CN112185908A

CN112185908A - Semiconductor packaging structure and preparation method thereof

Info

Publication number: CN112185908A
Application number: CN201910600122.7A
Authority: CN
Inventors: 蔡汉龙; 林正忠
Original assignee: SJ Semiconductor Jiangyin Corp
Current assignee: SJ Semiconductor Jiangyin Corp
Priority date: 2019-07-04
Filing date: 2019-07-04
Publication date: 2021-01-05

Abstract

The invention provides a semiconductor packaging structure and a preparation method thereof. The semiconductor package structure includes: the first packaging body comprises a first packaging substrate, a first chip, a first plastic packaging layer, a first heat-conducting adhesive layer, a first heat-conducting lead and a first heat dissipation layer; the second packaging body is positioned above the first packaging body and comprises a second packaging substrate, a second chip, a second plastic packaging layer, a second heat-conducting adhesive layer, a second heat-conducting lead and a second heat dissipation layer; a third package body located above the second package body; the third package body comprises a third package substrate, a third chip and a third plastic package layer. The semiconductor packaging structure is provided with the heat dissipation layer at the periphery of the chip positioned in the middle of the laminated packaging structure so as to improve the heat dissipation of the laminated packaging structure, and simultaneously, the heat dissipated by the chip is conducted to the heat dissipation layer through the heat conduction lead, so that the quick heat dissipation of the chip is facilitated, the warping of a device caused by poor heat dissipation can be prevented, and the performance of the device is facilitated to be improved.

Description

Semiconductor packaging structure and preparation method thereof

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure and a preparation method thereof.

Background

With the rapid development of electronic information technology and the continuous improvement of the consumption level of people, the functions of a single electronic device are increasingly diversified and the size of the single electronic device is increasingly miniaturized, so that in the internal structure of the electronic device, the density of chips and functional components is continuously increased, and the Critical Dimension (line width) of the device is continuously smaller, which brings great challenges to the semiconductor packaging industry.

In order to meet the demand of increasing device integration, various packaging technologies are developed, and among them, a package-on-package (PoP) technology is attracting attention. The stacked package is a package in which a plurality of chips are stacked up and down, and the current most stacked layers can be more than 8 layers. However, the stacked package helps to improve the integration of the packaged device, and there are many problems to be solved, especially the heat dissipation problem is the most outstanding. Because the laminated packaging packages a plurality of chips together, the chips, especially the chips located in the middle of the packaging structure and the wires between the chips release a large amount of heat in the working process, and if the heat cannot be dissipated in time, the heat not only can cause the warping deformation of the device, but also can cause the performance reduction and even complete failure of the device, and even can cause the short circuit of the device, thereby causing serious production accidents.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a semiconductor package structure and a method for manufacturing the same, which are used to solve the problems of warpage and performance degradation of a device caused by poor heat dissipation effect of a stacked package structure in the prior art.

To achieve the above and other related objects, the present invention provides a semiconductor package structure, comprising: the first package body comprises a first package substrate, a first chip, a first plastic package layer, a first heat-conducting adhesive layer, a first heat-conducting lead and a first heat dissipation layer; the first chip is bonded on the upper surface of the first packaging substrate; the first plastic package layer is positioned on the upper surfaces of the first package substrate and the first chip and is used for plastic packaging the first chip; the first heat-conducting adhesive layer is positioned on the side wall of the first plastic packaging layer; the first heat conducting lead is positioned in the first plastic packaging layer, and two ends of the first heat conducting lead are respectively connected with the first chip and the first heat conducting adhesive layer; the first heat dissipation layer is positioned on the surface of the side wall of the first heat conduction adhesive layer, which is far away from the first plastic packaging layer; a second package body positioned above the first package body; the second packaging body comprises a second packaging substrate, a second chip, a second plastic packaging layer, a second heat-conducting adhesive layer, a second heat-conducting lead and a second heat dissipation layer; the second packaging substrate is positioned above the first plastic packaging layer; the second chip is bonded on the upper surface of the second packaging substrate; the second plastic packaging layer is positioned on the upper surfaces of the second packaging substrate and the second chip and is used for plastic packaging of the second chip; the second heat-conducting adhesive layer is positioned on the side wall of the second plastic packaging layer; the second heat conduction lead is positioned in the second plastic packaging layer, and two ends of the second heat conduction lead are respectively connected with the second chip and the second heat conduction adhesive layer; the second heat dissipation layer is positioned on the surface of the side wall of the second heat conduction adhesive layer, which is far away from the second plastic packaging layer; a third package body positioned above the second package body; the third packaging body comprises a third packaging substrate, a third chip and a third plastic packaging layer; the third packaging substrate is positioned above the second plastic packaging layer; the third chip is bonded on the upper surface of the third packaging substrate; and the third plastic package layer is positioned on the upper surfaces of the third package substrate and the third chip and is used for plastic package of the third chip.

Optionally, the first chip is bonded to the upper surface of the first package substrate by a first bonding wire, the second chip is bonded to the upper surface of the second package substrate by a second bonding wire, and the first bonding wire, the second bonding wire, the first heat conducting wire, and the second heat conducting wire are made of the same material.

Optionally, the first heat conductive adhesive layer is in contact with the second heat conductive adhesive layer, and the first heat dissipation layer is in contact with the second heat dissipation layer.

Optionally, the semiconductor package structure further includes a plurality of electrical connection structures distributed in the first plastic package layer and the second plastic package layer to electrically connect the first package body, the second package body, and the third package body.

Optionally, the semiconductor package structure further includes a third thermal conductive adhesive layer, a third thermal conductive wire, and a third heat dissipation layer; the third heat-conducting adhesive layer is positioned on the upper surface of the third plastic packaging layer; the third heat-conducting lead is positioned in the third plastic packaging layer, and two ends of the third heat-conducting lead are respectively connected with the third chip and the third heat-conducting adhesive layer; the third heat dissipation layer is located on the surface, far away from the third plastic packaging layer, of the third heat conduction adhesive layer.

Optionally, the third heat dissipation layer extends downwards along the side wall of the third thermal conductive adhesive layer to be in contact with the second heat dissipation layer.

The invention also provides a preparation method of the semiconductor packaging structure, which comprises the following steps:

forming a first packaging body, wherein the first packaging body comprises a first packaging substrate, a first chip, a first plastic packaging layer, a first heat conduction lead, a first heat conduction adhesive layer and a first heat dissipation layer; the first chip is bonded on the upper surface of the first packaging substrate; the first plastic package layer is positioned on the upper surfaces of the first package substrate and the first chip and is used for plastic packaging the first chip; the first heat-conducting adhesive layer is positioned on the side wall of the first plastic packaging layer; the first heat conducting lead is positioned in the first plastic packaging layer, and two ends of the first heat conducting lead are respectively connected with the first chip and the first heat conducting adhesive layer; the first heat dissipation layer is positioned on the surface of the side wall of the first heat conduction adhesive layer, which is far away from the first plastic packaging layer;

forming a second packaging body, wherein the second packaging body comprises a second packaging substrate, a second chip, a second plastic packaging layer, a second heat conduction lead, a second heat conduction adhesive layer and a second heat dissipation layer; the second chip is bonded on the upper surface of the second packaging substrate; the second plastic packaging layer is positioned on the upper surfaces of the second packaging substrate and the second chip and is used for plastic packaging of the second chip; the second heat-conducting adhesive layer is positioned on the side wall of the second plastic packaging layer; the second heat conduction lead is positioned in the second plastic packaging layer, and two ends of the second heat conduction lead are respectively connected with the second chip and the second heat conduction adhesive layer; the second heat dissipation layer is positioned on the surface of the side wall of the second heat conduction adhesive layer, which is far away from the second plastic packaging layer;

bonding the first package body and the second package body, wherein the upper surface of the first plastic package layer of the first package body and the lower surface of the second package substrate of the second package body are bonding surfaces;

bonding the structure obtained after bonding with a third package; the third packaging body comprises a third packaging substrate, a third chip and a third plastic packaging layer, the third chip is bonded on the upper surface of the third plastic packaging layer, and the third plastic packaging layer is located on the upper surfaces of the third packaging substrate and the third chip and is used for plastic packaging of the third chip; the lower surface of the third package substrate and the upper surface of the second plastic package layer are bonding surfaces.

