CN112114404A - Array optical fiber output laser - Google Patents
Array optical fiber output laser Download PDFInfo
- Publication number
- CN112114404A CN112114404A CN201910532214.6A CN201910532214A CN112114404A CN 112114404 A CN112114404 A CN 112114404A CN 201910532214 A CN201910532214 A CN 201910532214A CN 112114404 A CN112114404 A CN 112114404A
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- CN
- China
- Prior art keywords
- mode
- chip
- chips
- array
- output laser
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000013307 optical fiber Substances 0.000 title claims description 13
- 239000000835 fiber Substances 0.000 claims abstract description 28
- 230000008878 coupling Effects 0.000 claims abstract description 8
- 238000010168 coupling process Methods 0.000 claims abstract description 8
- 238000005859 coupling reaction Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses an array fiber output laser, which sequentially comprises a single-mode LD chip array and a V-groove fiber array along a light path, wherein each single-mode LD chip in the single-mode LD chip array is independent, the output end surface of each single-mode LD chip is on the same plane, and light emitted by each single-mode LD chip is coupled into a single-mode fiber corresponding to the V-groove fiber array; the single-mode LD chips are formed by cutting the integrated multi-LD chip component. The invention adopts a mode of cutting an integrated multi-LD chip component, thereby realizing a multi-fiber and multi-single-mode chip coupling output structure in the existing butterfly-shaped packaging structure, and simultaneously reducing the cost and the space occupied by a plurality of groups of pump lasers.
Description
Technical Field
The invention relates to the field of lasers, in particular to an array optical fiber output laser.
Background
In the field of communication single-mode pump lasers, butterfly-type packaging is mostly adopted, and generally only one chip and single optical fiber output is adopted, or double optical fibers of double optical fiber chips are adopted for output.
Disclosure of Invention
The invention aims to provide an array optical fiber output laser with low cost and small volume.
In order to achieve the purpose, the invention adopts the following technical scheme:
an array fiber output laser comprises a single-mode LD chip array and a V-groove fiber array in sequence along a light path, wherein each single-mode LD chip in the single-mode LD chip array is independent, the output end face of each single-mode LD chip is on the same plane, and light emitted by each single-mode LD chip is coupled into a single-mode fiber corresponding to the V-groove fiber array; the single-mode LD chips are formed by cutting the integrated multi-LD chip component.
The specific method for forming the independent single-mode LD chips by cutting the integrated multi-LD chip component is as follows: and welding and fixing the integrated multi-LD chip component on the surface of the heat sink, and then cutting the substrate between two adjacent single-mode LD chips to the surface of the heat sink by femtosecond laser to make the LD chips independent.
The distance between two adjacent single-mode LD chips is 10um-100 um.
The specific method for forming the independent single-mode LD chips by cutting the integrated multi-LD chip component is as follows: and welding and fixing the integrated multi-LD chip component on the surface of the heat sink, and then etching a separation groove between two adjacent single-mode LD chips by using femtosecond laser to form a common gold electrode on the upper surface, so that the LD chips are mutually independent.
The width of the partition groove is 10um-100 um.
The input end of the single mode fiber has a wedge angle.
And a coupling element is also arranged between the single-mode LD chip array and the V-groove optical fiber array, and the coupling element is a single cylindrical surface and an aspheric surface composite lens.
By adopting the technology and adopting a mode of cutting the integrated multi-LD chip component, the invention can realize a multi-fiber and multi-single-mode chip coupling output structure in the existing butterfly-shaped packaging structure, and simultaneously can reduce the cost and the space occupied by a plurality of groups of pump lasers.
Drawings
The invention is described in further detail below with reference to the accompanying drawings and the detailed description;
FIG. 1 is a top view of a first embodiment of an arrayed fiber optic output laser of the present invention;
FIG. 2 is a side view of a single-mode LD chip according to one embodiment of the present invention, showing the direct coupling of light from the chip into a single-mode fiber;
FIG. 3 is a top view of a second embodiment of an arrayed fiber optic output laser of the present invention;
FIG. 4 is a schematic diagram of a first embodiment of cutting using a femtosecond laser;
FIG. 5 is a schematic diagram of a second embodiment of cutting with a femtosecond laser.
Detailed Description
As shown in fig. 1 or fig. 2, the array fiber output laser of the present invention sequentially includes a single-mode LD chip array 1 and a V-groove fiber array 2 along a light path, each single-mode LD chip 11 in the single-mode LD chip array 1 is independent from each other, an output end surface of each single-mode LD chip 11 is on the same plane, and light emitted by each single-mode LD chip 11 is coupled into a single-mode fiber 21 corresponding to the V-groove fiber array 2; the single-mode LD chips 11, which are independent of each other, are formed by cutting an integrated multi-LD chip member.
For a butterfly-packaged LD, a single-mode fiber 21 with a wedge angle is generally used for direct coupling.
As shown in fig. 4, the specific method for forming the individual single-mode LD chips 11 by cutting the integrated multi-LD chip component 3 is as follows: the integrated multi-LD chip component 3 is welded and fixed on the surface of the heat sink 4, then the substrate between two adjacent single-mode LD chips 11 is cut to the surface of the heat sink 4 by femtosecond laser, so that the single-mode LD chips 11 are mutually independent, and the distance between two adjacent single-mode LD chips 11 is 10-100 um.
