CN112138970A - Ultrasonic forward loop array transceiver - Google Patents
Ultrasonic forward loop array transceiver Download PDFInfo
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Abstract
The application is suitable for the technical field of ultrasonic imaging, and provides an ultrasonic forward ring array transceiver, which comprises a transceiving chip and a transduction array chip; the packaging shape of the transceiver chip is a cylinder, and the transduction array chips are annularly arranged on one bottom surface of the transceiver chip; the receiving and transmitting chip is respectively electrically connected with the transduction array chip and a host in the ultrasonic imaging equipment; the transmitting and receiving chip drives the transduction array chip to transmit ultrasonic waves to the right front of the bottom surface according to an excitation signal of the host; the energy conversion array chip generates a corresponding imaging electric signal according to the returned ultrasonic wave and transmits the imaging electric signal to the transceiver chip; the transceiver chip also amplifies the imaging electric signal with low noise and sends the amplified imaging electric signal to the host. The receiving and transmitting chip and the transduction array chip in the ultrasonic forward ring array transceiver are integrated semiconductor chips, so that the structure of the ultrasonic forward ring array transceiver is simplified, the integration level is improved, and the miniaturization design can be realized.
Description
Technical Field
The application belongs to the technical field of ultrasonic imaging, and particularly relates to an ultrasonic forward ring array transceiver.
Background
With the rapid development of scientific technology, the ultrasonic technology and the computer technology are closely combined, and the wide application of the ultrasonic detection and ultrasonic echo imaging technology in the fields of medical treatment, industry, aerospace, automobiles, consumer electronics and the like is promoted. Compared with other imaging technologies, the medical ultrasound has the unique advantages of good real-time performance, no damage, no pain, no ionizing radiation, low cost and the like, is widely used for clinical examination and diagnosis at present, and is popular with wide medical workers and patients.
An ultrasonic transducer (also called an ultrasonic probe) is one of the key components of a medical ultrasonic imaging device, and the performance of the ultrasonic transducer directly influences and even limits the performance of the whole device. The traditional ultrasonic transducer consists of piezoelectric ceramics, an acoustic lens, an acoustic matching layer, a back material, an electrode, a metal shell and the like, and has the defects of complex device structure and low integration level.
Disclosure of Invention
The embodiment of the application provides an ultrasonic forward ring array transceiver, which can solve the problems of complex structure and low integration level of the traditional ultrasonic transducer.
The embodiment of the application provides an ultrasonic forward ring array transceiver, which is applied to ultrasonic imaging equipment and comprises a transceiver chip and a transduction array chip; the packaging shape of the transceiver chip is a cylinder, and the transduction array chip is annularly arranged on one bottom surface of the transceiver chip; the transceiver chip is electrically connected with the transduction array chip and a host in the ultrasonic imaging equipment respectively;
the receiving and transmitting chip is used for driving the transduction array chip to transmit ultrasonic waves to the right front of the bottom surface according to an excitation signal of the host;
the energy conversion array chip is used for receiving the returned ultrasonic waves, generating corresponding imaging electric signals according to the returned ultrasonic waves and transmitting the imaging electric signals to the transceiver chip;
the receiving and transmitting chip is also used for carrying out low-noise signal amplification on the imaging electric signal and sending the amplified imaging electric signal to the host.
In a possible implementation manner, the transduction array chip is a single-ring transduction array chip, and includes a plurality of transceiving array unit groups; the transceiving chip comprises a plurality of first sub transceiving chips, and the plurality of first sub transceiving chips and the plurality of transceiving array unit groups correspond to each other one by one; each first sub-transceiver chip comprises a first transmitting channel circuit module, a first receiving channel circuit module and a transceiving switch circuit module;
the input end of the first transmitting channel circuit module and the output end of the first receiving channel circuit module are respectively electrically connected with the host, the output end of the first transmitting channel circuit module and the input end of the first receiving channel circuit module are respectively electrically connected with the transceiving switch circuit module, and the transceiving switch circuit module is also electrically connected with the corresponding transceiving array unit group.