Optionally, the process of forming the first package body includes:

providing the first package substrate, bonding the first chip on the upper surface of the first package substrate through a first bonding wire, and forming the first heat conducting wire, wherein one end of the first heat conducting wire is connected with the first chip, the other end of the first heat conducting wire extends to be jointed with the surface of the first package substrate, the maximum height of the first heat conducting wire is larger than the height of the first bonding wire, and the joint of the first heat conducting wire and the first package substrate is positioned at one end of the first bonding wire, which is far away from the first chip;

forming the first plastic package layer on the upper surfaces of the first package substrate, the first chip, the first heat conducting lead and the first bonding lead, wherein the first plastic package layer plastically packages the first chip, the first heat conducting lead and the first bonding lead;

removing a part of the first heat conducting wire, which is jointed with the first packaging substrate, so that one end of the first heat conducting wire, which is far away from the first chip, is exposed to the side wall surface of the first plastic packaging layer;

forming the first heat-conducting adhesive layer on the surface of the side wall of the first plastic packaging layer, wherein the first heat-conducting adhesive layer is in contact with the first heat-conducting lead;

and forming the first heat dissipation layer on the surface of the side wall of the first heat conduction adhesive layer.

Optionally, the process of forming the second package body includes:

providing the second package substrate, bonding the second chip to the upper surface of the second package substrate through a second bonding wire, and forming the second heat conducting wire, wherein one end of the second heat conducting wire is connected with the second chip, the other end of the second heat conducting wire extends to be bonded with the surface of the second package substrate, the maximum height of the second heat conducting wire is greater than the height of the second bonding wire, and the joint of the second heat conducting wire and the second package substrate is located at one end of the second bonding wire, which is far away from the second chip;

forming a second plastic package layer on the upper surfaces of the second package substrate, the second chip, the second heat conducting lead and the second bonding lead, wherein the second plastic package layer plastically packages the second chip, the second heat conducting lead and the second bonding lead;

removing a part of the second heat conducting wire bonded with the second packaging substrate to expose one end of the second heat conducting wire far away from the second chip to the side wall surface of the second plastic packaging layer;

forming a second heat-conducting adhesive layer on the surface of the side wall of the second plastic packaging layer, wherein the second heat-conducting adhesive layer is in contact with the second heat-conducting lead;

and forming the second heat dissipation layer on the surface of the side wall of the second heat conduction adhesive layer.

Optionally, the method for manufacturing the semiconductor package structure further includes a step of forming a first electrical connection structure in the first molding layer after the first package body is formed, and forming a second electrical connection structure in the second molding layer after the second package body is formed, and the first electrical connection structure and the second electrical connection structure are electrically connected in a process of bonding the first package body and the second package body.

Optionally, the method for manufacturing the semiconductor package structure further includes a step of sequentially forming a third thermal conductive adhesive layer and a third heat dissipation layer on the upper surface of the third plastic package layer.

As described above, the semiconductor package structure and the method for manufacturing the same of the present invention have the following advantages: the semiconductor packaging structure is provided with the heat dissipation layer at the periphery of the chip positioned in the middle of the laminated packaging structure so as to improve the heat dissipation of the laminated packaging structure, and simultaneously, the heat dissipated by the chip is conducted to the heat dissipation layer through the heat conduction lead, so that the quick heat dissipation of the chip is facilitated, the warping of a device caused by poor heat dissipation can be prevented, and the performance of the semiconductor packaging structure is facilitated to be improved. The preparation method can obviously improve the performance of the prepared semiconductor packaging structure.

Drawings

Fig. 1a to fig. 1c are schematic cross-sectional views illustrating a semiconductor package structure according to a first embodiment of the invention.

Fig. 2a and fig. 2b are schematic cross-sectional views illustrating a semiconductor package structure according to a second embodiment of the invention.

Fig. 3 is a flowchart illustrating a method for manufacturing a semiconductor package structure according to a third embodiment of the invention.

Fig. 4 to 8 are schematic cross-sectional views illustrating structures obtained in steps of forming a first package according to a third manufacturing method of the invention.

Description of the element reference numerals

1 first Package

11 first package substrate

12 first chip

13 first plastic packaging layer

14 first heat-conducting adhesive layer

15 first heat conducting wire

16 first heat dissipation layer

17 first electrical connection structure

18 first bonding wire

2 second package

21 second package substrate

22 second chip

23 second plastic packaging layer

24 second heat-conducting glue layer

25 second thermally conductive lead

26 second heat sink layer

27 second electrical connection structure

28 second bonding wire

3 third Package

31 third package substrate

32 third chip

33 third plastic packaging layer

34 third heat-conducting glue layer

35 third thermally conductive lead

36 third heat sink layer

37 third electrical connection structure

38 third bond wire

4 solder ball bump

5 underfill layer

S1-S4

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Please refer to fig. 1 to 8. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component in actual implementation may be changed at will, the layout of the components may be more complex, and "upper" and "lower" in the present embodiment are not strictly limited and are only for the convenience of description.

Example one

As shown in fig. 1a to 1c, the present invention provides a semiconductor package structure, including: the first package body 1, the first package body 1 includes a first package substrate 11, a first chip 12, a first molding compound layer 13, a first thermal conductive adhesive layer 14, a first thermal conductive lead 15 and a first heat dissipation layer 16; the first chip 12 is bonded to the upper surface of the first package substrate 11; the first plastic package layer 13 is located on the upper surfaces of the first package substrate 11 and the first chip 12, and is used for plastic packaging of the first chip 12; the first heat-conducting adhesive layer 14 is located on the side wall of the first plastic package layer 13; the first heat conducting lead 15 is located in the first plastic package layer 13, and two ends of the first heat conducting lead are respectively connected with the first chip 12 and the first heat conducting adhesive layer 14; the first heat dissipation layer 16 is located on the surface of the side wall of the first thermal conductive adhesive layer 14 away from the first plastic package layer 13; a second package 2 located above the first package 1; the second package body 2 includes a second package substrate 21, a second chip 22, a second plastic package layer 23, a second thermal conductive adhesive layer 24, a second thermal conductive wire 25, and a second heat dissipation layer 26; the second package substrate 21 is located above the first plastic package layer 13; the second chip 22 is bonded to the upper surface of the second package substrate 21; the second plastic package layer 23 is located on the upper surfaces of the second package substrate 21 and the second chip 22, and is used for plastic packaging of the second chip 22; the second thermal conductive adhesive layer 24 is located on the side wall of the second plastic package layer 23; the second heat conducting wire 25 is located in the second plastic package layer 23, and two ends of the second heat conducting wire are respectively connected with the second chip 22 and the second heat conducting adhesive layer 24; the second heat dissipation layer 26 is located on the surface of the sidewall of the second thermal conductive adhesive layer 24 away from the second molding compound layer 23; a third package 3 located above the second package 2; the third package 3 includes a third package substrate 31, a third chip 32 and a third molding compound layer 33; the third package substrate 31 is located above the second molding layer 23; the third chip 32 is bonded to the upper surface of the third package substrate 31; the third plastic package layer 33 is located on the upper surfaces of the third package substrate 31 and the third chip 32, and is used for plastic packaging the third chip 32. The semiconductor packaging structure is provided with the heat dissipation layer at the periphery of the chip positioned in the middle of the laminated packaging structure so as to improve the heat dissipation of the laminated packaging structure, and simultaneously, the heat dissipated by the chip is conducted to the heat dissipation layer through the heat conduction lead, so that the quick heat dissipation of the chip is facilitated, the warping of a device caused by poor heat dissipation can be prevented, and the performance of the semiconductor packaging structure is facilitated to be improved.