As shown in fig. 5, a specific method for forming the individual single-mode LD chips 11 by cutting the integrated multi-LD chip member 3 may be as follows: the integrated multi-LD chip component 3 is welded and fixed on the surface of the heat sink 4, and then the femtosecond laser is used to etch the upper surface common gold electrode into a separation groove between two adjacent single-mode LD chips 11, so that the single-mode LD chips 11 are independent from each other, and the width of the separation groove is 10-100 um.
The invention adopts femtosecond laser to cut each single-mode LD chip, mainly prevents the large-size uncut multichip from being inconsistent with the heat sink thermal expansion in high power, and the multichip can not be influenced when being divided into single clearance to generate heat. If the single-mode LD chip is cut into small pieces and then welded, the end faces of the single-mode LD chips cannot be ensured to be on the same plane.
As shown in fig. 3, since the single-mode LD chips 11 are in the same plane, the light emitted from each single-mode LD chip 11 can be coupled into each corresponding single-mode fiber 21 by using a single cylindrical surface and the aspheric composite lens 5.
While the invention has been described in connection with the above embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, which are illustrative and not restrictive, and that those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (7)
1. An arrayed fiber optic output laser, comprising: the optical fiber grating comprises a single-mode LD chip array and a V-groove optical fiber array in sequence along an optical path, wherein each single-mode LD chip in the single-mode LD chip array is independent from each other, the output end surface of each single-mode LD chip is on the same plane, and light emitted by each single-mode LD chip is coupled into a single-mode optical fiber corresponding to the V-groove optical fiber array; the single-mode LD chips are formed by cutting the integrated multi-LD chip component.
2. An arrayed fiber optic output laser according to claim 1, wherein: the specific method for forming the independent single-mode LD chips by cutting the integrated multi-LD chip component is as follows: and welding and fixing the integrated multi-LD chip component on the surface of the heat sink, and then cutting the substrate between two adjacent single-mode LD chips to the surface of the heat sink by femtosecond laser to make the LD chips independent.
3. An arrayed fiber optic output laser according to claim 2, wherein: the distance between two adjacent single-mode LD chips is 10um-100 um.
4. An arrayed fiber optic output laser according to claim 1, wherein: the specific method for forming the independent single-mode LD chips by cutting the integrated multi-LD chip component is as follows: and welding and fixing the integrated multi-LD chip component on the surface of the heat sink, and then etching a separation groove between two adjacent single-mode LD chips by using femtosecond laser to form a common gold electrode on the upper surface, so that the LD chips are mutually independent.
5. An arrayed fiber optic output laser according to claim 4, wherein: the width of the partition groove is 10um-100 um.
6. An arrayed fiber optic output laser according to claim 1, wherein: the input end of the single mode fiber has a wedge angle.
7. An arrayed fiber optic output laser according to claim 1, wherein: and a coupling element is also arranged between the single-mode LD chip array and the V-groove optical fiber array, and the coupling element is a single cylindrical surface and an aspheric surface composite lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910532214.6A CN112114404A (en) | 2019-06-19 | 2019-06-19 | Array optical fiber output laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910532214.6A CN112114404A (en) | 2019-06-19 | 2019-06-19 | Array optical fiber output laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112114404A true CN112114404A (en) | 2020-12-22 |
Family
ID=73795666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910532214.6A Pending CN112114404A (en) | 2019-06-19 | 2019-06-19 | Array optical fiber output laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112114404A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5065406A (en) * | 1990-03-16 | 1991-11-12 | Kabushiki Kaisha Toshiba | Semiconductor laser chip and method of making the same |
| JP2002094095A (en) * | 2000-09-18 | 2002-03-29 | Canon Inc | Integrated type photovoltaic element and its manufacturing method |
| US20020172244A1 (en) * | 2001-05-17 | 2002-11-21 | Peng-Chih Li | Self-separating laser diode assembly and method |
| JP2014033035A (en) * | 2012-08-02 | 2014-02-20 | Ricoh Co Ltd | Method for manufacturing optical devices, and cleaving apparatus |
| CN203800378U (en) * | 2014-04-11 | 2014-08-27 | 福州高意通讯有限公司 | Optical fiber coupling semiconductor laser device |
| CN105706257A (en) * | 2013-11-07 | 2016-06-22 | 东芝北斗电子株式会社 | Light-emitting device |
-
2019
- 2019-06-19 CN CN201910532214.6A patent/CN112114404A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5065406A (en) * | 1990-03-16 | 1991-11-12 | Kabushiki Kaisha Toshiba | Semiconductor laser chip and method of making the same |
| JP2002094095A (en) * | 2000-09-18 | 2002-03-29 | Canon Inc | Integrated type photovoltaic element and its manufacturing method |
| US20020172244A1 (en) * | 2001-05-17 | 2002-11-21 | Peng-Chih Li | Self-separating laser diode assembly and method |
| JP2014033035A (en) * | 2012-08-02 | 2014-02-20 | Ricoh Co Ltd | Method for manufacturing optical devices, and cleaving apparatus |
| CN105706257A (en) * | 2013-11-07 | 2016-06-22 | 东芝北斗电子株式会社 | Light-emitting device |
| CN203800378U (en) * | 2014-04-11 | 2014-08-27 | 福州高意通讯有限公司 | Optical fiber coupling semiconductor laser device |
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Application publication date: 20201222 |