CN112134623A

CN112134623A - Link design capable of realizing high-speed signal transmission and low loss

Info

Publication number: CN112134623A
Application number: CN202011012953.1A
Authority: CN
Inventors: 刘青山
Original assignee: Beijing Anshi Technology Co ltd
Current assignee: Beijing Anshi Technology Co ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2020-12-25

Abstract

The invention provides a link design which can realize high-speed signal transmission and has low loss. The design includes: and a metal block disposed at the bottom of the ceramic substrate transmission line for soldering the pin needle and protruding into the ceramic substrate. The link design capable of realizing high-speed signal transmission and low loss provided by the invention can effectively realize high-speed transmission up to 50Gbps and overcome the problem of high-speed signal transmission deterioration.

Description

Link design capable of realizing high-speed signal transmission and low loss

Technical Field

The invention relates to the technical field of radio frequency, in particular to a low-loss link design capable of realizing high-speed signal transmission.

Background

Currently, the requirements for the speed of the optical transceiver module of the core component of the fifth generation communication network 5G are increasing under the push of the requirements of wireless forwarding and ultra-large broadband data centers. In the aspect of 5G wireless forward transmission, a 25Gbps optical module becomes the mainstream, and the market demand is huge. In addition, the use of high-speed optical modules in data centers is more extensive.

Common package types of optical devices include TO packages, Box packages, and the like. The TO package (as shown in FIG. 1) has simple process and low cost, is the mainstream packaging form of the past optical module, but cannot be applied TO the high-speed and ultra-high-speed optical module. The Box package adopts the ceramic tube seat 13, and assembles optical chip, electric chip and optical device, etc. among them, can realize high-speed encapsulation, but its cost is extremely high, is 5-10 times of TO price, and the packaging technology requires extremely high.

The TO packaging manufacturing process is simple, the cost is extremely low, but the TO packaging manufacturing process can only be applied TO a low-speed optical module with the speed of 10G or less, because the special structure of the TO causes that a high-speed link between an internal laser chip 11 and an external circuit Driver is too long and has a complex path, the whole link routing is positioned in a PCB hard board 21, an FPC soft board 22 and a TO tube seat 23 (shown in figure 2), and high-speed and ultrahigh-speed signals can generate serious signal reflection and loss at the position, so that the performance of the optical module can not meet the index requirement. In a high-speed TO package, the laser chip 11 is soldered TO a high-speed ceramic substrate 12, the ceramic substrate is then assembled TO a TO stem and electrically interconnected, and finally the lens, cap 14, etc. are assembled TO form a TO device.

The electrical interconnection between the high-speed ceramic substrate 12 and the TO socket 13 is one of the most important reasons for the deterioration of ultra-high-speed signal transmission, and most of the current packages are TO lead the wiring of the ceramic substrate 32 TO the pin 33 of the socket by wire bonding (as shown in fig. 3), but the wire bonding has high impedance, so that the high-speed signal has very strong impedance mutation when passing through, which causes great signal loss, and may also bring about the resonance problem with destructive influence. In the aspect of high-speed packaging, the ceramic substrate 42 and the pin 43 are gradually interconnected by means of solder (as shown in fig. 4), although this scheme reduces signal loss compared with wire bonding interconnection, the transmission modes of high-speed signals in the ceramic substrate 42 and the pin 43 are different, and there is still a significant problem of impedance jump, the rate of passing radio frequency signals cannot be too high, which is a key technical bottleneck that TO packaging cannot be applied TO high speed and ultra high speed.

Disclosure of Invention

The technical problem to be solved by the invention is to provide a link design which can realize high-speed signal transmission and has low loss, can effectively realize high-speed transmission of 50Gbps, and overcomes the problem of high-speed signal transmission deterioration.

In order to solve the above technical problem, the present invention provides a ceramic substrate transmission line, including: and a metal block disposed at the bottom of the ceramic substrate transmission line for soldering the pin needle and protruding into the ceramic substrate.

In some embodiments, the pin pins are disposed on the TO header.

In some embodiments, the ceramic substrate is vertically disposed on the TO header.

In some embodiments, the metal block bottom edge is flush with the signal line bottom edge.

In some embodiments, the metal block width is 20-30% of the signal line width.

In some embodiments, the metal block length ranges from 200 um to 300 um.

In addition, the present invention also provides a ceramic substrate including: a ceramic substrate transmission line according to the preceding.

After adopting such design, the invention has at least the following advantages:

1. the invention can effectively realize high-speed transmission of 50Gbps, which is the first guideline in the industry;

2. the invention has unique design and simple manufacture, and only needs to be designed on the ceramic substrate;

3. the invention effectively solves the technical problem of resonance in a specific frequency band;

4. the invention can be applied TO various TO forms, such as 4pin and 5pinTO, TO38 and TO 56;

5. the invention can abandon the expensive box packaging form, and greatly reduce the cost of the ultra-high speed optical device.

Drawings

The foregoing is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description.

FIG. 1 is a schematic diagram of a TO package provided by the prior art;

fig. 2 is a schematic structural diagram of a link trace provided in the prior art;

FIG. 3 is a schematic structural diagram of a pin of a socket for guiding a trace of a ceramic substrate to the socket by wire bonding according to the prior art;

fig. 4 is a schematic structural diagram of interconnection between a ceramic substrate and a pin needle by means of solder welding in the prior art;

fig. 5 is a schematic structural diagram of a transmission line design of a ceramic substrate according to an embodiment of the present invention.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

As shown in fig. 5, in the ceramic substrate transmission provided in the embodiment of the present invention, a metal block 52 is projected and designed to the inside of the ceramic substrate at a position close to the bottom edge of the transmission line 51. The bottom edge of the metal block 52 is flush with the bottom edge of the signal line. The width of the metal block 52 is 20-30% of the width of the signal line. In addition, the length of the metal block 52 ranges from 200 um to 300 um.

Since the transmission lines 51 are disposed along both side edges of the ceramic substrate, typically, metal blocks are disposed inside both side transmission lines 51.

After the metal block 52 is added to the transmission line 51, the high-speed signal transmission performance of the transmission line 51 is greatly improved, and the transmission loss is greatly reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention in any way, and it will be apparent to those skilled in the art that the above description of the present invention can be applied to various modifications, equivalent variations or modifications without departing from the spirit and scope of the present invention.

Claims

1. A ceramic substrate transmission line, comprising:

and a metal block disposed at the bottom of the ceramic substrate transmission line for soldering the pin needle and protruding into the ceramic substrate.

2. The ceramic substrate transmission line of claim 1, wherein the pin pins are disposed on the TO header.

3. The ceramic substrate transmission line according TO claim 2, wherein the ceramic substrate is vertically disposed on the TO socket.

4. The ceramic substrate transmission line of claim 1, wherein the metal block bottom edge is flush with the signal line bottom edge.

5. The ceramic substrate transmission line of claim 1, wherein the metal block width is 20-30% of the signal line width.

6. The ceramic substrate transmission line as claimed in claim 1, wherein the metal block length is in the range of 200-300 μm.

7. A ceramic substrate, comprising: the ceramic substrate transmission line according to any one of claims 1 to 6.