CN112135920A - Evaporation source for depositing evaporated source material, method for shielding evaporated source material and shielding device for evaporation source - Google Patents

Evaporation source for depositing evaporated source material, method for shielding evaporated source material and shielding device for evaporation source Download PDF

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Publication number
CN112135920A
CN112135920A CN201880093054.3A CN201880093054A CN112135920A CN 112135920 A CN112135920 A CN 112135920A CN 201880093054 A CN201880093054 A CN 201880093054A CN 112135920 A CN112135920 A CN 112135920A
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shielding
source material
movable
evaporation source
evaporated
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托马斯·格比利
安德烈亚斯·勒普
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0068—Reactive sputtering characterised by means for confinement of gases or sputtered material, e.g. screens, baffles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Embodiments described herein relate to a shielding device (200) for an evaporation source (20). An evaporation source (20) is configured to direct evaporated source material through one or more outlets (22). The shielding (200) comprises one or more movable shielding portions (205) configured to block the evaporated source material according to an emission angle of a plume (342) of evaporated source material from the one or more outlets (22) and configured to be displaced by movement. A shielding device comprising one or more shielding tapes (210) is disclosed. An evaporation source and a method of shielding are also disclosed.

Description

Evaporation source for depositing evaporated source material, method for shielding evaporated source material and shielding device for evaporation source
Technical Field
The present disclosure relates generally to an evaporation source for depositing an evaporated source material, and in particular to a shielding apparatus for an evaporation source and a method of shielding an evaporated source material. More particularly, the present disclosure relates to an evaporation source for evaporation of organic material and to a shielding device for use in a deposition system for manufacturing devices, in particular devices including organic material therein.
Background
An organic vaporizer is a tool for producing an organic light-emitting diode (OLED). An OLED is a special type of light emitting diode in which the emissive layer comprises a thin film of certain organic compounds. Organic Light Emitting Diodes (OLEDs) are used to manufacture television screens, computer monitors, mobile phones and other hand held devices for displaying information. OLEDs are also used for general space illumination. Furthermore, the fact that OLEDs can be manufactured on flexible substrates leads to further applications. For example, an OLED display may comprise layers of organic material located between two electrodes, all deposited on a substrate in such a way as to form a matrix display panel with individually excitable pixels. The OLED is typically placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein.
Many challenges are encountered in the manufacture of such display devices. OLED displays or OLED lighting applications include stacks of various organic materials that are, for example, evaporated in vacuum. The organic material is deposited through a mask in a subsequent manner. In order to efficiently manufacture an OLED stack, co-deposition or co-evaporation of two or more materials (e.g., host and dopant) results in a mixed/doped layer that is beneficial. Furthermore, it must be taken into account that there are a variety of process conditions for evaporating very sensitive organic materials.
To deposit the material on the substrate, the material is heated until the material evaporates. The distribution pipe guides the evaporated material to the substrate through the outlet. In recent years, the accuracy of the deposition process has been improved, for example allowing small pixel sizes to be provided. In some processes, a mask is used to define pixels as the evaporated material passes through the mask openings. Inaccuracies in the deposited material may result in non-uniform pixel fill. This may have a negative impact on the properties of the article as well as the deposition process.
In view of the above, it would be beneficial to improve the accuracy of the manufacturing process.
Disclosure of Invention
In view of the above, a shielding device for an evaporation source is provided. The evaporation source is configured to direct evaporated source material through one or more outlets. The shielding includes one or more movable shielding portions configured to block the evaporated source material according to an emission angle of a plume (plume) of the evaporated source material from the one or more outlets and configured to be displaced by movement.
According to an aspect of the present disclosure, there is provided a shielding apparatus for an evaporation source. The evaporation source is configured to direct evaporated source material through one or more outlets. The shielding device comprises: a movable shielding strip (movable shielding belt) providing one or more movable shielding sections configured to block the evaporated source material according to an emission angle of a plume of the evaporated source material; an unwinding supply device (unwinding supply device) for the tape; and a take-up device (take-up device) for the strip.
According to an aspect of the present disclosure, there is provided an evaporation source for depositing an evaporated source material on a substrate. According to embodiments described herein, the evaporation source comprises a shielding device.
According to an aspect of the present disclosure, there is provided a method of shielding evaporated source material released from an evaporation source. The evaporation source comprises one or more outlets. The method comprises the following steps: moving a first movable shield portion adjacent to the one or more outlets to block the evaporated source material according to an emission angle of a plume of the evaporated source material during deposition; and replacing the first movable shielding device portion with the second movable shielding device portion.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described below:
fig. 1 shows a schematic top view of a deposition apparatus comprising an evaporation source according to embodiments described herein;
fig. 2 shows a schematic side view of a shielding arrangement according to embodiments described herein;
fig. 3A shows a schematic side view of a shielding arrangement configuration according to embodiments described herein;
fig. 3B shows a schematic perspective view of an evaporation source according to embodiments described herein;
fig. 4A shows a schematic top view of an evaporation source according to embodiments described herein;
fig. 4B shows a schematic side view of an evaporation source according to embodiments described herein;
fig. 4C shows a schematic top view of an evaporation source according to embodiments described herein;
fig. 5A shows a schematic side view of a redirection device configuration according to embodiments described herein;
fig. 5B shows a schematic side view of a redirection device configuration according to embodiments described herein; and
fig. 6 shows a flow chart illustrating a method for shielding evaporated source material released from an evaporation source according to embodiments described herein.
Detailed Description
Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numerals designate like parts. Generally, only the differences with respect to the respective embodiments are described. Each example is provided by way of illustration and is not meant as a limitation of the present disclosure. Features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. The description is intended to include such modifications and alterations.
Embodiments of the present disclosure allow for material release to limit the extended life of the device. The material release limiting device defines or limits the angle of the released deposition material. Such a collimator or shaper (shaper) may be used to improve the pixel accuracy of a deposition process, in particular a mask deposition process. A problem with static collimators is the formation of debris particles on the side of the collimator facing the deposition outlet releasing the material to be deposited onto the substrate. Thus, the debris particles obstruct the path of material deposition onto the substrate and weight the deposition.
In view of the above, the material release limiting device limits the total deposition time due to the fact that maintenance must be performed after several deposition cycles to remove the debris material from the collimator or shaper. Embodiments of the present disclosure allow for reducing or preventing the impact of material release limiting devices on the total deposition time. Embodiments of the present disclosure provide a self-refreshing (self-refreshing) effect, making maintenance of the collimator redundant.
