CN112126006A - Hydrofluoric acid-resistant acrylic resin, preparation method thereof, and pressure-sensitive adhesive tape containing acrylic resin - Google Patents
Hydrofluoric acid-resistant acrylic resin, preparation method thereof, and pressure-sensitive adhesive tape containing acrylic resin Download PDFInfo
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- CN112126006A CN112126006A CN202010996262.3A CN202010996262A CN112126006A CN 112126006 A CN112126006 A CN 112126006A CN 202010996262 A CN202010996262 A CN 202010996262A CN 112126006 A CN112126006 A CN 112126006A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2433/00—Presence of (meth)acrylic polymer
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Abstract
The invention relates to the technical field of hydrofluoric acid etching surface protection adhesives, in particular to hydrofluoric acid resistant acrylic resin, a preparation method thereof, and a pressure sensitive adhesive tape containing the acrylic resin. The preparation method of the hydrofluoric acid resistant acrylic resin takes butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate, an initiator A, an initiator B, a solvent A and a solvent B as raw materials, and free radicals of the raw materials are synthesized into the hydrofluoric acid resistant acrylic resin according to the operations of the steps (S1) - (S5), and the preparation method has the advantages of simple operation, convenient control, high production efficiency and low production cost, and can be used for large-scale production; the material is used for manufacturing the pressure-sensitive adhesive, can achieve the hydrofluoric acid resistant effect after being cured, and prevents the protected part from being corroded when the hydrofluoric acid etches part of the surface of the substrate.
Description
Technical Field
The invention relates to the technical field of hydrofluoric acid etching surface protection adhesives, in particular to hydrofluoric acid resistant acrylic resin, a preparation method thereof, and a pressure sensitive adhesive tape containing the acrylic resin.
Background
The polymer commonly used for pressure-sensitive adhesives may be a rubber such as natural rubber, polyisobutylene rubber, butyl rubber, and may also be various resins such as atactic polypropylene, acrylic resin, silicone resin, fluorine resin, etc. Fluorine is an active nonmetal, has strong oxidizing ability, and fluorine ions in hydrofluoric acid have small radius, so that the hydrofluoric acid has strong permeability, a compact oxide film cannot prevent the permeation, and the hydrofluoric acid can strongly corrode metal, glass and silicon-containing base materials.
When hydrofluoric acid is used for etching partial surface of a substrate (such as a glass screen), the existing pressure-sensitive adhesive is difficult to play a good protection role.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide the preparation method of the hydrofluoric acid resistant acrylic resin, which has the advantages of simple operation, convenient control, high production efficiency and low production cost and can be used for large-scale production; the material is used for manufacturing the pressure-sensitive adhesive, can achieve the hydrofluoric acid resistant effect after being cured, and prevents the protected part from being corroded when the hydrofluoric acid etches part of the surface of the substrate.
The second purpose of the invention is to provide a hydrofluoric acid resistant acrylic resin.
The invention also aims to provide the pressure-sensitive adhesive resistant to hydrofluoric acid.
The fourth purpose of the invention is to provide a pressure-sensitive adhesive tape which is resistant to hydrofluoric acid and easy to remove adhesive.
One of the purposes of the invention is realized by the following technical scheme: a preparation method of hydrofluoric acid resistant acrylic resin comprises the following steps:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 60-80 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 90-95 ℃ for reaction for 7-14min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 92-96 ℃ for 1-3h to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 1-3h at the temperature of 75-80 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid resistant acrylic resin.
Preferably, in the preparation method of the hydrofluoric acid resistant acrylic resin, the weight parts of the components are as follows:
preferably, the ratio of the amount of the initiator a in parts by weight in the step (S1) to the amount of the initiator a in parts by weight in the step (S3) is 1.5 to 2.0: 10; the ratio of the amount of the solvent A in the step (S1) in parts by weight, the amount of the solvent A in the step (S2) in parts by weight, the amount of the solvent A in the step (S3) in parts by weight, the amount of the solvent A in the step (S4) in parts by weight, and the amount of the solvent A in the step (S5) in parts by weight is 3-4: 55-58: 20-23: 2.5-3.5: 12-16; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 5.5-6.5.
Preferably, the initiator A is benzoyl peroxide or lauroyl peroxide, the initiator B is azobisisobutyronitrile or dimethyl azobisisobutyrate, the solvent A is ethyl acetate and/or isobutyl acetate, and the solvent B is toluene or xylene.