The material of the first package substrate 11 may be non-metal material such as silicon, glass, silicon oxide, ceramic, polymer, etc., or metal material such as copper (e.g., lead frame made of copper), or composite material of two or more kinds (e.g., PCB or flexible circuit board), and the shape of the first package substrate may be circular, square, or any other desired shape, and the surface area of the first package substrate is determined by the capability of carrying the subsequent structure. In this embodiment, for subsequent packaging, the surface area of the first package substrate 11 is larger than the surface area of the first chip 12, for example, the surface area of the first package substrate 11 is 1.1 to 2 times the surface area of the first chip 12.

The first chip 12, the second chip 22 and the third chip 32 may include various types of active or passive components, and the number of the active or passive components may be one or more, and when there are a plurality of chips in the same package, the plurality of chips may be stacked one on another or distributed at intervals on the same plane. In this embodiment, as an example, the first chip 12 is bonded to the upper surface of the first package substrate 11 by first bonding wires 18, that is, two ends of the first bonding wires 18 are respectively connected to the first package substrate 11 and the first chip 12, and a connection pad (not shown) may be disposed on the surface of the first chip 12 to be connected to the first bonding wire 18. The material of the first bonding wire 18 is preferably gold wire, because gold wire not only has good conductivity and oxidation resistance, but also has the characteristics of very good ductility and easy balling, and thus contributes to the improvement of the performance of the semiconductor package structure. Of course, in other examples, the first chip 12 may be fixed to the surface of the first package substrate 11 in other manners according to different needs, such as being soldered to the surface of the first package substrate 11 through a pad.

As an example, the material of the first molding compound layer 13 may include, but is not limited to, one or more of polyimide, silicone, or epoxy, and the first molding compound layer 13 preferably completely covers the upper surface of the first package substrate 11.

In one example, the first bonding wire 18 and the first heat conductive wire 15 are made of the same material, such as gold wire, so that the first heat conductive wire 15 and the first bonding wire 18 can be formed in the same process, which is beneficial to simplifying the manufacturing process. Of course, in other examples, the first thermally conductive lead 15 may also be other metal wires with good thermal conductivity, such as copper wire, aluminum wire, copper alloy wire, and the like, and the present embodiment is not limited strictly. The heat generated by the first chip 12 can be rapidly conducted to the first thermal conductive adhesive layer 14 through the first thermal conductive wire 15 and finally dissipated through the first heat dissipation layer 16. The number of the first heat conducting wires 15 and the number of the first bonding wires 18 are preferably multiple, for example, 2 or more, and 2 or more than 2 of the first heat conducting wires 15 are preferably located on multiple sides of the first chip 12, for example, symmetrically distributed on two sides of the first chip 12, so as to guide the heat dissipation of the first chip 12 out through multiple directions, thereby realizing uniform heat dissipation of the first chip 12 and improving the performance of the semiconductor package structure.

In a conventional semiconductor package structure, a thermal conductive adhesive made of an insulating material, such as silicon gel, is generally used. In this embodiment, the first thermal conductive adhesive layer 14 is preferably made of a material with electrical conductivity, such as an electrically conductive silver adhesive layer, so that the first heat dissipation layer 16 is grounded through the first thermal conductive adhesive layer 14, so that the first heat dissipation layer 16 can also play a role of electromagnetic shielding while realizing a heat dissipation function, thereby improving the performance of the semiconductor package structure.

The first heat dissipation layer 16 may be made of any material with good heat dissipation performance. In this embodiment, as an example, the first heat dissipation layer 16 includes a metal main body layer and a coating layer located on a surface of the metal main body layer; the metal main body layer can be a copper layer, an aluminum layer, a stainless steel layer, a copper alloy layer or a composite layer of a plurality of metal layers, and the coating layer can be a nickel layer, a chromium layer or other coatings with good rust prevention and oxidation resistance; the film coating layer is used for protecting the metal main body layer, so that the heat dissipation performance of the metal main body layer is prevented from being reduced due to oxidation and/or corrosion, and the heat dissipation performance of the first heat dissipation layer 16 is ensured. The surface area of the first heat dissipation layer 16 is usually not less than the surface area of the sidewall of the first molding layer 13, and the first heat dissipation layer 16 may be a customized integral structure to completely cover the sidewall of the first molding layer 13. The sidewall surface of the first heat dissipation layer 16 away from the first molding compound layer 13 may have a non-flat surface structure, such as a concave-convex structure, a corrugated structure, or any other irregular shape, so as to increase the surface area of the first heat dissipation layer 16, and meanwhile, the non-flat surface structure is disposed to avoid the problems of expansion deformation and stress of the first heat dissipation layer 16 when being heated, thereby ensuring the performance of the semiconductor package structure.

As an example, the second chip 22 is bonded to the upper surface of the second package substrate 21 by second bonding wires 28, and the third chip 32 is bonded to the upper surface of the third package substrate 31 by third bonding wires 38; the second package substrate 21 and the third package substrate 31 may be made of the same material as the first package substrate 11, and the second bonding wires 28, the third bonding wires 38 and the second heat conductive wires 25 are preferably made of the same material and are preferably made of the same material as the first bonding wires 18 and the first heat conductive wires 15, such as gold wires, and the number of the second bonding wires, the third bonding wires and the second heat conductive wires is preferably 2 or more, and the second bonding wires, the third bonding wires and the third heat conductive wires are preferably distributed in multiple directions of a corresponding chip, such as symmetrically distributed on two sides of the corresponding chip, so as to improve the electrical balance and the heat dissipation uniformity of the semiconductor package structure.

The material and structure of the second package substrate 21 are preferably the same as those of the first package substrate 11; the second heat dissipation layer 26 and the first heat dissipation layer 16 are preferably the same in material and structure, and have a non-flat surface structure on the surface as a composite layer of a metal main body layer and a coating layer; the second thermal conductive adhesive layer 24 and the first thermal conductive adhesive layer 14 are preferably made of the same material and structure, and are more preferably made of the same conductive silver adhesive layer; the materials and structures of the second plastic package layer 23 and the third plastic package layer 33 are preferably the same as those of the first plastic package layer 13, and more detailed description please refer to the foregoing contents than that of one or more of polyimide, silica gel, or epoxy resin, which is not repeated for brevity.

