CN112183398A - Display substrate, manufacturing method thereof and display device - Google Patents

Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to improve fingerprint identification effect. The display substrate comprises a substrate, a circuit structure layer, a light emitting function layer, a packaging layer and a plurality of fingerprint identification electrodes. The circuit structure layer comprises a plurality of pixel driving circuits which are arranged in the sub-pixel areas in a one-to-one correspondence mode and a plurality of capacitive fingerprint acquisition circuits which are arranged in at least part of the sub-pixel areas in a one-to-one correspondence mode. The light-emitting functional layer is positioned on one side, far away from the substrate, of the circuit structure layer and comprises a plurality of light-emitting parts in one-to-one correspondence with the sub-pixel areas. The packaging layer is positioned on one side of the plurality of light-emitting functional layers far away from the substrate. A plurality of fingerprint identification electrodes are located the encapsulation layer and keep away from one side of substrate, and every fingerprint identification electrode is connected with a capacitanc fingerprint acquisition circuit electricity. The display substrate provided by the invention is internally integrated with the capacitive fingerprint acquisition circuit and the plurality of fingerprint identification electrodes, so that the fingerprint identification effect is improved.

Description

Display substrate, manufacturing method thereof and display device

Technical Field

The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method of the display substrate and a display device.

Background

The organic light emitting display device has the advantages of low power consumption, high response speed, wide viewing angle, high resolution and the like, not only has diversified application fields, but also gradually develops to multiple functions for part of products, for example, part of products have an in-screen fingerprint function.

The existing fingerprint identification technology mainly comprises capacitive fingerprint identification, optical fingerprint identification and ultrasonic fingerprint identification. The ultrasonic fingerprint identification is not easy to integrate in a screen due to material limitation; the optical fingerprint identification can be integrated in a screen, but the defects of large optical signal loss, low sensitivity and the like exist; capacitive fingerprinting is also difficult to integrate into the screen due to the limited penetration distance.

Disclosure of Invention

The invention aims to provide a display substrate, a manufacturing method thereof and a display device, which are used for improving fingerprint identification effect.

In order to achieve the above purpose, the invention provides the following technical scheme:

in one aspect, a display substrate is provided, including: a substrate having a display area and a peripheral area adjacent to the display area, the display area including a plurality of sub-pixel areas; the circuit structure layer is positioned on one side of the substrate and comprises a plurality of pixel driving circuits which are arranged in the sub-pixel areas in a one-to-one correspondence mode and a plurality of capacitive fingerprint acquisition circuits which are arranged in at least part of the sub-pixel areas in a one-to-one correspondence mode; the light-emitting functional layer is positioned on one side, far away from the substrate, of the circuit structure layer and comprises a plurality of light-emitting parts in one-to-one correspondence with the sub-pixel areas; each pixel driving circuit is used for driving one light emitting part to emit light; the packaging layer is positioned on one side, far away from the substrate, of the plurality of light-emitting functional layers, extends from the display area to the peripheral area, and the edge of the packaging layer is positioned in the peripheral area; the fingerprint identification electrodes are located on one side, far away from the substrate, of the packaging layer, the fingerprint identification electrodes are arranged in an array mode in at least part of the display area, and each fingerprint identification electrode is electrically connected with one capacitive fingerprint acquisition circuit.

In some embodiments, the display substrate further comprises: the first end of each first conductive wire is connected with the signal input end of the capacitive fingerprint acquisition circuit, and the second end of each first conductive wire extends to the peripheral area; and the second conductive wires are positioned between the fingerprint identification electrodes and the packaging layer, the first end of each second conductive wire is connected with the fingerprint identification electrodes, the second end of each second conductive wire extends to the peripheral area, and the second end of each second conductive wire is connected with the second end of one first conductive wire through a through hole in the packaging layer.

In some embodiments, the display substrate further comprises: the pixel defining layer is positioned on one side, away from the substrate, of the circuit structure layer and is used for isolating the plurality of light emitting parts; the fingerprint identification electrode is electrically connected with the signal input end of the capacitive fingerprint acquisition circuit through a first through hole on the packaging layer and a second through hole on the pixel defining layer.

In some embodiments, an orthographic projection of the first via on the substrate is within a range of an orthographic projection of the second via on the substrate; the pixel defining layer further includes at least one blocking hole disposed around the second via hole, the blocking hole being configured to block the light emitting function layer.

In some embodiments, the pixel defining layer further comprises: and the plurality of isolation grooves are positioned on the surface of the pixel defining layer far away from the circuit structure layer, and are arranged around the partition hole.

In some embodiments, the fingerprint identification electrode is a transparent electrode; alternatively, the fingerprint recognition electrode is an opaque electrode having a plurality of first mesh holes exposing the light emitting part.

In some embodiments, the display substrate further comprises: the first touch electrode strips and the fingerprint identification electrodes are arranged on the same layer, and the first touch electrode strips extend along a first direction; the plurality of touch electrode blocks and the plurality of fingerprint identification electrodes are arranged on the same layer, the plurality of touch electrode blocks are arranged in a plurality of rows along a second direction crossed with the first direction, and the plurality of rows of touch electrode blocks are not connected with the plurality of first touch electrode strips; the first insulating layer is positioned between the touch electrode blocks and the packaging layer; the multiple groups of first conductive structures are positioned between the first insulating layer and the packaging layer, and each group of first conductive structures is connected with the same row of touch electrode blocks arranged along the second direction through via holes of the first insulating layer; the plurality of first touch electrode strips and the plurality of touch electrode blocks comprise a plurality of second meshes, and the orthographic projection of each fingerprint identification electrode on the substrate is positioned in the orthographic projection of one second mesh on the substrate.