Preferably, in the step (S3), the remaining initiator a is added to the remaining solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2), the dropwise addition time is 1 to 3 hours, and the reflux is maintained during the dropwise addition.
The second purpose of the invention is realized by the following technical scheme: the hydrofluoric acid resistant acrylic resin is prepared by adopting the preparation method of the hydrofluoric acid resistant acrylic resin.
The third purpose of the invention is realized by the following technical scheme: the pressure-sensitive adhesive containing the hydrofluoric acid resistant acrylic resin comprises the following raw materials in parts by weight:
92-100 parts of hydrofluoric acid resistant acrylic resin
1-3 parts of isocyanate curing agent
0.1 to 0.3 portion of organic salt curing agent.
Preferably, the preparation method of the pressure-sensitive adhesive is formed by mixing hydrofluoric acid-resistant acrylic resin, isocyanate curing agent and organic salt curing agent according to parts by weight.
The fourth purpose of the invention is realized by the following technical scheme: the utility model provides a pressure-sensitive adhesive tape comprises in proper order compound release layer, resistant hydrofluoric acid pressure-sensitive adhesive layer and thermal contraction layer, resistant hydrofluoric acid pressure-sensitive adhesive layer is formed by foretell pressure-sensitive adhesive coating thermal cure after leaving the type layer.
Preferably, the preparation method of the pressure-sensitive adhesive tape comprises the following steps: and coating the pressure-sensitive adhesive on one surface of the release layer, curing at the temperature of 100-120 ℃ for 3-5min, and transferring and coating the pressure-sensitive adhesive on one surface of the thermal shrinkage layer to obtain the pressure-sensitive adhesive tape.
The invention has the beneficial effects that: according to the preparation method of the hydrofluoric acid resistant acrylic resin, butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate, an initiator A, an initiator B, a solvent A and a solvent B are used as raw materials, and the raw materials are subjected to free radical synthesis to obtain the hydrofluoric acid resistant acrylic resin according to the operations of the steps (S1) - (S5), so that the preparation method is simple to operate, convenient to control, high in production efficiency and low in production cost, and can be used for large-scale production; the material is used for manufacturing the pressure-sensitive adhesive, can achieve the hydrofluoric acid resistant effect after being cured, and prevents the protected part from being corroded when the hydrofluoric acid etches part of the surface of the substrate.
The hydrofluoric acid resistant acrylic resin disclosed by the invention can play a hydrofluoric acid resistant effect after being cured when being used for manufacturing a pressure sensitive adhesive, and prevents a protected part from being corroded when hydrofluoric acid is used for etching part of the surface of a substrate.
According to the pressure-sensitive adhesive, hydrofluoric acid-resistant acrylic resin is mixed with a curing agent with a specific dosage, a compact coating is formed after curing, the hydrophobicity of the coating is increased by the hydrophobic groups of butyl acrylate and isooctyl acrylate, the permeation and corrosion of hydrofluoric acid are slowed down and even prevented, the acrylic acid endows the adhesive layer with a larger stripping force, and the adhesive layer is attached to a base material more tightly.
When the pressure-sensitive adhesive tape is used, the release layer is torn off, the other surface of the hydrofluoric acid resistant pressure-sensitive adhesive layer is attached to the surface of the base material, the protection effect can be achieved, the situation that the protected part is still corroded when hydrofluoric acid etches part of the surface of the base material is avoided, the pressure-sensitive adhesive tape is cleaned after etching is finished, the thermal shrinkage layer is shrunk at 80-100 ℃ to drive the hydrofluoric acid resistant pressure-sensitive adhesive layer to shrink together, and therefore the adhesive tape is removed without residual adhesive.
Drawings
FIG. 1 is a schematic structural view of the present invention;
the reference signs are: 1. a release layer; 2. a hydrofluoric acid resistant pressure sensitive adhesive layer; 3. a heat-shrinkable layer.
Detailed Description
For the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention.
In an exemplary embodiment of the present application, there is provided a method for preparing a hydrofluoric acid resistant acrylic resin, including the steps of:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 60-80 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 90-95 ℃ for reaction for 7-14min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 92-96 ℃ for 1-3h to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 1-3h at the temperature of 75-80 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid resistant acrylic resin.
