CN112188739A - 3D circuit board manufacturing method - Google Patents
3D circuit board manufacturing method Download PDFInfo
- Publication number
- CN112188739A CN112188739A CN202011060787.2A CN202011060787A CN112188739A CN 112188739 A CN112188739 A CN 112188739A CN 202011060787 A CN202011060787 A CN 202011060787A CN 112188739 A CN112188739 A CN 112188739A
- Authority
- CN
- China
- Prior art keywords
- laser
- electroplating
- injection molding
- circuit board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a 3D circuit board manufacturing method, which comprises the following steps of S1: preparing an injection molding part for manufacturing a three-dimensional circuit; cleaning the surface of the injection molding part; s2: coating a layer of anti-electroplating layer on the injection molding piece; s3: carrying out laser engraving processing on the injection molding part coated with the anti-electroplating layer; adopting laser beams to carry out 2D plane or 3D stereo engraving treatment, and engraving the graph to be electroplated according to preset pattern data information; s4: after the laser processing is finished, the injection molding piece is subjected to metal electroplating according to the electroplating degree, the reliability is high, the fineness of the prepared circuit board circuit is high, and the using requirement on a large scale can be met.
Description
[ technical field ]
The invention relates to the technical field of circuit board manufacturing processes, in particular to a 3D three-dimensional circuit board manufacturing method with a prominent application effect.
[ background art ]
In the prior art, the laser engraving process in the process of preparing the three-dimensional circuit basically adopts an infrared laser with a wavelength of 1064nm, the processing laser pulse frequency is between 10kHz and 200kHz, the heat is large during processing, the circuit width of the conductor after metallization plating is larger than 35UM, the distance between the conductor circuit and the conductor circuit is also larger than 35UM, if the circuit width of the conductor is smaller than 35UM and the distance between the conductor circuit and the conductor circuit is also smaller than 35UM, a green light source laser with a wavelength ranging from 492nm to 577nm, a UV violet light source laser with a wavelength ranging from 300nm to 400nm, or a UV deep violet light source laser with a wavelength ranging from 200nm to 299nm, an extreme ultraviolet light source laser with a wavelength ranging from 10nm to 199nm are required to be adopted, and epoxy resin is required to be added locally or wholly to the modified plastic, the modified material added with the epoxy resin has poor toughness, is easy to crack and break, and has influence on the mechanism shaping and strength of the product.
Based on the above problems, those skilled in the art have made extensive research and development and have achieved good results.
[ summary of the invention ]
In order to overcome the problems in the prior art, the invention provides the manufacturing method of the 3D three-dimensional circuit board with a prominent application effect.
The invention provides a method for manufacturing a 3D circuit board, which solves the technical problem and comprises the following steps,
s1: preparing an injection molding part for manufacturing a three-dimensional circuit; cleaning the surface of the injection molding part;
s2: coating a layer of anti-electroplating layer on the injection molding piece;
s3: carrying out laser engraving processing on the injection molding part coated with the anti-electroplating layer; adopting laser beams to carry out 2D plane or 3D stereo engraving treatment, and engraving the graph to be electroplated according to preset pattern data information;
s4: after the laser processing treatment is finished, performing metal electroplating treatment on the injection molding piece according to the electroplating degree;
s5: removing the anti-electroplating layer of the injection molded part after the metal electroplating;
s6: and preparing the plastic three-dimensional circuit board.
Preferably, the plating resist layer in step S2 is a plating resist ink layer, a glue layer or a powder layer.
Preferably, the laser used for performing the laser engraving process in step S3 is a green light source laser with a wavelength ranging from 492nm to 577nm, a UV violet light source laser with a wavelength ranging from 300nm to 400nm, a UV deep violet light source laser with a wavelength ranging from 200nm to 299nm, or an euv light source laser with a wavelength ranging from 10nm to 199 nm.
Preferably, after the laser engraving in step S3 is completed, the plastic surface of the injection molded part cut by the laser line pattern is cleaned; removing etching scraps; the width of the line body of the graph after laser engraving is controlled between 5 microns and 50 microns.
Preferably, the metal in the metal electroplating process in step S4 includes copper or nickel, and after the electroplating is completed, the plastic surface of the injection molded part becomes the MID component with the conductive circuit.
Compared with the prior art, the 3D circuit board manufacturing method has the advantages that the laser beam activation treatment is carried out on the circuit board substrate through the laser, the laser line pattern cutting manufacturing process flow is combined, the required circuits and patterns are formed when unnecessary plastic surface conductor materials are etched by the laser, the metal circuit with the thickness ranging from 5 microns to 8 microns is formed through the subsequent electroplating treatment, the whole processing process flow is simple, the reliability is high, the fineness of the prepared circuit board circuit is high, and the using requirement in a large range can be met.
[ description of the drawings ]
Fig. 1 is a schematic flow chart of a 3D circuit board manufacturing method of the present invention.
[ detailed description of the invention ]
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a method 1 for manufacturing a 3D circuit board according to the present invention includes the following steps,
s1: preparing an injection molding part for manufacturing a three-dimensional circuit; cleaning the surface of the injection molding part;
s2: coating a layer of anti-electroplating layer on the injection molding piece;
s3: carrying out laser engraving processing on the injection molding part coated with the anti-electroplating layer; adopting laser beams to carry out 2D plane or 3D stereo engraving treatment, and engraving the graph to be electroplated according to preset pattern data information;
s4: after the laser processing treatment is finished, performing metal electroplating treatment on the injection molding piece according to the electroplating degree;
s5: removing the anti-electroplating layer of the injection molded part after the metal electroplating;
s6: and preparing the plastic three-dimensional circuit board.
