CN112151428A - Silicon wafer bearing device - Google Patents
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- CN112151428A CN112151428A CN202011045629.XA CN202011045629A CN112151428A CN 112151428 A CN112151428 A CN 112151428A CN 202011045629 A CN202011045629 A CN 202011045629A CN 112151428 A CN112151428 A CN 112151428A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 235000012431 wafers Nutrition 0.000 claims abstract description 67
- 239000004576 sand Substances 0.000 claims abstract description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 229920002530 polyetherether ketone Polymers 0.000 claims description 7
- 239000002033 PVDF binder Substances 0.000 claims description 6
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 2
- 238000003466 welding Methods 0.000 abstract description 12
- 239000000243 solution Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000003781 tooth socket Anatomy 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of solar cells and provides a silicon wafer bearing device. The silicon wafer bearing device comprises two end plates and a plurality of supporting rods arranged between the two end plates; the supporting rods are provided with a plurality of tooth grooves for inserting silicon wafers along the length direction of the supporting rods, and the end plates are provided with mounting holes corresponding to the supporting rods one to one; a first limiting structure is formed on the inner wall of the mounting hole, and a second limiting structure corresponding to the first limiting structure is formed on the outer wall of the supporting rod; one of them includes spacing sand grip in first limit structure with second limit structure, and the other one includes two parallel arrangement's spacing piece, two form between the spacing piece and be used for holding the passageway of spacing sand grip. The invention not only facilitates the disassembly of the silicon wafer bearing device, the independent replacement of the damaged supporting rod or end plate at the later stage and the cost reduction, but also avoids the problems of size deformation and low strength of the welding position caused by welding.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to a silicon wafer bearing device.
Background
With the deterioration of global environment and the exhaustion of fossil fuels, all countries in the world aim to the energy transformation, and on the way of energy transformation, new energy is considered as an important direction of energy transformation. Solar energy is used as a clean renewable resource, and the application field of the solar energy is increasingly wide. Photovoltaic power generation is one of the main ways of utilizing solar energy at present, has become a new industry which is generally concerned and mainly developed by countries in the world due to the characteristics of cleanness, safety, convenience, high efficiency and the like, and a solar cell is one of indispensable components for photovoltaic power generation.
The silicon solar cell is one of the solar cells, and most of the commercialized solar cells are manufactured by using silicon wafers at present based on the advantages of non-toxicity, low price and large reserves in the earth crust. In the process of preparing the solar cell, a silicon wafer is firstly placed in a silicon wafer bearing device, the strong acid and strong alkali solution with certain temperature is utilized to carry out procedures of cleaning, texturing and the like on the silicon wafer, so that the microstructure on the surface of the silicon wafer is changed, and then the photoelectric conversion is realized through the subsequent procedures.
With the upgrading of the industry, the number of silicon wafers to be carried by the silicon wafer carrying device is increased from dozens of original silicon wafers to 100 silicon wafers, so that the requirements on the strength and the size stability of the silicon wafer carrying device are improved. The existing silicon wafer bearing device is generally composed of an end plate and a supporting rod which are made of plastic materials, and the end plate and the supporting rod are fixed together through hot melting welding or secondary injection welding. The end plate and the supporting rod can be heated again by hot melting welding or secondary injection welding, so that the sizes of the end plate and the supporting rod are changed, and further the whole size of the silicon wafer bearing device is deviated. In the process of manufacturing the solar cell, the deviation of the whole size of the silicon wafer bearing device can cause the silicon wafer and the silicon wafer bearing device to generate wafer collision, so that the silicon wafer is damaged, and the qualification rate of the silicon wafer is influenced. In addition, because end plate and bracing piece pass through welded connection, therefore end plate or bracing piece can not replace alone when damaging, greatly increased the cost to the silicon chip bears the device and falls easily because of staff's maloperation in the use, and the low, very easily emergence damage of the splice intensity of end plate and bracing piece.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art. Therefore, the invention provides a silicon wafer bearing device, which aims to reduce the production cost, prolong the service life of the silicon wafer bearing device and improve the strength and the dimensional stability of the silicon wafer bearing device.
