CN112186497A - Semiconductor laser and packaging method - Google Patents
Semiconductor laser and packaging method Download PDFInfo
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- CN112186497A CN112186497A CN202011097173.1A CN202011097173A CN112186497A CN 112186497 A CN112186497 A CN 112186497A CN 202011097173 A CN202011097173 A CN 202011097173A CN 112186497 A CN112186497 A CN 112186497A
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- temperature controller
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a semiconductor laser and a packaging method, which are used for packaging the semiconductor laser, wherein a tube shell with pins and a tube opening is manufactured, and the pins are horizontally arranged in parallel and embedded in the middle upper part of the tube shell; a step seat is welded on one side of the temperature controller, and a recoverable fuse is connected in series on the step seat; fixing the tube shell on a fixture with a lifting function, starting a wire binding machine, electrically connecting a pole piece on a temperature controller with the lowest end of the step seat through a wire binding, adjusting the fixture to a specified height, and electrically connecting the top of the take-over seat with the corresponding positions of the pins and the control chip with the pins through the wire binding; detecting; and (6) packaging. The laser device is simple and reasonable in structure and easy to automatically process; the packaging method is efficient and automatic, is accurate and pollution-free, and greatly improves the production efficiency and the yield; meanwhile, the current control is more flexible, and the thickness and the number of the binding wires can be adjusted according to the current required by the temperature controller.
Description
Technical Field
The invention relates to the field of semiconductor lasers, in particular to a semiconductor laser and a packaging method.
Background
The semiconductor laser device capable of refrigerating 14pin butterfly package is a common optical instrument, can continuously and stably output laser with specified power, and has high stability and reliability. Due to the compact internal structure of the laser, the TEC electrodes of the laser are typically manually wire bonded, which requires manual welding to the pins of the semiconductor package during assembly of the laser using a spot welder.
The electrodes of the temperature controller (TEC) of current lasers are connected by two soldered leads spot welded to pins of the laser package. The process has obvious defects that firstly, the electrode lead of the TEC is welded manually, the repeatability and the reliability are poor, and the efficiency is low; secondly when assembling the TEC to the laser instrument, the pin can only be welded through the electric welding machine with being connected with of laser instrument tube base pin, because manual operation, maneuverability is poor, and the repeatability is not good, and more important one is in the spot welding in-process, and the phenomenon that can hardly avoid sparking produces, and the splashing of output metal particle causes the inside pollution of product, brings the risk of product reliability.
And the position between current pin and the control chip changes often, is not located the position that the height is equivalent, just after exceeding the limit height difference of wiring, just can't adopt traditional wiring machine to carry out welding operation. And because the temperature controller (TEC) is generally positioned below the control chip for controlling the temperature of the control chip, the welding pins of the temperature controller and the welding area of the chip are generally not positioned at the same height, and efficient automatic welding operation cannot be carried out through a wire binding machine.
Meanwhile, in the use process, the phenomenon that the current of the TEC exceeds the range of the current or the product is burnt and scrapped due to overlong heating time caused by misjudgment of the thermistor on the chip often occurs, so that the function of the TEC is invalid and the temperature cannot be effectively controlled.
Disclosure of Invention
In view of the above problems, the present invention is directed to a semiconductor laser and a packaging method, which are easy to perform automatic soldering, stable in soldering, and free of pollution, and have an overheat protection function.
In order to realize the technical purpose, the scheme of the invention is as follows: a semiconductor laser comprises a tube shell and a chip assembly, wherein the chip assembly is embedded in the tube shell, one side of the tube shell is provided with a protective sleeve and a connecting sleeve, optical fibers are embedded in the protective sleeve and the connecting sleeve, one end of each optical fiber extends out of the protective sleeve, the chip assembly is formed by combining a chip seat, a control chip and a thermistor, the other end of each optical fiber is connected to the control chip on the chip seat, a plurality of pins which are arranged in parallel are horizontally arranged on two sides of the tube shell, one end of each pin extends out of the tube shell, and the other end of each pin is positioned on the inner side of the tube shell and is correspondingly electrically connected;
and a temperature controller is also installed in the tube shell and is electrically connected with the corresponding pin.