In some embodiments, the plurality of first touch electrode bars and the plurality of touch electrode blocks are transparent electrodes; or, the plurality of first touch electrode strips and the plurality of touch electrode blocks are opaque electrodes, and the plurality of first touch electrode strips and the plurality of touch electrode blocks each further include a plurality of third mesh holes exposing the light emitting portion.

In some embodiments, the display substrate further comprises: the multiple groups of second conductive structures are arranged on the same layer as the multiple groups of first conductive structures; each group of the second conductive structures is connected with at least two fingerprint identification electrodes in all the fingerprint identification electrodes through the through holes of the first insulating layer.

In another aspect, a display device is provided. The display device includes: a display substrate according to any one of the embodiments above; and the protective cover plate is arranged on the display side of the display substrate.

In another aspect, a method for manufacturing a display substrate is provided, including:

providing a substrate, wherein the substrate is provided with a display area and a peripheral area adjacent to the display area, and the display area comprises a plurality of sub-pixel areas;

manufacturing a circuit structure layer on a first side of the substrate, wherein the circuit structure layer comprises a plurality of pixel driving circuits which are arranged in the plurality of sub-pixel regions in a one-to-one correspondence mode and a plurality of capacitive fingerprint acquisition circuits which are arranged in at least part of the sub-pixel regions in a one-to-one correspondence mode;

manufacturing a light-emitting functional layer on one side of the circuit structure layer, which is far away from the substrate, wherein the light-emitting functional layer comprises light-emitting parts which correspond to the sub-pixel regions one to one; each pixel driving circuit is used for driving one light emitting part to emit light;

manufacturing an encapsulation layer on one side of the light-emitting functional layer, which is far away from the substrate, wherein the encapsulation layer extends from the display area to the peripheral area, and the edge of the encapsulation layer is positioned in the peripheral area;

and manufacturing a plurality of fingerprint identification electrodes on one side of the packaging layer, which is far away from the substrate, wherein the fingerprint identification electrodes are arranged in an array manner, and each fingerprint identification electrode is electrically connected with one capacitive fingerprint acquisition circuit.

In some embodiments, said fabricating a circuit structure layer on a first side of said substrate comprises:

manufacturing a plurality of first conductive wires, wherein a first end of each first conductive wire is electrically connected with a signal input end of the capacitive fingerprint acquisition circuit, and a second end of each first conductive wire extends out of the peripheral area;

before fabricating the plurality of fingerprint identification electrodes, the fabrication method further comprises:

and manufacturing a plurality of second conductive wires on one side of the packaging layer far away from the substrate, wherein the first end of each second conductive wire is connected with the fingerprint identification electrode, the second end of each second conductive wire extends to the peripheral area, and the second end of each second conductive wire is connected with the second end of the first conductive wire through a through hole in the packaging layer.

In some embodiments, after the fabricating the circuit structure layer and before the fabricating the light emitting function layer, the fabricating method further includes:

manufacturing a pixel defining layer on one side of the circuit structure layer, which is far away from the substrate, and etching a plurality of pixel opening areas, a second through hole exposing a signal input end of the capacitive fingerprint acquisition circuit and at least one partition hole arranged around the second through hole on the pixel defining layer by an etching process;

sequentially forming a light-emitting functional layer and a packaging layer on one side, far away from the substrate, of the pixel defining layer, wherein the light-emitting functional layer is separated by the at least one partition hole, and the packaging layer is at least filled into the second through hole;

etching a first through hole exposing a signal input end of the capacitive fingerprint acquisition circuit on the part of the packaging layer, which is positioned in the second through hole, by an etching process;

and a plurality of fingerprint identification electrodes are formed on the packaging layer, and each fingerprint identification electrode is electrically connected with one capacitive fingerprint acquisition circuit through one first through hole.

The display substrate, the manufacturing method thereof and the display device provided by the invention have the following beneficial effects:

according to the display substrate provided by the invention, the plurality of capacitive fingerprint acquisition circuits are arranged in the circuit structure layer, and the plurality of fingerprint identification electrodes electrically connected with the plurality of capacitive fingerprint acquisition circuits are arranged on one side of the packaging layer far away from the substrate, so that the plurality of capacitive fingerprint acquisition circuits and the plurality of fingerprint identification electrodes are integrated in the display substrate, and a display device adopting the display substrate has a better fingerprint identification effect.

The beneficial effects that can be achieved by the display substrate and the display device provided by the invention are the same as those achieved by the display substrate provided by the technical scheme, and are not repeated herein.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in some embodiments of the present invention will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, according to embodiments of the present invention.

FIG. 1 is a block diagram of a display substrate according to some embodiments;

FIG. 2 is a block diagram of another display substrate according to some embodiments;

FIG. 3 is a block diagram of a fingerprint identification circuit according to some embodiments;

FIG. 4 is a block diagram of yet another display substrate according to some embodiments;

FIG. 5 is a block diagram of yet another display substrate according to some embodiments;

FIG. 6 is a diagram of a touch electrode strip and a touch electrode block layout according to some embodiments;

FIG. 7 is a diagram of connections of a touch electrode block according to some embodiments;

FIG. 8 is a block diagram of a display device according to some embodiments;

FIG. 9 is a flow chart of a method of fabricating a display substrate according to some embodiments.