As an example, the semiconductor package structure further includes a third thermal adhesive layer 34, a third thermal wire 35, and a third heat dissipation layer 36; the third thermal adhesive layer 34 is located on the upper surface of the third plastic package layer 33; the third thermal conductive wire 35 is located in the third plastic package layer 33, and two ends of the third thermal conductive wire are connected to the third chip 32 and the third thermal conductive adhesive layer 34 respectively; the third heat dissipation layer 36 is located on the surface of the third thermal conductive adhesive layer 34 away from the third molding compound layer 33; the third thermal conductive wire 35 is preferably made of the same material as the third bonding wire 38, the third thermal conductive adhesive layer 34 is preferably made of the same material as the first thermal conductive adhesive layer 14 and the second thermal conductive adhesive layer 24, and the third heat dissipation layer 36 is preferably made of the same material as the first heat dissipation layer 16 and the second heat dissipation layer 26.

As an example, the semiconductor package structure further includes a plurality of electrical connection structures, such as a first electrical connection structure 17 distributed in the first molding layer 13 and a second electrical connection structure 27 distributed in the second molding layer 23, to electrically connect the first package body 1, the second package body 2 and the third package body 3. As shown in fig. 1a, the first electrical connection structure 17 and the second electrical connection structure 27 may be conductive plugs, and are located in the corresponding plastic package layers, so that the first package body 1 may be attached to the second package body 2, that is, the second package body 2 is located on the upper surface of the first package body 1; the second package 2 may be attached to the third package 3, that is, the third package 3 is located on the upper surface of the second package 2; according to different structures, such as different materials of the first package substrate 11, the second package substrate 21 and the third package substrate 31, the first electrical connection structure 17 may extend downward from the first molding compound 13 to penetrate through the first package substrate 11, and the second electrical connection structure 27 may extend downward from the second molding compound 23 to penetrate through the second package substrate 21 to electrically connect the first package body 1 and the second package body 2; a third electrical connection structure 37 may be disposed in the third package substrate 31 to be electrically connected with the second electrical connection structure 27. The design of the electric connection structure helps to improve the stability of the semiconductor packaging structure and is beneficial to further miniaturization of the semiconductor packaging structure.

As shown in fig. 1b, in another example, the electrical connection structure may further include a metal solder ball (not labeled) located between two adjacent packages besides the conductive plug, where the metal solder ball is connected to the conductive plug to achieve electrical connection between the multiple packages, and then a gap may be formed between the adjacent packages, and the connected packages are electrically connected through the metal solder ball. This electrical connection structure design facilitates alignment when bonding different packages.

As shown in fig. 1c, in another example, the electrical connection structure also includes a conductive plug and a metal solder ball, unlike fig. 1b, the metal solder ball in fig. 1b is located in a gap between two adjacent packages, and the metal solder ball in this embodiment is located in a molding compound of the package, for example, the metal solder ball between the first package 1 and the second package 2 is located in the first molding compound 13 of the first package 1 and exposed on a top surface of the first molding compound 13; the metal solder balls between the second package body 2 and the third package body 3 are located in the second molding layer 23 and exposed to the top surface of the second molding layer 23; the second package body 2 is positioned on the upper surface of the first package body 1, and the third package body 3 is positioned on the upper surface of the second package body 2; this arrangement of the structure not only facilitates the bonding alignment, but also contributes to the stability and miniaturization of the structure. Of course, such a structure is relatively complicated in manufacturing, for example, after the corresponding metal solder balls are formed in the corresponding plastic package layer, the surface is planarized to make the corresponding metal solder balls flush with the upper surface of the corresponding plastic package layer.

As an example, the semiconductor package structure further has solder ball bumps 4, the solder ball bumps 4 are located on a lower surface of the first package substrate 11 (i.e., a surface opposite to the surface on which the first chip 12 is located) and electrically connected to the electrical connection structure, and the material of the solder ball bumps 4 may include at least one of copper and tin; the solder ball bumps 4 may also be connected to the first package substrate 11 through bonding pads (not shown); the solder ball bumps 4 are preferably distributed at intervals so as to lead out the semiconductor packaging structure electrically.

As an example, the semiconductor package structure further has an underfill layer 5, the underfill layer 5 is located on the lower surface of the first package substrate 11 and partially covers the solder ball bumps 4, and the lower surfaces of the solder ball bumps 4 protrude outward from the surface of the underfill layer 5; the material of the underfill layer 5 may include, but is not limited to, one or more of polyimide, silicone, and epoxy, and the process for forming the underfill layer 5 may include, but is not limited to, one or more of an inkjet process, a dispensing process, a compression molding process, a transfer molding process, a liquid seal molding process, a vacuum lamination process, or a spin coating process; the underfill layer 5 can protect the solder ball bumps 4 and also buffer the semiconductor package structure.

The heat dissipation performance of the semiconductor packaging structure can be obviously improved, so that the warping of a device caused by poor heat dissipation is avoided, and the electrical property of the semiconductor packaging structure is improved.

Example two

As shown in fig. 2a and fig. 2b, the present invention further provides a semiconductor package structure with another structure, and the semiconductor package structure of this embodiment is different from the semiconductor package structure of the first embodiment in that: in the semiconductor package structure of the first embodiment, the first thermal adhesive layer 14 and the second thermal adhesive layer 24 are spaced apart from each other, and the first heat dissipation layer 16 and the second heat dissipation layer 26 are spaced apart from each other, so that there is a problem that each structural layer lacks support of other structures, and may collapse to affect device performance in case of accidental impact; in the present embodiment, as an example, the first thermal conductive adhesive layer 14 is in contact with the second thermal conductive adhesive layer 24, the first heat dissipation layer 16 is in contact with the second heat dissipation layer 26, that is, the second heat dissipation layer 26 may extend downward to be in contact with the first heat dissipation layer 16, and the second thermal conductive adhesive layer 24 may extend downward to be in contact with the first thermal conductive adhesive layer 14; or the first thermal conductive adhesive layer 14 and the second thermal conductive adhesive layer 24 may be an integral structure, and are simply divided into two parts according to the positions of the two parts; the first heat dissipation layer 16 and the second heat dissipation layer 26 can be an integral structure, and are divided into two parts according to different positions; in a further example, the third thermal adhesive layer 34 may extend down the sidewalls of the third molding layer 33 to contact the second thermal adhesive layer 24, and the third heat spreading layer 36 may extend down the sidewalls of the third thermal adhesive layer 34 to contact the second heat spreading layer 26; the underfill layer 5 may also extend to the sidewall of the first package substrate 11 to contact the first thermal adhesive layer 14 and the first heat dissipation layer 16, or the first heat dissipation layer 16 and the first thermal adhesive layer 14 may extend down to the sidewall surface of the first package substrate 11 until contacting the underfill layer 5. Through the design, the semiconductor packaging structure is more stable. In addition, other parts of the semiconductor package structure of the present embodiment are the same as those of the first embodiment, and for brevity, please refer to the foregoing details.

EXAMPLE III

As shown in fig. 3, the present invention further provides a method for manufacturing a semiconductor package structure, which can be used for manufacturing the semiconductor package structure according to the first embodiment, so that the above description of the semiconductor package structure is fully applicable here, and the same contents are not repeated as much as possible for the sake of brevity; similarly, the contents mentioned in the present manufacturing method are also fully applicable to the aforementioned semiconductor package structure.