Fig. 1 shows a schematic top view of a deposition apparatus 100 comprising an evaporation source 20 according to embodiments described herein. The deposition apparatus 100 includes a vacuum chamber 110 in which an evaporation source 20 is provided. According to some embodiments, which can be combined with other embodiments described herein, the evaporation source 20 is configured to perform a translational movement along the surface of the substrate to be coated. Further, the evaporation source 20 may be configured to rotate about a rotation axis.
According to an embodiment, the evaporation source 20 may have one or more evaporation crucibles and one or more distribution pipes 106. For example, the evaporation source 20 shown in fig. 1 includes two evaporation crucibles 104 and two distribution pipes 106. Generally, the evaporation source may include three evaporation crucibles 104 and three distribution pipes 106. As shown in fig. 1, a substrate 10 and another substrate 11 are provided in a vacuum chamber 110 for receiving evaporated source material.
In general, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of: glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite, carbon fiber material, or any other material or combination of materials that may be coated by a deposition process.
According to some embodiments herein, a mask assembly for masking a substrate may be provided between the substrate and an evaporation source. The mask assembly may include a mask and a mask frame to hold the mask in a predetermined position. In embodiments herein, one or more additional tracks may be provided to support and displace (displacing) the mask assembly. For example, the embodiment shown in fig. 1 has a first mask 133 supported by a first mask frame 131 disposed between the evaporation source 20 and the substrate 10 and a second mask 134 supported by a second mask frame 132 disposed between the evaporation source 20 and another substrate 11. The substrate 10 and the further substrate 11 may be supported on respective transport rails (not shown in fig. 1) within the vacuum chamber 110.
Fig. 1 further shows a shielding device 200 provided to guide evaporated source material from the distribution pipe 106 to the substrate 10 and/or the further substrate 11, respectively, as will be explained in more detail below. A shielding device 200 may be provided downstream of the outlet, i.e. between the distribution pipe and the base plate. In some embodiments, the shielding device 200 may be detachably fixed to the at least one distribution pipe, for example via screws. The shielding means defines a plume of vaporized material.
According to embodiments described herein, a substrate may be coated with a source material in a substantially vertical position. Typically, the distribution pipe 106 is configured as a line source extending substantially vertically. In embodiments described herein, which may be combined with other embodiments described herein, the term "vertically" should be understood to allow deviations from the vertical direction of 20 ° or less, for example 10 ° or less, in particular when referring to the orientation of the substrate. For example, this deviation may be provided because a substrate support with some deviation from a vertical orientation may result in a more stable substrate position. However, it is believed that the substantially vertical substrate orientation is different from the horizontal substrate orientation during deposition of the source material. The surface of the substrate is coated by a line source that extends in one direction corresponding to one substrate dimension and moves translationally in another direction corresponding to the other substrate dimension.
In some embodiments, the evaporation source 20 can be provided in the vacuum chamber 110 of the deposition apparatus 100 on a track or linear guide 120. The nozzle may be guided on a circular trajectory while the evaporation source moves in a combination of translation and rotation. The track or linear guide 120 is configured for translational movement of the evaporation source 20. According to different embodiments, which can be combined with other embodiments described herein, a drive for translational movement can be provided in the evaporation source 20, at the track or linear guide 120, within the vacuum chamber 110, or a combination thereof. Thus, the evaporation source can be moved along the surface of the substrate to be coated, in particular along a linear path, during deposition. Uniformity of the deposited material on the substrate can be improved.
Fig. 1 further shows a valve 105, for example a gate valve. The valve 105 allows vacuum sealing to an adjacent vacuum chamber (not shown in fig. 1). According to embodiments described herein, the valve 105 may be opened for transferring a substrate or mask into the vacuum chamber 110 and/or out of the vacuum chamber 110.
The deposition apparatus may be used in a variety of applications, including applications for OLED device fabrication including processing methods in which two or more source materials, such as, for example, two or more organic materials, are evaporated simultaneously. In the example shown in fig. 1, two or more distribution pipes 106 and corresponding evaporation crucibles are provided adjacent to each other. For example, in some embodiments, three distribution pipes may be provided adjacent to each other, each distribution pipe comprising a plurality of outlets with respective nozzles for introducing evaporated source material from the interior of the respective distribution pipe into the deposition region of the vacuum chamber. The outlets or nozzles may be provided along the linear extension of the respective distribution pipe, e.g. at equal intervals. Each distribution tube may be configured to introduce a different vaporized source material into the deposition region of the vacuum chamber.
As used herein, the term "source material" may be understood as a material that is evaporated and deposited on the surface of the substrate. For example, in embodiments described herein, the vaporized organic material deposited on the surface of the substrate may be the source material. Non-limiting examples of organic materials include one or more of the following: ITO, NPD, Alq3, Quinacridone (Quinavirdone), Mg/AG, starburst material (starburst material), and the like.
Although the embodiment shown in fig. 1 provides a deposition apparatus 100 having a movable evaporation source 20, it can be understood by those skilled in the art that the above-described embodiment can also be applied to a deposition system that moves a substrate during processing. For example, the substrate to be coated may be guided and driven along a fixed material deposition arrangement.
Embodiments described herein relate, inter alia, to deposition of organic materials, e.g., for fabricating OLED displays on large area substrates. According to some embodiments, the large area substrate or the carrier supporting the one or more substrates may have a thickness of at least 0.174m2The size of (c). For example, the deposition system may be adapted to process large area substrates, such as the following: GEN 5, corresponding to about 1.4m2A substrate (1.1m × 1.3 m); GEN 7.5, corresponding to about 4.29m2A substrate (1.95m × 2.2 m); GEN 8.5, corresponding to 5.7m2A substrate (2.2m × 2.5 m); or even GEN 10, corresponding to about 8.7m2Substrate (2.85m × 3.05 m). Even higher generations such as GEN 11 and GEN 12 and corresponding substrate areas may be similarly implemented. For example, for OLED display manufacturing, evaporation by an apparatus for evaporating materials may be usedHalf the size of the substrate was coated, including GEN 6. Half the size of a substrate generation may result from some processes running on the full substrate size and subsequent processes running on half of a previously processed substrate.
According to embodiments described herein, the evaporation source 20 may include a distribution tube 106 and an evaporation crucible 104. For example, the distribution pipe may be an elongated cube (elongated cube) having a first heating unit. The first heating unit may be configured to heat the distribution pipe to a temperature to prevent the evaporated source material from condensing at an inner wall of the distribution pipe. The evaporation crucible may be a reservoir (reservoir) for a source material, such as an organic material evaporated using a second heating unit. The second heating unit may be configured to heat the crucible to a temperature to allow the source material to evaporate. Additionally, a thermal shield may be provided around the tubes of the distribution pipe 106 to reduce or prevent heat radiation to the surrounding chamber.