Reference numerals:

1-substrate, 2-circuit structure layer, 21-pixel drive circuit,

22-first thin film transistor, 221-active layer, 222-gate,

223-source, 224-drain, 23-capacitive fingerprint acquisition circuit,

231-signal input terminal, 24-second thin film transistor, 3-light emitting functional layer,

31-a light emitting part, 32-an anode layer, 33-a cathode layer,

4-encapsulation layer, 41-first via, 42-first encapsulation layer,

43-second encapsulation layer, 44-third encapsulation layer, 5-fingerprint identification electrode,

6-first conductive lines, 7-second conductive lines, 8-pixel defining layers,

81-second via hole, 82-partition hole, 83-isolation groove,

91-touch electrode strips, 91-touch electrode blocks, 93-first insulating layers,

94-first conductive structure, 95-second conductive structure, 100-display substrate,

200-display device, 201-protective cover plate, a 1-display area,

a 2-peripheral region, a 11-subpixel region, X-first direction,

y-second direction, 51-first mesh, 901-second mesh,

902-third mesh.

Detailed Description

The technical solutions in some embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present invention belong to the protection scope of the present invention.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

As used herein, the term "if" is optionally to be interpreted to mean "when … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrase "if determined … …" or "if [ stated condition or event ] is detected" is optionally to be construed to mean "upon determination … …" or "in response to determination … …" or "upon detection of [ stated condition or event ] or" in response to detection of [ stated condition or event ] ", depending on the context.

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

Some embodiments of the present invention provide a display substrate 100, as shown in fig. 1 and fig. 2, including a substrate 1, a circuit structure layer 2 located on one side of the substrate 1, a light emitting function layer 3 located on one side of the circuit structure layer 2 away from the substrate 1, an encapsulation layer 4 located on one side of the light emitting function layer 3 away from the substrate 1, and a plurality of fingerprint identification electrodes 5 located on one side of the encapsulation layer 4 away from the substrate 1.

The substrate 1 has a display region a1 and a peripheral region a2 adjacent to the display region a1, and the display region a1 includes a plurality of sub-pixel regions a 11. The circuit structure layer 2 includes a plurality of pixel driving circuits 21 disposed in a one-to-one correspondence in a plurality of sub-pixel regions a11 and a plurality of capacitive fingerprint acquisition circuits 23 disposed in a one-to-one correspondence in at least some of the sub-pixel regions a 11. The light-emitting functional layer 3 includes a plurality of light-emitting portions 31 in one-to-one correspondence with the plurality of sub-pixel regions a 11. Each pixel driving circuit 21 is for driving one light emitting section 31 to emit light. The encapsulation layer 4 extends from the display area a1 to the peripheral area a2, and the edge of the encapsulation layer 4 is located in the peripheral area a 2. A plurality of fingerprint identification electrodes 5 are arranged in an array in at least a part of the display area a1, and each fingerprint identification electrode 5 is electrically connected with one capacitive fingerprint acquisition circuit 23.

In the display substrate 100 provided by some embodiments of the present invention, the plurality of capacitive fingerprint acquisition circuits 23 are disposed in the circuit structure layer 2, and the plurality of fingerprint identification electrodes 5 electrically connected to the plurality of capacitive fingerprint acquisition circuits 23 are disposed on the side of the encapsulation layer 4 away from the substrate 1, so that the plurality of capacitive fingerprint acquisition circuits 23 and the plurality of fingerprint identification electrodes 5 are integrated in the display substrate 100, and thus, a display device using the display substrate 100 has a fingerprint identification function.

Meanwhile, the fingerprint identification electrode 5 is arranged on one side of the packaging layer 4 far away from the substrate 1, so that the distances between the fingerprint identification electrode 5 and metal circuits in the circuit structure layer 2 and the light-emitting function layer 3 are far, the parasitic capacitance between the fingerprint identification electrode 5 and the metal circuits (such as a grid electrode, a source electrode and a drain electrode) in the circuit structure layer 2 and between the fingerprint identification electrode 5 and the metal circuits (such as an anode and a cathode) in the light-emitting function layer 3 is reduced, the influence of the parasitic capacitance on the circuit speed is avoided, and the problem of signal loss is solved. The fingerprint identification electrode 5 is arranged on one side of the packaging layer 4 far away from the substrate 1, and the distance between the fingerprint identification electrode 5 and a finger can be smaller, so that the problem of limitation of the penetration distance of a capacitive fingerprint identification technology is avoided.

It should be noted that "the fingerprint identification electrodes 5 are arranged in an array in at least a portion of the display area a 1" may be that the fingerprint identification electrodes 5 are arranged in an array only in a portion of the display area a1, or that the fingerprint identification electrodes 5 are arranged in an array in the entire display area a 1. Namely, the display device adopting the display substrate provided by the invention can realize full-screen fingerprint identification and can realize fingerprint identification in a specific area. The size and shape of the specific area may be designed according to actual requirements, for example, the shape of the specific area may be a circle, a rectangle, or an ellipse, and the invention is not limited thereto.