The preparation method of the semiconductor packaging structure comprises the following steps:

s1: forming a first package body 1, wherein the first package body 1 comprises a first package substrate 11, a first chip 12, a first molding compound layer 13, a first heat conduction lead 15, a first heat conduction adhesive layer 14 and a first heat dissipation layer 16; the first chip 12 is bonded to the upper surface of the first package substrate 11; the first plastic package layer 13 is located on the upper surfaces of the first package substrate 11 and the first chip 12, and is used for plastic packaging of the first chip 12; the first heat-conducting adhesive layer 14 is located on the side wall of the first plastic package layer 13; the first heat conducting lead 15 is located in the first plastic package layer 13, and two ends of the first heat conducting lead are respectively connected with the first chip 12 and the first heat conducting adhesive layer 14; the first heat dissipation layer 16 is located on the surface of the side wall of the first thermal conductive adhesive layer 14 away from the first plastic package layer 13;

s1: forming a second package body 2, wherein the second package body 2 includes a second package substrate 21, a second chip 22, a second molding layer 23, a second thermal conductive wire 25, a second thermal conductive adhesive layer 24, and a second heat dissipation layer 26; the second chip 22 is bonded to the upper surface of the second package substrate 21; the second plastic package layer 23 is located on the upper surfaces of the second package substrate 21 and the second chip 22, and is used for plastic packaging of the second chip 22; the second thermal conductive adhesive layer 24 is located on the side wall of the second plastic package layer 23; the second heat conducting wire 25 is located in the second plastic package layer 23, and two ends of the second heat conducting wire are respectively connected with the second chip 22 and the second heat conducting adhesive layer 24; the second heat dissipation layer 26 is located on the surface of the sidewall of the second thermal conductive adhesive layer 24 away from the second molding compound layer 23;

s1: bonding the first package body 1 and the second package body 2, wherein the upper surface of the first molding compound layer 13 of the first package body 1 and the lower surface of the second package substrate 21 of the second package body 2 are bonding surfaces;

s1: bonding the structure obtained after bonding with the third package body 3; the third package body 3 includes a third package substrate 31, a third chip 32 and a third plastic package layer 33, the third chip 32 is bonded to the upper surface of the third plastic package layer 33, the third plastic package layer 33 is located on the upper surfaces of the third package substrate 31 and the third chip 32, and the third chip 32 is plastic-packaged; the lower surface of the third package substrate 31 and the upper surface of the second plastic package layer 23 are bonding surfaces.

The materials of the first package substrate 11, the second package substrate 21, and the third package substrate 31 may be selected according to different requirements, for example, the materials may be non-metallic materials such as silicon, glass, silicon oxide, ceramic, polymer, etc., or metallic materials such as copper, or a composite material of two or more, the shape of the composite material may be circular, square, or any other desired shape, and the surface area of the composite material is determined by the capability of supporting a subsequent structure. In this embodiment, for subsequent packaging, the surface areas of the first package substrate 11, the second package substrate 21 and the third package substrate 31 are larger than the surface area of the corresponding chip, for example, 1.1 to 2 times of the surface area of the corresponding chip. In this embodiment, the chips are bonded to the corresponding package substrates through wire bonding, i.e., through corresponding bonding wires. Of course, in other examples, the chip may be soldered on the corresponding package substrate by using a die bonding (die bonding), which is not strictly limited in this embodiment.

As an example, the process of forming the heat conducting wires is also through a wire bonding process, the heat conducting wires and the corresponding bonding wires in the same package body are preferably formed in the same process, and the heat conducting wires and the bonding wires are preferably made of the same material, and are more like gold wires; therefore, the bonding wire and the heat conducting wire in the same packaging body can be synchronously formed without replacing equipment and materials, and the preparation process is simplified.

The materials of the first molding compound layer 13, the second molding compound layer 23 and the third molding compound layer 33 may include, but are not limited to, one or more of polyimide, silicone and epoxy resin, and the process for forming the molding compound layer may include, but is not limited to, one or more of an inkjet process, a dispensing process, a compression molding process, a transfer molding process, a liquid sealing process, a vacuum lamination process or a spin coating process. The thickness of the third molding compound layer 33 may be greater than the thickness of the first molding compound layer 13 and the thickness of the second molding compound layer 23, so as to form a buffer protection for the semiconductor package structure.

The first thermal adhesive layer 14, the second thermal adhesive layer 24 and the third thermal adhesive layer 34 may be insulating material layers, such as silica gel layers; in this embodiment, the first thermal conductive adhesive layer 14, the second thermal conductive adhesive layer 24, and the third thermal conductive adhesive layer 34 are preferably made of a material layer with an electrical conductive function, such as an electrical conductive silver adhesive layer, so as to ground the heat dissipation layers located in the same package through the corresponding thermal conductive adhesive layers, so that the heat dissipation layers can perform an electromagnetic shielding function while achieving a heat dissipation function, thereby improving the performance of the semiconductor package structure; the process of forming the thermal conductive adhesive layer may include, but is not limited to, one or more of an inkjet process, a dispensing process, a compression molding process, a transfer molding process, a liquid sealing process, a vacuum lamination process, or a spin coating process; in this embodiment, an inkjet or dispensing process is preferred, so that the thickness and shape of the thermal conductive adhesive layer can be flexibly adjusted according to different package conditions. Particularly, in the process of forming the third thermal conductive adhesive layer 34, the third thermal conductive adhesive layer 34 with a non-flat surface structure can be formed through an inkjet or dispensing process, so that the third heat dissipation layer 36 with a non-flat surface structure can be formed through a physical vapor deposition or electroplating process, so that the third heat dissipation layer 36 has a larger heat dissipation surface area, and deformation caused by thermal expansion and/or adverse effects caused by stress can be avoided; meanwhile, the third thermal adhesive layer 34 and the third heat dissipation layer 36 can be made to be more closely fitted.

Certainly, in other examples, the third heat dissipation layer 36 may also be a heat dissipation sheet customized in advance, and the heat dissipation sheet is attached to the third thermal conductive adhesive layer 34 to form the third heat dissipation layer 36, which is not strictly limited in this embodiment, and the surface area of the heat dissipation sheet is preferably slightly larger than the surface area of the third thermal conductive adhesive layer 34, so that after the heat dissipation sheet is attached to the third thermal conductive adhesive layer 34, the edge of the heat dissipation sheet can be bent downward along the sidewall of the third thermal conductive adhesive layer 34 until covering a part of the sidewall of the third molding compound layer 33, so that the heat dissipation sheet and the third thermal conductive adhesive layer 34 are attached more tightly and firmly, a heat dissipation channel on the side surface is provided for the semiconductor package structure, and the performance of the semiconductor package structure is further improved. The first heat dissipation layer 16 and the second heat dissipation layer 26 are preferably customized metal heat sinks, such as heat sinks with a square hollow frame structure, so as to respectively coat the peripheries of the first thermal adhesive layer 14 and the second thermal adhesive layer 24, so as to provide a heat dissipation channel with all directions in the circumferential direction for a corresponding package, thereby improving the performance of the semiconductor package structure.

As an example, the process of forming the first package 1 includes: providing the first package substrate 11, bonding the first chip 12 to the upper surface of the first package substrate 11 through a first bonding wire 18, and forming the first heat conducting wire 15, where one end of the first heat conducting wire 15 is connected to the first chip 12, and the other end extends to be bonded to the surface of the first package substrate 11, the maximum height of the first heat conducting wire 15 is greater than the height of the first bonding wire 18, and the joint of the first heat conducting wire 15 and the first package substrate 11 is located at the end of the first bonding wire 18 away from the first chip 12, as shown in fig. 4 in particular; forming the first plastic package layer 13 on the upper surfaces of the first package substrate 11, the first chip 12, the first heat conducting wire 15, and the first bonding wire 18, wherein the first plastic package layer 13 is used for plastic packaging the first chip 12, the first heat conducting wire 15, and the first bonding wire 18, as shown in fig. 5; removing a portion where the first thermal conductive wire 15 and the first package substrate 11 are bonded (an area shown by a dashed line frame in fig. 5) to expose an end of the first thermal conductive wire 15 away from the first chip 12 to a sidewall surface of the first molding compound 13, and obtaining a structure shown in fig. 6; forming the first thermal conductive adhesive layer 14 on the surface of the sidewall of the first molding compound layer 13, wherein the first thermal conductive adhesive layer 14 is in contact with the first thermal conductive lead 15; the first heat dissipation layer 16 is formed on the sidewall surface of the first thermal conductive adhesive layer 14, and the obtained structure is shown in fig. 7 and 8, where fig. 7 is a schematic cross-sectional structure, and fig. 8 is a schematic top-view structure.