The preparation method of the hydrofluoric acid resistant acrylic resin takes butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate, an initiator A, an initiator B, a solvent A and a solvent B as raw materials, and free radicals of the raw materials are synthesized into the hydrofluoric acid resistant acrylic resin according to the operations of the steps (S1) - (S5), and the preparation method has the advantages of simple operation, convenient control, high production efficiency and low production cost, and can be used for large-scale production; the material is used for manufacturing the pressure-sensitive adhesive, can achieve the hydrofluoric acid resistant effect after being cured, and prevents the protected part from being corroded when the hydrofluoric acid etches part of the surface of the substrate. Wherein, the dilution initiator A is prepared in advance in the step (S1), the monomer reaction is initiated in the step (S2), after the free radical polymerization is carried out in the step (S3), the dilution initiator B is added in the step (S5) for further polymerization, so that the colorless to light yellow solvent type acrylic resin is formed, the compactness and the hydrophobicity of the acrylic resin are improved, and the permeation and the corrosion of hydrofluoric acid are slowed down or even prevented.
In one embodiment, in the preparation method of the acrylic resin, the weight parts of the components are as follows:
according to the technical scheme, butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid and hydroxyethyl acrylate are used as free radical polymerization raw materials, free radical polymerization is carried out in a solvent A and a solvent B by means of an initiator A and an initiator B to form hydrofluoric acid resistant acrylic resin, wherein the acrylic acid and the hydroxyethyl acrylate provide cross-linking points for subsequent pressure-sensitive adhesive preparation and endow a larger stripping force to enable the pressure-sensitive adhesive to be tightly attached to a base material, the hydrophobic groups of the butyl acrylate and the isooctyl acrylate increase the hydrophobicity of a coating and can slow down or even prevent permeation and corrosion of hydrofluoric acid, the methyl methacrylate and the hydroxyethyl acrylate act together to improve the stability of a system in the solvent A and the solvent B, and the reaction temperature of each stage is controlled, so that the prepared material has the advantages of more uniform molecular weight distribution, more concentrated particle size distribution, Acrylic resins with more uniform viscosity.
In one embodiment, the ratio of the amount of initiator a parts by weight used in step (S1) to the amount of initiator a parts by weight used in step (S3) is 1.5 to 2.0: 10; the ratio of the amount of the solvent A in the step (S1) in parts by weight, the amount of the solvent A in the step (S2) in parts by weight, the amount of the solvent A in the step (S3) in parts by weight, the amount of the solvent A in the step (S4) in parts by weight, and the amount of the solvent A in the step (S5) in parts by weight is 3-4: 55-58: 20-23: 2.5-3.5: 12-16; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 5.5-6.5.
By adopting the technical scheme, the specific addition of the initiator A in the step (S1) and the step (S3) is controlled, the reaction intensity of the system is controlled, and the acrylic resin is prevented from exploding and polymerizing in the initiation reaction stage, so that the hydrofluoric acid resistant effect and the bonding effect of the acrylic resin are greatly reduced, and the acrylic resin is prevented from being scrapped. The specific dosage of the solvent A in each step is controlled, the compatibility and the reaction stability of the system are improved, and the scrapping caused by the explosion polymerization of the solvent A in the reaction initiation stage and the free radical polymerization stage, which greatly reduces the hydrofluoric acid resistant effect and the bonding effect of the acrylic resin, is avoided. Controlling the specific adding amount of the solvent B in the step (S1) and the step (S3) to be synergistic with the solvent A in the system, promoting the dissolving capacity of the solvent, and improving the dispersion uniformity and the reaction stability of the system.
In one embodiment, the initiator a is benzoyl peroxide or lauroyl peroxide, the initiator B is azobisisobutyronitrile or dimethyl azobisisobutyrate, the solvent a is ethyl acetate and/or isobutyl acetate, and the solvent B is toluene or xylene.
By adopting the technical scheme, in the reaction process, the initiator A is used for initiating the free radical polymerization at a specific temperature, the hydrophilic capacity of the monomer is mainly reduced aiming at the hydroxyl and carboxyl in the monomer, and then the initiator B is used for initiating the free radical polymerization, so that the residual quantity of the monomer is reduced, the reaction conversion rate of the monomer is improved, and the compactness of the monomer is improved. The solvent A and the solvent B are adopted, and the addition amount of the solvent A and the solvent B in each step is controlled, so that the dissolution and dispersion of the system are promoted, and the stability of the system is maintained.
In one embodiment, in the step (S3), the rest of the initiator a is added to the rest of the solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2), the dropwise adding time is 1-3h, and the reflux is maintained during the dropwise adding process.
By adopting the technical scheme, the phenomenon that the acrylic resin is scrapped due to implosion in the reaction process is avoided, and the reflux is maintained so as to avoid the increase of the production cost and the reduction of the yield of the acrylic resin due to the volatilization of reaction raw materials and solvents.