In one possible implementation manner, the first transmit channel circuit module includes a first receive port, a first deserializer circuit, and a first multi-channel high-voltage driving circuit;
the first receiving port is used as an input end of the first transmitting channel circuit module and is electrically connected with the host and the input end of the first deserializer circuit respectively; the output end of the first deserializer circuit is electrically connected with the input end of the first multi-channel high-voltage driving circuit; the first multi-channel high-voltage driving circuit is used as the output end of the first transmitting channel circuit module and is electrically connected with the transceiving switch circuit module.
In a possible implementation manner, the first receiving channel circuit module includes a first transmitting port, a first serializer circuit, and a first multi-channel low-noise amplifying circuit;
the input end of the first multi-channel low-noise amplification circuit is used as the input end of the first receiving channel circuit module and is electrically connected with the transceiving switch circuit module; the output end of the first multichannel low-noise amplification circuit is electrically connected with the input end of the first serializer circuit; the first transmitting port is used as an output end of the first receiving channel circuit module and is electrically connected with the host and an output end of the first serializer circuit respectively.
In a possible implementation manner, each of the transceiving array unit groups includes a plurality of transduction array elements, and the transduction array elements are electrically connected to a plurality of ports in the transceiving switch circuit module in a one-to-one correspondence manner.
In one possible implementation, the transducing array element includes a plurality of transducer elements connected in parallel in sequence.
In one possible implementation manner, the transduction array chip is a multi-ring transduction array chip, and includes at least one transmitting transduction array ring and at least one receiving transduction array ring; each transmitting transduction array ring comprises a plurality of transmitting array unit groups, and each receiving transduction array ring comprises a plurality of receiving array unit groups; the transceiver chip comprises a plurality of second sub transceiver chips, and each second sub transceiver chip comprises a second transmitting channel circuit module and a second receiving channel circuit module;
the input end of the second transmitting channel circuit module and the output end of the second receiving channel circuit module are respectively electrically connected with the host, the output end of the second transmitting channel circuit module is electrically connected with one transmitting array unit group, and the input end of the second receiving channel circuit module is electrically connected with one receiving array unit group.
In a possible implementation manner, the second transmit channel circuit module includes a second receive port, a second deserializer circuit, and a second multi-channel high-voltage driving circuit;
the second receiving port is used as an input end of the second transmitting channel circuit module and is electrically connected with the host and the input end of the second deserializer circuit respectively; the output end of the second deserializer circuit is electrically connected with the input end of the second multi-channel high-voltage driving circuit; the second multi-channel high-voltage driving circuit is used as the output end of the second transmitting channel circuit module and is electrically connected with one transmitting array unit group.
In a possible implementation manner, the second receiving channel circuit module includes a second transmitting port, a second serializer circuit, and a second multi-channel low-noise amplifying circuit;
the input end of the second multi-channel low-noise amplification circuit is used as the input end of the second receiving channel circuit module and is electrically connected with one receiving array unit group; the output end of the second multi-channel low-noise amplifying circuit is electrically connected with the input end of the second serializer circuit; the second transmitting port is used as the output end of the second receiving channel circuit module and is electrically connected with the output ends of the host and the second serializer circuit respectively.
In a possible implementation manner, the transduction array chip is a single chip, and the single chip is prepared by a piezoelectric micro-electromechanical ultrasonic transducer PMUT manufacturing process;
the transceiver chip and the transduction array chip are packaged into a whole through an embedded packaging process.
