CN112157486A - Ultra-precision machining method for fused quartz strong laser optical element - Google Patents
Ultra-precision machining method for fused quartz strong laser optical element Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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Abstract
The invention relates to a strong laser optical element processing technology, and provides a short-flow low-damage high-precision ultra-precision processing method of a fused quartz strong laser optical element with the core of ultra-precision grinding → magnetorheological rapid polishing → acid washing aiming at the problems of long processing period, low efficiency and uncertain processing precision in the prior art, wherein the implementation steps comprise: ultra-precision grinding is carried out on the fused quartz element; carrying out magneto-rheological polishing and shape modification on the fused quartz element after ultra-precision grinding; carrying out dynamic acid etching, cleaning and drying on the fused quartz element subjected to magnetorheological rapid polishing; and finally, finishing the inspection of the fused quartz strong laser optical element. The method has the advantages of simple process flow, strong operability and short processing period, ensures the surface precision of the fused quartz strong laser element, realizes low damage of the surface/subsurface of the element, and has excellent laser damage resistance.
Description
Technical Field
The invention relates to a processing technology of a strong laser optical element, in particular to an ultra-precise processing method of a fused quartz strong laser optical element, which realizes short-flow low-damage processing of the fused quartz element.
Background
The intense laser optical element generally refers to an optical element which needs to be subjected to high-energy or high-power laser irradiation, and has the characteristics of high precision and high radiation damage resistance. Driven by the application requirements of high-power laser devices, the demand for ultra-precision machining of strong laser optical elements is increasing. Fused quartz is the most commonly used optical material in high-power laser devices, has the characteristics of stable chemical performance, good light transmission, high temperature resistance, radiation resistance, strong laser damage resistance and the like, and is widely applied to the preparation of strong laser optical elements such as lenses, windows, shielding sheets and the like. With the continuous development of the manufacturing level of the intense laser optical element, the surface/sub-surface quality requirements of the quartz glass are higher and higher.
The quartz glass has high hardness and large brittleness, and belongs to a typical hard, brittle and difficult-to-process material. At present, the typical processing flow of the fused silica strong laser optical element follows the process route of grinding → polishing → acid washing. However, since the process of the machining process is multiple, the machining tool or the workpiece needs to be repeatedly installed, which not only increases the auxiliary time of the forming process, but also brings larger installation errors, and greatly reduces the machining efficiency and the manufacturing precision. For example, conventional grinding makes it difficult to control the depth of defects in the process and the accuracy of surface formation of optical elements is low. The grinding has the problems of strong technical dependence of workers, more mechanical fracture defects of the sub-surface of an element and the like. During polishing, the polishing disc is unpredictably worn and unknowably matched, the possibility of damaging the surface integrity by the component concentration of the polishing solution and the polishing environment is high, and the characteristics of long period, low efficiency, uncertain processing precision and unpredictable processing result are also shown. Moreover, the repeated and alternate processing and detection processes in the polishing process can also increase the processing period of the workpiece. The traditional processing technology is difficult to meet the use requirement of manufacturing the strong-light optical element, so that the processing technology route of the strong-laser optical element needs to be further reasonably optimized by improving each technology stage.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: aiming at the problems of long processing period, low efficiency and uncertain processing precision in the prior art, the invention provides a short-process low-damage high-precision ultra-precision processing method of a fused quartz strong laser optical element taking ultra-precision grinding → magnetorheological rapid polishing → acid washing as a core.
In order to solve the technical problems, the invention adopts the technical scheme that the short-flow low-damage high-precision ultra-precision machining method of the fused quartz strong laser optical element taking ultra-precision grinding → magnetorheological polishing shaping → acid washing as the core comprises the following steps:
a method for ultraprecise processing of a fused quartz strong laser optical element comprises the following implementation steps:
1) ultra-precision grinding is carried out on the fused quartz element;
2) carrying out magneto-rheological polishing and shape modification on the fused quartz element after ultra-precision grinding;
3) carrying out dynamic acid etching, cleaning and drying on the fused quartz element subjected to magnetorheological rapid polishing;
4) the fused silica component is inspected.
Optionally, when the fused quartz component is subjected to ultra-precision grinding in step 1), a workpiece self-rotation grinding mode is adopted.