Preferably, a step-shaped step seat is further arranged in the tube shell, the step seat is formed by combining a groove, a positive step and a negative step, the step seat is arranged on one side of the temperature controller, and the groove can allow the optical fiber to pass through;
the positive electrode step and the negative electrode step are respectively provided with an electric connection part, the electric connection part at the uppermost end is electrically connected with the appointed pin through a gold thread, and the electric connection part at the lowermost end is electrically connected with a pin of the temperature controller through a gold thread;
and the positive electrode step or the negative electrode step is also connected with a recoverable fuse in series.
Preferably, the inner sides of the pins and the corresponding welding positions of the control chip are positioned on the same horizontal plane;
and the connecting ends of the pins and the pins are of a horizontal sheet structure.
A packaging method is used for packaging a semiconductor laser, and comprises the following specific steps:
s1: manufacturing, namely manufacturing a tube shell with pins and a tube opening, wherein the pins are horizontally arranged in parallel and embedded at the middle upper part of the tube shell;
a temperature controller, a chip seat and a control chip are welded and fixed in the tube shell from bottom to top in sequence, a step seat is welded on one side of the temperature controller, and a recoverable fuse is connected in series on the step seat;
s2: pin welding, namely fixing a tube shell on a fixture with a lifting function, starting a wire binding machine, setting the ultrasonic power of the wire binding machine to be 120-plus-250W, the ultrasonic time to be 10-500ms and the welding temperature to be 120-plus-200 ℃, and simultaneously selecting the number and thickness of the wire binding according to the requirements of a temperature controller and a control chip on current;
firstly, electrically connecting a pole piece on the temperature controller with the lowest end of the step seat through a binding wire, then adjusting the clamp to a specified height, and then electrically connecting the top of the step seat with the pins and the corresponding positions of the control chip and the pins through the binding wire;
s3: detecting, namely conveying the welded laser to a detection platform, detecting the connection stability of a chip and a pin and the connection stability of a temperature controller and the pin through visual inspection and tensile force test, and if the detection is not passed, failing to enter the next step of operation and entering an abnormal area;
s4: and packaging, namely conveying the detected laser to a packaging platform, and welding a cover plate printed with parameter marks at the windowing part of the tube shell.
Preferably, the height difference between the pole piece on the temperature controller and the lowest end of the stepped seat, the height difference between the top of the stepped seat and the pins, and the height difference between the control chip and the pins are all less than 2.2 mm;
the positive electrode step and the negative electrode step respectively comprise two or more steps, and the height between every two steps on the positive electrode step and the negative electrode step is less than 2.2 mm.
Preferably, the binding wire is a copper wire, a silver wire or a gold wire.
Preferably, after the packaging is finished in step S4, the extracted laser is mounted on the aging test module for stability detection;
the method comprises the steps of testing the stability of the temperature controller, applying a temperature test current on a laser through an aging test module, reading the currents of a control chip and the temperature controller and the resistance value of a thermistor, and if the control chip keeps a stable temperature within a specified time and repeats for a plurality of times, determining that the temperature controller is qualified;
secondly, testing the stability of the recoverable fuse, applying fusing test current on a laser through an aging test module, reading the current of a control chip and a temperature controller and the resistance value of a thermistor, automatically breaking the recoverable fuse after the current on the temperature controller exceeds a threshold value and rated time, switching on the test current after specified time, repeating for several times, and ensuring that the control chip and the temperature controller are qualified when the recoverable fuse can normally run;
thirdly, performing aging test, applying an aging test current on the laser through the aging test module, reading the current of the control chip and the temperature controller and the resistance of the thermistor at room temperature, and recording the stable operation time of the control chip and the temperature controller;
and fourthly, accelerating the aging test, applying an aging test current on the laser through the aging test module, setting the test temperature to be 40-80 ℃, reading the current of the control chip and the temperature controller and the resistance value of the thermistor, and recording the stable operation time of the control chip and the temperature controller.
