CN112103379A - Packaging assembly for LED lamp beads - Google Patents
Packaging assembly for LED lamp beads Download PDFInfo
- Publication number
- CN112103379A CN112103379A CN202011139533.XA CN202011139533A CN112103379A CN 112103379 A CN112103379 A CN 112103379A CN 202011139533 A CN202011139533 A CN 202011139533A CN 112103379 A CN112103379 A CN 112103379A
- Authority
- CN
- China
- Prior art keywords
- packaging box
- box
- fluororubber
- layer
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 75
- 239000011324 bead Substances 0.000 title claims abstract description 21
- 229920001973 fluoroelastomer Polymers 0.000 claims abstract description 45
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 46
- 230000001681 protective effect Effects 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 239000011247 coating layer Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 abstract description 12
- 239000012535 impurity Substances 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a packaging assembly of LED lamp beads, which comprises a packaging box, wherein the packaging box is provided with a protection box, the inner side wall of the protection box is provided with a clamping groove, a connecting block is fixedly arranged in the clamping groove, a groove is formed in the connecting block, the side wall of the packaging box is provided with a connecting rod, a buffering device is arranged between the packaging box and the bottom of the protection box and comprises a buffering telescopic rod, the lower end of the buffering telescopic rod is fixedly connected with the bottom of the protection box, the upper end of the buffering telescopic rod is fixedly connected with the lower surface of the packaging box, the side surface of the buffering telescopic rod is provided with a buffering spring, an LED chip is arranged in the packaging box, the upper end of the packaging box is. According to the invention, the fluororubber layer and the box cover are arranged, so that the box cover is convenient for replacing and maintaining the LED chip, and the fluororubber layer plays a role in sealing the joint of the box cover and the packaging box, so that the LED chip in the packaging box is prevented from being polluted by external impurities.
Description
Technical Field
The invention relates to a lamp packaging structure, in particular to a packaging assembly of an LED lamp bead.
Background
When the existing LED lamp bead packaging structure is used, the LED lamp beads are directly welded on a PC circuit board, the packaging structure enables the LED lamp beads to be poor in sealing performance when the LED lamp beads work, external impurities are easy to permeate into the LED lamp beads, the existing LED lamp bead timer does not have the buffering function, and the LED lamp bead timer is easy to damage when being impacted, so that the service life of the LED lamp beads is influenced.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides a packaging component of an LED lamp bead,
comprises a packaging box, a protective box is arranged on the packaging box, a clamping groove is arranged on the inner side wall of the protective box, a connecting block is fixedly arranged in the clamping groove, a groove is arranged on the connecting block, a connecting rod is arranged on the side wall of the packaging box, the lower end of the connecting rod is inserted in the groove of the connecting block, a buffer device is arranged between the packaging box and the bottom of the protection box, the buffer device comprises a buffer telescopic rod, the lower end of the buffer telescopic rod is fixedly connected with the bottom of the protective box, the upper end of the buffering telescopic rod is fixedly connected with the lower surface of the packaging box, the side surface of the buffering telescopic rod is provided with buffering springs spirally distributed along the side surface of the buffering telescopic rod, the LED packaging box is characterized in that an LED chip is arranged in the packaging box, the upper end of the packaging box is hinged with a box cover, and a sealing layer is arranged at the joint of the packaging box and the box cover.
Preferably, the sealing layer is a fluororubber layer, the fluororubber layer comprises an upper fluororubber layer and a lower fluororubber layer, the upper fluororubber layer is arranged on the box cover, the lower fluororubber layer is arranged on the packaging box, the upper fluororubber layer is provided with a fluororubber projection, and the lower fluororubber layer is provided with a fluororubber groove matched with the fluororubber projection.
Preferably, a compression spring is arranged in a groove of the connecting block, one end of the compression spring is vertically fixed in the groove, and the other end of the compression spring abuts against the lower end of the connecting rod.