In another exemplary embodiment of the present application, a hydrofluoric acid resistant acrylic resin is provided, which is prepared by the above method for preparing a hydrofluoric acid resistant acrylic resin.
In another exemplary embodiment of the present application, there is provided a pressure-sensitive adhesive containing the above hydrofluoric acid resistant acrylic resin, including the following raw materials in parts by weight:
92-100 parts of hydrofluoric acid resistant acrylic resin
1-3 parts of isocyanate curing agent
0.1 to 0.3 portion of organic salt curing agent.
By adopting the technical scheme, under the synergistic effect of the specific dosage of the isocyanate curing agent and the organic salt curing agent, the hydrofluoric acid resistant acrylic resin is promoted to be thermally cured into a compact coating so as to slow down and even prevent the permeation and corrosion of hydrofluoric acid.
In one embodiment, the pressure-sensitive adhesive is prepared by mixing hydrofluoric acid-resistant acrylic resin, an isocyanate curing agent and an organic salt curing agent in parts by weight.
As shown in fig. 1, in another exemplary embodiment of the present application, a pressure-sensitive adhesive tape is provided, which comprises a release layer 1, a hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 and a thermal shrinkage layer 3, which are sequentially combined, wherein the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 is formed by coating the above pressure-sensitive adhesive on the release layer 1 and then thermally curing the coated pressure-sensitive adhesive.
For the traditional pressure-sensitive adhesive tape, even if a few pressure-sensitive adhesive tapes play a hydrofluoric acid resistant role, the pressure-sensitive adhesive tapes are adhered to the surface of a base material and then torn off to form residual adhesive, the residual adhesive needs to be additionally removed through a residual adhesive removing process, the production efficiency is reduced, and the surface of the base material is easily abraded. By adopting the technical scheme, when the adhesive tape is used, the release layer 1 is torn off, the other surface of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is attached to the surface of the substrate, the protective effect can be achieved, the situation that the part of the surface of the substrate is still corroded when hydrofluoric acid is used for etching is avoided, the part is cleaned after etching is finished, the thermal shrinkage layer 3 is shrunk to drive the hydrofluoric acid resistant pressure sensitive adhesive layer 2 to shrink together under the condition of 80-100 ℃, and therefore the adhesive tape is removed and no adhesive residue exists.
In one embodiment, the method for preparing the pressure-sensitive adhesive tape comprises the following steps: and coating the pressure-sensitive adhesive on one surface of the release layer 1, curing at the temperature of 100-120 ℃ for 3-5min, and transferring and coating the pressure-sensitive adhesive on one surface of the thermal shrinkage layer 3 to obtain the pressure-sensitive adhesive tape.
By adopting the technical scheme, one surface of the pressure-sensitive adhesive is adhered to the release layer 1 after being cured at the temperature of 100-120 ℃, and the other surface of the pressure-sensitive adhesive is transferred and coated on the heat shrinkage layer 3, so that the other surface of the pressure-sensitive adhesive is adhered to the heat shrinkage layer 3, and the heat shrinkage layer 3 is prevented from being shrunk and scrapped due to the fact that the heat shrinkage layer 3 and the pressure-sensitive adhesive are treated together at the temperature of 100-120 ℃.
In one embodiment, the release layer 1 is a release film, so as to protect the hydrofluoric acid resistant pressure sensitive adhesive layer 2 before use, and prevent hydrofluoric acid from permeating along a gap during etching due to water or dust of the hydrofluoric acid resistant pressure sensitive adhesive layer 2, thereby reducing hydrofluoric acid resistant effect.
In one embodiment, the heat shrinkable layer 3 is a POF heat shrinkable film, the POF heat shrinkable film is a commercially available heat shrinkable film which shrinks under the condition of 80 ℃ to 100 ℃, and the POF heat shrinkable film is a short term for a biaxially oriented polyolefin shrink film, and is a safe and reliable soft shrinkable film with high transparency, high shrinkage, high toughness, high heat sealing performance, antistatic property, and excellent cold resistance, and is only used herein.
In one embodiment, the thickness of the release layer 1 is 50-100 μm, so that the release layer has enough thickness to protect the hydrofluoric acid resistant pressure sensitive adhesive layer 2 before use, and prevent hydrofluoric acid from permeating along gaps in an etching process due to water or dust of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 to reduce hydrofluoric acid resistant effect. Preferably, the thickness of the release layer 1 is 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 80 μm, 90 μm or 100 μm, and more preferably, the thickness of the release layer 1 is 65 μm.