Compared with the prior art, the embodiment of the application has the advantages that:
when the ultrasonic forward ring array transceiver works, the transceiver chip drives the transduction array chip to send ultrasonic waves to the front of the bottom surface of the transceiver chip according to an excitation signal of the host; the energy conversion array chip receives the returned ultrasonic waves, generates corresponding imaging electric signals according to the returned ultrasonic waves, and transmits the imaging electric signals to the transceiver chip; and the transceiver chip amplifies the low-noise signal of the imaging electric signal and sends the signal to the host to finish the acquisition of the imaging electric signal. Compared with the traditional transducer, the piezoelectric acoustic transducer is generally composed of piezoelectric ceramics, an acoustic lens, an acoustic matching layer, a back material, an electrode, a metal shell and the like, and has the problems of poor consistency of devices, complex assembly process, low integral integration level and the like. The ultrasonic forward ring array transceiver provided by the embodiment of the application uses the transceiver chip and the transduction array chip, so that the ultrasonic forward ring array transceiver has the advantages of simplifying the structure, improving the integration level and realizing the miniaturization design.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of an ultrasonic forward loop array transceiver according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an ultrasonic forward loop array transceiver as provided by an embodiment of the present application;
FIG. 3 is a schematic diagram of an ultrasonic forward loop array transceiver according to another embodiment of the present application;
fig. 4 is a schematic structural diagram of an ultrasonic forward loop array transceiver according to another embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to" determining "or" in response to detecting ". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing or implying relative importance.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
Fig. 1 shows a schematic structural diagram of an ultrasonic forward loop array transceiver provided in an embodiment of the present application. Referring to fig. 1, an ultrasonic forward ring array transceiver may include a transceiver chip 100 and a transducer array chip 200. The transceiver chip 100 is packaged in a cylindrical shape, and the transduction array chip 200 is annularly arranged on a bottom surface of the transceiver chip 100. The transceiver chip 100 is electrically connected to the transducer array chip 200 and the host 300 in the ultrasound imaging apparatus, respectively.
When the ultrasonic forward loop array transceiver works, the transceiver chip 100 drives the transduction array chip 200 to transmit ultrasonic waves to the front of the bottom surface of the transceiver chip 100 according to an excitation signal of the host 300. The transduction array chip 200 receives the returned ultrasonic waves, generates corresponding imaging electrical signals according to the returned ultrasonic waves, and transmits the imaging electrical signals to the transceiver chip 100. Then, the transceiver chip 100 amplifies the low-noise signal of the image electrical signal, and transmits the amplified imaging electrical signal to the host 300, thereby completing the acquisition of the imaging electrical signal of the bottom right in front of the image. For traditional planar matrix array structure, the transduction array chip 200 in the embodiment of the present application adopts the annular array to be disposed on the bottom surface of the transceiver chip 100, so that the channel crosstalk between the transduction array elements can be reduced, the beam forming algorithm is easier to implement, and the imaging accuracy can be improved by controlling different channel scanning sequences.
Because the transceiver chip 100 and the transduction array chip 200 used in the ultrasonic forward ring array transceiver are integrated semiconductor chips, the ultrasonic probe based on the ultrasonic forward ring array transceiver has a simplified structure, improves the integration level, and can realize the miniaturization design of the whole device. The ultrasonic forward loop array transceiver can be applied to some high-precision measurement, such as forward imaging detection in blood vessels.
In some embodiments, the transduction array chip 200 may include a plurality of transceiving array unit groups, the transceiving chip 100 includes a plurality of sub transceiving chips, and the transceiving chip is electrically connected to the plurality of transceiving array unit groups in a one-to-one correspondence, and all the sub transceiving chips are electrically connected to the host 300.
Specifically, each sub-transceiver chip in the transceiver chip 100 controls one transceiver array unit group, and each transceiver array unit group includes a plurality of transducer array elements. The number of the transducer elements included in each transceiver array element group may be set according to actual conditions (for example, the number of the transducer elements included in each transceiver array element group is one fifth, one sixth, or one eighth of the total number of the transducer elements in the transducer array chip 200).
For example, when the transducer array chip 200 is 64 array elements, the number of transducer elements included in each transceiver array element group may be 13, 11, or 8, etc.