Optionally, the step of ultra-precision grinding the fused quartz component in step 1) includes: firstly, grinding by using a 500# resin-based diamond grinding wheel for multiple times to fully grind the surface of the whole fused quartz element; and then grinding for multiple times by using a 2000# resin-based diamond grinding wheel to achieve the specified removal amount.
Optionally, the process parameters adopted when the 500# resin-based diamond grinding wheel is used for grinding for multiple times are as follows: the rotating speed of a workpiece is 200-400 rpm, the rotating speed of a grinding wheel is 1000-5000 rpm, the feeding speed of the grinding wheel is 5mm/min, the grinding quantity of each time is 10-20 mu m, and the polishing time is specified; the technical parameters adopted when the 2000# resin-based diamond grinding wheel is adopted for grinding for multiple times are as follows: the rotating speed of a workpiece is 200-400 rpm, the rotating speed of a grinding wheel is 3000-7000 rpm, the feeding speed of the grinding wheel is 3mm/min, the grinding quantity of each time is 1-2 mu m, and the polishing time is set.
Optionally, the step of performing magnetorheological finishing in step 2) includes: firstly, quickly and uniformly removing a material with the thickness of 3 mu m on the surface of the element by utilizing magnetorheological polishing so as to remove the crushing defect introduced by ultra-precise grinding in the sub-surface of the element; and then, the magnetorheological modification is adopted to ensure that the surface shape and the roughness of the fused quartz element meet the requirements.
Optionally, the process parameters adopted when the material with the thickness of 3 μm on the surface of the element is quickly and uniformly removed by utilizing magnetorheological polishing are as follows: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotating speed of the polishing wheel is 100-200 rpm, the current is 8-9A, the pressing depth is 0.3-0.4 mm, the flow of the magnetorheological polishing solution is 100-200L/h, and the material removal rate is 0.1-0.2 mm3Min; the technological parameters adopted when the magnetorheological modification is adopted are as follows: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotational speed of the polishing wheel is 200-300 rpm, the current is 7-8A, the pressing depth is 0.1-0.2 mm, the flow rate of the magnetorheological polishing solution is 100-200L/h, and the material removal rate is 0.05-0.1 mm3/min。
Optionally, in the step 2), the magnetorheological modification is adopted to ensure that the surface shape and the roughness of the fused quartz element meet the requirements, specifically, the surface shape and the roughness before and after the magnetorheological modification are detected every time one round of the magnetorheological modification is carried out; wherein, the surface shape detection is realized by adopting a wave surface interferometer with a compensator and a pose adjusting platform thereof; the roughness detection adopts an atomic force microscope, the surface of the element randomly takes 5 points, the detection range of each point is 10 Mum multiplied by 10 Mum, a Si scanning probe with the vertex radius smaller than 10nm is used in the measurement process, the scanning resolution is 256 multiplied by 256 pixels, the scanning frequency is 1.0Hz, and finally the average value of five points is taken as the surface roughness test result of the element; the detection process of the surface shape and the roughness is finished in a thousand-level clean room with constant temperature and constant humidity, the temperature is controlled to be 23 +/-0.2 ℃, the humidity is 50 percent, and the step 3 is executed when the measured surface shape PV is less than 0.5wave and the roughness RMS is less than 0.5 nm; otherwise, continuing to carry out the next round of magneto-rheological modification.
Optionally, the step of performing dynamic acid etching on the magnetorheological rapidly polished fused quartz component in the step 3) comprises: firstly, washing a fused quartz element by using deionized water, and clamping the fused quartz element by using a special acid-proof clamp for dynamic acid etching, wherein the adopted process parameters in the dynamic acid etching are 30L of an HF acid solution with the concentration of 5%, the temperature is 25 ℃, the dynamic acid washing time and the megasonic frequency are as follows: keeping the temperature for 30min under 430KHz, keeping the temperature for 30min under 430KHz matched with the sweeping mode, keeping the temperature for 30min under 1300KHz matched with the sweeping mode, and keeping the temperature for 30min under 1300KHz matched with the sweeping mode;
optionally, the step of washing and drying in step 3) includes: rinsing the acid etched fused quartz component for 30 minutes, spraying the component with deionized water for 5 minutes, and finally drying the fused quartz component by using filtered high-pressure nitrogen.