According to embodiments described herein, the distribution pipe may be heated by a heating element mounted or attached to a wall of the distribution pipe. In order to reduce the heat radiation towards the substrate, an outer shield surrounding the heated inner wall of the distribution pipe may be cooled. An additional second external shield may be provided to further reduce the thermal load directed to the deposition area or substrate, respectively. According to some embodiments, which can be combined with other embodiments described herein, the shield can be provided as a metal plate with a conduit for a cooling fluid (such as water) attached to or provided within the metal shield. Additionally or alternatively, a thermoelectric cooling device or other cooling device may be provided to cool the shield. Thus, the interior of the distribution tube may be kept at a high temperature, e.g. higher than the evaporation temperature of the source material, while the heat radiation towards the deposition area and towards the substrate may be reduced.
According to some embodiments, which can be combined with other embodiments described herein, the distribution pipe 106 extends substantially vertically in the length direction. For example, the length of the distribution pipe 106 corresponds to at least the height of the substrate to be deposited in the deposition apparatus. Accordingly, deposition uniformity of the evaporated source material may be improved. The length of the distribution pipe 106 may be at least 10% or even 20% longer than the height of the substrate to be deposited, which allows for uniform deposition at the upper end of the substrate and/or the lower end of the substrate. Alternatively, the distribution pipe 106 may be shorter in length than the height of the substrate. The distribution uniformity of the evaporated source material may be provided, for example, by the larger diameter of the nozzles provided at the outermost positions of the distribution pipe.
According to the embodiments described herein, the evaporation source comprises one or more outlets 22. In particular, one or more outlets 22 may be arranged at the distribution pipe 106. The one or more outlets 22 may be configured as one or more nozzles. The one or more nozzles may be configured to deposit the vaporized source material onto the substrate. In particular, the nozzle may be configured to form a plume of evaporated source material for deposition of the evaporated source material onto the substrate.
According to embodiments, which can be combined with any other embodiments described herein, the shielding device 200 can be arranged at one or more outlets 22 or nozzles. The shielding 200 may define a plume of vaporized source material. The shield 200 may define a vaporized source material that is released by one nozzle.
For example, the shield may surround a nozzle. The shielding means may define plumes of evaporated source material released by the nozzle in two or more directions from the perspective of the nozzle as a center point. In particular, defining the plume may occur in a vertical and/or horizontal direction from the nozzle perspective and directed toward the substrate.
According to an embodiment, the distribution pipe 106 comprises one or more outlets 22. The outlets 22 may be arranged vertically along the distribution pipe. The outlet may be configured as a nozzle to deposit the vaporized source material on the substrate. For example, the distribution pipe may have more than 30 nozzles, such as 40, 50 or 54 nozzles arranged along the length of the distribution pipe. According to embodiments herein, the nozzles may be spaced apart from each other. For example, the nozzles may be spaced apart by a distance of 1cm or more, for example 1cm to 3cm, for example 2 cm.
According to some embodiments, which can be combined with other embodiments described herein, the outlet is arranged such that the outlet or nozzle defines a main emission direction X which is substantially horizontal (+/-10 °). According to some embodiments, the main emission direction X may be oriented slightly upwards, for example in the range from horizontal to 10 ° upwards, such as 3 ° to 7 ° upwards. Similarly, the substrate may be slightly tilted to be substantially perpendicular to the evaporation direction, which may reduce the generation of particles.
Fig. 2 illustrates a shielding apparatus 200 according to embodiments described herein. The shielding device 200 includes one or more movable shielding device portions 205. The shielding device 200 may include one or more shielding tapes 210. One or more shield strips 210 may include a movable shield portion 205. The shielding device 200 may include a unwind supply 212 for tape and a wind-up 214 for tape. For example, the unwind supplying device 212 and the winding device 214 may be arranged perpendicular to each other. Additionally or alternatively, the unwind supply 212 and the take-up 214 for the ribbon may be arranged horizontally to each other.
Fig. 2 shows a deployment supply 212 at the upper portion of the shielding device 200 and a take-up 214 at the lower portion of the shielding device. For example, the outlet 22 may be between the unwind supply 212 and the take-up 214. According to yet further embodiments, which can be combined with other embodiments described herein, the unwind supplying device 212 and the winding device 214 can be on the same side, e.g., on an upper or lower portion of the shielding device 200. The tape may then be redirected back to the same side of the shielding means 220 using the redirecting means 220 accordingly.
According to embodiments described herein, the shielding device 200 may be arranged at the distribution pipe. The shielding 200 may be disposed around one or more of the outlets 22 or nozzles. The outlet or nozzle may release the vaporized source material. The outlet or nozzle may plume the vaporized source material. The plume may be defined by the shielding means. The defined plume may result in deposition of evaporated source material at the shielding means. For example, the vaporized source material is blocked by a shielding device. Confining or blocking the evaporated source material may result in deposition of the blocked material at the shielding. For example, the blocked evaporated source material may be deposited on the surface of the shielding means.
According to embodiments described herein, one or more movable shield portions may be replaced to reduce the film thickness of material deposited on the surface of the shield. A shield portion may be provided adjacent the outlet or nozzle. The blocked vaporized source material may be deposited onto the movable shield portion 205. When the blocked evaporated source material has been deposited on the movable shielding device part, the movable shielding device part may be replaced with another movable shielding device part. In particular, the other movable shielding device portion may be free of deposited material at the time of replacement. One skilled in the art will appreciate that substitutions may be repeated in a continuous manner or may be provided in a stepwise manner.
According to embodiments described herein, one or more moveable shielding device portions may be provided by a deployment provision for a tape. The deployment delivery device is movable to provide one or more movable shielding device portions. For example, the supply may be rotatably deployed to provide a movable shield portion. One or more moveable shield portions may be taken up by a take-up device for the tape. A movable take-up device for taking up one or more movable shield portions. For example, the winding device may be rotated to wind up the movable shielding device portion. For example, the unwind supply may provide one or more movable shield portions that are free of deposited vaporized source material, while the take-up may take up one or more movable shield portions that carry deposited vaporized source material.
According to embodiments described herein, a shielding device for an evaporation source may be provided. The evaporation source may be configured to direct evaporated source material through one or more outlets. The shielding may include one or more movable shielding portions configured to block the evaporated source material according to an emission angle of a plume of the evaporated source material from the one or more outlets and configured to be displaced by movement.