The laser has the beneficial effects that the laser is simple and reasonable in structure and easy to automatically process, and meanwhile, the temperature controller is provided with the recoverable fuse in parallel, so that when the current exceeds a threshold value or the time is too long, a circuit can be automatically cut off to protect the temperature controller; the packaging method can automatically and efficiently finish the wire binding operation, is simple and convenient to operate, is accurate and pollution-free, and greatly improves the production efficiency and the yield; meanwhile, the current control is more flexible, the thickness and the number of binding wires can be adjusted according to the current required by the temperature controller, and the safe operation of the temperature controller is further guaranteed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a partial structural schematic diagram of the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and specific embodiments.
As shown in fig. 1-2, a semiconductor laser according to a specific embodiment of the present invention includes a tube case 1 and a chip assembly, wherein the chip assembly is embedded in the tube case, one side of the tube case 1 is provided with a protection sleeve 4 and a connection sleeve 5, an optical fiber 6 is embedded in the protection sleeve 4 and the connection sleeve 5, one end of the optical fiber 6 extends out from the protection sleeve 4, the chip assembly is formed by combining a chip holder 1, a control chip 2 and a thermistor, the other end of the optical fiber 6 is connected to a control chip 3 on the chip holder 2, a plurality of pins 7 arranged in parallel are horizontally installed on two sides of the tube case 1, one end of each pin 7 extends out from the tube case 1, and the other end of each pin 7 is located inside the tube case 1 and is correspondingly electrically connected to the control chip 3;
and a semiconductor temperature controller 8 for adjusting the temperature is also arranged in the tube shell 1, and the temperature controller 8 is electrically connected with the corresponding pin 7.
In order to facilitate the stepped welding to meet the welding requirement of the wire binding machine, a stepped seat 9 is further arranged in the tube shell 1, the stepped seat 9 is formed by combining a groove 901, a positive step 902 and a negative step 903, the stepped seat 9 is positioned on one side of the temperature controller 8, and the groove 901 can allow the optical fiber 6 to pass through;
the positive electrode step 902 and the negative electrode step 903 are respectively provided with an electric connection part 904, the electric connection part 904 at the uppermost end is electrically connected with a designated pin 7 through a gold wire 10, and the electric connection part 904 at the lowermost end is electrically connected with a pin 801 of the temperature controller 8 through a gold wire 10;
the positive electrode step 902 or the negative electrode step 903 is also connected in series with a recoverable fuse 11. Through the ladder seat, the wire binding machine can realize the electricity between temperature controller and the pin through twice or many ultrasonic bonding and be connected, need not to adopt traditional welding mode, and pollution abatement promotes product quality.
When the semiconductor laser with the recoverable fuse is used, when the current exceeds a threshold value or the time is too long, the recoverable fuse automatically cuts off a circuit, so that a temperature controller and a control chip are protected, and overheating damage is avoided; at the same time, the system control software will stop powering up or related testing and prompt for checking the line connection. When the fuse restores to the original state, the TEC circuit restores to normal connection; when the line system control software recognizes that the path connection is confirmed to be normal, the line system control software can be powered on again or relevant tests can be carried out.
In order to reduce the processing cost and improve the welding efficiency, the inner sides of the pins 7 and the corresponding welding positions of the control chip 3 are positioned at the same horizontal plane height; the electric connection part 904, the connection end of the pin 801 control chip 3 and the connection end of the pin 7 are in a horizontal thin sheet structure. The height and the sheet structure of the wire binding machine on the same horizontal plane are beneficial to ultrasonic welding of the wire binding machine; meanwhile, the temperature controller does not need to be provided with a columnar pin, so that the cost can be reduced.