It should be particularly noted that, although the process of forming the first package 1 is divided into a plurality of steps for the sake of simplicity, the steps are not strictly distinguished and have no strict sequence restriction, for example, the step of forming the first heat-conducting wire 15 and the step of bonding the first chip 12 to the upper surface of the first package substrate 11 may be completed simultaneously in the same process, or the bonding of the first chip 12 may be completed first and then the first heat-conducting wire 15 is formed; it is also possible to form the first thermally conductive wire 15 and then bond the first chip 12 to the first package substrate 11, and it is important to design the first thermally conductive wire according to the process selected in each step. In this embodiment, as an example, the first chip 12 is bonded to the upper surface of the first package substrate 11 by a first bonding wire 18, the first heat conducting wire 15 and the first bonding wire 18 are formed in the same process, so that in the process of bonding the first chip 12 to the upper surface of the first package substrate 11, that is, in the process of forming the first bonding wire 18, a first heat conducting wire 15 is further formed on the surface of the first chip 12, the first heat conducting wire 15 extends from the surface of the first chip 12 to be bonded to the surface of the first package substrate 11, that is, one end of the first heat conducting wire 15 is bonded to the first chip 12, and the other end of the first heat conducting wire 15 is bonded to the first package substrate 11; the maximum height of the first heat conducting wire 15 is greater than the height of the first bonding wire 18, and the joint point of the first heat conducting wire 15 and the first package substrate 11 is located at the periphery of the joint point of the first bonding wire 18 and the first chip 12 (i.e. the end far away from the first chip 12), then the first molding compound layer 13 completely molds the first chip 12, the first bonding wire 18 and the first heat conducting wire 15 in the molding process, and after the first molding compound layer 13 is formed, the joint part of the first heat conducting wire 15 and the first package substrate 11 is removed (i.e. the area marked by the dashed line frame in fig. 5 is removed), so as to obtain the first package 1 shown in fig. 6, and if necessary, planarization may be performed, so as to further miniaturize the semiconductor package structure.

In this embodiment, the bonding points of the first thermal conductive wires 15 and the first package substrate 11 are distributed on two sides of the first package substrate 11 (as shown in fig. 4), so that two removal processes (for example, a cutting process) are required to be performed subsequently when the bonding portion is removed, so as to form the first thermal conductive wires 15 located in multiple directions, which is beneficial to uniform heat dissipation of the first package body 1 and avoids performance degradation caused by poor local heat dissipation. If the first heat dissipation layer 16 has a customized specification, the joints between the first thermal conductive leads 15 and the first package substrate 11 are preferably pre-arranged, for example, joint marks are pre-arranged on the first package substrate 11 (taking into account the thickness of the first thermal conductive adhesive layer 14) to ensure that the package structure size after cutting the joints matches with the first heat dissipation layer 16.

As an example, the method for manufacturing the semiconductor package structure further includes forming a first electrical connection structure 17 in the first molding compound layer 13 after forming the first package body 1, for example, etching a through hole in the first molding compound layer 13 by using an etching process (for example, laser etching), and then filling metal in the through hole by using an electroplating process or a physical vapor deposition process to form the first electrical connection structure 17, where the first electrical connection structure 17 may penetrate through the first package substrate 11 all the time to achieve electrical leading of the first package body 1, and the through hole may have a larger top opening for metal filling, and at the same time, a metal solder ball may be formed in the top opening of the through hole to ensure sufficient electrical connection with the second package body 2 subsequently. This step may be performed before the first heat dissipation layer 16 is formed, or may be performed after the first heat dissipation layer 16 is formed, and in this embodiment, it is preferably performed before the first heat dissipation layer 16 is formed, or more specifically, before the joint between the first bonding wire 18 and the first package substrate 11 is removed, so that during the process of forming the through hole in the first plastic package layer 13, the portion that has not been cut away can form a good protection for other structures (for example, the first plastic package layer 13 that has not been cut away can disperse the stress during the process of forming the through hole, and reduce the possibility of cracks or even collapse of the first plastic package layer 13 during the process of forming the through hole). In addition, according to needs, surface planarization may be performed after the first electrical connection structure 17 is formed, so that the upper surface of the first electrical connection structure 17 is flush with the upper surface of the first molding compound layer 13 and the upper surface of the first electrical connection structure 17 is ensured to be exposed to the upper surface of the first molding compound layer 13, and the planarization process facilitates the subsequent bonding of the first package body 10 and the second package body 20 to be more compact.

As an example, the process of forming the second package body 2 may be completely the same as the process of forming the first package body 1, such as specifically including: providing the second package substrate 21, bonding the second chip 22 to the upper surface of the second package substrate 21 through a second bonding wire 28, and forming the second heat conducting wire 25, where one end of the second heat conducting wire 25 is connected to the second chip 22, and the other end extends to be bonded to the surface of the second package substrate 21, the maximum height of the second heat conducting wire 25 is greater than the height of the second bonding wire 28, and the joint of the second heat conducting wire 25 and the second package substrate 21 is located at the end of the second bonding wire 28 away from the second chip 22; forming the second plastic package layer 23 on the upper surfaces of the second package substrate 21, the second chip 22, the second heat conducting wire 25 and the second bonding wire 28, wherein the second plastic package layer 23 plastic packages the second chip 22, the second heat conducting wire 25 and the second bonding wire 28; removing a portion where the second thermal conductive wire 25 and the second package substrate 21 are bonded so that an end of the second thermal conductive wire 25 away from the second chip 22 is exposed to a sidewall surface of the second molding layer 23; forming the second thermal conductive adhesive layer 24 on the sidewall surface of the second molding compound layer 23, wherein the second thermal conductive adhesive layer 24 is in contact with the second thermal conductive wire 25; the second heat dissipation layer 26 is formed on the sidewall surface of the second thermal conductive adhesive layer 24. Please refer to the foregoing for more details, which are not repeated for brevity, and a second electrical connection structure 27 may also be formed in the second molding compound layer 23 after the second package body 2 is formed, the second electrical connection structure 27 may also penetrate the second package substrate 21, the forming process of the second electrical connection structure 27 may refer to the forming process of the first electrical connection structure 17, and is preferably completed before the joint of the second bonding wire 28 and the second package substrate 21 is removed; the first electrical connection structure 17 and the second electrical connection structure are electrically connected in the process of bonding the first package 1 and the second package 2. And if necessary, a planarization process may also be performed after the second electrical connection structure 27 is formed to make the upper surface of the second electrical connection 27 and the upper surface of the second molding layer 23 flush.

