CN109735060B - Thermoplastic composite material for laser direct forming technology and preparation method thereof - Google Patents
Thermoplastic composite material for laser direct forming technology and preparation method thereof Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 27
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 20
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 20
- 238000005516 engineering process Methods 0.000 title claims abstract description 11
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000654 additive Substances 0.000 claims abstract description 20
- 229920000728 polyester Polymers 0.000 claims abstract description 19
- 230000000996 additive effect Effects 0.000 claims abstract description 18
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000000945 filler Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 14
- 238000001125 extrusion Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 150000001491 aromatic compounds Chemical class 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical group CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims description 2
- 239000008116 calcium stearate Substances 0.000 claims description 2
- 235000013539 calcium stearate Nutrition 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 238000005469 granulation Methods 0.000 claims description 2
- 230000003179 granulation Effects 0.000 claims description 2
- 239000005337 ground glass Substances 0.000 claims description 2
- HGPXWXLYXNVULB-UHFFFAOYSA-M lithium stearate Chemical compound [Li+].CCCCCCCCCCCCCCCCCC([O-])=O HGPXWXLYXNVULB-UHFFFAOYSA-M 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 229910003455 mixed metal oxide Inorganic materials 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- 239000004974 Thermotropic liquid crystal Substances 0.000 claims 1
- 230000004913 activation Effects 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920007019 PC/ABS Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- OYFJQPXVCSSHAI-QFPUQLAESA-N enalapril maleate Chemical compound OC(=O)\C=C/C(O)=O.C([C@@H](C(=O)OCC)N[C@@H](C)C(=O)N1[C@@H](CCC1)C(O)=O)CC1=CC=CC=C1 OYFJQPXVCSSHAI-QFPUQLAESA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008672 reprogramming Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a thermoplastic composite material for laser direct structuring technology and a preparation method thereof, wherein the thermoplastic composite material comprises the following raw materials in percentage by weight: 59-98.9% of liquid crystal polyester, 1-10% of laser sensitive additive, 0.1-1% of compatilizer and 0-30% of filler. The laser sensitive additive and the compatilizer are premixed and then are subjected to vacuum heat treatment for 2 to 6 hours, and then are blended with other raw and auxiliary materials to be extruded and modified. The thermoplastic composite material of the invention improves the dispersibility and the activation capability of the laser sensitive additive, reduces the dosage, and simultaneously maintains the characteristics of high temperature resistance and high toughness of the liquid crystal polyester, so that the composite material has excellent comprehensive performance.
Description
Technical Field
The invention relates to a thermoplastic composite material, in particular to a liquid crystal polymer composite material used for a laser direct forming technology and a preparation method of the composite material, belonging to the technical field of liquid crystal polymer composite materials.
Background
Laser Direct Structuring (LDS) is a production technology of Laser processing and chemical plating process, which is used to fabricate Three-dimensional molded Interconnect devices (3D-MID). The principle is that laser is irradiated on a plastic part containing laser sensitive additive to activate a circuit pattern, and the activated area on the part can deposit metals such as copper, nickel, gold and the like in electroless chemical plating, so that the three-dimensional plastic part is endowed with a conductive function.
Electronic components are becoming increasingly popular today and typically provide wireless communication capabilities. For example, the electronic component can use a mobile phone frequency band (2G/3G/4G standard) under 815 MHz-3600 MHz to communicate. The electronic components may also communicate using wireless networks in the 2.4GHz and 5GHz bands (802.11 a/b/g/n/ac). Such an electronic component structure, i.e. a 3D-MID, is typically formed of a plastic substrate and conductive elements or vias formed therein, which is a three-dimensional part having integrated printed conductors or circuit layout. Using the LDS method, conductive element widths and pitches of 150 μm or less can be obtained, which saves space and weight for smaller electronic devices. Another advantage of the LDS method is its flexibility. If the design of the conductive path needs to be changed, the laser is controlled by reprogramming, and the die does not need to be redesigned. This reduces the cost of the process and saves time.
