CN112143217A - Low dielectric loss heat conduction material and preparation method thereof - Google Patents
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Abstract
The invention discloses a low dielectric loss heat conduction material and a preparation method thereof, and the formula comprises the following components: 65-80% of PA plastic, 9.5-10% of compatilizer, 9.5-15% of heat-conducting powder and 0.2-0.5% of modifier; the preparation method comprises the following steps of firstly, selecting materials and burdening; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage; compared with the existing heat conduction material formula, the formula and the proportion of the raw materials are innovated, the mechanical property of the material can be greatly improved, and the low dielectric property that the dielectric loss of the heat conduction material is less than 0.004 is realized; the invention further improves the heat resistance of the heat-conducting material; the invention further improves the fluidity of the heat conduction material, so that the heat conduction material can be used as the material of a connector with smaller and narrower pin spacing; the preparation method provided by the invention is more scientific and standard, can greatly improve the production efficiency, and can avoid the reduction of the mechanical property and the physical property of a finished product due to the defects of the preparation method.
Description
Technical Field
The invention relates to the technical field of heat conduction materials, in particular to a low-dielectric-loss heat conduction material and a preparation method thereof.
Background
LCP heat conduction material is because of its excellent heat resistance and easy shaping processability, often is used for making sports goods, brake block, film, soft printed circuit, microwave oven container, make satellite electronic parts etc. current LCP heat conduction material leads to its heat conduction material mechanical properties who produces to be low because of the not scientific and reasonable enough of prescription, current heat conduction material production processes are not normative enough, and degree of automation is low, leads to its production efficiency low, also influences the performance of product simultaneously.
Disclosure of Invention
The present invention is directed to a low dielectric loss thermal conductive material and a method for making the same, which solves the above problems.
In order to solve the technical problems, the invention provides the following technical scheme: a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 65-80% of PA plastic, 9.5-10% of compatilizer, 9.5-15% of heat-conducting powder and 0.2-0.5% of modifier.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: 65-80% of PA plastic, 9.5-10% of compatilizer, 9.5-15% of heat-conducting powder and 0.2-0.5% of modifier are selected and weighed according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer for mixing and stirring;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard;
2) and (5) recording qualified products into a warehouse.
According to the technical scheme, the components are as follows by mass percent: 75% of PA plastic, 10% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier.
According to the technical scheme, the compatilizer is a maleic anhydride graft subjected to washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
According to the technical scheme, in the second step 2), the stirring temperature is 110 ℃, and the stirring time is 3 min.
According to the technical scheme, in the step three 2), the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
According to the technical scheme, in the step four 1), the granulator is a melting granulator.
According to the technical scheme, in the step five 1), the quality inspection standard is as follows: a density of 1.1-2.1g/cm3, a hardness of 84-85A, a tensile strength of greater than 60MPa, an elongation at break of greater than 4.2%, a melt index of 28-32g/10min, a thermal conductivity of 1.4-1.8W/MK, and a dielectric loss tangent of 3.7.
Compared with the prior art, the invention has the following beneficial effects: compared with the existing heat conduction material formula, the formula and the proportion of the raw materials are innovated, the mechanical property of the material can be greatly improved, and the low dielectric property that the dielectric loss of the heat conduction material is less than 0.004 is realized; the invention further improves the heat resistance of the heat-conducting material; the invention further improves the fluidity of the heat conduction material, so that the heat conduction material can be used as the material of a connector with smaller and narrower pin spacing; the preparation method provided by the invention is more scientific and standard, can greatly improve the production efficiency, and can avoid the reduction of the mechanical property and the physical property of a finished product due to the defects of the preparation method.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a low dielectric loss heat conduction material and its preparation method:
example 1:
a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 75% of PA plastic, 10% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: selecting 75% of PA plastic, 10% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier, and weighing according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer to mix and stir at the stirring temperature of 110 ℃ for 3 min;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion, wherein the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a melting granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard, wherein the quality inspection standard is as follows: density of 1.1-2.1g/cm3, hardness of 84-85A, tensile strength of more than 60MPa, elongation at break of more than 4.2%, melt index of 28-32g/10min, thermal conductivity of 1.4-1.8W/MK, and dielectric loss tangent of 3.7;
2) and (5) recording qualified products into a warehouse.