According to embodiments described herein, the shielding device 200 may be arranged at the evaporation source 20. The vaporized source material may be conveyed via the distribution pipe 106 and through the outlet 22. The shielding device 200 may include one or more movable shielding device portions 205. The movable shield portion may be arranged adjacent to one or more outlets 22 at the distribution pipe 106. The shield 200 and/or the movable shield portion 205 may be configured to block vaporized source material released through the outlet 22. For example, the vaporized source material may be plume released. The plume of vaporized source material may be defined by the shielding device 200. For example, vaporized source material released at the maximum emission angle may be collected by the shielding device 200. The shielding device 200 may block the evaporated source material released at the maximum emission angle.
According to embodiments described herein, the shielding device 200 may include one or more shielding tapes 210. One or more shielding tapes may be disposed between the unwind supply 212 and the take-up 214 for tape. The deployment delivery device 212 may be configured to provide one or more shielding strips. For example, the shield tape 210 may be attached to the deployment delivery device and may be deployed by rotating the deployment delivery device. The take-up device 214 may be configured to receive one or more shield tapes.
According to embodiments described herein, the unwind supply for the ribbon and the take-up for the ribbon may be configured as rollers movable about an axis. The shaft may be arranged in a substantially horizontal plane with respect to the unwind supplying device and/or the winding device. One or more shield tapes 210 may be removably secured to the unwind supply, i.e., to the rollers.
According to embodiments described herein, the unwind supply and the take-up device for the tape may be configured as a cylindrical hollow body rotatable about a rotational axis. The cylindrical hollow body may for example be a sheath (sheath) or a sleeve (sleeve). The cylindrical hollow body may be removably arranged at the bearing. One or more shield bands may be attached to the cylindrical hollow body, for example to the deployment delivery device.
According to embodiments, which can be combined with other embodiments described herein, the detachment of one or more shielding tapes can be achieved by movement of the unwind supplying device 212 (i.e., the unwind tape supplying roller). For example, the movement is a movement of the movable shielding device part from the unwinding supply device in the direction of the winding device for the tape. The deployed delivery device may be rotated in a counter-clockwise direction, indicated by rotational arrow 6 in fig. 2. Alternatively, the deployment delivery device may be rotated in a clockwise direction for deploying one or more shielding tapes.
According to embodiments described herein, one or more shield tapes may be taken up by the take-up device 214. The tape take-up device may be movable to take up one or more shield tapes. For example, the take-up device may rotate in a clockwise direction, indicated by the rotational arrow 5 in fig. 2. For example, when the unwind supply is rotated in a counterclockwise direction, the take-up may be rotated in a clockwise direction, and vice versa.
The movement of the unwind supply and/or the take-up for the tape may be controlled by an actuator 216. The unwind supplying device and/or the winding device may be driven by an actuator. The actuator may provide movement to replace one or more of the moveable shielding device portions. An actuator 216 may be provided at the unwind supply 212 and/or the take-up 214 for the tape. For example, the actuator may be attached to the unwind supplying device 212 and/or to the winding device 214.
The one or more shield strips and/or the one or more moveable shield portions may be moved at a speed in the millimeter range per minute. For example, one or more shield tapes and/or one or more moveable shield portions may be moved at a speed in the range of 0.1 to 10 millimeters per minute. Additionally or alternatively, the speed of movement may be selected such that flaking of the collected vaporized source material from the one or more movable shielding device portions or the one or more shielding bands is avoided or prevented.
According to embodiments described herein, movement of the one or more shielding tapes and/or the one or more moveable shielding device portions may be provided discontinuously. For example, one or more shield bands and/or one or more movable shield portions may be moved during idle (idle) (i.e., when an evaporation source is switched from one substrate to another). During idle, the speed of movement may be, for example, 25 mm/sec or less.
According to embodiments described herein, the shielding device 200 may be arranged at an evaporation source. A shielding means may be provided at the distribution pipe of the evaporation source. A shielding means may be provided adjacent the outlet 22 of the distribution pipe. According to embodiments, one or more shielding strips may be provided adjacent to the outlet 22, and in particular one or more movable shielding device portions 205 may be provided adjacent to the outlet 22.
For example, a first movable shielding portion and a second movable shielding portion 205 are arranged at the outlet 22. A first moveable shielding means portion may be provided adjacent the outlet 22. The second moveable shielding means portion may be provided adjacent the first moveable shielding means portion, for example remote from the outlet in the first position. The second movable shielding device portion may be provided such that the second movable shielding device portion may replace the first movable shielding device portion when the first and second movable shielding device portions are moved (i.e., movement of the tape). The movement of the first and second moveable shielding portions may be directed away from a unwind supply for tape and toward a wind-up for tape. The second movable shield band portion may replace the first movable shield portion when moved.
According to embodiments described herein, the one or more shielding tapes and/or the one or more movable shielding means parts may be guided in a substantially vertical direction (indicated by directional arrow 7 in fig. 2) and/or in a substantially horizontal direction (indicated by directional arrow 8 in fig. 2). The shielding means may comprise one or more redirecting means 220. The redirection device 220 may be configured to change the orientation of one or more shield strips and/or one or more movable shield portions. For example, one or more shielding strips are guided around the redirection means 220. According to embodiments described herein, the two redirection means 220 may be arranged in a horizontal plane. For example, two redirecting means may be arranged above the outlet of the distribution pipe in a first horizontal plane and two further redirecting means may be arranged below the outlet of the distribution pipe in a second horizontal plane, the second horizontal plane being aligned with the direction of the first horizontal plane.
According to embodiments described herein, one or more redirecting devices 220 may be fixed or rotatable about an axis of rotation. For example, the belt may slide over a fixed redirection device as the belt moves. The redirecting means may rotate with the belt as the belt moves. One or more redirecting means may be provided as a roller. The redirecting means may be rotated by movement of one or more of the shield strips and/or movement of one or more of the moveable shield portions.
According to an embodiment, one or more shielding tapes may be arranged between the unwind supply for tape and the take-up. The shielding tapes may cover each other. Advantageously, the shielding tape may trap (trap) the collected evaporated source material when the shielding tape is overlaid on each other. Thus, once collected by the shielding device, the vaporized source material is prevented from re-entering the system. Furthermore, advantageously, the covering of the shielding tape may provide a space-saving way to provide shielding means for many outlets at the same time. The winding up of the shielding tape can be facilitated.