As an example, the method for manufacturing the semiconductor package structure further includes a step of sequentially forming a third thermal conductive adhesive layer 34 and a third heat dissipation layer 36 on the upper surface of the third molding compound layer 33, where the third chip 32 is bonded to the upper surface of the third package substrate 31 through a third bonding wire 38, and in the process of bonding the third chip 32 to the upper surface of the third package substrate 31 through the third bonding wire 38, a step of forming a third thermal conductive wire 35, where the third thermal conductive wire 35 is molded by the third molding compound layer 33 and extends upward along the third molding compound layer 33, and one end of the third thermal conductive wire 35 is exposed on the surface of the third molding compound layer 33 and contacts with the subsequently formed third thermal conductive adhesive layer 34. This process can be referred to as the above, for example, in the process of bonding the third chip 32 to the upper surface of the third package substrate 31 through the third bonding wires 38, forming the third thermally conductive wire 35 having a maximum height greater than the height of the third bond wire 38, the junction point of the third thermal conductive wire 35 and the third package substrate 31 is located at the periphery of the junction point of the third bonding wire 38 and the third package substrate 31 (i.e. the end away from the third chip 32), then, the third molding compound layer 33 is formed to complete the molding of the third chip 32, the third bonding wires 38, and the third heat conductive wires 35, and then the bonding portions of the third heat conductive wires 35 and the third package substrate 31 are removed by a cutting process, and one end of the third thermally conductive wire 35 is exposed to the surface of the third molding layer 33 through a planarization process. The third heat conducting adhesive layer 34 is formed by a process of preferably performing ink-jet and spot gluing processes so as to form a composite structure with a non-flat surface structure on the surface, the third heat conducting adhesive layer 34 is preferably made of conductive silver adhesive, the third heat dissipation layer 36 can be a composite structure comprising a metal main body layer and a coating layer positioned on the surface of the metal main body layer, and can also be a graphene layer, and the surface of the third heat dissipation layer 36 is preferably provided with a non-flat surface structure so as to increase the heat dissipation area and avoid the problems of device deformation, stress and the like caused by thermal expansion.

As an example, the method for manufacturing the semiconductor package structure further includes a step of forming an underfill layer 5 on a lower surface of the first package substrate 11; the material of the underfill layer 5 may include, but is not limited to, one or more of polyimide, silicone, and epoxy, and the step of forming the underfill layer 5 includes, but is not limited to, one or more of an inkjet process, a dispensing process, a compression molding process, a transfer molding process, a liquid sealing process, a vacuum lamination process, or a spin coating process. The underfill layer 5 may further extend along the sidewall of the first package substrate 11 until contacting the first thermal conductive adhesive layer 14 and the first heat dissipation layer 16 to support the first heat dissipation layer 16 and the first thermal conductive adhesive layer 14, so as to enhance the stability of the semiconductor package structure.

As an example, the preparation method further includes a step of forming a solder ball bump 4 after forming the underfill layer 5, such as forming a through hole in the underfill layer 5 to expose the first electrical connection structure 17, and then depositing metal in the formed through hole by a process such as physical vapor deposition or electroplating to form the solder ball bump 4, where the solder ball bump 4 is electrically connected to the first package substrate 11 (such as correspondingly connected to the first electrical connection structure 17 penetrating through the first package substrate 11) and is partially covered by the underfill layer 5, that is, the solder ball bump 4 protrudes outward from the surface of the underfill layer 5, and the solder ball bump 4 is used to electrically lead out the semiconductor package structure, and the material of the solder ball bump 4 includes, but is not limited to, one or more of copper or tin; the underfill layer 5 can provide good protection for the solder ball bumps 4 and the first chip 12. The structure finally prepared by the preparation method of this example is shown in fig. 1.

It should be noted that the forming sequence of the above steps is not strictly limited, for example, the first package 1, the second package 2, and the third package 3 may be formed synchronously in different devices, or may be formed sequentially in the same device, and the third package 3 and the second package 2 may be bonded first and then bonded to the first package 1; the underfill layer 5 and the solder ball bump 4 may be formed after bonding of the three packages is completed, or the solder ball bump 4 and the underfill layer 5 may be formed before the bottom of the first package 1 and then bonded to the second package 2 or bonded to the structure formed by bonding the second package 2 and the third package 3, which is not strictly limited in this embodiment.

Example four

The present embodiment provides another method for manufacturing a semiconductor package structure, and the method of the present embodiment can be used to manufacture the semiconductor package structure in the second embodiment; the main difference between the manufacturing method of the semiconductor package structure of the present embodiment and the third embodiment is that: in the third embodiment, in the process of forming the first package body 1, after the bonding portion between the first thermal conductive wire 15 and the first package substrate 11 is removed, the first thermal conductive adhesive layer 14 and the first heat dissipation layer 16 are formed on the sidewall of the first molding compound layer 13; in the process of forming the second package body 2, after the joint portion between the second thermal conductive lead 25 and the second package substrate 21 is removed, the second thermal conductive adhesive layer 24 and the second heat dissipation layer 26 are formed on the sidewall of the second molding compound layer 23, and then the first package body 1 and the third package body 3 are bonded; in the embodiment, in the process of forming the first package body 1, the first thermal adhesive layer 14 and the first heat dissipation layer 16 are not formed first after the bonding portion between the first thermal lead 15 and the first package substrate 11 is removed; in the process of forming the second package 2, after the joint portion between the second heat conducting wire 25 and the second package substrate 21 is removed, the second heat conducting adhesive layer 24 and the second heat dissipation layer 26 are not formed, but the first heat conducting adhesive layer 14, the second heat conducting adhesive layer 24, the first heat dissipation layer 16 and the second heat dissipation layer 26 are formed on the side walls of the first molding compound layer 13 and the second molding compound layer 23 in sequence after the two packages are bonded; the first thermal conductive adhesive layer 14 and the second thermal conductive adhesive layer 24 may be independent structures in contact with each other or may be a continuous integrated structure, and the first heat dissipation layer 16 and the second heat dissipation layer 26 may be independent structures in contact with each other or may be a continuous integrated structure.

In yet another example, the first thermal conductive adhesive layer 14 and the first heat dissipation layer 16 may not be formed first after the bonding portions of the first thermal conductive leads 15 and the first package substrate 11 are removed in the formation process of the first package body 1; in the process of forming the second package 2, after the joint portion between the second thermal conductive lead 25 and the second package substrate 21 is removed, the second thermal conductive adhesive layer 24 and the second heat dissipation layer 26 are not formed, but three package preforms without the thermal conductive adhesive layers and the heat dissipation layers are bonded first, and then the first thermal conductive adhesive layer 14, the second thermal conductive adhesive layer 24, the third thermal conductive adhesive layer 34, the first heat dissipation layer 16, the second heat dissipation layer 26, and the third heat dissipation layer 36 are formed in sequence; or the third thermal adhesive layer 34 is formed on the surface of the third plastic package layer 33, and the third thermal adhesive layer 34 extends downward from the sidewall of the third plastic package layer 33 to the second plastic package layer 23 and the sidewall of the first plastic package layer 13 (and can also extend up to the sidewall of the first package substrate 11. at this time, the first thermal adhesive layer 14, the second thermal adhesive layer 24 and the third thermal adhesive layer 34 are substantially an integral structure, and are defined according to the difference of the positions thereof so as to facilitate the clarity and unification of description), and then the third heat dissipation layer 36 is formed on the surface of the third thermal adhesive layer 34, and the third heat dissipation layer 36 extends downward along the sidewall of the third thermal adhesive layer 34 to the sidewalls of the second thermal adhesive layer 24 and the first thermal adhesive layer 14, that is, the third heat dissipation layer 36, the second heat dissipation layer 26 and the first heat dissipation layer 16 can also be an integral structure, and are distinguished according to the difference of the positions thereof The definition is convenient for clarity and uniformity of description, and through the arrangement, the semiconductor packaging structure is further stabilized, meanwhile, a more comprehensive heat dissipation channel is provided for the semiconductor packaging structure, and the performance of the semiconductor packaging structure is improved. In addition, the preparation method of this embodiment is substantially the same as the preparation method of the third embodiment, for example, the material selection and the formation process of each structural layer are the same, and specific reference is made to the foregoing contents, which are not repeated for the sake of brevity.