Wherein the compatilizer is maleic anhydride graft after washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
Example 2:
a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 80% of PA plastic, 5% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: 80% of PA plastic, 5% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier are selected and weighed according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer to mix and stir at the stirring temperature of 110 ℃ for 3 min;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion, wherein the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a melting granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard, wherein the quality inspection standard is as follows: density of 1.1-2.1g/cm3, hardness of 84-85A, tensile strength of more than 60MPa, elongation at break of more than 4.2%, melt index of 28-32g/10min, thermal conductivity of 1.4-1.8W/MK, and dielectric loss tangent of 3.7;
2) and (5) recording qualified products into a warehouse.
Wherein the compatilizer is maleic anhydride graft after washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
Example 3:
a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 70% of PA plastic, 15% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: 70% of PA plastic, 15% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier are selected and weighed according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer to mix and stir at the stirring temperature of 110 ℃ for 3 min;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion, wherein the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a melting granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard, wherein the quality inspection standard is as follows: density of 1.1-2.1g/cm3, hardness of 84-85A, tensile strength of more than 60MPa, elongation at break of more than 4.2%, melt index of 28-32g/10min, thermal conductivity of 1.4-1.8W/MK, and dielectric loss tangent of 3.7;
2) and (5) recording qualified products into a warehouse.
Wherein the compatilizer is maleic anhydride graft after washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
Example 4:
a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 80% of PA plastic, 10% of compatilizer, 9.5% of heat-conducting powder and 0.5% of modifier.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: 80% of PA plastic, 10% of compatilizer, 9.5% of heat-conducting powder and 0.5% of modifier are selected and weighed according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer to mix and stir at the stirring temperature of 110 ℃ for 3 min;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion, wherein the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a melting granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard, wherein the quality inspection standard is as follows: density of 1.1-2.1g/cm3, hardness of 84-85A, tensile strength of more than 60MPa, elongation at break of more than 4.2%, melt index of 28-32g/10min, thermal conductivity of 1.4-1.8W/MK, and dielectric loss tangent of 3.7;
2) and (5) recording qualified products into a warehouse.
Wherein the compatilizer is maleic anhydride graft after washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
Example 5:
a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 70% of PA plastic, 10% of compatilizer, 19.5% of heat-conducting powder and 0.5% of modifier.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: 70% of PA plastic, 10% of compatilizer, 19.5% of heat-conducting powder and 0.5% of modifier are selected and weighed according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer to mix and stir at the stirring temperature of 110 ℃ for 3 min;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion, wherein the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a melting granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard, wherein the quality inspection standard is as follows: density of 1.1-2.1g/cm3, hardness of 84-85A, tensile strength of more than 60MPa, elongation at break of more than 4.2%, melt index of 28-32g/10min, thermal conductivity of 1.4-1.8W/MK, and dielectric loss tangent of 3.7;
2) and (5) recording qualified products into a warehouse.
Wherein the compatilizer is maleic anhydride graft after washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
Example 6:
a low dielectric loss thermal conductive material, the formula comprises: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 75.5% of PA plastic, 15% of compatilizer and 14.5% of heat-conducting powder.
A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage;
in the first step, the components in percentage by mass are as follows: selecting 75.5% of PA plastic, 5% of compatilizer and 14.5% of heat-conducting powder, and weighing according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer to mix and stir at the stirring temperature of 110 ℃ for 3 min;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion, wherein the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a melting granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard, wherein the quality inspection standard is as follows: density of 1.1-2.1g/cm3, hardness of 84-85A, tensile strength of more than 60MPa, elongation at break of more than 4.2%, melt index of 28-32g/10min, thermal conductivity of 1.4-1.8W/MK, and dielectric loss tangent of 3.7;
2) and (5) recording qualified products into a warehouse.