Optionally, the step 4) of inspecting the fused quartz component includes measuring the surface shape and the roughness of the fused quartz component, and if the measured surface shape PV is less than 1wave and the roughness RMS is less than 1nm, finishing final inspection, otherwise, skipping to execute the step 2) to continue the magnetorheological shaping and the dynamic acid etching.
Compared with the prior art, the invention has the following advantages:
1. the method has the advantages of simple process flow and strong operability. After ultra-precision grinding, the surface precision of the element is good, the subsurface damage is less, the grinding process can be omitted, the subsequent process task amount is greatly reduced, the processing period of the fused quartz strong laser element is effectively shortened, and the processing efficiency is improved.
2. The invention can ensure that the surface quality is not damaged, because the fused quartz element is widely applied to a high-precision strong light optical system, the system has extremely high requirements on the surface quality and the surface precision of the element, the magnetorheological polishing is used as a deterministic ultra-precision optical processing technology, the high-precision high-surface-quality optical element can be processed, the later shallow etching cannot damage the surface quality of the element to a great extent, and the surface can still reach the production index after the acid etching. This ensures that the fused silica optical element maintains excellent optical properties after the entire process is completed.
3. The invention can effectively improve the laser damage resistance of the fused quartz component, compared with the traditional process route, the invention introduces ultra-precise grinding, controls the fragmenting defect from the beginning of the process, and the component has better surface integrity. And then, utilizing the nondestructive removal capability of magnetorheological polishing to inhibit and remove the fragmenting defects. And finally, removing iron element pollution and other impurity elements brought by the magnetorheological process by using a dynamic acid etching process, wherein residual acid liquor and compounds generated in the acid washing process exist on the surface of the fused quartz element after acid washing, ultrasonic rinsing and deionized water spraying are needed, and finally, the sample piece is dried by using filtered high-pressure nitrogen to obtain the fused quartz element with a clean surface, so that the element surface is clean and pollution-free, and the laser damage resistance of the fused quartz element is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a basic flow of a method according to an embodiment of the present invention.
FIG. 2 is a removal function image of magnetorheological polishing for rapid and uniform removal under preferred process parameters in an embodiment of the invention.
FIG. 3 is a graph of a removal function for MR modification under preferred process parameters in an embodiment of the present invention.
Detailed Description
Will be described in one piece below
The square fused quartz strong laser optical element is taken as an example, and the ultra-precision machining of the strong laser optical element is carried out on the square fused quartz strong laser optical element, and the method comprises the following steps:
as shown in fig. 1, the implementation steps of the method for ultra-precision machining of the fused silica strong laser optical element in the embodiment include:
1) ultra-precision grinding is carried out on the fused quartz element;
2) carrying out magneto-rheological polishing and shape modification on the fused quartz element after ultra-precision grinding;
3) carrying out dynamic acid etching, cleaning and drying on the fused quartz element subjected to magnetorheological rapid polishing;
4) the fused silica component is inspected.
In this embodiment, when the fused quartz component is subjected to ultra-precision grinding in step 1), a workpiece self-rotation grinding manner is adopted.
In this embodiment, the step of ultra-precisely grinding the fused quartz component in step 1) includes: firstly, grinding by using a 500# resin-based diamond grinding wheel for multiple times to fully grind the surface of the whole fused quartz element; grinding was then carried out a number of times using a # 2000 resin based diamond wheel to achieve the specified removal (20 μm in this example, and may in fact be adjusted and configured as required).
In this embodiment, the process parameters adopted when grinding with the 500# resin-based diamond grinding wheel for multiple times are as follows: the workpiece rotating speed is 200-400 rpm, the grinding wheel rotating speed is 1000-5000 rpm, the grinding wheel feeding speed is 5mm/min, the grinding amount is 10-20 mu m each time, and the polishing time is set to be specific time (in the embodiment, 1min, actually, the polishing time can be adjusted and configured as required); as a specific process parameter example: the rotating speed of the workpiece is 400rpm, the rotating speed of the grinding wheel is 3000rpm, the feeding speed of the grinding wheel is 5mm/min, the grinding quantity is 10 mu m each time, the polishing time is 1min, and the whole workpiece surface is fully ground after multiple times of grinding.