In one embodiment, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is 10-30 μm, if the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is less than 10 μm, the hydrofluoric acid resistant effect is deteriorated, and if the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is more than 30 μm, the thickness is too thick, the time for resisting hydrofluoric acid is longer, the hydrofluoric acid etching process is excessively completed, waste is caused, and the cost is higher. Preferably, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 25 μm, 28 μm or 30 μm, and more preferably, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is 20 μm.
In one embodiment, the thickness of the thermal contraction layer 3 is 30-60 μm, which ensures that the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is driven to contract during thermal contraction, thereby facilitating adhesive removal. Preferably, the thickness of the heat-shrinkable layer 3 is 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 45 μm, 48 μm, 50 μm, 55 μm, 58 μm or 60 μm, and more preferably, the thickness of the heat-shrinkable layer 3 is 40 μm.
Example 1
As shown in fig. 1, the pressure-sensitive adhesive tape comprises a release layer 1, a hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 and a thermal shrinkage layer 3 which are sequentially compounded, wherein the hydrofluoric acid-resistant pressure-sensitive adhesive layer 2 is formed by coating a pressure-sensitive adhesive containing hydrofluoric acid-resistant acrylic resin on the release layer 1 and then thermally curing.
The preparation method of the pressure-sensitive adhesive tape comprises the following steps: and coating the pressure-sensitive adhesive on one surface of the release layer 1, curing at 110 ℃ for 4min, and transferring and coating the pressure-sensitive adhesive on one surface of the thermal shrinkage layer 3 to obtain the pressure-sensitive adhesive tape.
The release layer 1 is a release film, the thermal contraction layer 3 is a POF thermal contraction film, the thickness of the release layer 1 is 80 micrometers, the thickness of the hydrofluoric acid resistant pressure sensitive adhesive layer 2 is 20 micrometers, and the thickness of the thermal contraction layer 3 is 40 micrometers.
Example 2
This example differs from example 1 in that:
a pressure-sensitive adhesive containing hydrofluoric acid resistant acrylic resin comprises the following raw materials in parts by weight:
96 parts of hydrofluoric acid resistant acrylic resin
Isocyanate curing agent 2.0 parts
0.2 part of organic salt curing agent.
The preparation method of the pressure-sensitive adhesive is formed by mixing hydrofluoric acid resistant acrylic resin, isocyanate curing agent L-75 and organic salt curing agent aluminum acetylacetonate according to parts by weight.
The preparation method of each part of the hydrofluoric acid resistant acrylic resin comprises the following steps:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 70 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 92 ℃ for reaction for 10min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 94 ℃ for 2 hours to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 2 hours at 78 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid-resistant acrylic resin.
In the preparation method of the hydrofluoric acid resistant acrylic resin, the weight parts of the components are as follows:
the ratio of the amount of the initiator A in parts by weight in the step (S1) to the amount of the initiator A in parts by weight in the step (S3) is 1.8: 10; the ratio of the amount of solvent A in parts by weight in step (S1), the amount of solvent A in parts by weight in step (S2), the amount of solvent A in parts by weight in step (S3), the amount of solvent A in parts by weight in step (S4) to the amount of solvent A in parts by weight in step (S5) is 3.5: 56: 22: 3.0: 14; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 6.0.
the initiator A is benzoyl peroxide, the initiator B is azobisisobutyronitrile, the solvent A is ethyl acetate, and the solvent B is toluene.
In the step (S3), the remaining initiator a was added to the remaining solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2) over 2 hours, and the reflux was maintained during the addition.
Example 3
This example differs from example 1 in that:
a pressure-sensitive adhesive containing hydrofluoric acid resistant acrylic resin comprises the following raw materials in parts by weight:
hydrofluoric acid resistant acrylic resin 92 parts
0.1 part of organic salt curing agent.
The preparation method of the pressure-sensitive adhesive is formed by mixing hydrofluoric acid resistant acrylic resin, isocyanate curing agent L-75 and organic salt curing agent aluminum acetylacetonate according to parts by weight.
The preparation method of each part of the hydrofluoric acid resistant acrylic resin comprises the following steps:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 60 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 90 ℃ for reaction for 14min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 92 ℃ for 3 hours to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 3 hours at the temperature of 75 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid resistant acrylic resin.