At present, the material science applied to the LDS technology is also rapidly developed. The resin matrix is covered with general purpose plastics, engineering plastics and special engineering plastics. Among the more typical applications are Polycarbonate (PC), polycarbonate and polyacrylonitrile/butadiene/styrene alloy (PC/ABS), polybutylene terephthalate (PBT), poly (paraphenylene terephthalamide) (PPA), and the like. However, these materials require the addition of flame retardants, which are detrimental to the mechanical properties of the material, making it unsuitable for Surface Mount Technology (SMT) requiring high temperature resistance. In addition, these materials have high dielectric loss tangents, which makes them difficult to use in high frequency communication device applications.
Thermotropic Liquid Crystalline Polymer (TLCP) is a high performance polyester material that can be used in manufacturing parts including electrical and electronic connectors, circuit boards, motor insulators, housings for various applications, automotive components, cookware/bakeware, replacement ceramics for high temperature light sockets, and light emitting diode housings and/or mounts. They are generally known for their excellent melt processing and forming characteristics, inherent flame retardancy, low loss tangent, and many uses at high temperatures.
At present, TLCP is used for LDS materials (such as CN 104961922A, CN 103906803B), but the adhesion of a metal plating layer on an LCP molded part prepared in the prior art is not strong, the LDS material in the prior art cannot meet the requirement, and more laser sensitive additives are needed to influence the toughness of the molded material.
Disclosure of Invention
The invention aims to provide a thermoplastic composite material for a laser direct structuring technology, which uses less laser sensitive additive to obtain better metal film adhesion and the obtained composite material has better toughness.
The purpose of the invention can be realized by the following technical scheme:
a thermoplastic composite material comprises the following raw materials in percentage by weight:
the liquid crystal polyester in the invention is a liquid crystal polyester which shows liquid crystallinity in a molten state, and the melting point of the liquid crystal polyester used in the invention is 250-350 ℃, preferably 300-340 ℃. The melt viscosity of the liquid crystal polyester used in the present invention is usually 10 to 100 pas, preferably 25 to 45 pas.
The liquid crystal polyester is a liquid crystal polyester obtained by using an aromatic compound as a raw material monomer, and preferably a wholly aromatic liquid crystal polyester obtained by using only an aromatic compound as a raw material monomer.
The laser sensitive additive is mixed metal oxide of tin and antimony, and the addition amount is 1-10%. After the compatilizer is used, the using amount of the compatilizer can be reduced without influencing the activation effect of the laser sensitive additive, and the adding amount is preferably 1-3%.
The compatilizer is a stearate dispersant which can be dissolved with the liquid crystal polyester and promote the dispersion of the metal oxide, and comprises one or the combination of more of sodium stearate, calcium stearate and lithium stearate.
The filler is one or a combination of more of ground glass fiber, talc, mica, titanium dioxide, silicon dioxide and wollastonite. If a large amount of inorganic filler is contained, the toughness of the material is affected and the activation effect of the laser sensitive additive is affected, so the addition amount is preferably 0% to 30%.
The thermoplastic composite materials described above may be formed by known melt-forming processes (and corresponding equipment) including injection molding, extrusion (particularly when formed into sheets, films or tubes), blow molding and sintering.
The preparation method of the thermoplastic composite material comprises the following steps:
(1) vacuum drying the liquid crystal polyester at 105-200 ℃ for 2-15 hours, preferably at 120-180 ℃ for 4-8 hours;
(2) pre-mixing a laser sensitive additive and a compatilizer, and carrying out vacuum heat treatment for 2-6 hours at 55-150 ℃, preferably for 2-3 hours at 60-120 ℃;
(3) adding the (1) and the (2) and other auxiliary materials into a double-screw extruder according to a certain proportion by using a weightlessness scale, extruding and granulating. The temperatures of the double-screw extruder from the feeding port to the extrusion die head are respectively 280-350 ℃, 300-360 ℃, 320-380 ℃, 300-350 ℃, 240-300 ℃, and the rotating speed of the main machine is 300 revolutions per minute. The performance test piece is injection molded by an injection molding machine.
Thereafter, conductive elements are formed on the injection molded molding using the LDS method. Laser-activated laser-sensitive additives are used, in which a metal oxide undergoes a physicochemical reaction to release metal atoms. These metal atoms are at the surface of the molding to act as nucleation centers for electroless deposition of other metals. Other metals deposited, such as copper, can be fixed to the surface of the molded part during this electroless plating process to form the conductive features. The resulting molded part is an MID part that contains the integrated electronic circuit conductive elements. 100 test pieces are prepared by the method, a hundred-grid test is carried out, and the average falling area is calculated.