Since the transceiver chip 100 and the transduction array chip 200 are finally packaged into an integral device, the shape of the integral device may be designed according to the number of the transceiver array unit groups included in the transduction array chip 200, and the shape of the integral device may be set to be a cylinder or a polygonal column (e.g., a pentagonal prism or a hexagonal prism).
Illustratively, the monolithically integrated Transducer array chip 200 is fabricated on a substrate by a PMUT (Piezoelectric micro electromechanical Transducer) fabrication process, and the transceiver chip 100 is fabricated by a CMOS (Complementary Metal Oxide Semiconductor) fabrication process.
At present, two novel Micro-Electro-Mechanical ultrasonic transducers can be prepared by using a Micro-Electro-Mechanical System (MEMS) technology, including a capacitive Micro-Electro-Mechanical ultrasonic transducer and a piezoelectric Micro-Electro-Mechanical ultrasonic transducer, and the MEMS technology allows the ultrasonic transducers to get rid of the constraint of the conventional piezoelectric ceramic materials, and can realize high-consistency, high-integration, large-scale and low-cost manufacturing by using the microelectronic technology.
The PMUT manufacturing process supports low-temperature deposition (less than 400 ℃), the minimum thickness can be within 5 microns, the PMUT manufacturing process can be well compatible with the CMOS manufacturing process, and the transduction array chip 200 and the transceiver chip 100 can be integrated together. In addition, the process of the PMUT manufacturing process supports the array manufacturing of the ultrasonic transducer, the size precision of a single transducer unit is controllable, the consistency is high, and the complexity of a later imaging algorithm is reduced.
Illustratively, the transduction array chip 200 includes a plurality of transceiving array unit groups, each of which includes a plurality of transduction array elements, each of which includes a plurality of transducer elements connected in parallel in sequence. And (3) manufacturing a plurality of transmitting-receiving array unit groups on a single chip by utilizing a PMUT manufacturing process, and finally forming a single-chip integrated annular transduction array chip. This design may improve the receive signal sensitivity and spatial scanning resolution of the transducing array chip 200.
Illustratively, the transceiver chip 100 and the transducer array chip 200 are packaged as a whole by an embedded packaging process.
For example, the transceiver chip 100 may be fabricated by a CMOS fabrication process, and then the transceiver chip 100 and the transducer array chip 200 may be packaged as a whole by a heterogeneous integration technology such as an embedded package. For example, the transceiver chip 100 and the transducer array chip 200 may be integrated on a single chip. The single chip can support a miniaturized structure, the diameter of a forward ring of the whole packaging of the transceiver chip 100 and the transduction array chip 200 can be smaller than 1 mm, and the single chip can be applied to intravascular ultrasound imaging, intracardiac imaging, ultrasonic enterogastroscope, interventional ultrasound guidance and other human body cavity imaging.
In addition, the transceiver chip 100 and the transducer array chip 200 may be integrated in a planar manner by an FPC (Flexible Printed Circuit Board).
Fig. 2 shows a schematic diagram of an ultrasonic forward loop array transceiver provided in an embodiment of the present application, and a transduction array chip 200 is a single-loop transduction array chip and includes a plurality of transceiving array unit groups 201. The transceiver chip 100 includes a plurality of first sub transceiver chips, and the plurality of first sub transceiver chips correspond to the plurality of transceiver array unit groups 201 one to one. Each of the first sub transceiving chips includes a first transmit channel circuit module 110, a first receive channel circuit module 120, and a transceiving switch circuit module 130. The input end of the first transmit channel circuit module 110 and the output end of the first receive channel circuit module 120 are electrically connected to the host 300, the output end of the first transmit channel circuit module 110 and the input end of the first receive channel circuit module 120 are electrically connected to the transmit-receive switch circuit module 130, and the transmit-receive switch circuit module 130 is further electrically connected to the corresponding transmit-receive array unit 201.