In the preparation method of the hydrofluoric acid resistant acrylic resin, the weight parts of the components are as follows:
the ratio of the amount of the initiator A in parts by weight in the step (S1) to the amount of the initiator A in parts by weight in the step (S3) is 1.5: 10; the ratio of the amount of the solvent A used in the step (S1) in parts by weight, the amount of the solvent A used in the step (S2) in parts by weight, the amount of the solvent A used in the step (S3) in parts by weight, the amount of the solvent A used in the step (S4) in parts by weight, and the amount of the solvent A used in the step (S5) in parts by weight is 3: 55: 20: 2.5: 12; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 5.5.
the initiator A is lauroyl peroxide, the initiator B is dimethyl azodiisobutyrate, the solvent A is isobutyl acetate, and the solvent B is xylene.
In the step (S3), the remaining initiator a was added to the remaining solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2) over a period of 3 hours, with the addition being maintained at reflux.
Example 4
This example differs from example 1 in that:
a pressure-sensitive adhesive containing hydrofluoric acid resistant acrylic resin comprises the following raw materials in parts by weight:
100 parts of hydrofluoric acid resistant acrylic resin
0.3 part of organic salt curing agent.
The preparation method of the pressure-sensitive adhesive is formed by mixing hydrofluoric acid resistant acrylic resin, isocyanate curing agent L-75 and organic salt curing agent aluminum acetylacetonate according to parts by weight.
The preparation method of each part of the hydrofluoric acid resistant acrylic resin comprises the following steps:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 80 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 95 ℃ for reaction for 7min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 96 ℃ for 1h to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 1h at the temperature of 80 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid resistant acrylic resin.
In the preparation method of the hydrofluoric acid resistant acrylic resin, the weight parts of the components are as follows:
the ratio of the amount of the initiator A in parts by weight in the step (S1) to the amount of the initiator A in parts by weight in the step (S3) is 2.0: 10; the ratio of the amount of solvent A in parts by weight in step (S1), the amount of solvent A in parts by weight in step (S2), the amount of solvent A in parts by weight in step (S3), the amount of solvent A in parts by weight in step (S4) to the amount of solvent A in parts by weight in step (S5) is 4: 58: 23: 3.5: 16; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 6.5.
the initiator A is benzoyl peroxide, the initiator B is azobisisobutyronitrile, and the solvent A is ethyl acetate and isobutyl acetate according to a weight ratio of 8: 3, and the solvent B is toluene.
In the step (S3), the remaining initiator a was added to the remaining solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2) over 1 hour, and the reflux was maintained during the addition.
Example 5
This example differs from example 1 in that:
a pressure-sensitive adhesive containing hydrofluoric acid resistant acrylic resin comprises the following raw materials in parts by weight:
98 parts of hydrofluoric acid resistant acrylic resin
Isocyanate curing agent 1.5 parts
0.25 part of organic salt curing agent.
The preparation method of the pressure-sensitive adhesive is formed by mixing hydrofluoric acid resistant acrylic resin, isocyanate curing agent L-75 and organic salt curing agent aluminum acetylacetonate according to parts by weight.
The preparation method of each part of the hydrofluoric acid resistant acrylic resin comprises the following steps:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 75 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 92 ℃ for reaction for 12min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 93 ℃ for 1.5h to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 2.2 hours at the temperature of 77 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid resistant acrylic resin.
In the preparation method of the hydrofluoric acid resistant acrylic resin, the weight parts of the components are as follows:
the ratio of the amount of the initiator A in parts by weight in the step (S1) to the amount of the initiator A in parts by weight in the step (S3) is 1.7: 10; the ratio of the amount of solvent A in parts by weight in step (S1), the amount of solvent A in parts by weight in step (S2), the amount of solvent A in parts by weight in step (S3), the amount of solvent A in parts by weight in step (S4) to the amount of solvent A in parts by weight in step (S5) is 3.2: 56: 21: 2.8: 13; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 5.8.
the initiator A is benzoyl peroxide, the initiator B is azobisisobutyronitrile, the solvent A is ethyl acetate, and the solvent B is toluene.
In the step (S3), the remaining initiator a was added to the remaining solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2) over 1.2 hours while maintaining reflux during the addition.
Comparative example 1
This comparative example differs from example 2 in that:
the pressure-sensitive adhesive containing the hydrofluoric acid resistant acrylic resin does not contain an isocyanate curing agent, and the weight part and the using amount of the organic salt curing agent are 2.2 parts.
Comparative example 2
This comparative example differs from example 2 in that:
the pressure-sensitive adhesive containing the hydrofluoric acid resistant acrylic resin does not contain an organic salt curing agent.