The shielding tape may be provided at the same unwind supply and at the same take-up for the tape. The shielding tape may be moved simultaneously by unwinding the supply device and/or the take-up device. Although four shielding tapes 210A, 210B, 210C, 210D and three outlets 22 are shown in fig. 2, it will be appreciated by those skilled in the art that the shielding device may comprise more than four shielding tapes and/or the evaporation source may comprise more than three outlets. According to an embodiment, the number of shielding strips may depend on the number of outlets provided at the distribution pipe. For example, if the distribution pipe provides n outlets, n +1 shielding strips may be provided. The outlets may be separated by a shielding tape.
According to embodiments described herein, at least a portion of the shielding tape and/or the movable shielding tape portion may be guided over the redirection device 220. The shield tape and/or the movable shield tape portion may be arranged in a horizontal plane between the outlets. In particular, one shielding strip may be arranged between two outlets. Additionally or alternatively, two shielding strips may be arranged between the two outlets.
According to embodiments described herein, the shield tapes may be conveyed simultaneously. The shielding tape is transported joinably (jointly). The joined shielding strips may be divided at the redirecting means 220. For example, the first two redirecting means are arranged in a horizontal plane above the outlet and the second two redirecting means are arranged in a horizontal plane below the outlet. A first shielding tape engaging the shielding tape may be guided via the first two redirecting means and a second shielding tape engaging the shielding tape may be guided via the second two redirecting means. The first and second shield strips may be joined together after passing through the first and second redirecting means.
According to embodiments described herein, the shielding tape may comprise a thickness in the range of 0.010mm to 0.500mm, in particular in the range of 0.020mm to 0.100 mm. The one or more shielding strips may be made of metal, in particular stainless steel and/or may be coated with titanium. Additionally or alternatively, one or more of the shielding tapes may be made of aluminum, for example, when a temperature of T < 550 ℃ is applied.
Fig. 3A illustrates a shielding device configuration according to embodiments described herein. A plurality of shielding devices 200 may be arranged at the evaporation source, i.e. at the distribution pipes 106 of the evaporation source. The distribution pipe may comprise an outlet 22. The plurality of shielding means may be arranged in a horizontal plane adjacent to the distribution pipe 106. The planes may be arranged such that each outlet of the distribution pipe is surrounded by at least two of the shielding means 200. For example, a plurality of shielding means may be arranged between the distribution pipe and the substrate to be coated with the evaporated source material. According to an embodiment, shielding means may be provided above and below the plurality of outlets.
According to embodiments described herein, the second shielding device 24 may be arranged at the evaporation source. The second shield may be referred to herein as a "shaper shield". The second shielding device 24 may be vertically disposed at the evaporation source. In particular, the second shielding device 24 may be arranged vertically at the distribution pipe 106. The second shielding means may be arranged downstream of the one or more outlets 22, i.e. between the evaporation source and the substrate. The second shielding means may be configured to block evaporated source material at the side of the outlet. For example, the shaper shields may block evaporated source material at both sides of the distribution pipe. In addition to the confinement of the plurality of shielding devices 200 in the horizontal plane, the second shielding device may provide confinement of the plume of vaporized material in the vertical plane. The shield 200 and shaper shields may block vaporized source material released at maximum emission angles around the exit 22.
For example, the one or more shield portions comprise a first shield portion provided adjacent to an outlet of the one or more outlets and a second shield portion provided at a distance from the outlet of the one or more outlets and movable adjacent to the outlet of the one or more outlets when the first portion is moved away from the outlet of the one or more outlets.
The plurality of shielding devices may be arranged such that the unwind supplying device 212 and/or the winding device 214 for the tape are arranged above each other. One skilled in the art will appreciate that the unwind supplying device 212 and/or the winding device may be arranged in the opposite direction, i.e., the unwind supplying device is arranged above or below the winding device, or vice versa. The unwinding supply device can be rotated in the direction of the winding device or vice versa. The deployment delivery device may rotate in a counter-clockwise direction indicated by rotational arrow 5. The take-up device 214 may rotate in a clockwise direction indicated by rotational arrow 6.
According to embodiments described herein, the shielding device 200 may be configured to block the evaporated source material according to an emission angle of a plume of the evaporated source material from the one or more outlets and configured to be replaced by movement. "blocking" of the evaporated source material can be understood as selectively suppressing particles released from the evaporation source. For example, particles of the plume which are not oriented in the main emission direction X and/or particles released at an emission angle different from the emission angle θ may be collected by the shielding means.
According to embodiments described herein, the shielding device may be configured to collect evaporated source material particles by adsorption and/or condensation at one or more surfaces of the shielding device. One or more shield strips and/or movable shield strip portions of the shield may be configured to adsorb and/or condense particles on one or more surfaces. Thus, the shield tape, the movable shield tape portion, and/or the surface may have a first temperature and the vaporized source material may have a second temperature, the first temperature being lower than the second temperature. For example, the temperature of the shielding means may be lower than the temperature of the vaporized source material.
Fig. 3B shows a schematic perspective view of an evaporation source according to embodiments described herein. A plurality of shielding devices may be disposed at the distribution pipe of the evaporation source. The shielding means may be mounted to the dispensing tube via fixing means, e.g. screws. In particular, a deployment supply and a take-up for the tape may be mounted to the dispensing tube. The second shielding device 24 may be arranged at the distribution pipe 106. The second shielding device 24 may be arranged such that the shielding device 200 and the second shielding device 24 surround the outlet at the distribution pipe.
The distance between the two shielding means may be similar to the distance between the two outlets. The shielding means may be spaced apart by a distance of 1cm or more, for example 1cm to 3cm, for example 2 cm. It will be appreciated by those skilled in the art that the shielding means may be arranged in a gap between two adjacent outlets arranged in a vertical orientation.
According to embodiments, the vaporized source material may be collected at both sides of the shielding tape and/or the movable shielding tape portion. The shield tape and/or the movable shield tape portion may include an upper surface 211 and a lower surface 213 for adsorbing or condensing the vaporized source material. For example, an upper surface 211 of the shielding device arranged between two vertically oriented adjacent outlets of the distribution pipe may collect evaporated source material of the upper outlets, while a lower surface 213 of the shielding device may collect evaporated source material of the lower outlets. The vaporized source material may be collected at the surface of the second shielding device 24. For example, the vaporized source material may be collected at a surface facing the outlet 22.
Advantageously, the collected material adsorbed or condensed at the shielding tape and/or the movable shielding tape portion is conveyed towards a take-up for tape. The shield tape and/or the movable shield tape portion is wound onto the winding device by rotation of the winding device. Thus, the collected material is trapped between a single turn (single tum) of the shield tape and/or the movable shield tape portion on the tape take-up. In this way, material collected at the belt can no longer enter the system. Impurities in the system are reduced or prevented from entering the system and deposition accuracy is improved.