The silicon wafer bearing device comprises two end plates and a plurality of supporting rods arranged between the two end plates; the supporting rods are provided with a plurality of tooth grooves for inserting silicon wafers along the length direction of the supporting rods, and the end plates are provided with mounting holes corresponding to the supporting rods one to one; a first limiting structure is formed on the inner wall of the mounting hole, and a second limiting structure corresponding to the first limiting structure is formed on the outer wall of the supporting rod; one of them includes spacing sand grip in first limit structure with second limit structure, and the other one includes two parallel arrangement's spacing piece, two form between the spacing piece and be used for holding the passageway of spacing sand grip.
According to the silicon wafer bearing device provided by the embodiment of the invention, the first limiting structure is arranged in the mounting hole of the end plate, the second limiting structure is arranged on the outer wall of the supporting rod, the first limiting structure and the second limiting structure can be matched by rotating the supporting rod, and the supporting rod is further fixed between the two end plates, so that the silicon wafer bearing device is convenient to disassemble, the damaged supporting rod or end plate can be conveniently and independently replaced at the later stage, the cost is reduced, and the problems of size deformation and low strength of a welding part caused by welding are avoided. Therefore, the silicon wafer basket has the advantages that the service life of the silicon wafer basket is prolonged, and the strength and the size stability of the silicon wafer basket are improved.
In addition, the silicon wafer bearing device according to the embodiment of the invention may further have the following additional technical features:
according to one embodiment of the invention, the number of the first limiting structures is multiple, and the first limiting structures are arranged at intervals along the circumferential direction of the mounting hole.
According to one embodiment of the invention, the number of the first limiting structures is two, and the two first limiting structures are arranged oppositely.
According to one embodiment of the invention, the support rod further comprises a retaining ring which corresponds to the end part of the support rod one by one, the retaining ring comprises two semicircular rings which are detachably connected, and the two semicircular rings are oppositely arranged to form an annular space for clamping the end part of the support rod; two the semicircle ring orientation one side of end plate all is formed with the edge semicircle ring axial extension's arc limiting plate, the quantity of arc limiting plate with first limit structure's quantity is the same, the arc limiting plate is used for inserting and establishes adjacent two between the first limit structure, just the both sides of arc limiting plate respectively with two first limit structure's tip laminating.
According to one embodiment of the invention, a first positioning part is formed on the outer wall of the arc limiting plate, and a second positioning part matched with the first positioning part is formed on the inner wall of the mounting hole; one of the first positioning part and the second positioning part is a protrusion, and the other one is a groove.
According to one embodiment of the invention, a first clamping portion and a second clamping portion are respectively formed on the opposite surfaces of the two semicircular rings, and the first clamping portion is in clamping fit with the second clamping portion.
According to an embodiment of the present invention, the first engaging portion is a locking block, and the second engaging portion is a locking groove.
According to one embodiment of the invention, the outer wall of the semicircular ring is formed with a semicircular limiting boss, and the limiting boss is used for abutting against the end plate.
According to one embodiment of the invention, the support rod and the semicircular ring are made of PVDF, PP or PEEK compounded with glass fibers or carbon fibers.
According to one embodiment of the invention, the end plate is made of PTFE, PVDF, PP or PEEK.
One or more technical solutions in the embodiments of the present invention have at least one of the following technical effects:
the silicon wafer bearing device is simple in structure and convenient and fast to install, the first limiting structure is arranged in the installing hole of the end plate, the second limiting structure is arranged on the outer wall of the supporting rod, the first limiting structure and the second limiting structure can be matched by rotating the supporting rod, and the supporting rod is further fixed between the two end plates, so that the silicon wafer bearing device is convenient to disassemble, the damaged supporting rod or the end plate can be conveniently and independently replaced at the later stage, the cost is reduced, and the problems of size deformation and low strength of a welding position caused by welding are solved. Therefore, the silicon wafer basket has the advantages that the service life of the silicon wafer basket is prolonged, and the strength and the size stability of the silicon wafer basket are improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a silicon wafer carrying device according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a support plate and an end plate provided in an embodiment of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is an assembled schematic view of a support plate and end plate provided by an embodiment of the present invention;
FIG. 5 is an enlarged view of FIG. 4 at B;
FIG. 6 is a schematic partial exploded view of another silicon wafer carrier according to an embodiment of the present invention;
FIG. 7 is an enlarged view of FIG. 6 at C;
fig. 8 is an assembly schematic diagram of a support plate, an end plate and a retaining ring according to an embodiment of the invention.
