CN112175355A - Friction-resistant epoxy plastic packaging material chip protection film composition - Google Patents
Friction-resistant epoxy plastic packaging material chip protection film composition Download PDFInfo
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- CN112175355A CN112175355A CN202011355155.9A CN202011355155A CN112175355A CN 112175355 A CN112175355 A CN 112175355A CN 202011355155 A CN202011355155 A CN 202011355155A CN 112175355 A CN112175355 A CN 112175355A
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- protection film
- friction
- mass
- film composition
- chip protection
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/298—Semiconductor material, e.g. amorphous silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Abstract
The invention discloses a friction-resistant epoxy plastic packaging material chip protection film composition which comprises 40-100 parts by mass of epoxy resin, 2-5 parts by mass of modified glass resin, 45-55 parts by mass of silicon dioxide and 1-5 parts by mass of a curing system, wherein the modified glass resin is glass resin with a terminal group grafted with a hydrophilic group. The invention can obviously improve the hardness and the wear resistance of the chip protection film, reduce and even avoid the scratch in the production link, and is beneficial to protecting the chip, thereby improving the yield of the chip; but also can avoid the abrasion of laser lettering.
Description
Technical Field
The invention belongs to the technical field of electronic chip packaging, and particularly relates to a friction-resistant epoxy plastic packaging material chip protection film composition.
Background
In order to ensure that the electronic chip has certain strength, a protective film is adhered to the back surface of the chip with the circuit on the surface. In order to perform product tracing and unified management of models and trademarks, laser lettering needs to be performed on the protective film. However, the traditional chip protection film material used has the problems of low hardness and poor wear resistance, and the protection film is easy to scratch in the chip production process, so that characters engraved by laser are worn and difficult to identify. Moreover, the worn protection film does not protect the chip, which results in a decrease in the yield of the chip.
Disclosure of Invention
The invention aims to provide a friction-resistant epoxy molding compound chip protection film composition.
The invention provides a friction-resistant epoxy plastic packaging material chip protection film composition, which comprises the following components:
40-100 parts by mass of epoxy resin;
2-5 parts by mass of modified glass resin;
45-55 parts by mass of silicon dioxide;
1-5 parts by mass of a curing system;
the modified glass resin is glass resin with a terminal group grafted with a hydrophilic group.
Further, the epoxy resin is one or more of polyether epoxy resin, BPF type epoxy resin and polyurethane modified bisphenol A type epoxy resin, and the polyether epoxy resin is preferred.
Further, the modified glass resin is preferably NH2CH2CH2CH2Si(OCH3)3。
Further, the D50 particle size of the silica is preferably 0.15 to 0.6. mu.m, and more preferably 0.5 to 0.6. mu.m.
Further, the curing system comprises an accelerator and a curing agent, wherein the curing agent is one or more of amines, thiols, acid anhydrides and phenolic resin curing agents; the accelerant is an imidazole accelerant.
The accelerator and the curing agent are added according to the conventional dosage, in the invention, the dosage of the accelerator is preferably 0.1-1 part by mass, and the dosage of the curing agent is preferably 1-4 parts by mass.
Further, dicyandiamide is preferably used as the curing agent, and 2-methyl-4-ethylimidazole is preferably used as the accelerator.
Further, the composition also comprises 1-5 parts by mass of a coloring agent.
The mechanism for improving the wear resistance of the invention is as follows:
referring to fig. 1-2, the modified glass resin in the composition of the invention has the end group grafted with a hydrophilic group, so that the organic silicon main chain is repelled by the epoxy resin, the modified glass resin is easy to migrate to the surface of the film after coating, and the silica with the particle size of D50 being 0.15 μm-0.6 μm can further promote the migration of the modified glass resin. The modified glass resin transferred to the surface of the film adsorbs water and oxygen in contact with air, and is solidified to form hard needle-shaped crystals, so that the hardness and the wear resistance of the film are improved. In addition, the modified glass resin which migrates to the surface of the film and the silicon dioxide which is not embedded by the epoxy resin form a micelle, which is beneficial to the dispersion of the silicon dioxide, thereby obtaining the film with uniform performance.