Comparative example 3
This comparative example differs from example 2 in that:
in the step (S4), the initiator B is replaced by the initiator a, and the amounts used are the same.
Comparative example 4
This comparative example differs from example 2 in that:
in the steps (S1) and (S3), the solvent B is replaced with the solvent a in the same amount.
Comparative example 5
This comparative example differs from example 2 in that:
the hydrofluoric acid resistant acrylic resin does not contain butyl acrylate.
Comparative example 6
This comparative example differs from example 2 in that:
the hydrofluoric acid resistant acrylic resin does not contain hydroxyethyl acrylate.
Example 6
The pressure-sensitive adhesive tapes of examples 2 to 5 and comparative examples 1 to 6 were subjected to peel strength, hydrofluoric acid resistance and residual adhesive test, respectively, as follows:
and (3) testing the peel strength: according to the test method of the peeling strength of the adhesive tape of GB/T2792-2014, the 180-degree peeling strength between the pressure-sensitive adhesive layer and the heat shrinkable layer is tested by adopting the method 2.
Testing the hydrofluoric acid resistance: taking a glass plate with the thickness of 1mm, attaching a pressure-sensitive adhesive tape to one half of the glass plate to serve as an experimental group, and taking the other half of the glass plate to serve as a blank control group to finish sample preparation; then, the sample was treated with 9 wt% hydrofluoric acid at 35 ℃ for 1 hour, and then cleaned and the thickness of the glass plate was measured to calculate the difference in thickness.
Testing residual glue: a pressure-sensitive adhesive tape with the width of 1 inch and the length of 180mm is attached to the surface of a glass plate, the glass plate is placed in constant-temperature and constant-humidity equipment with the temperature of 30 ℃ and the RH of 50 percent, the glass plate is kept stand for 24 hours, then the glass plate is taken out and heated to 85 ℃, the pressure-sensitive adhesive tape is torn off after cooling, and whether the glass plate has residual adhesive or not is observed.
The test results are shown in table 1 below:
TABLE 1
As can be seen from the above Table 1, the peel strength between the pressure-sensitive adhesive and the POF shrink film of the present application reaches 525-. In addition, the pressure sensitive adhesive tape has obvious preference in hydrofluoric acid resistant effect.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.
Claims (10)
1. The preparation method of the hydrofluoric acid resistant acrylic resin is characterized by comprising the following steps:
(S1) uniformly mixing a part of the initiator A, a part of the solvent A and a part of the solvent B to obtain a diluted initiator A;
(S2) mixing butyl acrylate, isooctyl acrylate, methyl methacrylate, acrylic acid, hydroxyethyl acrylate and a part of solvent A, heating to 60-80 ℃ under the condition of continuous stirring, then adding the diluted initiator obtained in the step (S1) under the condition of introducing nitrogen gas for protection, and continuously heating to 90-95 ℃ for reaction for 7-14min to obtain a prepolymer;
(S3) adding the residual initiator A into the residual solvent B, mixing, adding into the prepolymer obtained in the step (S2), adding a part of the solvent A, uniformly mixing, and keeping the temperature at 92-96 ℃ for 1-3h to obtain a reactant;
(S4), adding an initiator B into a part of the solvent A, and mixing to obtain a diluted initiator B;
(S5) adding the diluted initiator B obtained in the step (S4) into the reactant obtained in the step (S3), preserving the heat for 1-3h at the temperature of 75-80 ℃, adding the residual solvent A, cooling to below 50 ℃, and then removing the nitrogen protection to obtain the hydrofluoric acid resistant acrylic resin.
2. The method for preparing acrylic resin resistant to hydrofluoric acid according to claim 1, wherein: in the preparation method of the hydrofluoric acid resistant acrylic resin, the weight parts of the components are as follows:
3. the method for preparing acrylic resin resistant to hydrofluoric acid according to claim 2, wherein: the ratio of the used amount of the initiator A in the step (S1) to the used amount of the initiator A in the step (S3) is 1.5-2.0: 10; the ratio of the amount of the solvent A in the step (S1) in parts by weight, the amount of the solvent A in the step (S2) in parts by weight, the amount of the solvent A in the step (S3) in parts by weight, the amount of the solvent A in the step (S4) in parts by weight, and the amount of the solvent A in the step (S5) in parts by weight is 3-4: 55-58: 20-23: 2.5-3.5: 12-16; the ratio of the amount of the solvent B in the step (S1) to the amount of the solvent B in the step (S3) in parts by weight is 1: 5.5-6.5.