The invention has the following beneficial effects: the stearic acid compatilizer is adopted to improve the dispersibility of the laser sensitive additive, reduce the using amount of the laser sensitive additive and ensure that the laser sensitive additive can have better laser activation effect and chemical plating effect under lower content.
Detailed Description
The present invention is further illustrated by the following examples and comparative examples, but the present invention should not be limited to the contents specifically illustrated in the following examples without departing from the spirit of the present invention.
The product performance testing method comprises the following steps:
in the present invention, Izod notched Impact Strength (IS) was measured by ASTM D256 method, and the thickness of the test piece was 3.2 mm. Heat Distortion Temperature (HDT) was measured by the method of ASTM D648, with an applied load of 1.82 MPa.
In the invention, the adhesive force of the metal coating is evaluated by using the average falling area obtained by a Baige test.
Examples 1 to 8 and comparative examples 1 to 3
Liquid crystal polyester: KG300, Shanghai pril specialty Chemicals New materials Co., Ltd
Laser sensitive additive:
8850, Merck group;
sodium stearate: licomont Nav 101, Clariant Inc.
Talc powder: HM 4, IMI Fabi.
Vacuum drying the liquid crystal polyester at 140 ℃ for 4 hours; the laser sensitive additive and the compatibilizer were premixed and heat treated in vacuum at 60 ℃ for 2 hours. The dried material was added to a twin screw extruder in a weightless scale in the proportions shown in Table 1 for extrusion granulation. The extruder contains conveying elements, kneading elements, a low-pressure zone for evacuating volatile constituents which may be present in the polyester under vacuum, and a die. The temperatures of the extruder from the feeding port to the extrusion die head are 240 ℃, 290 ℃, 300 ℃, 310 ℃, 315 ℃, 325 ℃ and 345 ℃ respectively, and the rotating speed of the main machine is 300 revolutions per minute. And (4) the thermoplastic composite material leaves the die, is cooled by a water tank and is cut into particles.
And drying the thermoplastic composite material particles at 150 ℃ for 3-5 hours, and preparing a sample strip for testing the performance by using an injection molding method. The injection temperature is 350 ℃, the injection pressure is 20MPa, the injection time is 5-10 sec, the cooling time is 5-10 sec, and the mold temperature is 90-110 ℃. The injection molded bars were tested for properties after at least 24 hours at 23 ℃ under 50% relative humidity and the properties obtained are given in Table 2.
TABLE 1
TABLE 2
"/": electroless plating could not be performed under this comparative example.
As can be seen from examples 1 to 8 and comparative examples 1 to 3:
the thermoplastic composite material obtained in the embodiments 1 to 8 has the advantages of strong adsorption force of the metal coating, high toughness, good heat resistance and the like after chemical plating. Compared with the comparative example, the use of the compatilizer can greatly reduce the dosage of the laser sensitive additive, and can increase the adsorption force of the metal coating. When the filler content is too high, the toughness of the composite material is rapidly deteriorated.
The thermoplastic composite material for LDS provided by the invention has good laser activation effect and chemical plating effect under the condition of low usage amount of the laser sensitive additive, and simultaneously maintains the characteristics of high temperature resistance and high toughness of liquid crystal polyester, and has excellent comprehensive performance.
Claims (6)
1. A thermoplastic composite material for use in laser direct structuring technology, characterized by: the composite material consists of the following raw materials in percentage by weight:
the laser sensitive additive is a mixed metal oxide of tin and antimony; the compatilizer is stearate, and comprises one or more of sodium stearate, calcium stearate and lithium stearate.
2. A thermoplastic composite material for laser direct structuring technology according to claim 1, characterized in that: the thermotropic liquid crystal polyester is prepared by using aromatic compounds as raw material monomers.
3. A thermoplastic composite material for laser direct structuring technology according to claim 1, characterized in that: the filler is one or a combination of more of ground glass fiber, talc, mica, titanium dioxide, silicon dioxide and wollastonite.