Compared with the prior art, the invention has the following characteristics and beneficial effects:
the invention can obviously improve the hardness and the wear resistance of the chip protection film, reduce and even avoid the scratch in the production link, and is beneficial to protecting the chip, thereby improving the yield of the chip; but also can avoid the abrasion of laser lettering.
Drawings
FIG. 1 is a schematic view showing the microstructure of a coating film obtained by coating a conventional chip protection film composition;
FIG. 2 is a schematic view showing the microstructure of a coating film obtained by coating the chip protection film composition according to the present invention;
FIG. 3 is an infrared micrograph of the film of example 1;
FIG. 4 is an infrared micrograph of the film of example 2;
FIG. 5 is an infrared micrograph of a comparative example film;
FIG. 6 is an infrared micrograph of a protective film attached to a chip according to example 1;
FIG. 7 is an infrared micrograph of a protective film attached to a chip according to example 2;
FIG. 8 is an infrared micrograph of a comparative example protective film attached to a chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of the embodiments of the present invention is provided. It should be understood that the detailed description is merely illustrative of the invention and is not intended to limit the invention.
The friction-resistant epoxy plastic packaging material chip protection film composition comprises 40-100 parts by mass of epoxy resin, 2-5 parts by mass of modified glass resin, 45-55 parts by mass of silicon dioxide and 1-5 parts by mass of a curing system, wherein the modified glass resin is glass resin with a terminal group grafted with a hydrophilic group. The D50 particle size of the silicon dioxide is preferably 0.15 μm to 0.6 μm. 1-5 parts by mass of a coloring agent can be optionally added into the composition.
The epoxy resin is used as a main resin, and one or more of polyether epoxy resin, BPF type epoxy resin and polyurethane modified bisphenol A type epoxy resin can be selected, and polyether epoxy resin is preferably used. The curing system is an epoxy resin curing system and comprises a curing agent and an accelerator, wherein the curing agent can be any curing agent corresponding to epoxy resin, and one or more of amines, thiols, acid anhydrides and phenolic resin curing agents can be selected according to requirements; the accelerator is preferably an imidazole accelerator. The colorant is used to provide color to the gum filler and pigments such as carbon black may be used, with the colorant being an optional component.
The composition can be prepared into a chip protection film by a coating process, and a specific preparation process comprises the following steps:
firstly, adding epoxy resin into a planetary stirrer, and stirring the epoxy resin for 10-180 min at the temperature of 95-140 ℃;
secondly, adding silicon dioxide and a coloring agent into the planetary stirrer, and continuously stirring for 10-180 min at the temperature of 95-140 ℃;
thirdly, adding a curing system into the planetary stirrer, and continuously stirring for 10-60 min at the temperature lower than 40 ℃;
fourthly, adding the modified glass resin, stirring, vacuumizing by a vacuum pump until the negative pressure in the cylinder body is less than or equal to-0.95 Mpa, and defoaming until the slurry in the cylinder has no bubbles;
and fifthly, coating the slurry on a release film coated with silicone oil, and drying to obtain the chip protection film.
To further prove the advantages of the chip protection film of the present invention, the following comparative tests were conducted.
In the following examples and comparative examples, polyether epoxy resins were used as the epoxy resins, and commercially available well-known polyether epoxy resins Jef-0220, Jef-0211, Jef-0221, SHIN-A SE-4125P, and Japanese ADEKA EP-4000 polyether epoxy resins were selected; the modified glass resin is glass resin of Enoki materials Co., Ltd, and the end group of the glass resin is grafted with a hydrophilic group NH2Molecular formula is NH2CH2CH2CH2Si(OCH3)3(ii) a The curing system adopts 2-methyl-4-ethylimidazole and dicyandiamide.
The proportions of the examples and comparative examples are shown in Table 1, and the preparation process adopts the specific preparation process described above. The products obtained in the examples and comparative examples were tested as follows: (1) testing the hardness of the pencil at an angle of 45 degrees under a load of 1000g by using a pencil hardness tester; (2) a scraping tester is adopted to carry out a reciprocating friction resistance test under the condition of applying 500g of force; (3) detecting the glossiness of the 60-degree angle by using a glossiness instrument; (4) detecting the reflectivity under the incident light wavelength of 532nm by adopting a spectrocolorimeter; (5) observing the surface of the film by using an infrared microscope at the wavelength of 1200nm, as shown in figures 3-5; (6) the infrared images of the films attached to the chip were observed at a wavelength of 1200nm using an infrared microscope, see FIGS. 6-8.