Reference numerals:
100. an end plate; 110. mounting holes; 120. limiting convex strips; 130. a second positioning portion; 200. a support bar; 210. a tooth socket; 220. a limiting sheet; 221. a channel; 300. a retaining ring; 310. a semicircular ring; 311. an arc limiting plate; 312. a first positioning portion; 313. a first clamping part; 314. a second clamping part.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Referring to fig. 1 to 8, an embodiment of the present invention provides a silicon wafer carrying device, which includes two end plates 100 and a plurality of support rods 200 disposed between the two end plates 100; a plurality of tooth grooves 210 for inserting silicon wafers are formed in the supporting rod 200 along the length direction thereof, and mounting holes 110 corresponding to the supporting rods 200 one to one are formed in the end plate 100; a first limit structure is formed on the inner wall of the mounting hole 110, and a second limit structure corresponding to the first limit structure is formed on the outer wall of the support rod 200; one of the first limit structure and the second limit structure comprises a limit convex strip 120, the other one comprises two limit pieces 220 arranged in parallel, and a channel 221 for accommodating the limit convex strip 120 is formed between the two limit pieces 220.
The following describes a method for disassembling and assembling a silicon wafer carrying device according to an embodiment of the present invention, taking the first limiting structure as the limiting convex strip 120 and the second limiting structure as the two limiting pieces 220 as an example:
when the silicon wafer bearing device is assembled: firstly, as shown in fig. 2 and 3, two ends of the supporting rod 200 are respectively aligned with the mounting holes 110 of the two end plates 100, and the limiting sheets 220 are staggered with the limiting convex strips 120; then, the ends of the support rods 200 are inserted into the corresponding mounting holes 110; then, as shown in fig. 4 and 5, the supporting rod 200 is rotated until the limiting protrusion 120 is inserted between the two limiting pieces 220. At this time, the supporting rod 200 is restrained by the limiting ribs 120 and cannot move relative to the end plate 100.
When the silicon wafer bearing device is disassembled: firstly, the supporting rod 200 is rotated until the limiting sheet 220 is separated from the limiting convex strip 120, that is, until the limiting convex strip 120 extends out of the channel 221 completely; then, the two end plates 100 are simply removed from the ends of the support rods 200, respectively.
Therefore, according to the invention, the first limiting structure is arranged in the mounting hole 110 of the end plate 100, and the second limiting structure is arranged on the outer wall of the supporting rod 200, so that the supporting rod 200 can be matched with the first limiting structure and the second limiting structure by rotating the supporting rod 200, and the supporting rod 200 is further fixed between the two end plates 100, thereby facilitating the disassembly of the silicon wafer bearing device, facilitating the later independent replacement of the damaged supporting rod 200 or the end plate 100, reducing the cost, and avoiding the problems of size deformation and low strength of a welding position caused by welding. Therefore, the silicon wafer basket has the advantages that the service life of the silicon wafer basket is prolonged, and the strength and the size stability of the silicon wafer basket are improved.
It should be noted that, the number of the first limiting structures may be multiple, and multiple first limiting structures are arranged at intervals along the circumferential direction of the mounting hole 110. For example, as shown in fig. 1, the number of the first limiting structures is two, and the two first limiting structures are arranged oppositely. In addition, in order to prevent the supporting rod 200 from rotating to separate the limiting pieces 220 from the limiting convex strips 120 during the use of the silicon wafer carrying device, the width of the channel 221 between two limiting pieces 220 is preferably equal to the thickness of the limiting convex strips 120. Of course, instead of restricting the size of the channel 221 and the limiting rib 120 to prevent the rotation of the support rod 200, the retaining ring 300 may be used. Specifically, as shown in fig. 6 and 7, the silicon wafer carrying device further includes a retaining ring 300 corresponding to the end of the supporting rod 200 one by one, the retaining ring 300 includes two detachably connected semicircular rings 310, and the two semicircular rings 310 are oppositely disposed to form an annular space for clamping the end of the corresponding supporting rod 200; two semicircle rings 310 all are formed with along the arc limiting plate 311 of semicircle ring 310 axial extension towards one side of end plate 100, and the quantity of arc limiting plate 311 is the same with first limit structure's quantity, and arc limiting plate 311 is used for inserting and establishes between two adjacent first limit structure, and the both sides of arc limiting plate 311 laminate with two first limit structure's tip respectively.