In summary, the present invention provides a semiconductor package structure and a method for fabricating the same. The semiconductor package structure includes: the first package body comprises a first package substrate, a first chip, a first plastic package layer, a first heat-conducting adhesive layer, a first heat-conducting lead and a first heat dissipation layer; the first chip is bonded on the upper surface of the first packaging substrate; the first plastic package layer is positioned on the upper surfaces of the first package substrate and the first chip and is used for plastic packaging the first chip; the first heat-conducting adhesive layer is positioned on the side wall of the first plastic packaging layer; the first heat conducting lead is positioned in the first plastic packaging layer, and two ends of the first heat conducting lead are respectively connected with the first chip and the first heat conducting adhesive layer; the first heat dissipation layer is positioned on the surface of the side wall of the first heat conduction adhesive layer, which is far away from the first plastic packaging layer; a second package body positioned above the first package body; the second packaging body comprises a second packaging substrate, a second chip, a second plastic packaging layer, a second heat-conducting adhesive layer, a second heat-conducting lead and a second heat dissipation layer; the second packaging substrate is positioned above the first plastic packaging layer; the second chip is bonded on the upper surface of the second packaging substrate; the second plastic packaging layer is positioned on the upper surfaces of the second packaging substrate and the second chip and is used for plastic packaging of the second chip; the second heat-conducting adhesive layer is positioned on the side wall of the second plastic packaging layer; the second heat conduction lead is positioned in the second plastic packaging layer, and two ends of the second heat conduction lead are respectively connected with the second chip and the second heat conduction adhesive layer; the second heat dissipation layer is positioned on the surface of the side wall of the second heat conduction adhesive layer, which is far away from the second plastic packaging layer; a third package body positioned above the second package body; the third packaging body comprises a third packaging substrate, a third chip and a third plastic packaging layer; the third packaging substrate is positioned above the second plastic packaging layer; the third chip is bonded on the upper surface of the third packaging substrate; and the third plastic package layer is positioned on the upper surfaces of the third package substrate and the third chip and is used for plastic package of the third chip. The semiconductor packaging structure is provided with the heat dissipation layer at the periphery of the chip positioned in the middle of the laminated packaging structure so as to improve the heat dissipation of the laminated packaging structure, and simultaneously, the heat dissipated by the chip is conducted to the heat dissipation layer through the heat conduction lead, so that the quick heat dissipation of the chip is facilitated, the warping of a device caused by poor heat dissipation can be prevented, and the performance of the semiconductor packaging structure is facilitated to be improved.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A semiconductor package structure, comprising:

the first package body comprises a first package substrate, a first chip, a first plastic package layer, a first heat-conducting adhesive layer, a first heat-conducting lead and a first heat dissipation layer; the first chip is bonded on the upper surface of the first packaging substrate; the first plastic package layer is positioned on the upper surfaces of the first package substrate and the first chip and is used for plastic packaging the first chip; the first heat-conducting adhesive layer is positioned on the side wall of the first plastic packaging layer; the first heat conducting lead is positioned in the first plastic packaging layer, and two ends of the first heat conducting lead are respectively connected with the first chip and the first heat conducting adhesive layer; the first heat dissipation layer is positioned on the surface of the side wall of the first heat conduction adhesive layer, which is far away from the first plastic packaging layer;

a second package body positioned above the first package body; the second packaging body comprises a second packaging substrate, a second chip, a second plastic packaging layer, a second heat-conducting adhesive layer, a second heat-conducting lead and a second heat dissipation layer; the second packaging substrate is positioned above the first plastic packaging layer; the second chip is bonded on the upper surface of the second packaging substrate; the second plastic packaging layer is positioned on the upper surfaces of the second packaging substrate and the second chip and is used for plastic packaging of the second chip; the second heat-conducting adhesive layer is positioned on the side wall of the second plastic packaging layer; the second heat conduction lead is positioned in the second plastic packaging layer, and two ends of the second heat conduction lead are respectively connected with the second chip and the second heat conduction adhesive layer; the second heat dissipation layer is positioned on the surface of the side wall of the second heat conduction adhesive layer, which is far away from the second plastic packaging layer;

a third package body positioned above the second package body; the third packaging body comprises a third packaging substrate, a third chip and a third plastic packaging layer; the third packaging substrate is positioned above the second plastic packaging layer; the third chip is bonded on the upper surface of the third packaging substrate; and the third plastic package layer is positioned on the upper surfaces of the third package substrate and the third chip and is used for plastic package of the third chip.

2. The semiconductor package structure of claim 1, wherein: the first chip is bonded to the upper surface of the first package substrate through a first bonding wire, the second chip is bonded to the upper surface of the second package substrate through a second bonding wire, and the first bonding wire, the second bonding wire, the first heat conducting wire and the second heat conducting wire are made of the same material.

3. The semiconductor package structure of claim 1, wherein: the first heat-conducting adhesive layer is in contact with the second heat-conducting adhesive layer, and the first heat dissipation layer is in contact with the second heat dissipation layer.

4. The semiconductor package structure of claim 1, wherein: the semiconductor packaging structure further comprises a plurality of electric connection structures, and the electric connection structures are distributed in the first plastic packaging layer and the second plastic packaging layer so as to electrically connect the first packaging body, the second packaging body and the third packaging body.

5. The semiconductor package structure of any one of claims 1 to 4, wherein: the semiconductor packaging structure further comprises a third heat-conducting adhesive layer, a third heat-conducting lead and a third heat dissipation layer; the third heat-conducting adhesive layer is positioned on the upper surface of the third plastic packaging layer; the third heat-conducting lead is positioned in the third plastic packaging layer, and two ends of the third heat-conducting lead are respectively connected with the third chip and the third heat-conducting adhesive layer; the third heat dissipation layer is located on the surface, far away from the third plastic packaging layer, of the third heat conduction adhesive layer.

6. The semiconductor package structure of claim 5, wherein: the third heat dissipation layer extends downwards along the side wall of the third heat conduction glue layer to be in contact with the second heat dissipation layer.

7. A preparation method of a semiconductor packaging structure is characterized by comprising the following steps:

8. The method for manufacturing a semiconductor package structure according to claim 7, wherein the process of forming the first package body comprises:

9. The method for manufacturing a semiconductor package structure according to claim 7, wherein the process of forming the second package body comprises:

10. The method of manufacturing a semiconductor package structure according to claim 7, further comprising the steps of forming a first electrical connection structure in the first molding layer after the first package body is formed, and forming a second electrical connection structure in the second molding layer after the second package body is formed, wherein the first electrical connection structure and the second electrical connection structure are electrically connected during the bonding of the first package body and the second package body.

11. The method for manufacturing a semiconductor package structure according to any one of claims 7 to 10, wherein: the preparation method of the semiconductor packaging structure further comprises the step of sequentially forming a third heat-conducting adhesive layer and a third heat dissipation layer on the upper surface of the third plastic packaging layer.