4. A process for the preparation of a thermoplastic composite material according to any one of claims 1 to 3, characterized in that: the method comprises the following steps:
(1) vacuum drying the liquid crystal polyester at 105-200 ℃ for 2-15 hours;
(2) pre-mixing a laser sensitive additive and a compatilizer, and carrying out vacuum heat treatment for 2-6 hours at 55-150 ℃;
(3) adding the (1) and the (2) and other auxiliary materials into a double-screw extruder according to a certain proportion by using a weightlessness scale for extrusion and granulation; the temperatures of the double-screw extruder from the feeding port to the extrusion die head are respectively 280-350 ℃, 300-360 ℃, 320-380 ℃, 300-350 ℃, 240-300 ℃, and the rotating speed of the main machine is 300 revolutions per minute.
5. The method for preparing a thermoplastic composite material according to claim 4, wherein: in the step (1), the liquid crystal polyester is dried for 4-8 hours in vacuum at 120-180 ℃.
6. The method for preparing a thermoplastic composite material according to claim 4, wherein: in the step (2), the vacuum heat treatment condition is vacuum heat treatment for 2-3 hours at 60-120 ℃.
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| US11637365B2 (en) | 2019-08-21 | 2023-04-25 | Ticona Llc | Polymer composition for use in an antenna system |
| US11258184B2 (en) | 2019-08-21 | 2022-02-22 | Ticona Llc | Antenna system including a polymer composition having a low dissipation factor |
| US11912817B2 (en) | 2019-09-10 | 2024-02-27 | Ticona Llc | Polymer composition for laser direct structuring |
| US11555113B2 (en) | 2019-09-10 | 2023-01-17 | Ticona Llc | Liquid crystalline polymer composition |
| US11646760B2 (en) | 2019-09-23 | 2023-05-09 | Ticona Llc | RF filter for use at 5G frequencies |
| US11917753B2 (en) | 2019-09-23 | 2024-02-27 | Ticona Llc | Circuit board for use at 5G frequencies |
| US11721888B2 (en) | 2019-11-11 | 2023-08-08 | Ticona Llc | Antenna cover including a polymer composition having a low dielectric constant and dissipation factor |
| JP2023515976A (en) | 2020-02-26 | 2023-04-17 | ティコナ・エルエルシー | circuit structure |
| US11728559B2 (en) | 2021-02-18 | 2023-08-15 | Ticona Llc | Polymer composition for use in an antenna system |
| CN114316619B (en) * | 2021-12-07 | 2023-05-23 | 富海(东营)新材料科技有限公司 | Liquid crystal polymer composite material formed by rapid injection molding, preparation method thereof and injection screw rod used by rapid injection molding |
| CN114381093A (en) * | 2021-12-28 | 2022-04-22 | 上海普利特化工新材料有限公司 | Thermoplastic composite material with high dielectric constant and low dielectric loss and preparation method thereof |
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| CN103450675A (en) * | 2012-05-31 | 2013-12-18 | 金发科技股份有限公司 | Resin composition having laser direct-structuring function and its preparation method and use |
| CN103694697A (en) * | 2012-09-27 | 2014-04-02 | 金发科技股份有限公司 | Thermal conducting material capable of selectively depositing metal, preparation method of the material and applications of the material |
| CN103906803A (en) * | 2011-10-31 | 2014-07-02 | 提克纳有限责任公司 | Thermoplastic composition for use in forming a laser direct structured substrate |
| CN104961922A (en) * | 2015-07-11 | 2015-10-07 | 刘帅 | Co-modified LDS (Laser Direct Structuring) additive and LCP (Liquid Crystal Polymer) composition containing same |
| WO2018130970A1 (en) * | 2017-01-11 | 2018-07-19 | Sabic Global Technologies B.V. | Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906803A (en) * | 2011-10-31 | 2014-07-02 | 提克纳有限责任公司 | Thermoplastic composition for use in forming a laser direct structured substrate |
| CN103450675A (en) * | 2012-05-31 | 2013-12-18 | 金发科技股份有限公司 | Resin composition having laser direct-structuring function and its preparation method and use |
| CN103694697A (en) * | 2012-09-27 | 2014-04-02 | 金发科技股份有限公司 | Thermal conducting material capable of selectively depositing metal, preparation method of the material and applications of the material |
| CN104961922A (en) * | 2015-07-11 | 2015-10-07 | 刘帅 | Co-modified LDS (Laser Direct Structuring) additive and LCP (Liquid Crystal Polymer) composition containing same |
| WO2018130970A1 (en) * | 2017-01-11 | 2018-07-19 | Sabic Global Technologies B.V. | Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom |
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