Preferably, an expansion spring is arranged in the clamping groove, one end of the expansion spring is fixedly arranged on the inner side wall of the clamping groove, and the other end of the expansion spring is fixedly arranged on the side wall of the connecting rod.
Preferably, the surface of the packaging box is provided with a heat dissipation layer, and the heat dissipation layer adopts a heat conduction polyester coating layer.
Preferably, the lower extreme surface of guard box runs through and is equipped with a plurality of through-holes, be provided with the filter screen in the through-hole.
Preferably, the cross section of the through hole is provided with a circular and/or rectangular structure.
The invention has the beneficial effects
(1) According to the invention, the fluororubber layer and the box cover are arranged, so that the box cover is convenient for replacing and maintaining the LED chip, and the fluororubber layer plays a role in sealing the joint of the box cover and the packaging box, so that the LED chip in the packaging box is prevented from being polluted by external impurities.
(2) When the packaging box and the protection box integrally fall on the ground, the buffer telescopic rod and the buffer spring can reduce the vibration of the packaging box in the vertical direction, and meanwhile, the compression spring can further slow down the vibration of the connecting rod and the packaging box integrally in the vertical direction, so that the LED chip is protected in the vertical direction, the connecting rod can clamp and fix the left side wall and the right side wall of the packaging box, and when the packaging box shakes in the left-right direction, the telescopic spring can absorb the shaking impact force of the packaging box in the left-right direction, so that the LED chip is protected in the left-right direction.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
FIG. 2 is a schematic view of the structure of the fluororubber layer of the present invention.
Description of reference numerals: 1. packaging the box; 2. a box cover; 3. a protective box; 4. a card slot; 5. connecting blocks; 6. a connecting rod; 7. buffering the telescopic rod; 8. a buffer spring; 9. a compression spring; 10. a tension spring; 11. a through hole; 12. an LED chip; 13. a fluororubber layer, 131, an upper fluororubber layer; 132. a lower fluororubber layer; 133. a fluororubber bump; 134. fluororubber grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1-2, the present invention provides a package assembly of LED lamp beads,
the LED packaging box comprises a packaging box 1, a protective box 3 is arranged on the packaging box 1, a clamping groove 4 is arranged on the inner side wall of the protective box 3, a connecting block 5 is fixedly arranged in the clamping groove 4, a groove is formed in the connecting block 5, a connecting rod 6 is arranged on the side wall of the packaging box 1, the lower end of the connecting rod 6 is inserted in the groove of the connecting block 5, a buffer device is arranged between the packaging box 1 and the bottom of the protective box 3 and comprises a buffer telescopic rod 7, the lower end of the buffer telescopic rod 7 is fixedly connected with the bottom of the protective box 3, the upper end of the buffer telescopic rod 7 is fixedly connected with the lower surface of the packaging box 1, a buffer spring 8 spirally distributed along the side surface of the buffer telescopic rod 7 is arranged on the side surface of the buffer telescopic rod 7, an LED chip 12 is arranged in the packaging box 1, and a box cover 2, a sealing layer is arranged at the joint of the packaging box 1 and the box cover 2, the sealing layer is a fluororubber layer 13, the fluororubber layer 13 comprises an upper fluororubber layer 131 and a lower fluororubber layer 132, the upper fluororubber layer 131 is arranged on the box cover 2, the lower fluororubber layer 132 is arranged on the packaging box 1, the upper fluororubber layer 131 is provided with a fluororubber bulge 133, the lower fluororubber layer 132 is provided with a fluororubber groove 134 matched with the fluororubber bulge 133,