4. The method for preparing acrylic resin resistant to hydrofluoric acid according to claim 1, wherein: the initiator A is benzoyl peroxide or lauroyl peroxide, the initiator B is azobisisobutyronitrile or dimethyl azobisisobutyrate, the solvent A is ethyl acetate and/or isobutyl acetate, and the solvent B is toluene or xylene.
5. The method for preparing acrylic resin resistant to hydrofluoric acid according to claim 1, wherein: in the step (S3), the remaining initiator a is added to the remaining solvent B, mixed and added dropwise to the prepolymer obtained in the step (S2), the dropwise addition time is 1 to 3 hours, and the reflux is maintained during the dropwise addition.
6. A hydrofluoric acid resistant acrylic resin characterized by: the acrylic resin is prepared by the method for preparing the acrylic resin which is resistant to hydrofluoric acid according to any one of claims 1 to 5.
7. A pressure-sensitive adhesive comprising the hydrofluoric acid resistant acrylic resin of claim 6, wherein: the feed comprises the following raw materials in parts by weight:
92-100 parts of hydrofluoric acid resistant acrylic resin
1-3 parts of isocyanate curing agent
0.1 to 0.3 portion of organic salt curing agent.
8. The pressure-sensitive adhesive of claim 7, wherein: the preparation method of the pressure-sensitive adhesive is formed by mixing hydrofluoric acid-resistant acrylic resin, isocyanate curing agent and organic salt curing agent according to parts by weight.
9. A pressure-sensitive adhesive tape characterized in that: the hydrofluoric acid resistant pressure-sensitive adhesive layer is formed by coating the pressure-sensitive adhesive of claim 7 or 8 on a release layer and then thermally curing.
10. A pressure-sensitive adhesive tape according to claim 9, wherein: the preparation method of the pressure-sensitive adhesive tape comprises the following steps: and coating the pressure-sensitive adhesive on one surface of the release layer, curing at the temperature of 100-120 ℃ for 3-5min, and transferring and coating the pressure-sensitive adhesive on one surface of the thermal shrinkage layer to obtain the pressure-sensitive adhesive tape.
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| CN113480688A (en) * | 2021-07-20 | 2021-10-08 | 东莞澳中新材料科技股份有限公司 | Solvent type acrylic resin and application thereof in battery wrapping pressure-sensitive adhesive tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105111810A (en) * | 2015-09-10 | 2015-12-02 | 深圳市美信电子有限公司 | Heat-shrinkage adhesive tape and preparation method thereof |
| CN106749874A (en) * | 2016-12-27 | 2017-05-31 | 无锡海特新材料研究院有限公司 | Controllable pressure sensitive adhesive of a kind of peeling force and preparation method thereof |
| CN110776592A (en) * | 2019-10-16 | 2020-02-11 | 太仓斯迪克新材料科技有限公司 | Adhesive and preparation method thereof, pressure-sensitive adhesive tape and preparation method thereof |
| CN111440573A (en) * | 2019-09-26 | 2020-07-24 | 宁波激智创新材料研究院有限公司 | Formula of pressure-sensitive adhesive, pressure-sensitive adhesive glue, pressure-sensitive adhesive coating liquid and adhesive tape |
-
2020
- 2020-09-21 CN CN202010996262.3A patent/CN112126006B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105111810A (en) * | 2015-09-10 | 2015-12-02 | 深圳市美信电子有限公司 | Heat-shrinkage adhesive tape and preparation method thereof |
| CN106749874A (en) * | 2016-12-27 | 2017-05-31 | 无锡海特新材料研究院有限公司 | Controllable pressure sensitive adhesive of a kind of peeling force and preparation method thereof |
| CN111440573A (en) * | 2019-09-26 | 2020-07-24 | 宁波激智创新材料研究院有限公司 | Formula of pressure-sensitive adhesive, pressure-sensitive adhesive glue, pressure-sensitive adhesive coating liquid and adhesive tape |
| CN110776592A (en) * | 2019-10-16 | 2020-02-11 | 太仓斯迪克新材料科技有限公司 | Adhesive and preparation method thereof, pressure-sensitive adhesive tape and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113480688A (en) * | 2021-07-20 | 2021-10-08 | 东莞澳中新材料科技股份有限公司 | Solvent type acrylic resin and application thereof in battery wrapping pressure-sensitive adhesive tape |
| CN113480688B (en) * | 2021-07-20 | 2024-04-12 | 东莞澳中新材料科技股份有限公司 | Solvent type acrylic resin and application thereof in battery wrapping pressure-sensitive adhesive tape |
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