Wherein the compatilizer is maleic anhydride graft after washing treatment, the heat-conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
The properties of the examples are compared in the following table:
based on the above, compared with the existing heat conduction material, the low dielectric constant ceramic material has the advantages that the low dielectric constant ceramic material realizes the low dielectric property that the dielectric constant in the parallel flow direction and the dielectric constant in the vertical flow direction are both less than 3.0 and the dielectric loss is less than 0.004 in the frequency range of 1-20GHz by optimizing the proportion of the compatilizer, the heat conduction powder and the modifier, and in addition, the dielectric tangent of the low dielectric constant ceramic material is completely unchanged and is very stable in the frequency spectrum interval; the invention adjusts the crystal orientation through the screening and formula combination of the added filler, endows the connector component with the materials with low warpage and fluidity, further improves the heat resistance, and ensures that the connector component is not easy to deform under extremely severe use environment; the mobility of LCP is further improved by adjusting the intermolecular mobility and molecular conformation, and the LCP can be used as a material of a connector with smaller and narrower needle spacing; compared with the existing heat conduction material manufacturing method, the manufacturing method provided by the invention is more scientific and standard, can greatly improve the production efficiency, and can avoid the reduction of the mechanical property and the physical property of a finished product due to the defects of the manufacturing method.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A low dielectric loss heat conducting material, characterized in that: the formula comprises the following components: the heat-conducting PA plastic comprises PA plastic, a compatilizer, heat-conducting powder and a modifier, wherein the components in percentage by mass are as follows: 65-80% of PA plastic, 9.5-10% of compatilizer, 9.5-15% of heat-conducting powder and 0.2-0.5% of modifier.
2. A method for preparing a low dielectric loss heat conduction material comprises the following steps of selecting and proportioning materials; step two, mixing and stirring; step three, melt extrusion; step four, granulating and packaging; step five, quality inspection is put in storage; the method is characterized in that:
in the first step, the components in percentage by mass are as follows: 65-80% of PA plastic, 9.5-10% of compatilizer, 9.5-15% of heat-conducting powder and 0.2-0.5% of modifier are selected and weighed according to the weight percentage sum of 1;
in the second step, the mixing and stirring step comprises the following steps:
1) putting raw materials prepared according to a formula into a high-speed mixer;
2) starting a high-speed mixer for mixing and stirring;
in the third step, the melt extrusion comprises the following steps:
1) transferring the mixture obtained in the second step into a double-screw extruder;
2) and starting the double-screw extruder to perform melt extrusion.
In the fourth step, the granulation package comprises the following steps:
1) transferring the extrudate obtained in the third step to a granulator for granulation treatment;
2) and transferring the treated granules to a packaging machine for packaging treatment.
In the fifth step, the quality inspection warehousing comprises the following steps:
1) sampling and inspecting each finished product according to a quality inspection standard;
2) and (5) recording qualified products into a warehouse.
3. The low dielectric loss thermally conductive material of claim 1, wherein: the components are as follows by mass percent: 75% of PA plastic, 10% of compatilizer, 14.5% of heat-conducting powder and 0.5% of modifier.
4. The low dielectric loss thermally conductive material of claim 1, wherein: the compatilizer is maleic anhydride graft after washing treatment, the heat conducting powder is compound powder of modified beta-Al 2O3 and c-BN, and the modifier is LM 300.
5. The method of claim 2, wherein the step of preparing the low dielectric loss heat conductive material comprises: in the second step 2), the stirring temperature is 110 ℃, and the stirring time is 3 min.
6. The method of claim 2, wherein the step of preparing the low dielectric loss heat conductive material comprises: in the step three 2), the melt extrusion temperature is 250 ℃, and the screw rotating speed is 350 r/min.
7. The method of claim 2, wherein the step of preparing the low dielectric loss heat conductive material comprises: in the step four 1), the granulator is a melting granulator.
8. The method of claim 2, wherein the step of preparing the low dielectric loss heat conductive material comprises: in the step five 1), the quality inspection standard is as follows: a density of 1.1-2.1g/cm3, a hardness of 84-85A, a tensile strength of greater than 60MPa, an elongation at break of greater than 4.2%, a melt index of 28-32g/10min, a thermal conductivity of 1.4-1.8W/MK, and a dielectric loss tangent of 3.7.
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| CN112830800A (en) * | 2021-01-21 | 2021-05-25 | 北京惠地智能技术研究院有限公司 | Method for manufacturing refractory brick by using waste bricks and tiles |
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| CN110218442A (en) * | 2019-06-25 | 2019-09-10 | 金旸（厦门）新材料科技有限公司 | A kind of high flowing Heat conduction nylon composite material and its preparation method and application |
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| CN107955368A (en) * | 2017-12-06 | 2018-04-24 | 厦门源亚泰塑胶科技有限公司 | A kind of heat conduction nylon for improving heat resistance and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112830800A (en) * | 2021-01-21 | 2021-05-25 | 北京惠地智能技术研究院有限公司 | Method for manufacturing refractory brick by using waste bricks and tiles |
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