By arranging the fingerprint identification electrodes 5 in the at least partial display area A1 in an array manner, the distance between the fingerprint identification electrodes 5 is uniform, the problem that the fingerprint identification precision of different parts in the same area is different due to the fact that the number of the fingerprint identification electrodes 5 of one part in the same area is too much and the number of the fingerprint identification electrodes 5 of the other part is too few is avoided, and the accuracy of fingerprint identification is improved. In addition, the distance between the fingerprint identification electrodes 5 and the number of the fingerprint identification electrodes 5 are not limited in the present invention, as long as the fingerprint identification can be realized.

Here, the light emitting function layer 3 may include not only the light emitting parts 31 corresponding to the plurality of sub-pixel regions a11 one to one, but also the anode layer 32 and the cathode layer 33 (shown in fig. 1) in contact with the light emitting parts 31. Alternatively, the light emitting function layer 3 may further include, for example, a hole injection layer and a hole transport layer disposed between the anode layer 32 and the light emitting part 31, and an electron injection layer and an electron transport layer disposed between the cathode layer 33 and the light emitting part 31. The hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer may not be disposed in the plurality of sub-pixel regions in a one-to-one correspondence, that is, the hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer may cover the entire display region a 1.

The pixel driving circuit 21 may include at least one thin film transistor. Illustratively, referring to fig. 1, the pixel driving circuit 21 includes a first thin film transistor 22, and the thin film transistor 22 includes an active layer 221, a gate electrode 222, a source electrode 223, and a drain electrode 224. The source 223 is connected to the anode layer 32 in the light-emitting functional layer 3 to drive the light-emitting part 31 to emit light. Fig. 1 illustrates the tft 22 as a top-gate structure, but the invention is not limited thereto, i.e., the tft 22 may also be a bottom-gate structure. Meanwhile, the type of the thin film transistor is not particularly limited in the present invention, that is, the thin film transistor may be a P-type transistor or an N-type transistor.

The separation of fingerprint recognition by the plurality of fingerprint recognition electrodes 5 and the plurality of capacitive fingerprint recognition circuits 23 will be briefly described with reference to fig. 3. The capacitive fingerprinting circuit 23 may comprise at least one thin film transistor. Illustratively, as shown in fig. 3, the capacitive fingerprint recognition circuit 23 includes a second thin film transistor 24, wherein a control terminal of the second thin film transistor 24 is connected to the first gate control circuit GOA, a first terminal of the second thin film transistor 24 is connected to the fingerprint recognition electrode 5, and a second terminal of the second thin film transistor is connected to the transmission signal line Rx. At this time, when a finger is in contact with the display surface of the display device using the display substrate provided by the present invention, a capacitance is formed between the finger and the fingerprint recognition electrode 5, and since the finger fingerprint is uneven, the distances between different positions and the fingerprint recognition electrode are different, and the formed capacitances are different. The plurality of Rx signal lines receive different signals transmitted from the respective fingerprint recognition electrodes 5, respectively, and transmit the signals to the integrated circuit IC, and the integrated circuit IC processes the signals to obtain fingerprint information, thereby implementing fingerprint recognition.

In some embodiments, as shown in fig. 1 and 2, the display substrate 100 further includes a plurality of first conductive lines 6 and second conductive lines 7. Wherein a first end of each first conductive line 6 is connected to the signal input 231 of the capacitive fingerprint acquisition circuit 23, and a second end of each first conductive line 6 extends to the peripheral area a 2. The second conductive lines 7 are located between the plurality of fingerprint identification electrodes 5 and the encapsulation layer 4, a first end of each second conductive line 7 is connected to the fingerprint identification electrode 5, a second end of each second conductive line 7 extends to the peripheral area a2, and a second end of each second conductive line 7 is connected to a second end of one first conductive line 6 through a via hole on the encapsulation layer 4.

Through setting up like this, need not to set up fingerprint identification electrode 5 also at circuit structure layer 2, utilize first conductor wire 6 and second conductor wire 7 can be connected capacitanc fingerprint acquisition circuit 23 and fingerprint identification electrode 5 electricity to when having avoided fingerprint identification electrode 6 to set up at circuit structure layer 2, generate parasitic capacitance between the metal circuit in fingerprint identification electrode 5 and the circuit structure layer 2, thereby avoided the influence of parasitic capacitance to circuit speed, improved signal loss's problem. Meanwhile, the failure of fingerprint identification caused by distance limitation due to the arrangement of the fingerprint identification electrode 5 in the circuit structure layer 2 is avoided.

In some embodiments, as shown in fig. 4, the display substrate 100 further includes a pixel defining layer 8 located on a side of the circuit structure layer 2 away from the substrate 1, and the pixel defining layer 8 is used for isolating the plurality of light emitting portions 31. The fingerprint identification electrode 5 is electrically connected with the signal input terminal 231 of the capacitive fingerprint acquisition circuit 23 through a first via 41 located on the encapsulation layer 4 and a second via 81 located on the pixel defining layer 8.