A packaging method is used for packaging a semiconductor laser, and comprises the following specific steps:
s1: manufacturing, namely manufacturing a tube shell with pins and a tube opening, wherein the pins are horizontally arranged in parallel and embedded at the middle upper part of the tube shell;
the temperature controller, the chip base and the control chip are sequentially welded and fixed in the tube shell from bottom to top (after the soldering tin sheet is placed, the soldering tin sheet is welded in one step), the height of the control chip is equal to that of the pins, the stepped base is welded on one side of the temperature controller, and the recoverable fuse is connected in series on the stepped base;
s2: pin welding, namely fixing a tube shell on a fixture with a lifting function, starting a wire binding machine, setting the ultrasonic power of the wire binding machine to be 120-plus-250W, the ultrasonic time to be 10-500ms and the welding temperature to be 120-plus-200 ℃, and simultaneously selecting the number and thickness of the wire binding according to the requirements of a temperature controller and a control chip on current;
firstly, electrically connecting a pole piece on the temperature controller with the lowest end of the step seat through a binding wire, then adjusting the clamp to a specified height, and then electrically connecting the top of the step seat with the pins and the corresponding positions of the control chip and the pins through the binding wire;
s3: detecting, namely conveying the welded laser to a detection platform, detecting the connection stability of a chip and a pin and the connection stability of a temperature controller and the pin through visual inspection and tensile force test, and if the detection is not passed, failing to enter the next step of operation and entering an abnormal area;
s4: and packaging, namely conveying the detected laser to a packaging platform, and welding a cover plate printed with parameter marks at the windowing part of the tube shell.
In order to ensure that the packaging method of the semiconductor laser can be stably carried out, the height difference between the pole piece on the temperature controller and the lowest end of the stepped seat, the height difference between the top of the stepped seat and the pins, and the height difference between the control chip and the pins are all smaller than 2.2 mm;
the positive electrode step and the negative electrode step respectively comprise two or more steps, and the height between every two steps on the positive electrode step and the negative electrode step is less than 2.2 mm. Just so ensure that every highly needs welded position can carry out ultrasonic bonding through wiring machine, switch over to next height through anchor clamps lift after the welding is accomplished.
In order to ensure the conductivity after welding, the binding wire is a copper wire, a silver wire or a gold wire.
In order to further test the stability of the laser, after the packaging is completed in step S4, the extracted laser is mounted on the aging test module for stability detection;
the method comprises the steps of testing the stability of the temperature controller, applying a temperature test current on a laser through an aging test module, reading the currents of a control chip and the temperature controller and the resistance value of a thermistor, and if the control chip keeps a stable temperature within a specified time and repeats for a plurality of times, determining that the temperature controller is qualified;
secondly, testing the stability of the recoverable fuse, applying fusing test current on a laser through an aging test module, reading the current of a control chip and a temperature controller and the resistance value of a thermistor, automatically breaking the recoverable fuse after the current on the temperature controller exceeds a threshold value and rated time, switching on the test current after specified time, repeating for several times, and ensuring that the control chip and the temperature controller are qualified when the recoverable fuse can normally run;
thirdly, performing aging test, applying an aging test current on the laser through the aging test module, reading the current of the control chip and the temperature controller and the resistance of the thermistor at room temperature, and recording the stable operation time of the control chip and the temperature controller;
and fourthly, accelerating the aging test, applying an aging test current on the laser through the aging test module, setting the test temperature to be 40-80 ℃, reading the current of the control chip and the temperature controller and the resistance value of the thermistor, and recording the stable operation time of the control chip and the temperature controller.
The method is suitable for refrigerating 14pin butterfly-shaped packaged semiconductor laser devices. Because the 14Pin butterfly-shaped packaged tube shell is deep, the height from the tube shell Pin to the bottom of the tube shell is more than 4mm, and the wire bonding limit height of the current automatic wire bonding machine is 2.3mm, the height of the control chip of the semiconductor laser device is equal to the height of the Pin, and the welding is convenient; meanwhile, a TEC (temperature controller) is electrically connected with the pins through a step seat, and a clamp with a lifting function is additionally arranged, so that the wire bonding fall is divided into two stages, and the automatic wire bonding is realized while the efficiency is kept (fig. 2). Meanwhile, the current control is more flexible, and reasonable matching can be realized by adjusting the thickness of binding wires or the number of binding wires according to the current requirement of the TEC. The method not only realizes the conversion from manual welding to machine bonding wire, greatly improves the operability and repeatability of the process, but also avoids the pollution caused by spot welding, thereby reducing the reliability risk of the product. Meanwhile, the method introduces a simple TEC production process, does not need an electrode lead welded by the traditional TEC, and reduces the cost; meanwhile, the design of the tube shell can be simplified, the two special pin for spot welding do not need to be welded, only the flaky pin is needed, the production process of the tube shell is simplified, and meanwhile, the cost is saved.