In this embodiment, the process parameters adopted when the 2000# resin-based diamond grinding wheel is used for grinding for multiple times are as follows: the workpiece rotating speed is 200-400 rpm, the grinding wheel rotating speed is 3000-7000 rpm, the grinding wheel feeding speed is 3mm/min, the grinding amount is 1-2 mu m each time, and the polishing time is set (in the embodiment, 1min, which can be actually adjusted and configured as required). As a specific process parameter example: the workpiece rotating speed is 400rpm, the grinding wheel rotating speed is 5000rpm, the grinding wheel feeding speed is 3mm/min, the grinding amount is 2 microns each time, the polishing time is 1min, and the removal amount is 20 microns after ten times of grinding.
In this embodiment, the step of performing magnetorheological polishing and shape modification in the step 2) includes: firstly, quickly and uniformly removing a material with the thickness of 3 mu m on the surface of the element by utilizing magnetorheological polishing so as to remove the crushing defect introduced by ultra-precise grinding in the sub-surface of the element; and then, the magnetorheological modification is adopted to ensure that the surface shape and the roughness of the fused quartz element meet the requirements.
In the embodiment, the technological parameters adopted when the magnetorheological polishing is used for quickly and uniformly removing the material with the thickness of 3 microns on the surface of the element are as follows: the abrasive has a particle size of 0.2 μm CeO2The rotating speed of the polishing wheel is 100-200 rpm, the current is 8-9A, the pressing depth is 0.3-0.4 mm, the flow of the magnetorheological polishing solution is 100-200L/h, and the material removal rate is 0.1-0.2 mm3Min; as a specific process parameter example: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotational speed of the polishing wheel is 200rpm, the current is 8A, the pressing depth is 0.4mm, the flow rate of the magnetorheological polishing solution is 200L/h, figure 2 is a removal function image under the optimized technological parameters, and the material volume removal rate is 0.2mm3/min。
In this embodiment, the process parameters adopted when the magnetorheological modification is adopted are as follows: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotational speed of the polishing wheel is 200-300 rpm, the current is 7-8A, the pressing depth is 0.1-0.2 mm, the flow rate of the magnetorheological polishing solution is 100-200L/h, and the material removal rate is 0.05-0.1 mm3And/min. As a specific process parameter example: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotational speed of the polishing wheel is 280rpm, the current is 7A, the pressing depth is 0.2mm, the flow rate of the magnetorheological polishing solution is 160L/h, FIG. 3 is a removal function image under the optimized process parameters, and the material volume removal rate is 0.1mm3/min。
In the embodiment, the magnetorheological modification is adopted in the step 2) to ensure that the surface shape and the roughness of the fused quartz element meet the requirements, specifically, the surface shape and the roughness before and after the magnetorheological modification are detected every time one round of the magnetorheological modification is carried out; wherein, the surface shape detection is realized by adopting a wave surface interferometer with a compensator and a pose adjusting platform thereof; the roughness detection adopts an atomic force microscope, the surface of the element randomly takes 5 points, the detection range of each point is 10 Mum multiplied by 10 Mum, a Si scanning probe with the vertex radius smaller than 10nm is used in the measurement process, the scanning resolution is 256 multiplied by 256 pixels, the scanning frequency is 1.0Hz, and finally the average value of five points is taken as the surface roughness test result of the element; the detection process of the surface shape and the roughness is finished in a thousand-level clean room with constant temperature and constant humidity, the temperature is controlled to be 23 +/-0.2 ℃, the humidity is 50 percent, and the step 3 is executed when the measured surface shape PV is less than 0.5wave and the roughness RMS is less than 0.5 nm; otherwise, continuing to carry out the next round of magneto-rheological modification.
In this embodiment, the wavefront interferometer is a 6-inch VeriFire Asphere laser wavefront interferometer manufactured by Zygo corporation, and the resolution is 1024 × 1024 pixels. In the detection process, a compensator and a pose adjusting platform thereof are added on the interferometer, so that the repeated measurement precision is improved. The roughness measurement adopts a Dimension Icon atomic force microscope of Bruker company, USA, 5 points are randomly sampled on the surface of the element, the detection range of each point is 10 Mum multiplied by 10 Mum, a Si scanning probe with the vertex radius less than 10nm is used in the measurement process, the scanning resolution is 256 multiplied by 256 pixels, and the scanning frequency is 1.0 Hz.
The purpose of the step 3) is to remove metal pollution introduced in the magnetorheological rapid polishing and shape modifying stage of the element surface.