Furthermore, advantageously, the shielding tape and/or the movable shielding device partially collects the material of the two outlets, which causes a very thin deposition of material on the tape. Thus preventing material from peeling off from the shielding device, in particular during movement of the shielding tape and/or the movable shielding tape portion.
Advantageously, and in particular with respect to the embodiment described with respect to fig. 3A, the shielding tape may be engaged after the exit of the source material evaporated by deposition. Thus, collected material may be trapped between the shield tape and/or the movable shield tape portions. Preventing the collected material from entering the system before reaching the take-up for the strip. Thus, impurities during belt movement can be prevented from entering the system. Further, the collected material may be transferred to a take-up device for the strip.
Furthermore, it is advantageous if two shielding strips are arranged between the two outlets, each of the shielding strips or the respective movable shielding strip portions may collect material at one surface. Thus, overall, less material may be present at the surface of the shielding tape, in particular to prevent flaking of the material. Conversely, if one shielding strip is arranged between two outlets, material can be collected at both surfaces of the shielding device, resulting in a higher amount of material being collected at the same time, making the process of collecting material more efficient by saving strip supply material.
Fig. 4A shows a schematic top view of an evaporation source 20 according to embodiments described herein. Fig. 4B shows a schematic side view of an evaporation source 20 according to embodiments described herein. The evaporation source 20 shown in fig. 4A and 4B includes a distribution pipe 106. According to embodiments described herein, the distribution pipe 106 may extend in a length direction, which may be perpendicular to the drawn plane of fig. 4A, in particular in a substantially perpendicular direction. One or more outlets 22 may be arranged along the length of the distribution pipe 106. The outlet may be configured as a nozzle. One outlet 22 of the one or more outlets 22 is schematically shown in fig. 4A as the outlet of the distribution pipe 106. As shown in fig. 4A and 4B, the evaporated source material may flow from the interior of the distribution pipe 106 through the outlet to the substrates 10, 11. The outlet is configured to direct a plume 342 of evaporated source material towards the substrates 10, 11. As shown in fig. 4A and 4B, a mask 340 may be disposed between the substrate 10 and the distribution pipe 106.
The evaporation source 20 further comprises a shielding device 200, which may be arranged downstream of the one or more outlets 22. The shielding device 200 may be configured for directing the evaporated source material towards the substrates 10, 11 and for individually shaping the plume of evaporated source material.
The shielding device 200 may be arranged such that the aperture 32 is formed. The orifices may frame (frame) the respective outlets. The apertures 32 are configured to individually shape the plume of vaporized source material emitted from a single associated outlet. To frame the exit opening and/or to form the aperture, the shielding device includes a shielding tape that can be conveyed adjacent the exit opening. The shielding tapes may be joined together. For example, a first shielding strip may pass in a horizontal plane above the outlet, while a second shielding strip may pass in a horizontal plane below the outlet, as described with respect to fig. 2.
According to an embodiment, one movable shielding means portion of the first shielding tape is movable in a horizontal direction above the outlet, indicated by directional arrow 8 in fig. 2. The second movable shielding means portion of the first shielding tape may be positioned in a vertical direction, indicated by directional arrow 7 in fig. 2. The second movable shield portion may be positioned above the horizontally oriented first movable shield portion. At the same time, one shielding device portion of the second shielding tape may be positioned in a horizontal direction below the outlet. The second movable shielding means portion of the second shielding tape may be positioned in a vertical direction. The second movable shielding device portion of the second shielding tape may be positioned on a side of the outlet.
It will be understood by those skilled in the art that when the shielding device is oriented horizontally, the horizontal direction is interchangeable with the vertical direction. Subsequently, the vertical direction becomes the horizontal direction and the horizontal direction becomes the vertical direction. The side position may then be changed to a position above or below the outlet.
In some embodiments, the number of outlets of the evaporation source may correspond to the number of apertures of the shielding device. For example, a shielding device forming ten or more holes may be arranged in front of a distribution pipe having ten or more outlets.
In some embodiments, the apertures may be arranged in front of the associated outlets, as shown in fig. 4A and 4B. For example, the main emission direction X of the outlet 22 may correspond to a connecting line between the center of the outlet 22 and the center of the hole 32. The aperture 32 may be configured as a passage for the plume 342 surrounded by a shielding band, wherein the shielding band may be configured to block at least a portion of the plume 342 of vaporized source material emitted from the outlet 22. In some embodiments, the shielding tape may be configured to block an outer corner portion of the plume 342 of vaporized source material.
As used herein, an "aperture" may refer to an opening or passage at least partially surrounded by a shielding band configured to shape a single plume of vaporized source material directed therethrough, particularly for limiting a maximum opening angle of the plume and for blocking an outer angular portion of the plume. In some embodiments, the passage may be surrounded, e.g. completely surrounded, by one or more shielding strips in order to shape the plume in two or more cross-sectional planes comprising the main emission direction X of the associated outlet. One or more shielding bands may extend around the main emission direction X of plume 342 in order to circumferentially shape the plume. In some embodiments, the width of one or more shielding strips may extend parallel to the main emission direction X.
In some embodiments, which can be combined with other embodiments herein, the shielding means can be arranged at a close distance from the distribution pipe 106, for example at a distance of 5cm or less or 1cm or less in the main emission direction X. Arranging the apertures at a close distance downstream of the nozzle may be beneficial because individual shaping of the plume is possible even if adjacent ones of the one or more outlets are arranged at a close distance with respect to each other. In some embodiments, the minimum distance between the outlet 22 and the shielding device 200 may be less than 3mm or less than 1mm and/or greater than 0.1 mm.
In some embodiments, the shielding device 200 may be actively or passively cooled. According to an embodiment, the shielding device may be cooled with a heat sink. The heat sink may be arranged such that the shielding means (i.e. the shielding tape) is movable through the heat sink. The heat sink may have a temperature lower than the temperature of the shielding means. Thus, heat may be dissipated from the shielding to the heat sink, causing cooling of the shielding.
According to an embodiment, the shielding means may be cooled by cooling means. The cooling means may comprise pre-cooling and/or in situ cooling. For example, the shielding device may be cooled by a pre-cooling device before the shielding device is arranged at the evaporation source. Additionally or alternatively, the pre-cooling means may comprise cooling means arranged at the unfolded supply for tape. For example, a cooling coil (cooling coil) may be disposed at the deployment feeding device.