Specifically, the first transmit channel circuit module 110 receives an excitation signal (e.g., a pulse signal) transmitted by the host 300, processes and amplifies the excitation signal, and then transmits the processed excitation signal to the transceiving switch circuit module 130. The transmit-receive switch circuit module 130 drives the transmit-receive array unit group 201 to transmit ultrasonic waves to the front side of the bottom surface of the transmit-receive chip 100 according to the received excitation signal. The transceiving array unit 201 receives the ultrasonic wave returned from the acoustic resistance interface, converts the returned ultrasonic wave into a corresponding imaging electrical signal, and transmits the imaging electrical signal to the host 300 through the transceiving switch circuit module 130 and the first receiving channel circuit module 120, thereby completing the acquisition of the imaging electrical signal.
In some embodiments, the transduction array chip 200 includes a plurality of transceiving array unit groups 201, each transceiving array unit group 201 includes a plurality of transduction array elements, and each transduction array element includes a plurality of transducer elements connected in parallel in sequence. By utilizing the PMUT manufacturing process, a plurality of transceiving array unit groups 201 are manufactured on a single substrate, and finally a single-chip integrated annular transduction array chip is formed. This design may improve the receive signal sensitivity and spatial scanning resolution of the transducing array chip 200.
For example, the single-ring transduction array chip can be arranged in a combination of different array element numbers such as 32 array elements, 64 array elements or 128 array elements, and the like, so as to be suitable for cavity imaging inside a human body, such as intravascular ultrasound imaging. The number of the transduction array elements in the transceiving array element group 201 can be one fifth, one sixth or one eighth of the total number of the transduction array elements in the transduction array chip 200.
For example, when the number of the transducer array chips 200 is 64, the number of transducer array elements included in each transceiver array unit group 201 may be 13, 11, or 8, etc.
In some embodiments, the first transmit channel circuit block 110 may include a first receive port 111, a first deserializer circuit 112, and a first multi-channel high voltage drive circuit 113. The first receiving port 111 serves as an input terminal of the first transmit channel circuit module 110, and is electrically connected to input terminals of the host 300 and the first deserializer circuit 112, respectively. The output of the first deserializer circuit 112 is electrically connected to the input of the first multi-channel high voltage drive circuit 113. The first multi-channel high voltage driving circuit 113 is used as an output terminal of the first transmit channel circuit module 110, and is electrically connected to the transmit-receive switch circuit module 130.
Specifically, the first deserializer circuit 112 receives the excitation signal sent by the host 300 through the first receiving port 111, generates a corresponding parallel excitation signal according to the excitation signal, and transmits the parallel excitation signal to the first multi-channel high voltage driving circuit 113. The first multi-channel high voltage driving circuit 113 amplifies the parallel excitation signal to obtain a parallel driving signal, and transmits the parallel driving signal to the transceiving switch circuit module 130. The transceiving switch circuit module 130 correspondingly drives each transducer array element in the transceiving array unit group 201 according to the parallel driving signal, so as to control the ultrasonic forward ring array transceiver to scan the bottom right front image by the host 300.
In some embodiments, the first receive channel circuit block 120 may include a first transmit port 121, a first serializer circuit 122, and a first multi-channel low noise amplification circuit 123. The input end of the first multi-channel low noise amplifier circuit 123 is used as the input end of the first receiving channel circuit module 120, and is electrically connected to the transceiving switch circuit module 130. An output terminal of the first multi-channel low-noise amplification circuit 123 is electrically connected to an input terminal of the first serializer circuit 122. The first transmitting port 121 serves as an output terminal of the first receiving channel circuit module 120, and is electrically connected to output terminals of the host 300 and the first serializer circuit 122, respectively.
Specifically, the multiple transducer array elements in the transceiver array element group 201 receive the ultrasonic waves returned from the acoustic resistance interface, convert the ultrasonic waves into corresponding parallel electrical imaging signals according to the returned ultrasonic waves, and transmit the parallel electrical imaging signals to the first multi-channel low-noise amplifier circuit 123 through the transceiver switch circuit module 130. The first multi-channel low-noise amplification circuit 123 performs filtering and low-noise amplification processing on the parallel imaging electric signals, and transmits the processed parallel imaging electric signals to the first serializer circuit 122. The first serializer circuit 122 converts the parallel imaging electrical signal into a serial imaging electrical signal and transmits the serial imaging electrical signal to the host 300 through the first transmission port 121.