By this arrangement, the fingerprint identification electrode 5 is electrically connected with the signal input terminal 231 of the capacitive fingerprint acquisition circuit 23 through the first via 41 on the encapsulation layer 4 and the second via 81 on the pixel defining layer 8. The fingerprint identification electrode 5 is not required to be arranged in the circuit structure layer 2, so that the phenomenon that parasitic capacitance is generated between the fingerprint identification electrode 5 and a metal circuit in the circuit structure layer 2 when the fingerprint identification electrode 5 is arranged in the circuit structure layer 2 is avoided, the influence of the parasitic capacitance on the circuit speed is avoided, and the problem of signal loss is solved. Meanwhile, the failure of fingerprint identification caused by distance limitation when the fingerprint identification electrode 5 is arranged in the circuit structure layer 2 is avoided.

In some embodiments, as shown in fig. 4, the orthographic projection of the first via 41 on the substrate 1 is within the range of the orthographic projection of the second via 81 on the substrate 1. At this time, the first via 41 may penetrate the second via 81. The pixel defining layer 8 further includes at least one blocking hole 82 disposed around the second via hole 81. The blocking hole 82 is configured to block the light emitting functional layer 3.

Through utilizing the partition hole 82 to partition the light-emitting functional layer 3, the packaging layer 4 is arranged on one side of the light-emitting functional layer 3 far away from the substrate 1, and when the first via hole 41 is manufactured on the packaging layer 4, water vapor used in the cleaning and stripping process cannot be diffused to the area where the light-emitting part 34 is located along the light-emitting functional layer 3 contacted with the side wall of the first via hole 41, so that the light-emitting part 31 cannot normally emit light under the influence of the water vapor.

In some embodiments, as shown in fig. 5, the encapsulation layer 4 may be a multi-layer structure. Illustratively, the encapsulation layer 4 may sequentially include a first encapsulation layer 42, a second encapsulation layer 43, and a third encapsulation layer 44 in a direction from the substrate 1 toward the fingerprint recognition electrode 5. The material of the first encapsulation layer 42 and the third encapsulation layer 44 may include inorganic materials, such as silicon nitride, silicon oxynitride, and the like. The material of the second encapsulation layer may be an organic material. A better encapsulation effect can be achieved by providing the encapsulation layer 4 as a multilayer structure. Here, the first encapsulation layer 42 and the third encapsulation layer 44 may be obtained by a CVD (Chemical vapor deposition) process, and the second encapsulation layer 43 may be manufactured by an inkjet printing process.

Since the organic material for inkjet printing has fluidity, in order to prevent the organic material used for inkjet printing from flowing into the partition hole 82 and affecting reliability, in some embodiments of the present invention, as shown in fig. 5, the pixel defining layer 8 further includes a plurality of isolation grooves 83, the plurality of isolation grooves 83 are located on a surface of the pixel defining layer 8 away from the circuit structure layer 2, and the plurality of isolation grooves 83 are disposed around the partition hole 82. In this way, when the organic material flows to the blocking hole 82, the organic material flows into the blocking groove 83 first, and is blocked by the blocking groove 83, and does not flow into the blocking hole 82, thereby improving the reliability of the display substrate 100.

In some embodiments, the fingerprint recognition electrode 5 is a transparent electrode. Illustratively, the material of the fingerprint recognition electrode 5 may be indium tin oxide. When the fingerprint recognition electrode 5 is a transparent electrode, the orthographic projection of the fingerprint recognition electrode 5 on the substrate 1 may overlap with the orthographic projection of the light emitting section 31 on the substrate 1, or may not overlap with the orthographic projection of the light emitting section 31 on the substrate 1. When the fingerprint recognition electrode 5 is a transparent electrode, the fingerprint recognition electrode 5 may cover the entire display area a1, or may cover only a part of the display area a 1.

In other embodiments, the fingerprint recognition electrode 5 may be an opaque electrode. Illustratively, the material of the fingerprint identification electrode 5 may be a metal material such as aluminum, molybdenum, and the like. When the fingerprint recognition electrode 5 is an opaque electrode, referring to fig. 2, the fingerprint recognition electrode 5 has a plurality of first mesh holes 51 exposing the light emitting part 31. With this arrangement, the light emitting section 31 is prevented from being blocked by the fingerprint recognition electrode 5, and the aperture ratio of the display device is ensured.

In some embodiments, as shown in fig. 6 and 7, the display substrate 100 further includes a plurality of first touch electrode bars 91, a plurality of touch electrode blocks 92, a first insulating layer 93, and a plurality of sets of first conductive structures 94. The plurality of first touch electrode strips 91 and the plurality of fingerprint identification electrodes 5 are disposed on the same layer, and the plurality of first touch electrode strips 91 extend along the first direction X. The plurality of touch electrode blocks 92 and the plurality of fingerprint recognition electrodes 5 are disposed on the same layer, the plurality of touch electrode blocks 92 are arranged in a plurality of rows along a second direction Y intersecting the first direction X, and the plurality of rows of touch electrode blocks 92 are not connected to the plurality of first touch electrode strips 91. The first insulating layer 93 is located between the touch electrode blocks 92 and the packaging layer 4. A plurality of groups of first conductive structures 94 are located between the first insulating layer 93 and the package layer 4, and each group of first conductive structures 94 is connected with the same row of touch electrode blocks 92 arranged along the second direction Y through via holes of the first insulating layer 93; the plurality of first touch electrode stripes 91 and the plurality of touch electrode blocks 92 each include a plurality of second meshes 901, and an orthogonal projection of each fingerprint identification electrode 5 on the substrate 1 is located within an orthogonal projection of one second mesh 901 on the substrate 1.