In this embodiment, the step of performing dynamic acid etching on the fused quartz component after the magnetorheological rapid polishing in step 3) includes: firstly, washing a fused quartz element by using deionized water, and clamping the fused quartz element by using a special acid-proof clamp for dynamic acid etching, wherein the adopted process parameters in the dynamic acid etching are 30L of an HF acid solution with the concentration of 5%, the temperature is 25 ℃, the dynamic acid washing time and the megasonic frequency are as follows: keeping the temperature for 30min under 430KHz, keeping the temperature for 30min under 430KHz matched with the sweeping mode, keeping the temperature for 30min under 1300KHz matched with the sweeping mode, and keeping the temperature for 30min under 1300KHz matched with the sweeping mode;
in this embodiment, the step of cleaning and drying in step 3) includes: rinsing the acid etched fused quartz component for 30 minutes, spraying the component with deionized water for 5 minutes, and finally drying the fused quartz component by using filtered high-pressure nitrogen.
In this embodiment, the step 4) of inspecting the fused quartz component includes measuring a surface shape and roughness of the fused quartz component, and if the measured surface shape PV is less than 1wave and the roughness RMS is less than 1nm, finishing final inspection, otherwise, skipping to perform the step 2) to continue performing magnetorheological shape modification and dynamic acid etching.
Similarly, in the present embodiment, in step 4), a 6-inch VeriFire Asphere laser wave surface interferometer from Zygo corporation is used for surface shape measurement, and the resolution is 1024 × 1024 pixels. In the detection process, a compensator and a pose adjusting platform thereof are added on the interferometer, so that the repeated measurement precision is improved. The roughness measurement adopts a Dimension Icon atomic force microscope of Bruker company, USA, 5 points are randomly sampled on the surface of the element, the detection range of each point is 10 Mum multiplied by 10 Mum, a Si scanning probe with the vertex radius less than 10nm is used in the measurement process, the scanning resolution is 256 multiplied by 256 pixels, and the scanning frequency is 1.0 Hz. And finally, taking the average value of five points as the surface roughness test result of the element. The surface shape and roughness detection process is completed in a thousand-level clean room with constant temperature and constant humidity, the temperature is controlled to be 23 +/-0.2 ℃, and the humidity is 50%. And (3) carrying out the next step when the measured surface PV is less than 0.5wave and the roughness RMS is less than 0.5nm, otherwise, continuing carrying out the magneto-rheological modification, and repeatedly iterating the modification process until the requirements are met.
In conclusion, the method has the advantages of simple process flow, strong operability and short processing period, ensures the surface precision of the fused quartz strong laser element, realizes low damage of the surface/subsurface of the element, and has excellent laser damage resistance.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. A method for ultraprecise processing of a fused quartz strong laser optical element is characterized by comprising the following implementation steps:
1) ultra-precision grinding is carried out on the fused quartz element;
2) carrying out magneto-rheological polishing and shape modification on the fused quartz element after ultra-precision grinding;
3) carrying out dynamic acid etching, cleaning and drying on the fused quartz element subjected to magnetorheological rapid polishing;
4) the fused silica component is inspected.
2. The method for ultra-precision machining of the fused quartz strong laser optical element according to claim 1, wherein the fused quartz element is ground by the self-rotation grinding mode of the workpiece in the step 1).
3. The method for ultraprecise processing of a fused silica intense laser optical element according to claim 1, wherein the step of ultraprecise grinding the fused silica element in step 1) comprises: firstly, grinding by using a 500# resin-based diamond grinding wheel for multiple times to fully grind the surface of the whole fused quartz element; and then grinding for multiple times by using a 2000# resin-based diamond grinding wheel to achieve the specified removal amount.
4. The method for ultra-precision machining of the fused silica strong laser optical element according to claim 3, wherein the process parameters adopted when grinding is carried out for multiple times by using a 500# resin-based diamond grinding wheel are as follows: the rotating speed of a workpiece is 200-400 rpm, the rotating speed of a grinding wheel is 1000-5000 rpm, the feeding speed of the grinding wheel is 5mm/min, the grinding quantity of each time is 10-20 mu m, and the polishing time is specified; the technical parameters adopted when the 2000# resin-based diamond grinding wheel is adopted for grinding for multiple times are as follows: the rotating speed of a workpiece is 200-400 rpm, the rotating speed of a grinding wheel is 3000-7000 rpm, the feeding speed of the grinding wheel is 3mm/min, the grinding quantity of each time is 1-2 mu m, and the polishing time is set.