Fig. 3 shows a schematic diagram of an ultrasonic forward ring array transceiver provided in an embodiment of the present application, and the transduction array chip 200 is a multi-ring transduction array chip, and includes at least one transmitting transduction array ring and at least one receiving transduction array ring (as shown in fig. 4). Each transmit transducing array ring includes a plurality of transmit array element groups 202 and each receive transducing array ring includes a plurality of receive array element groups 203. The transceiver chip 100 includes a plurality of second sub-transceiver chips, each of which includes a second transmit channel circuit module 140 and a second receive channel circuit module 150. The input end of the second transmit channel circuit module 140 and the output end of the second receive channel circuit module 150 are electrically connected to the host 300, respectively, the output end of the second transmit channel circuit module 140 is electrically connected to one transmit array unit group 202, and the input end of the second receive channel circuit module 150 is electrically connected to one receive array unit group 203.
Specifically, the second transmit channel circuit module 140 receives an excitation signal (pulse signal) sent by the host 300, processes and amplifies the excitation signal, and then sends the processed excitation signal to the transmit array unit group 202, where the transmit array unit group 202 generates an ultrasonic wave according to the excitation signal. The receiving array unit group 203 receives the ultrasonic wave returned from the acoustic resistance interface, converts the ultrasonic wave returned into a corresponding imaging electrical signal according to the ultrasonic wave, and transmits the imaging electrical signal to the host 300 through the second receiving channel circuit module 150, thereby completing the acquisition of the imaging electrical signal.
It should be noted that the transduction array chip 200 shown in fig. 4 includes one transmitting transduction array ring and one receiving transduction array ring, wherein each transmitting transduction array ring includes a plurality of transmitting array unit groups 202, each receiving transduction array ring includes a plurality of receiving array unit groups 203, and the transmitting transduction array ring is on the outside and the receiving transduction array ring is on the inside. Fig. 4 is merely an embodiment, and no limitation is made to a specific structure of the transduction array chip 200, the number of the transmitting transduction array rings and the number of the receiving transduction array rings in the transduction array chip 200, as well as the number of the transmitting array unit groups 202 in the transmitting transduction array rings and the number of the receiving array unit groups 203 in the receiving transduction array rings may be designed according to an actual situation (a requirement of an application scenario on a size), and the arrangement manner of the transmitting array unit groups 202 and the receiving array unit groups 203 may also be designed according to the actual situation.
In some embodiments, the second transmit channel circuit block 140 may include a second receive port 141, a second deserializer circuit 142, and a second multi-channel high voltage drive circuit 143. The second receiving port 141 serves as an input terminal of the second transmitting channel circuit module 140, and is electrically connected to input terminals of the host 300 and the second deserializer circuit 142, respectively. The output of the second deserializer circuit 142 is electrically connected to the input of the second multi-channel high voltage drive circuit 143. The second multi-channel high voltage driving circuit 143 is used as an output terminal of the second transmitting channel circuit module 140, and is electrically connected to one transmitting array unit group 202.
Specifically, the second deserializer circuit 142 receives the excitation signal sent by the host 300 through the second receiving port 141, generates a corresponding parallel excitation signal according to the excitation signal, and transmits the parallel excitation signal to the second multi-channel high-voltage driving circuit 143. The second multi-channel high-voltage driving circuit 143 amplifies the parallel excitation signal to obtain a parallel driving signal, and correspondingly drives each transduction array element in the transmitting array unit group 202 with the parallel driving signal, so as to control the ultrasonic forward ring array transceiver to scan the image right in front of the bottom surface by the host 300.