According to embodiments described herein, the cooling device may be an in-situ cooling device. The in-situ cooling device may be a heat sink. The heat sink may be arranged adjacent to the shielding means. For example, the heat sink may be arranged at the distribution pipe, where also the shielding means are arranged.
In some embodiments, which can be combined with other embodiments described herein, the one or more masking strips can be configured to block, in the first cross-sectional plane, the plume 342 of vaporized source material having an emission angle relative to the primary emission direction X that is greater than the first maximum emission angle θ.
The drawing plane of fig. 4A shows a first cross-sectional plane. The first cross-sectional plane may comprise the main emission direction X. In some embodiments, the first cross-sectional plane is a horizontal plane and/or a plane extending perpendicular to the length direction of the distribution pipe 106. The shielding 200 of the aperture 32 is configured to block an outer corner portion of the plume 342 of evaporated source material in the first cross-sectional plane such that an opening angle of the emission cone (emission cone) is limited to an angle of 2 θ. In other words, the shielding device 200 blocks portions of the evaporated source material that are emitted through the outlet 22 at emission angles that are greater than the first maximum emission angle θ.
In some embodiments, the first maximum emission angle θ is an angle of 10 ° to 45 °, particularly 20 ° to 30 °, more particularly about 25 °. Thus, the opening angle 2 θ of the emission cone in the first cross-sectional plane may be 20 ° or more and 90 ° or less, in particular about 50 °.
As shown in fig. 4A, the shielding device 200 may have a width T. Specifically, the width is the width of one or more shielding strips. In some embodiments, the width T may have a length between 10mm and 35mm, in particular a length of about 20mm to 25 mm. The "width" of the shielding device 200 may correspond to the projected length of the vector connecting the exit and the front end of the shielding tape in the respective cross-sectional plane in the main emission direction X.
Fig. 4C shows an evaporation source 20 according to embodiments described herein, comprising one or more distribution pipes (e.g., distribution pipe 106A), a second distribution pipe 106B, and a third distribution pipe 106C, each extending adjacent to each other in a length direction, wherein the length direction is perpendicular to the drawing plane of fig. 4C. The evaporation source 20 comprises a plurality of outlets 22, wherein one outlet of each distribution pipe is schematically depicted in fig. 4C as an outlet of the respective distribution pipe. Furthermore, the evaporation source 20 comprises a shielding device 200 comprising a plurality of apertures 32, wherein each aperture of the plurality of apertures 32 is arranged in front of a single associated outlet and is configured to shape a plume of evaporated source material emitted from the respective single associated outlet. According to an embodiment, each of the one or more distribution pipes may be equipped with shielding means.
The main emission direction of the outlet of the distribution pipe 106A may be inclined with respect to the main emission direction of the nozzles of the second distribution pipe 106B and/or the third distribution pipe 106C. For example, the main emission direction may be angled such that the plume of vaporized source material emitted from the distribution pipe 106A may overlap with the plume of vaporized source material emitted from the second distribution pipe 106B and/or from the third distribution pipe 106C. In some embodiments, the distribution pipes are arranged such that the main emission directions of the distribution pipes may substantially intersect on the surface of the substrate. Plumes emitted from different distribution tubes in the cross-sectional plane may be directed to substantially the same area on the substrate.
According to embodiments described herein, each of the distribution pipes 106A, 106B, and 106C may include a shielding device. Alternatively, one or more of the shields may be arranged horizontally, i.e. the unwind supply and the take-up for the tape may be arranged in a horizontal plane, rather than a vertical plane as depicted in fig. 2. When arranged in a horizontal plane, the plurality of shielding means may be arranged below each other in the respective plane of the outlet of the distribution pipe. The redirecting means may be arranged laterally in respective vertical planes, which correspond to the vertical planes of the distribution pipe.
In some embodiments, one of the distribution tubes (e.g., distribution tube 106A) may be configured to deposit a primary material and at least one other distribution tube (e.g., second distribution tube 106B) may be configured to deposit a secondary material (e.g., dopant).
According to embodiments described herein, the speed of the shielding device may be different compared to each other. For example, if the primary and secondary materials are deposited, the speed of the masking device (i.e., masking tape) may depend on the chemical composition of the material to be deposited. For example, the speed of the shielding means arranged at the distribution pipe conveying the dopant may be conveyed at a different speed than the shielding means arranged at the distribution pipe conveying the main material. This difference may occur due to the different particles of the primary and secondary materials. As a rule of thumb, the larger the particles, the faster the speed of the shielding means.
Fig. 5A and 5B show schematic side views of a redirection device configuration according to embodiments described herein. The redirecting means 220 may comprise one or more guiding means 218 and/or one or more supporting means 219. A shielding tape may be arranged around the redirection means 220 such that the guiding means 218 and/or the supporting means 219 are prevented from coming into contact with the evaporated source material.
According to an embodiment and with respect to fig. 5A, the guiding means 218 may be arranged with two supporting means 219. The support means may be arranged laterally and/or below the guide means. A rotatable guide 218 and a support 219. Rotation may occur as the shield tape moves. For example, the support means may rotate in a counter-clockwise direction and the guide means may rotate in a clockwise direction, or vice versa.
According to an embodiment, the redirecting means (i.e. the guiding means and/or the supporting means) may be configured as a cylindrical body, e.g. a roller. The redirecting means may have a diameter of 1 to 30mm, particularly a diameter of 3 to 20mm and more particularly a diameter of 5-15 mm. Typically, the guide means may comprise a larger dimension than the support means.
According to an embodiment and with respect to fig. 5B, the redirection means 220 may comprise four support means 219. A shielding tape may be arranged around the support 219 so as to prevent the support from contacting the evaporated source material. The support device may be rotated in a clockwise direction and/or a counter-clockwise direction. The support means may be arranged side by side and/or on top of each other.
Advantageously, the shielding comprising a movable shielding part results in an uninterrupted, prolonged deposition process, since it is superfluous to remove debris material adhering to the shielding. Furthermore, the lifetime of the shielding is improved and may be adjusted depending on the process in which the system is operated. For example, the length of the masking strip may be adjusted depending on the respective process settings that affect the age of the respective masking strip.
Fig. 6 shows a flow chart illustrating a method 600 for shielding evaporated source material released from an evaporation source according to embodiments described herein. The evaporation source comprises one or more outlets. As shown in block 650, the method comprises: during deposition, the first movable shield portion adjacent to the one or more outlets is moved to block the evaporated source material according to an emission angle of the plume of evaporated source material. As shown at block 660, the method further comprises: the first movable shielding means portion is replaced with a second movable shielding means portion. The first and second shield portions may be part of a shield tape. The method may include moving the shielding tape. The method may further comprise moving more than one shield band simultaneously.
