the above manufacturing method.
In summary, the preparation method of the ultrasonic probe and the ultrasonic probe provided by the invention adopt the laminated structure formed by the flexible piezoelectric layers, and because the primitives in the flexible piezoelectric layers are fixed by the flexible resin material to form a whole, each primitive can be ensured to be orderly arranged when the laminated structure is formed by bending, the condition that individual primitives, particularly the primitives in two end areas collapse is avoided, the primitives are orderly arranged after the bending, the coordinated operation can be realized, and the clear and accurate images are ensured.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. A method for preparing an ultrasonic probe is characterized in that,
the preparation method of the ultrasonic probe comprises the following steps:
providing a piezoelectric ceramic piece;
cutting the piezoelectric ceramic sheet to form a plurality of cells, wherein the cells are arranged in an array, and a gap part is formed between any two adjacent cells;
pouring resin into the gap part, and curing to form a resin layer, wherein the resin layer is connected with the plurality of elements to form a flexible piezoelectric layer;
a positive electrode is arranged on the first side of the flexible piezoelectric layer;
cutting only the positive electrode to form a plurality of grooves;
attaching a flexible circuit board to a first side of the positive electrode far away from the piezoelectric layer to form a laminated structure;
providing a backing comprising an arcuate surface; and
providing a forming die, wherein the forming die is provided with a forming surface, and the forming surface presses the laminated structure onto the cambered surface, so that the laminated structure is bent and combined onto the cambered surface;
in the bending and forming process of the laminated structure, the elements in the flexible piezoelectric layer and the resin layer are of an integrated structure;
the opening of each groove faces the flexible circuit board, and the shape of the molding surface is matched with the shape of the cambered surface;
providing a first matching layer, and attaching the first matching layer to a second side of the flexible piezoelectric layer;
the molding surface is pressed against the first matching layer, so that the molding surface is bent and molded;
wherein the first side and the second side of the flexible piezoelectric layer are opposite.
2. The method for preparing an ultrasonic probe according to claim 1, wherein,
the cambered surface is provided with a first adhesive layer, and the first adhesive layer is used for adhering the bent laminated structure to the cambered surface.
3. The method for preparing an ultrasonic probe according to claim 1, wherein,
the second side includes a negative electrode thereon, the negative electrode entirely covering the second side.
4. The method for preparing an ultrasonic probe according to claim 3,
further comprises:
providing a second adhesive layer formed on one side of the negative electrode facing the first matching layer, and fixing the first matching layer to the bent laminated structure.
5. The method for preparing an ultrasonic probe according to claim 1, wherein,
further comprises:
providing a third adhesive layer formed on one side of the first matching layer away from the piezoelectric layer;
providing a second matching layer, and attaching the second matching layer to the third adhesive layer;
and providing the forming die, and pressing the forming surface against the second matching layer so that the forming die is bent and formed.
6. The method for preparing an ultrasonic probe according to claim 1, wherein,
the depth of the groove is 0.01-0.02 mm.
7. The method for preparing an ultrasonic probe according to claim 1, wherein,
the material of the resin layer is selected from epoxy resin, polyethylene, rubber, nylon, polyurethane or a combination thereof.
8. An ultrasonic probe is characterized in that,
the ultrasonic probe is manufactured by adopting the manufacturing method of the ultrasonic probe according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011021052.9A CN112206004B (en) | 2020-09-25 | 2020-09-25 | Ultrasonic probe and method of manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011021052.9A CN112206004B (en) | 2020-09-25 | 2020-09-25 | Ultrasonic probe and method of manufacturing the same |
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| CN112206004A CN112206004A (en) | 2021-01-12 |
| CN112206004B true CN112206004B (en) | 2023-08-25 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869768A (en) * | 1988-07-15 | 1989-09-26 | North American Philips Corp. | Ultrasonic transducer arrays made from composite piezoelectric materials |
| CN103157594A (en) * | 2013-03-25 | 2013-06-19 | 广州多浦乐电子科技有限公司 | Flexible ultrasonic phased array transducer and manufacturing method |
| CN103315775A (en) * | 2013-06-28 | 2013-09-25 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array transducer and production method thereof |
| CN106880908A (en) * | 2017-03-21 | 2017-06-23 | 南京广慈医疗科技有限公司 | A kind of single-curved surface strip power ultrasonic device with central rotation imaging probe |
| WO2018168562A1 (en) * | 2017-03-17 | 2018-09-20 | 国立大学法人東北大学 | Transducer array, photoacoustic probe, and photoacoustic measuring device |
-
2020
- 2020-09-25 CN CN202011021052.9A patent/CN112206004B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869768A (en) * | 1988-07-15 | 1989-09-26 | North American Philips Corp. | Ultrasonic transducer arrays made from composite piezoelectric materials |
| CN103157594A (en) * | 2013-03-25 | 2013-06-19 | 广州多浦乐电子科技有限公司 | Flexible ultrasonic phased array transducer and manufacturing method |
| CN103315775A (en) * | 2013-06-28 | 2013-09-25 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array transducer and production method thereof |
| WO2018168562A1 (en) * | 2017-03-17 | 2018-09-20 | 国立大学法人東北大学 | Transducer array, photoacoustic probe, and photoacoustic measuring device |
| CN106880908A (en) * | 2017-03-21 | 2017-06-23 | 南京广慈医疗科技有限公司 | A kind of single-curved surface strip power ultrasonic device with central rotation imaging probe |
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