The semiconductor laser of this application has installed temperature controller (TEC), can be used to control and keep laser chip temperature, and when ambient temperature increased or reduced, the temperature of chip was calculated through the thermistor value on the chip to the system, and then fed back the system and applyed positive electricity or negative electricity to TEC, and TEC can refrigerate or heat the chip rapidly, ensures that the chip keeps at appointed operating temperature. In practical application, an abnormal condition often occurs, or communication abnormality or circuit connection problem causes the system to misjudge the thermistor value, and the TEC is continuously electrified to generate a large amount of heat to cause the chip to be overheated and burnt. In order to solve the problem and improve the product yield, a recoverable fuse is introduced into the semiconductor laser. The method comprises the steps of analyzing the temperature control characteristic of the TEC according to the characteristic of a recoverable fuse, and further selecting a proper recoverable fuse to be connected in series to a power supply circuit of the TEC; when the current of the TEC exceeds the self range or the heating time caused by the misjudgment of the thermistor is too long, the recoverable fuse can automatically cut off the circuit, the system can prompt that the test is abnormal, the continuous power-on work of the TEC of the product is stopped, and the product is prevented from being damaged. After exception is eliminated, the fuse can restore the circuit of the product to keep subsequent test application.
The semiconductor laser is easy to automatically process and produce, and the stability and the efficiency of welding are greatly improved while the stability of the structure is ensured; and meanwhile, a recoverable fuse is arranged on the temperature controller in parallel, and the circuit can be automatically cut off to protect the temperature controller when the current exceeds a threshold value or the time is too long. The packaging method can automatically and efficiently finish the wire binding operation, is simple and convenient to operate, is accurate and pollution-free, and greatly improves the production efficiency and the yield; meanwhile, the current control is more flexible, the thickness and the number of binding wires can be adjusted according to the current required by the temperature controller, and the safe operation of the temperature controller is further guaranteed.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any minor modifications, equivalent replacements and improvements made to the above embodiment according to the technical spirit of the present invention should be included in the protection scope of the technical solution of the present invention.
Claims (7)
1. The utility model provides a semiconductor laser, includes tube and chip module, the embedded installation of chip module is in the tube, tube one side is provided with protective case and adapter sleeve, protective case and the embedded optic fibre of installing in the adapter sleeve, optic fibre one end stretches out from protective case, the chip module has chip seat, control chip and thermistor combination to form, the optic fibre other end is connected to the control chip on the chip seat, its characterized in that: a plurality of pins arranged in parallel are horizontally arranged on two sides of the tube shell, one ends of the pins extend out of the tube shell, and the other ends of the pins are positioned on the inner side of the tube shell and correspondingly electrically connected with the control chip;
and a temperature controller is also installed in the tube shell and is electrically connected with the corresponding pin.
2. A semiconductor laser as claimed in claim 1 wherein: a step-shaped step seat is arranged in the tube shell and is formed by combining a groove, a positive step and a negative step, the step seat is positioned on one side of the temperature controller, and the groove can allow the optical fiber to pass through;
the positive electrode step and the negative electrode step are respectively provided with an electric connection part, the electric connection part at the uppermost end is electrically connected with the appointed pin through a gold thread, and the electric connection part at the lowermost end is electrically connected with a pin of the temperature controller through a gold thread;
and the positive electrode step or the negative electrode step is also connected with a recoverable fuse in series.
3. A method for packaging a semiconductor laser with an overheat protection function according to claim 2, wherein: the inner sides of the pins and the corresponding welding positions of the control chip are positioned on the same horizontal plane;
and the connecting ends of the pins and the pins are of a horizontal sheet structure.