According to the method, the laser beam is used for activating the circuit board substrate, the laser line pattern cutting manufacturing process flow is combined, when the unnecessary plastic surface conductor material is etched by utilizing laser, the required circuit and pattern are formed, the metal circuit with the thickness of the range of 5-8 microns is formed by subsequent electroplating treatment, the whole processing process flow is simple, the reliability is high, the fineness of the prepared circuit board is high, and the large-scale use requirement can be met.
Preferably, the plating resist layer in step S2 is a plating resist ink layer, a glue layer or a powder layer.
Preferably, the laser used for performing the laser engraving process in step S3 is a green light source laser with a wavelength ranging from 492nm to 577nm, a UV violet light source laser with a wavelength ranging from 300nm to 400nm, a UV deep violet light source laser with a wavelength ranging from 200nm to 299nm, or an euv light source laser with a wavelength ranging from 10nm to 199 nm.
Preferably, after the laser engraving in step S3 is completed, the plastic surface of the injection molded part cut by the laser line pattern is cleaned; removing etching scraps; the width of the line body of the graph after laser engraving is controlled between 5 microns and 50 microns.
Preferably, the metal in the metal electroplating process in step S4 includes copper or nickel, and after the electroplating is completed, the plastic surface of the injection molded part becomes the MID component with the conductive circuit.
Compared with the prior art, the 3D circuit board manufacturing method 1 has the advantages that the laser beam activation treatment is carried out on the circuit board substrate by adopting the laser, the laser line pattern cutting manufacturing process flow is combined, the required circuits and patterns are formed when unnecessary plastic surface conductor materials are etched by utilizing the laser, the metal circuit with the thickness of 5-8 microns is formed by the subsequent electroplating treatment, the whole processing process flow is simple, the reliability is high, the fineness of the prepared circuit board circuit is high, and the using requirement in a large range can be met.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (5)
1. A3D circuit board manufacturing method is characterized in that: comprises the following steps of (a) carrying out,
s1: preparing an injection molding part for manufacturing a three-dimensional circuit; cleaning the surface of the injection molding part;
s2: coating a layer of anti-electroplating layer on the injection molding piece;
s3: carrying out laser engraving processing on the injection molding part coated with the anti-electroplating layer; adopting laser beams to carry out 2D plane or 3D stereo engraving treatment, and engraving the graph to be electroplated according to preset pattern data information;
s4: after the laser processing treatment is finished, performing metal electroplating treatment on the injection molding piece according to the electroplating degree;
s5: removing the anti-electroplating layer of the injection molded part after the metal electroplating;
s6: and preparing the plastic three-dimensional circuit board.
2. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: the electroplating-resistant layer in the step S2 is an electroplating-resistant ink layer, a glue layer or a powder layer.
3. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: the laser used for performing the laser engraving process in step S3 is a green light source laser with a wavelength range of 492nm to 577nm, a UV violet light source laser with a wavelength range of 300nm to 400nm, a UV deep violet light source laser with a wavelength range of 200nm to 299nm, or an euv light source laser with a wavelength range of 10nm to 199 nm.
4. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: after the laser engraving in the step S3 is finished, cleaning and cleaning the plastic surface of the injection molding part after the laser line pattern is cut; removing etching scraps; the width of the line body of the graph after laser engraving is controlled between 5 microns and 50 microns.
5. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: the metal in the metal electroplating process in the step S4 includes copper or nickel, and after the electroplating is completed, the plastic surface of the injection molded part becomes an MID element with a conductive circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011060787.2A CN112188739A (en) | 2020-09-30 | 2020-09-30 | 3D circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011060787.2A CN112188739A (en) | 2020-09-30 | 2020-09-30 | 3D circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112188739A true CN112188739A (en) | 2021-01-05 |
Family
ID=73947397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011060787.2A Withdrawn CN112188739A (en) | 2020-09-30 | 2020-09-30 | 3D circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112188739A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113774384A (en) * | 2021-09-15 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Scheme for reducing three-dimensional line spraying cost through laser etching and chemical polishing |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046011A1 (en) * | 2003-07-07 | 2005-03-03 | Board Of Regents, The University Of Texas System | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| CN101198219A (en) * | 2006-12-06 | 2008-06-11 | 日立比亚机械股份有限公司 | Method for producing printed circuit board and machine for processing the same |
| CN103533764A (en) * | 2012-07-05 | 2014-01-22 | 昆山联滔电子有限公司 | Manufacturing method for forming conductor line on non-conductive substrate |
-
2020
- 2020-09-30 CN CN202011060787.2A patent/CN112188739A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046011A1 (en) * | 2003-07-07 | 2005-03-03 | Board Of Regents, The University Of Texas System | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| CN101198219A (en) * | 2006-12-06 | 2008-06-11 | 日立比亚机械股份有限公司 | Method for producing printed circuit board and machine for processing the same |
| CN103533764A (en) * | 2012-07-05 | 2014-01-22 | 昆山联滔电子有限公司 | Manufacturing method for forming conductor line on non-conductive substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113774384A (en) * | 2021-09-15 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Scheme for reducing three-dimensional line spraying cost through laser etching and chemical polishing |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
| CN113770546B (en) * | 2021-10-11 | 2024-06-18 | 心之光电子科技(广东)有限公司 | Process for manufacturing three-dimensional circuit through laser etching and carbonizing plastic surface |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210105 |
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| WW01 | Invention patent application withdrawn after publication |