In this way, the plurality of first touch electrode strips 91, the plurality of touch electrode blocks 92 and the fingerprint identification electrode 5 are arranged on the same layer, that is, the plurality of first touch electrode strips 91 and the plurality of touch electrode blocks 92 are arranged on one side of the packaging layer 4 away from the substrate 1, so that the display device adopting the display substrate 100 can have both a touch function and a fingerprint identification function, and the distances between the plurality of first touch electrode strips 91, the plurality of touch electrode blocks 92 and the finger are closer, thereby achieving a better touch effect. In addition, the plurality of first touch electrode strips 91, the plurality of touch electrode blocks 92 and the fingerprint identification electrode 5 are manufactured in the same layer, so that the preparation process of touch control and fingerprint identification can be effectively optimized and integrated, Mask use and process flow are reduced, and cost is reduced.

It should be noted that, the present invention is not limited to the technical solution that the plurality of first touch electrode bars 91, the plurality of touch electrode blocks 92 and the fingerprint identification electrode 5 are on the same layer, and the fingerprint identification electrode 5 may be arranged on a different layer from the plurality of first touch electrode bars 91 and the plurality of touch electrode blocks 92.

In addition, in the embodiment of the present invention, the touch structure may adopt a self-capacitance structure or a mutual capacitance structure, and the present invention is schematically described by using the mutual capacitance structure.

In some embodiments, the plurality of first touch electrode bars 91 and the plurality of touch electrode blocks 92 may be transparent electrodes. At this time, for example, the material of the plurality of first touch electrode bars 91 and the plurality of touch electrode blocks 92 may be indium tin oxide. When the plurality of first touch electrode stripes 91 and the plurality of touch electrode blocks 92 are transparent electrodes, the orthographic projections of the plurality of first touch electrode stripes 91 and the plurality of touch electrode blocks 92 on the substrate 1 may overlap with the orthographic projection of the light emitting portion 31 on the substrate 1, or the orthographic projections of the plurality of first touch electrode stripes 91 and the plurality of touch electrode blocks 92 on the substrate 1 may not overlap with the orthographic projection of the plurality of light emitting portions 31 on the substrate.

In other embodiments, the plurality of first touch electrode stripes 91 and the plurality of touch electrode blocks 92 are opaque electrodes, and each of the plurality of first touch electrode stripes 91 and the plurality of touch electrode blocks 92 further includes a plurality of third mesh holes 902 exposing the light emitting portion 31. At this time, for example, the material of the plurality of first touch electrode bars 91 and the plurality of touch electrode blocks 92 may be metal such as aluminum, molybdenum, and the like.

In some embodiments of the present invention, the size of the capacitance required for fingerprint identification determines the size of the finger identification electrode required. That is, when the capacitance necessary for fingerprint recognition is large, the area of the fingerprint recognition electrode 5 necessary for fingerprint recognition is large, and when the capacitance necessary for fingerprint recognition is small, the area of the fingerprint recognition electrode 5 necessary for fingerprint recognition is small. When the areas of the fingerprint identification electrodes 5 are all small, a large fingerprint identification electrode can be obtained by connecting the fingerprint identification electrodes 5 in series.

On the basis, in some embodiments, as shown in fig. 7, the display substrate 100 further includes a plurality of sets of second conductive structures 95 disposed in the same layer as the plurality of sets of first conductive structures 94. Each set of second conductive structures 95 connects at least two fingerprint identification electrodes 5 of all fingerprint identification electrodes 5 through the via holes of the first insulating layer 93. The arrangement is such that the fingerprint identification electrode 5 can apply a larger voltage to the fingerprint identification electrode 5, thereby improving the accuracy of fingerprint identification, and the fingerprint identification electrode 5 can be uniformly distributed in the display area a 1.

In another aspect, an embodiment of the present invention provides a method for manufacturing a display substrate, and referring to fig. 1 and 9, the method for manufacturing a display substrate includes:

s11, providing a substrate 1, the substrate 1 having a display area a1 and a peripheral area a2 adjacent to the display area a1, the display area a1 including a plurality of sub-pixel areas a 11.

S12, manufacturing a circuit structure layer 2 on one side of the substrate 1, wherein the circuit structure layer 2 comprises a plurality of pixel driving circuits 21 arranged in a plurality of sub-pixel regions a11 in a one-to-one correspondence manner and a plurality of capacitive fingerprint acquisition circuits 23 arranged in at least part of the sub-pixel regions a11 in a one-to-one correspondence manner.

S13, forming a light-emitting functional layer 3 on the side of the circuit structure layer 2 away from the substrate 1, wherein the light-emitting functional layer 3 comprises a plurality of light-emitting parts 31 corresponding to the plurality of sub-pixel regions a11 one by one; each pixel driving circuit 21 is for driving one light emitting section 31 to emit light.

S14, forming an encapsulation layer 4 on a side of the light-emitting functional layer 3 away from the substrate 1, where the encapsulation layer 4 extends from the display area a1 to the peripheral area a2, and an edge of the encapsulation layer 4 is located in the peripheral area a 2.

S15, manufacturing a plurality of fingerprint identification electrodes 5 on the side of the packaging layer 4 far away from the substrate 1, wherein the plurality of fingerprint identification electrodes 5 are arranged in an array in at least part of the display area A1, and each fingerprint identification electrode 5 is electrically connected with one capacitive fingerprint acquisition circuit 23.