The following describes an assembly method of a silicon wafer carrying device in an embodiment of the present invention, taking two limiting convex strips 120 oppositely arranged left and right in the mounting hole 110 as an example:
therefore, when the silicon wafer bearing device is assembled: first, as shown in fig. 2 and 3, the two ends of the support rod 200 are aligned with the mounting holes 110 of the two end plates 100, respectively, and the position-limiting pieces 220 are staggered from the position-limiting protrusions 120. Then, the ends of the support rods 200 are inserted into the corresponding mounting holes 110. Then, as shown in fig. 4 and 5, the supporting rod 200 is rotated until the limiting protrusion 120 is inserted between the two limiting pieces 220. Next, as shown in fig. 7, one of the semicircular rings 310 is fastened to the upper side of the end of the support pole 200. Next, as shown in fig. 8, another half ring 310 is fastened to the lower side of the end of the support bar 200, and the two half rings 310 are fixedly coupled together while the support bar 200 is held between the two half rings 310. Finally, the arc-shaped limiting plate 311 of the upper semicircular ring 310 is inserted between the top ends of the two limiting convex strips 120; at this time, the two sides of the arc-shaped limiting plate 311 are just respectively attached to the end surfaces of the top ends of the two limiting convex strips 120; meanwhile, the arc-shaped limiting plate 311 of the semicircular ring 310 located on the lower side is inserted between the bottom ends of the two limiting convex strips 120, and at this time, the two sides of the arc-shaped limiting plate 311 are just attached to the end surfaces of the bottom ends of the two limiting convex strips 120 respectively.
As can be seen from the above, since the arc-shaped limiting plate 311 is inserted between two adjacent first limiting structures, the supporting rod 200 cannot rotate in the mounting hole 110 due to the blocking of the arc-shaped limiting plate 311, and thus the spacing piece 220 is prevented from being separated from the limiting convex strip 120. As can be seen, in the silicon wafer carrying device according to the embodiment of the present invention, the supporting rod 200 cannot move relative to the end plates 100 by the cooperation of the first limiting structure and the second limiting structure, and the supporting rod 200 cannot rotate relative to the end plates 100 by the arc-shaped limiting plate 311 of the retaining ring 300, so that the supporting rod 200 can be firmly fixed between the two end plates 100.
Further, as shown in fig. 7, the outer wall of the arc limiting plate 311 is formed with a first positioning portion 312, and the inner wall of the mounting hole 110 is formed with a second positioning portion 130 for cooperating with the first positioning portion 312; one of the first positioning portion 312 and the second positioning portion 130 is a protrusion, and the other is a groove. Wherein the bumps are preferably bumps. The advantages of such an arrangement are: on one hand, the matching of the protrusion and the groove not only prevents the retaining ring 300 from rotating in the mounting hole 110, but also prevents the retaining ring 300 from being separated from the mounting hole 110; on the other hand, when the semicircular ring 310 is installed, the positioning of the semicircular ring 310 in the installation hole 110 is facilitated through the matching of the protrusion and the groove. It should be noted that the number of the first positioning portions 312 and the second positioning portions 130 may be plural, and the specific number may be determined according to actual situations. Of course, in order to facilitate the positioning of the semicircular ring 310, the outer wall of the semicircular ring 310 may also be formed with a semicircular limiting boss, and the limiting boss is used to abut against the end plate 100.