In some embodiments, the second receive channel circuit block 150 may include a second transmit port 151, a second serializer circuit 152, and a second multi-channel low-noise amplification circuit 153. The input terminal of the second multi-channel low-noise amplifier circuit 153 is used as the input terminal of the second receiving channel circuit module 150, and is electrically connected to one receiving array unit group 203. The output of the second multi-channel low noise amplification circuit 153 is electrically connected to the input of the second serializer circuit 152. The second transmitting port 151 is an output terminal of the second receiving channel circuit module 150, and is electrically connected to output terminals of the host 300 and the second serializer circuit 152, respectively.
Specifically, the multiple transducer array elements in the receiving array element group 203 receive the ultrasonic waves returned from the acoustic resistance interface, convert the ultrasonic waves into corresponding parallel imaging electrical signals according to the returned ultrasonic waves, and transmit the parallel imaging electrical signals to the second multi-channel low-noise amplifier circuit 153. The second multi-channel low-noise amplification circuit 153 performs filtering and low-noise amplification processing on the parallel imaging electric signals, and transmits the processed parallel imaging electric signals to the second serializer circuit 152. The second serializer circuit 152 converts the parallel imaging electrical signal into a serial imaging electrical signal and transmits the serial imaging electrical signal to the host 300 through the second transmission port 151.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. An ultrasonic forward ring array transceiver is applied to ultrasonic imaging equipment and is characterized by comprising a transceiver chip and a transduction array chip; the packaging shape of the transceiver chip is a cylinder, and the transduction array chip is annularly arranged on one bottom surface of the transceiver chip; the transceiver chip is electrically connected with the transduction array chip and a host in the ultrasonic imaging equipment respectively;
the receiving and transmitting chip is used for driving the transduction array chip to transmit ultrasonic waves to the right front of the bottom surface according to an excitation signal of the host;
the energy conversion array chip is used for receiving the returned ultrasonic waves, generating corresponding imaging electric signals according to the returned ultrasonic waves and transmitting the imaging electric signals to the transceiver chip;
the receiving and transmitting chip is also used for carrying out low-noise signal amplification on the imaging electric signal and sending the amplified imaging electric signal to the host.
2. The ultrasonic forward loop array transceiver of claim 1, wherein the transduction array chip is a single-loop transduction array chip comprising a plurality of transceiving array unit groups; the transceiving chip comprises a plurality of first sub transceiving chips, and the plurality of first sub transceiving chips and the plurality of transceiving array unit groups correspond to each other one by one; each first sub-transceiver chip comprises a first transmitting channel circuit module, a first receiving channel circuit module and a transceiving switch circuit module;
the input end of the first transmitting channel circuit module and the output end of the first receiving channel circuit module are respectively electrically connected with the host, the output end of the first transmitting channel circuit module and the input end of the first receiving channel circuit module are respectively electrically connected with the transceiving switch circuit module, and the transceiving switch circuit module is also electrically connected with the corresponding transceiving array unit group.
3. The ultrasonic forward loop array transceiver of claim 2, wherein the first transmit channel circuit module comprises a first receive port, a first deserializer circuit, and a first multi-channel high voltage drive circuit;
the first receiving port is used as an input end of the first transmitting channel circuit module and is electrically connected with the host and the input end of the first deserializer circuit respectively; the output end of the first deserializer circuit is electrically connected with the input end of the first multi-channel high-voltage driving circuit; the first multi-channel high-voltage driving circuit is used as the output end of the first transmitting channel circuit module and is electrically connected with the transceiving switch circuit module.
4. The ultrasonic forward loop array transceiver of claim 2, wherein the first receive channel circuit block comprises a first transmit port, a first serializer circuit, and a first multi-channel low noise amplification circuit;
the input end of the first multi-channel low-noise amplification circuit is used as the input end of the first receiving channel circuit module and is electrically connected with the transceiving switch circuit module; the output end of the first multichannel low-noise amplification circuit is electrically connected with the input end of the first serializer circuit; the first transmitting port is used as an output end of the first receiving channel circuit module and is electrically connected with the host and an output end of the first serializer circuit respectively.