According to the manufacturing method of the display substrate 100, the plurality of capacitive fingerprint acquisition circuits 23 are arranged in the circuit structure layer 2, and the plurality of fingerprint identification electrodes 5 electrically connected with the plurality of capacitive fingerprint acquisition circuits 23 are arranged on one side, far away from the substrate 1, of the packaging layer 4, so that the plurality of capacitive fingerprint acquisition circuits 23 and the plurality of fingerprint identification electrodes 5 are integrated in the display substrate 100, and a display device adopting the display substrate 100 has a good fingerprint identification effect.

In some embodiments, as shown in fig. 1, the fabricating of the circuit structure layer 2 on one side of the substrate 1 includes:

manufacturing a plurality of first conductive lines 6, wherein a first end of each first conductive line 6 is electrically connected with the signal input end 231 of the capacitive fingerprint acquisition circuit 23, and a second end of each first conductive line 6 extends to form a peripheral area a 2;

before the plurality of fingerprint recognition electrodes 5 are manufactured, the manufacturing method further comprises the following steps:

and manufacturing a plurality of second conductive lines 7 on the side of the encapsulation layer 4 far away from the substrate 1, wherein a first end of each second conductive line 7 is connected with the fingerprint identification electrode 5, a second end of each second conductive line 7 extends to the peripheral area a2, and a second end of each second conductive line 7 is connected with a second end of the first conductive line 6 through a via hole on the encapsulation layer 4.

In some embodiments, as shown in fig. 4, after the circuit structure layer 2 is fabricated and before the light-emitting functional layer 3 is fabricated, the fabrication method further includes:

the pixel defining layer 8 is manufactured on one side of the circuit structure layer 2, which is far away from the substrate 1, and a plurality of pixel opening areas, a second through hole 81 exposing the signal input end of the capacitive fingerprint acquisition circuit 23 and at least one partition hole 82 arranged around the second through hole 81 are etched on the pixel defining layer 8 through an etching process.

And sequentially forming a light-emitting functional layer 3 and an encapsulation layer 4 on one side of the pixel defining layer 8, which is far away from the substrate, wherein at least one partition hole 82 partitions the light-emitting functional layer 3, and the encapsulation layer 4 is at least filled into the second through hole 81.

The first via hole 41 exposing the signal input terminal 231 of the capacitive fingerprint acquisition circuit 23 is etched on the portion of the encapsulation layer 4 within the second via hole 81 by an etching process.

A plurality of fingerprint identification electrodes 5 are formed on the packaging layer 4, and each fingerprint identification electrode 5 is electrically connected with one capacitive fingerprint acquisition circuit 23 through one first via hole 41.

In another aspect, the present invention provides a display device 200, as shown in fig. 8, including the display substrate 100 according to any of the foregoing embodiments and a protective cover 201 disposed on a display side of the display substrate.

The display device 200 may be an OLED display device, such as an AMOLED display device. In addition, the display device 200 may be any component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, and a navigator.

The beneficial effects that the display device provided by the invention can achieve are the same as those that the display substrate provided by the above technical scheme can achieve, and are not repeated herein.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (13)

1. A display substrate, comprising:

a substrate having a display area and a peripheral area adjacent to the display area, the display area including a plurality of sub-pixel areas;

the circuit structure layer is positioned on one side of the substrate and comprises a plurality of pixel driving circuits which are arranged in the sub-pixel areas in a one-to-one correspondence mode and a plurality of capacitive fingerprint acquisition circuits which are arranged in at least part of the sub-pixel areas in a one-to-one correspondence mode;

the light-emitting functional layer is positioned on one side, far away from the substrate, of the circuit structure layer and comprises a plurality of light-emitting parts in one-to-one correspondence with the sub-pixel areas; each pixel driving circuit is used for driving one light emitting part to emit light;

the packaging layer is positioned on one side, far away from the substrate, of the plurality of light-emitting functional layers, extends from the display area to the peripheral area, and the edge of the packaging layer is positioned in the peripheral area;

the fingerprint identification electrodes are located on one side, far away from the substrate, of the packaging layer, the fingerprint identification electrodes are arranged in an array mode in at least part of the display area, and each fingerprint identification electrode is electrically connected with one capacitive fingerprint acquisition circuit.

2. The display substrate of claim 1, further comprising:

the first end of each first conductive wire is connected with the signal input end of the capacitive fingerprint acquisition circuit, and the second end of each first conductive wire extends to the peripheral area;

and the second conductive wires are positioned between the fingerprint identification electrodes and the packaging layer, the first end of each second conductive wire is connected with the fingerprint identification electrodes, the second end of each second conductive wire extends to the peripheral area, and the second end of each second conductive wire is connected with the second end of one first conductive wire through a through hole in the packaging layer.

3. The display substrate of claim 1, further comprising:

the pixel defining layer is positioned on one side, away from the substrate, of the circuit structure layer and is used for isolating the plurality of light emitting parts;

the fingerprint identification electrode is electrically connected with the signal input end of the capacitive fingerprint acquisition circuit through a first through hole on the packaging layer and a second through hole on the pixel defining layer.

4. The display substrate of claim 3,

the orthographic projection of the first via hole on the substrate is positioned within the range of the orthographic projection of the second via hole on the substrate;

the pixel defining layer further includes at least one blocking hole disposed around the second via hole, the blocking hole being configured to block the light emitting function layer.