4. A method of packaging, characterized by: a package for a semiconductor laser according to any of claims 1-3, comprising the following steps:
s1: manufacturing, namely manufacturing a tube shell with pins and a tube opening, wherein the pins are horizontally arranged in parallel and embedded at the middle upper part of the tube shell;
a temperature controller, a chip seat and a control chip are welded and fixed in the tube shell from bottom to top in sequence, a step seat is welded on one side of the temperature controller, and a recoverable fuse is connected in series on the step seat;
s2: pin welding, namely fixing a tube shell on a fixture with a lifting function, starting a wire binding machine, setting the ultrasonic power of the wire binding machine to be 120-plus-250W, the ultrasonic time to be 10-500ms and the welding temperature to be 120-plus-200 ℃, and simultaneously selecting the number and thickness of the wire binding according to the requirements of a temperature controller and a control chip on current;
firstly, electrically connecting a pole piece on the temperature controller with the lowest end of the step seat through a binding wire, then adjusting the clamp to a specified height, and then electrically connecting the top of the step seat with the pins and the corresponding positions of the control chip and the pins through the binding wire;
s3: detecting, namely conveying the welded laser to a detection platform, detecting the connection stability of a chip and a pin and the connection stability of a temperature controller and the pin through visual inspection and tensile force test, and if the detection is not passed, failing to enter the next step of operation and entering an abnormal area;
s4: and packaging, namely conveying the detected laser to a packaging platform, and welding a cover plate printed with parameter marks at the windowing part of the tube shell.
5. The method of packaging of claim 4, wherein: the height difference between the pole piece on the temperature controller and the lowest end of the stepped seat, the height difference between the top of the stepped seat and the pins, and the height difference between the control chip and the pins are all smaller than 2.2 mm;
the positive electrode step and the negative electrode step respectively comprise two or more steps, and the height between every two steps on the positive electrode step and the negative electrode step is less than 2.2 mm.
6. The method of packaging of claim 4, wherein: the binding wire is a copper wire, a silver wire or a gold wire.
7. The method of packaging of claim 4, wherein: after the packaging is finished in the step S4, extracting the laser and installing the laser on an aging test module for stability detection;
the method comprises the steps of testing the stability of the temperature controller, applying a temperature test current on a laser through an aging test module, reading the currents of a control chip and the temperature controller and the resistance value of a thermistor, and if the control chip keeps a stable temperature within a specified time and repeats for a plurality of times, determining that the temperature controller is qualified;
secondly, testing the stability of the recoverable fuse, applying fusing test current on a laser through an aging test module, reading the current of a control chip and a temperature controller and the resistance value of a thermistor, automatically breaking the recoverable fuse after the current on the temperature controller exceeds a threshold value and rated time, switching on the test current after specified time, repeating for several times, and ensuring that the control chip and the temperature controller are qualified when the recoverable fuse can normally run;
thirdly, performing aging test, applying an aging test current on the laser through the aging test module, reading the current of the control chip and the temperature controller and the resistance of the thermistor at room temperature, and recording the stable operation time of the control chip and the temperature controller;
and fourthly, accelerating the aging test, applying an aging test current on the laser through the aging test module, setting the test temperature to be 40-80 ℃, reading the current of the control chip and the temperature controller and the resistance value of the thermistor, and recording the stable operation time of the control chip and the temperature controller.
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| CN202011097173.1A CN112186497A (en) | 2020-10-14 | 2020-10-14 | Semiconductor laser and packaging method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437636A (en) * | 2021-06-11 | 2021-09-24 | 天津凯普林光电科技有限公司 | Bonding method of gold wire in semiconductor laser tube shell and semiconductor laser |
| CN115832860A (en) * | 2022-11-21 | 2023-03-21 | 武汉泵浦科技有限公司 | Tunable laser chip |
-
2020
- 2020-10-14 CN CN202011097173.1A patent/CN112186497A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437636A (en) * | 2021-06-11 | 2021-09-24 | 天津凯普林光电科技有限公司 | Bonding method of gold wire in semiconductor laser tube shell and semiconductor laser |
| CN113437636B (en) * | 2021-06-11 | 2023-05-09 | 天津凯普林光电科技有限公司 | Bonding method of gold wire in semiconductor laser tube shell and semiconductor laser |
| CN115832860A (en) * | 2022-11-21 | 2023-03-21 | 武汉泵浦科技有限公司 | Tunable laser chip |
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