5. The ultrasonic forward ring array transceiver of claim 2, wherein each of the transceiver array unit groups comprises a plurality of transducer elements, and the transducer elements are electrically connected to the ports of the transceiver switch circuit module in a one-to-one correspondence.
6. An ultrasonic forward loop array transceiver according to claim 5, wherein the transducing array element comprises a plurality of transducer elements connected in parallel in series.
7. The ultrasonic forward ring array transceiver of claim 1, wherein the transduction array chip is a multi-ring transduction array chip comprising at least one transmit transduction array ring and at least one receive transduction array ring; each transmitting transduction array ring comprises a plurality of transmitting array unit groups, and each receiving transduction array ring comprises a plurality of receiving array unit groups; the transceiver chip comprises a plurality of second sub transceiver chips, and each second sub transceiver chip comprises a second transmitting channel circuit module and a second receiving channel circuit module;
the input end of the second transmitting channel circuit module and the output end of the second receiving channel circuit module are respectively electrically connected with the host, the output end of the second transmitting channel circuit module is electrically connected with one transmitting array unit group, and the input end of the second receiving channel circuit module is electrically connected with one receiving array unit group.
8. The ultrasonic forward loop array transceiver of claim 7, wherein the second transmit channel circuit module comprises a second receive port, a second deserializer circuit, and a second multi-channel high voltage drive circuit;
the second receiving port is used as an input end of the second transmitting channel circuit module and is electrically connected with the host and the input end of the second deserializer circuit respectively; the output end of the second deserializer circuit is electrically connected with the input end of the second multi-channel high-voltage driving circuit; the second multi-channel high-voltage driving circuit is used as the output end of the second transmitting channel circuit module and is electrically connected with one transmitting array unit group.
9. The ultrasonic forward loop array transceiver of claim 7, wherein the second receive channel circuit block comprises a second transmit port, a second serializer circuit, and a second multi-channel low noise amplification circuit;
the input end of the second multi-channel low-noise amplification circuit is used as the input end of the second receiving channel circuit module and is electrically connected with one receiving array unit group; the output end of the second multi-channel low-noise amplifying circuit is electrically connected with the input end of the second serializer circuit; the second transmitting port is used as the output end of the second receiving channel circuit module and is electrically connected with the output ends of the host and the second serializer circuit respectively.
10. The ultrasonic forward ring array transceiver of any one of claims 1 to 9, wherein the transduction array chip is a monolithic chip prepared by a piezoelectric microelectromechanical ultrasound transducer PMUT manufacturing process;
the transceiver chip and the transduction array chip are packaged into a whole through an embedded packaging process.
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| CN202011000034.2A CN112138970A (en) | 2020-09-22 | 2020-09-22 | Ultrasonic forward loop array transceiver |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011000034.2A CN112138970A (en) | 2020-09-22 | 2020-09-22 | Ultrasonic forward loop array transceiver |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113552573A (en) * | 2021-06-29 | 2021-10-26 | 复旦大学 | Rapid imaging algorithm based on ultrasonic ring array synthetic aperture receiving |
| WO2023284212A1 (en) * | 2021-07-16 | 2023-01-19 | 深圳市赛禾医疗技术有限公司 | Ultrasonic device and ultrasound imaging catheter |
-
2020
- 2020-09-22 CN CN202011000034.2A patent/CN112138970A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113552573A (en) * | 2021-06-29 | 2021-10-26 | 复旦大学 | Rapid imaging algorithm based on ultrasonic ring array synthetic aperture receiving |
| CN113552573B (en) * | 2021-06-29 | 2022-07-29 | 复旦大学 | Rapid imaging algorithm based on ultrasonic ring array synthetic aperture receiving |
| WO2023284212A1 (en) * | 2021-07-16 | 2023-01-19 | 深圳市赛禾医疗技术有限公司 | Ultrasonic device and ultrasound imaging catheter |
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