5. The display substrate of claim 4, wherein the pixel definition layer further comprises:

and the plurality of isolation grooves are positioned on the surface of the pixel defining layer far away from the circuit structure layer, and are arranged around the partition hole.

6. The display substrate according to any one of claims 1 to 5,

the fingerprint identification electrode is a transparent electrode;

alternatively, the fingerprint recognition electrode is an opaque electrode having a plurality of first mesh holes exposing the light emitting part.

7. The display substrate according to any one of claims 1 to 5, wherein the display substrate further comprises:

the first touch electrode strips and the fingerprint identification electrodes are arranged on the same layer, and the first touch electrode strips extend along a first direction;

the plurality of touch electrode blocks and the plurality of fingerprint identification electrodes are arranged on the same layer, the plurality of touch electrode blocks are arranged in a plurality of rows along a second direction crossed with the first direction, and the plurality of rows of touch electrode blocks are not connected with the plurality of first touch electrode strips;

the first insulating layer is positioned between the touch electrode blocks and the packaging layer;

the multiple groups of first conductive structures are positioned between the first insulating layer and the packaging layer, and each group of first conductive structures is connected with the same row of touch electrode blocks arranged along the second direction through via holes of the first insulating layer;

the plurality of first touch electrode strips and the plurality of touch electrode blocks comprise a plurality of second meshes, and the orthographic projection of each fingerprint identification electrode on the substrate is positioned in the orthographic projection of one second mesh on the substrate.

8. The display substrate of claim 7,

the plurality of first touch electrode strips and the plurality of touch electrode blocks are transparent electrodes;

or, the plurality of first touch electrode strips and the plurality of touch electrode blocks are opaque electrodes, and the plurality of first touch electrode strips and the plurality of touch electrode blocks each further include a plurality of third mesh holes exposing the light emitting portion.

9. The display substrate of claim 7, further comprising:

the multiple groups of second conductive structures are arranged on the same layer as the multiple groups of first conductive structures;

each group of the second conductive structures is connected with at least two fingerprint identification electrodes in all the fingerprint identification electrodes through the through holes of the first insulating layer.

10. A display device, comprising:

a display substrate according to any one of claims 1 to 9;

and the protective cover plate is arranged on the display side of the display substrate.

11. A manufacturing method of a display substrate comprises the following steps:

providing a substrate, wherein the substrate is provided with a display area and a peripheral area adjacent to the display area, and the display area comprises a plurality of sub-pixel areas;

manufacturing a circuit structure layer on a first side of the substrate, wherein the circuit structure layer comprises a plurality of pixel driving circuits which are arranged in the plurality of sub-pixel regions in a one-to-one correspondence mode and a plurality of capacitive fingerprint acquisition circuits which are arranged in at least part of the sub-pixel regions in a one-to-one correspondence mode;

manufacturing a light-emitting functional layer on one side of the circuit structure layer, which is far away from the substrate, wherein the light-emitting functional layer comprises light-emitting parts which correspond to the sub-pixel regions one to one; each pixel driving circuit is used for driving one light emitting part to emit light;

manufacturing an encapsulation layer on one side of the plurality of light-emitting functional layers, which is far away from the substrate, wherein the encapsulation layer extends from the display area to the peripheral area, and the edge of the encapsulation layer is positioned in the peripheral area;

and manufacturing a plurality of fingerprint identification electrodes on one side of the packaging layer, which is far away from the substrate, wherein the fingerprint identification electrodes are arranged in an array manner, and each fingerprint identification electrode is electrically connected with one capacitive fingerprint acquisition circuit.

12. The method of claim 11, wherein the fabricating a circuit structure layer on one side of the substrate comprises:

manufacturing a plurality of first conductive wires, wherein a first end of each first conductive wire is electrically connected with a signal input end of the capacitive fingerprint acquisition circuit, and a second end of each first conductive wire extends out of the peripheral area;

before fabricating the plurality of fingerprint identification electrodes, the fabrication method further comprises:

and manufacturing a plurality of second conductive wires on one side of the packaging layer far away from the substrate, wherein the first end of each second conductive wire is connected with the fingerprint identification electrode, the second end of each second conductive wire extends to the peripheral area, and the second end of each second conductive wire is connected with the second end of the first conductive wire through a through hole in the packaging layer.

13. The method for manufacturing a display substrate according to claim 12, wherein after the step of manufacturing the circuit structure layer and before the step of manufacturing the light emitting function layer, the method further comprises:

manufacturing a pixel defining layer on one side of the circuit structure layer, which is far away from the substrate, and etching a plurality of pixel opening areas, a second through hole exposing a signal input end of the capacitive fingerprint acquisition circuit and at least one partition hole arranged around the second through hole on the pixel defining layer by an etching process;

sequentially forming a light-emitting functional layer and a packaging layer on one side, far away from the substrate, of the pixel defining layer, wherein the light-emitting functional layer is separated by the at least one partition hole, and the packaging layer is at least filled into the second through hole;

etching a first through hole exposing a signal input end of the capacitive fingerprint acquisition circuit on the part of the packaging layer, which is positioned in the second through hole, by an etching process;

and a plurality of fingerprint identification electrodes are formed on the packaging layer, and each fingerprint identification electrode is electrically connected with one capacitive fingerprint acquisition circuit through one first through hole.

Images