According to embodiments described herein, the source material that blocks evaporation may include: the first movable shielding means portion and the second movable shielding means portion collect particles by adsorption or condensation. The collected particles originate from a plume of deposition material released by an evaporation source.
According to embodiments described herein, moving the first moveable shielding portion and replacing the first moveable shielding portion with the second moveable shielding portion may be a continuous process. The first and second moveable shielding portions may be in continuous movement. Advantageously, continuously moving the first and second movable shielding portions may cause better prevention of flaking of material collected by the first and second movable shielding portions, as fewer particles are deposited at the same area of the first and second movable shielding portions.
According to embodiments described herein, the first movable shielding device portion may be stopped from moving and replaced with a second movable shielding device portion. Thus, the first and second moveable shielding portions may remain in position. When held in place, the evaporation source material can be deposited on the substrate. The first and second movable shielding device portions may collect material originating from the evaporated plume and released at an angle different from the opening angle 2 θ. After deposition, for example when the evaporation source is rotated at an idle position to deposit material to another substrate, the moving of the first movable shield portion and the replacement of the first movable shield portion with the second movable shield portion may be restarted. For example, the first and second moveable shielding portions may also be stopped during system maintenance. For example, the stopping and restarting of the movement of the movable shield portion may occur after 10 deposition cycles. One cycle may be considered as depositing the evaporated source material onto two substrates.
According to embodiments described herein, replacing the first movable shielding device portion may include moving the first movable shielding device portion away from the one or more outlets, as indicated by block 670. The second movable shielding means part is movable in the position of the first movable shielding means part. Thus, material collected by the first moveable shielding means portion may be conveyed away from the outlet.
According to embodiments described herein, as shown in block 680, the method further comprises: the vaporized source material is trapped by rolling the first movable shield portion and the second movable shield portion on a take-up for the tape. The trapping may comprise rotating a take-up device. Rotation of the winding device may cause the first shielding device to be partially wound onto the winding device. Thus, the collected material is trapped between a single turn of the coiled first movable shielding device portion.
Additionally or alternatively, and in accordance with embodiments described herein, trapping vaporized source material may include one or more first shielding device portions engaging one or more shielding tapes. Thus, material collected by more than one first shielding means portion may be trapped between more than one shielding tape. Additionally or alternatively, more than one engaged first shield portion may be wound together onto the take-up device.
This written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject matter, including making and using any devices or systems and performing any incorporated methods. Although various specific embodiments have been disclosed above, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if they have the same structural elements as the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.

Claims (16)

1. A shielding (200) for an evaporation source (20), the evaporation source (20) being configured to guide evaporated source material through one or more outlets (22), the shielding (200) comprising:
one or more movable shield portions (205) configured to block evaporated source material according to an emission angle of a plume (342) of evaporated source material from the one or more outlets (22) and configured to be displaced by movement.
2. The shielding (200) according to claim 1, wherein the shielding (200) comprises one or more shielding strips (210) comprising the one or more movable shielding portions (205).
3. The shielding device (200) according to claim 2, wherein the shielding device (200) comprises: an unwind supply (212) for the tape, the unwind supply configured to provide the one or more shielding tapes (210); and a take-up (214) for the tape, the take-up configured to receive the one or more shielding tapes (210).
4. The shielding device (200) according to any one of claims 2 to 3, wherein the one or more shielding strips (210) are made of metal, in particular stainless steel and/or are coated with titanium.
5. The shielding (200) according to any one of claims 3 to 4, wherein the unwinding supply (212) for the tape and/or the take-up (214) for the tape are driven by an actuator (216).
6. The shielding (200) according to any of claims 1 to 5, wherein the movement is a movement of the one or more movable shielding portions (205) from the unwind supplying device (212) for the tape towards the direction of the take-up device (214) for the tape.
7. A shielding (200) for an evaporation source (20), the evaporation source (20) being configured to guide evaporated source material through one or more outlets (22), the shielding (200) comprising:
a movable shielding strip (210) providing one or more movable shielding portions (205) configured to block evaporated source material according to an emission angle of a plume of the evaporation source material;
-an unwinding supply (212) for said band; and
a take-up device (214) for the strip.
8. The shielding (200) according to any one of claims 1 to 7, wherein the one or more shielding portions (205) comprise a first shielding portion provided adjacent to an outlet (22) of the one or more outlets (22) and a second shielding portion provided remote from the outlet (22), the second shielding portion being movable adjacent to the outlet (22) when the first portion is moved away from the outlet (22).
9. The shielding (200) according to any one of claims 1 to 8, wherein the shielding (200) is cooled with a cooling device.
10. The shielding (200) according to any one of claims 1 to 9, wherein the shielding (200) has a first temperature and the evaporated source material has a second temperature, the first temperature being lower than the second temperature.
11. The shielding (200) according to any one of claims 1 to 10, wherein the shielding (200) is configured to collect evaporated source material particles by adsorption and/or condensation at one or more surfaces of the shielding (200).
12. An evaporation source (20) for depositing evaporated source material on a substrate (10, 11), the evaporation source comprising:
the shielding (200) according to any one of claims 1 to 10.
13. The evaporation source (20) according to claim 12, wherein the evaporation source (20) comprises one or more distribution pipes (106), each of the one or more distribution pipes (106) being equipped with a shielding device (200).
14. A method (600) of shielding evaporated source material released from an evaporation source (20), the evaporation source (20) comprising one or more outlets (22), the method comprising:
moving a first movable shield portion (205) adjacent to the one or more outlets (22) to block the evaporated source material according to an emission angle of a plume of the evaporated source material during deposition; and
-replacing said first movable shielding means part (205) with a second movable shielding means part (205).
15. The method (600) of claim 14, wherein replacing the first movable shielding device portion (205) comprises:
moving the first movable shielding means portion (205) away from the one or more outlets (22).
16. The method (600) of any of claims 14-15, further comprising:
-trapping evaporated source material by rolling up the first movable shielding means portion (205) and the second movable shielding means portion (205) on a rolling-up device (214).
CN201880093054.3A 2018-08-03 2018-08-03 Evaporation source for depositing evaporated source material, method for shielding evaporated source material and shielding device for evaporation source Pending CN112135920A (en)

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CN112210757B (en) * 2020-09-23 2022-10-25 铜陵市超越电子有限公司 Belt type isolation device for metallized film evaporation

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