5. The method for ultraprecise processing of a fused silica intense laser optical element according to claim 1, wherein the step of performing magnetorheological polishing and shape modification in the step 2) comprises the following steps: firstly, quickly and uniformly removing a material with the thickness of 3 mu m on the surface of the element by utilizing magnetorheological polishing so as to remove the crushing defect introduced by ultra-precise grinding in the sub-surface of the element; and then, the magnetorheological modification is adopted to ensure that the surface shape and the roughness of the fused quartz element meet the requirements.
6. The method for ultraprecise processing of the fused silica intense laser optical element according to claim 5, wherein the technological parameters adopted when the magnetorheological polishing is used for quickly and uniformly removing the material with the thickness of 3 μm on the surface of the element are as follows: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotating speed of the polishing wheel is 100-200 rpm, the current is 8-9A, the pressing depth is 0.3-0.4 mm, the flow of the magnetorheological polishing solution is 100-200L/h, and the material removal rate is 0.1-0.2 mm3Min; the technological parameters adopted when the magnetorheological modification is adopted are as follows: the abrasive is CeO with the grain diameter of 0.2 mu m2The rotational speed of the polishing wheel is 200-300 rpm, the current is 7-8A, the pressing depth is 0.1-0.2 mm, the flow rate of the magnetorheological polishing solution is 100-200L/h, and the material removal rate is 0.05-0.1 mm3/min。
7. The method for ultraprecise processing of the fused quartz intense laser optical element according to claim 5, wherein magnetorheological modification is adopted in the step 2) to ensure that the surface shape and the roughness of the fused quartz element meet the requirements, specifically, the surface shape and the roughness before and after the magnetorheological modification are detected every time one round of magnetorheological modification is carried out; wherein, the surface shape detection is realized by adopting a wave surface interferometer with a compensator and a pose adjusting platform thereof; the roughness detection adopts an atomic force microscope, the surface of the element randomly takes 5 points, the detection range of each point is 10 Mum multiplied by 10 Mum, a Si scanning probe with the vertex radius smaller than 10nm is used in the measurement process, the scanning resolution is 256 multiplied by 256 pixels, the scanning frequency is 1.0Hz, and finally the average value of five points is taken as the surface roughness test result of the element; the detection process of the surface shape and the roughness is finished in a thousand-level clean room with constant temperature and constant humidity, the temperature is controlled to be 23 +/-0.2 ℃, the humidity is 50 percent, and the step 3 is executed when the measured surface shape PV is less than 0.5wave and the roughness RMS is less than 0.5 nm; otherwise, continuing to carry out the next round of magneto-rheological modification.
8. The method for ultra-precision processing of a fused silica intense laser optical element according to claim 1, wherein the step of performing dynamic acid etching on the fused silica element after magnetorheological rapid polishing in the step 3) comprises the following steps: firstly, washing a fused quartz element by using deionized water, and clamping the fused quartz element by using a special acid-proof clamp for dynamic acid etching, wherein the adopted process parameters in the dynamic acid etching are 30L of an HF acid solution with the concentration of 5%, the temperature is 25 ℃, the dynamic acid washing time and the megasonic frequency are as follows: keeping the temperature for 30min under 430KHz, 30min under 430KHz matched with the sweep mode, 30min under 1300KHz matched with the sweep mode, and 30min under 1300KHz matched with the sweep mode.
9. The method for ultraprecise processing of a fused silica intense laser optical element according to claim 1, wherein the step of cleaning and drying in step 3) comprises: rinsing the acid etched fused quartz component for 30 minutes, spraying the component with deionized water for 5 minutes, and finally drying the fused quartz component by using filtered high-pressure nitrogen.
10. The method for ultra-precision machining of a fused silica intense laser optical element according to claim 1, wherein the inspection of the fused silica element in the step 4) comprises measuring the surface shape and the roughness of the fused silica element, and if the measured surface shape PV <1wave and the roughness RMS <1nm, the final inspection is completed, otherwise, the step 2) is executed in a skipping mode to continue the magneto-rheological modification and the dynamic acid etching.
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| CN118024033A (en) * | 2024-04-10 | 2024-05-14 | 浙江大学 | Fused quartz grinding and polishing integrated processing device and method based on discharge tool |
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