TABLE 1 compounding ratio and test results of examples and comparative examples
The above-described embodiment is only one of many embodiments, and those skilled in the art can make other variations or modifications on the basis of the above description, and such other variations or modifications may be made without departing from the spirit of the present invention.
Claims (9)
1. A friction-resistant epoxy plastic packaging material chip protection film composition is characterized by comprising the following components:
40-100 parts by mass of epoxy resin;
2-5 parts by mass of modified glass resin;
45-55 parts by mass of silicon dioxide;
1-5 parts by mass of a curing system;
the modified glass resin is glass resin with a terminal group grafted with a hydrophilic group.
2. The friction-resistant epoxy molding compound chip protection film composition according to claim 1, wherein:
the epoxy resin is one or more of polyether epoxy resin, BPF type epoxy resin and polyurethane modified bisphenol A type epoxy resin.
3. The friction-resistant epoxy molding compound chip protection film composition according to claim 2, wherein:
the epoxy resin is polyether epoxy resin.
4. The friction-resistant epoxy molding compound chip protection film composition according to claim 1, wherein:
the modified glass resin is NH2CH2CH2CH2Si(OCH3)3。
5. The friction-resistant epoxy molding compound chip protection film composition according to claim 1, wherein:
the D50 particle size of the silicon dioxide is 0.15-0.6 μm.
6. The friction-resistant epoxy molding compound chip protection film composition according to claim 1, wherein:
the curing system comprises an accelerator and a curing agent, wherein the curing agent is one or more of amines, thiols, acid anhydrides and phenolic resin curing agents; the accelerant is an imidazole accelerant.
7. The friction-resistant epoxy molding compound chip protection film composition according to claim 6, wherein:
the amount of the accelerator is 0.1-1 part by mass, and the amount of the curing agent is 1-4 parts by mass.
8. The friction-resistant epoxy molding compound chip protection film composition according to claim 6, wherein:
the curing agent is dicyandiamide, and the accelerator is 2-methyl-4-ethylimidazole.
9. The friction-resistant epoxy molding compound chip protection film composition according to claim 1, wherein:
and also comprises 1-5 parts by mass of a coloring agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011355155.9A CN112175355A (en) | 2020-11-26 | 2020-11-26 | Friction-resistant epoxy plastic packaging material chip protection film composition |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011355155.9A CN112175355A (en) | 2020-11-26 | 2020-11-26 | Friction-resistant epoxy plastic packaging material chip protection film composition |
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| CN112175355A true CN112175355A (en) | 2021-01-05 |
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| CN202011355155.9A Pending CN112175355A (en) | 2020-11-26 | 2020-11-26 | Friction-resistant epoxy plastic packaging material chip protection film composition |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294800A (en) * | 2000-04-13 | 2001-10-23 | Nippon Steel Chem Co Ltd | Coating material and base plate coated with the same |
| CN104672785A (en) * | 2014-06-30 | 2015-06-03 | 广东丹邦科技有限公司 | Epoxy molding compound and preparation method thereof |
| CN107204308A (en) * | 2016-10-08 | 2017-09-26 | 武汉市三选科技有限公司 | A kind of thin slice and preparation method and circuit substrate and preparation method containing the thin slice |
-
2020
- 2020-11-26 CN CN202011355155.9A patent/CN112175355A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294800A (en) * | 2000-04-13 | 2001-10-23 | Nippon Steel Chem Co Ltd | Coating material and base plate coated with the same |
| CN104672785A (en) * | 2014-06-30 | 2015-06-03 | 广东丹邦科技有限公司 | Epoxy molding compound and preparation method thereof |
| CN107204308A (en) * | 2016-10-08 | 2017-09-26 | 武汉市三选科技有限公司 | A kind of thin slice and preparation method and circuit substrate and preparation method containing the thin slice |
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Application publication date: 20210105 |
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