It should be noted that, there are various detachable connection manners of the two semicircular rings 310, for example, the two semicircular rings 310 are connected by clamping, specifically, a first clamping portion 313 and a second clamping portion 314 are respectively formed on opposite surfaces of the two semicircular rings 310, and the first clamping portion 313 is matched with the second clamping portion 314 in a clamping manner. The first engaging portion 313 is a locking block, and the second engaging portion 314 is a locking slot.
The support rod 200 and the semicircular ring 310 may be made of PVDF (polyvinylidene fluoride), PP (polypropylene), or PEEK (polyetheretherketone) compounded with glass fibers or carbon fibers. Wherein, the support rod 200 and the semicircular ring 310 can be formed by integral injection molding. The end plate 100 may be made of PTFE, i.e., a corrosion-resistant material such as polytetrafluoroethylene, PVDF, PP, or PEEK.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the invention, but not to limit it; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A silicon wafer bearing device is characterized by comprising two end plates and a plurality of supporting rods arranged between the two end plates; the supporting rods are provided with a plurality of tooth grooves for inserting silicon wafers along the length direction of the supporting rods, and the end plates are provided with mounting holes corresponding to the supporting rods one to one; a first limiting structure is formed on the inner wall of the mounting hole, and a second limiting structure corresponding to the first limiting structure is formed on the outer wall of the supporting rod; one of them includes spacing sand grip in first limit structure with second limit structure, and the other one includes two parallel arrangement's spacing piece, two form between the spacing piece and be used for holding the passageway of spacing sand grip.
2. The silicon wafer bearing device according to claim 1, wherein the number of the first limit structures is multiple, and the multiple first limit structures are arranged at intervals along the circumferential direction of the mounting hole.
3. The silicon wafer bearing device according to claim 2, wherein the number of the first limit structures is two, and the two first limit structures are arranged oppositely.
4. The silicon wafer bearing device according to claim 2 or 3, further comprising a retaining ring corresponding to the end of the support rod, wherein the retaining ring comprises two detachably connected semicircular rings, and the two semicircular rings are oppositely arranged to form an annular space for clamping the end of the support rod; two the semicircle ring orientation one side of end plate all is formed with the edge semicircle ring axial extension's arc limiting plate, the quantity of arc limiting plate with first limit structure's quantity is the same, the arc limiting plate is used for inserting and establishes adjacent two between the first limit structure, just the both sides of arc limiting plate respectively with two first limit structure's tip laminating.
5. The silicon wafer carrying device according to claim 4, wherein a first positioning portion is formed on an outer wall of the arc-shaped limiting plate, and a second positioning portion for being matched with the first positioning portion is formed on an inner wall of the mounting hole; one of the first positioning part and the second positioning part is a protrusion, and the other one is a groove.
6. The silicon wafer bearing device according to claim 4, wherein a first clamping portion and a second clamping portion are respectively formed on the opposite surfaces of the two semicircular rings, and the first clamping portion is in clamping fit with the second clamping portion.
7. The silicon wafer bearing device according to claim 6, wherein the first clamping portion is a clamping block, and the second clamping portion is a clamping groove.
8. The silicon wafer bearing device according to claim 4, wherein the outer wall of the semicircular ring is formed with a semicircular limiting boss, and the limiting boss is used for abutting against the end plate.
9. The silicon wafer carrying device according to claim 4, wherein the support rod and the semicircular ring are made of PVDF, PP or PEEK compounded with glass fibers or carbon fibers.
10. The silicon wafer carrier device according to claim 1, wherein the end plate is made of PTFE, PVDF, PP or PEEK.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011045629.XA CN112151428A (en) | 2020-09-28 | 2020-09-28 | Silicon wafer bearing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011045629.XA CN112151428A (en) | 2020-09-28 | 2020-09-28 | Silicon wafer bearing device |
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| CN112151428A true CN112151428A (en) | 2020-12-29 |
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| CN202011045629.XA Pending CN112151428A (en) | 2020-09-28 | 2020-09-28 | Silicon wafer bearing device |
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| WO2012128459A2 (en) * | 2011-03-24 | 2012-09-27 | (주)상아프론테크 | Solar wafer cassette |
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