according to the invention, the fluororubber layer and the box cover 2 are arranged, the box cover 2 is convenient for replacing and maintaining the LED chip 12, and the fluororubber layer plays a role in sealing the joint of the box cover 2 and the packaging box 1, so that the LED chip 12 in the packaging box 1 is prevented from being polluted by external impurities; when the packaging box 1 and the protection box 3 integrally fall on the ground, the buffer telescopic rod 7 and the buffer spring 8 can reduce the vibration of the packaging box 1 in the vertical direction, and meanwhile, the compression spring can further reduce the vibration of the connecting rod 6 and the packaging box 1 integrally in the vertical direction, so that the LED chip 12 is protected in the vertical direction, the connecting rod 6 can clamp and fix the left side wall and the right side wall of the packaging box 1, and when the packaging box 1 shakes in the left-right direction, the telescopic spring can absorb the shaking impact force of the packaging box 1 in the left-right direction, so that the LED chip 12 is protected in the left-right direction;
an expansion spring is arranged in the clamping groove 4, one end of the expansion spring is fixedly arranged on the inner side wall of the clamping groove 4, and the other end of the expansion spring is fixedly arranged on the side wall of the connecting rod 6;
the surface of the packaging box 1 is provided with a heat dissipation layer, the heat dissipation layer adopts a heat conduction polyester coating layer, the heat dissipation layer is arranged on the surface of the packaging box 1, the heat dissipation layer can improve the heat dissipation performance of the packaging box 1, and can play a role in assisting heat dissipation when the packaging box 1 works, so that the overheating phenomenon of the packaging box 1 is avoided, the failure rate of the packaging box 1 is reduced, and the safety performance of the packaging box 1 in use is improved;
the lower extreme surface of protective housing 3 runs through and is equipped with a plurality of through-holes 11, be provided with the filter screen in the through-hole 11, through-hole 11 cross section sets up to circular structure, is convenient for accelerate the flow of air through setting up through-hole 11, better dispels the heat to packaging box 1 to further dispel the heat to LED chip 12, through set up the filter screen in through-hole 11, impurity in the filterable air improves packaging box 1 surface and the inside cleanliness factor of protective housing 3.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. A packaging component of an LED lamp bead is characterized in that,
comprises a packaging box (1), a protective box (3) is arranged on the packaging box (1), a clamping groove (4) is formed in the inner side wall of the protective box (3), a connecting block (5) is fixedly arranged in the clamping groove (4), a groove is formed in the connecting block (5), a connecting rod (6) is arranged on the side wall of the packaging box (1), the lower end of the connecting rod (6) is inserted into the groove of the connecting block (5), a buffer device is arranged between the packaging box (1) and the bottom of the protective box (3), the buffer device comprises a buffer telescopic rod (7), the lower end of the buffer telescopic rod (7) is fixedly connected with the bottom of the protective box (3), the upper end of the buffer telescopic rod (7) is fixedly connected with the lower surface of the packaging box (1), and buffer springs (8) which are spirally distributed along the side surface of the buffer telescopic rod (7) are arranged on the side surface of the buffer telescopic rod (7), the LED packaging box is characterized in that an LED chip (12) is arranged in the packaging box (1), the upper end of the packaging box (1) is hinged with a box cover (2), and a sealing layer is arranged at the joint of the packaging box (1) and the box cover (2).
2. The package assembly of the LED lamp bead of claim 1, wherein,
the sealing layer is arranged to be a fluororubber layer (13), the fluororubber layer (13) comprises an upper fluororubber layer (131) and a lower fluororubber layer (132), the upper fluororubber layer (131) is arranged on the box cover (2), the lower fluororubber layer (132) is arranged on the packaging box (1), fluororubber protrusions (133) are arranged on the upper fluororubber layer (131), and fluororubber grooves (134) matched with the fluororubber protrusions (133) are arranged on the lower fluororubber layer (132).
3. The package assembly of the LED lamp bead of claim 1, wherein,
a compression spring is arranged in a groove of the connecting block (5), one end of the compression spring is vertically fixed in the groove, and the other end of the compression spring abuts against the lower end of the connecting rod (6).
4. The package assembly of the LED lamp bead of claim 1, wherein,
an expansion spring is arranged in the clamping groove (4), one end of the expansion spring is fixedly arranged on the inner side wall of the clamping groove (4), and the other end of the expansion spring is fixedly arranged on the side wall of the connecting rod (6).
5. The package assembly of the LED lamp bead of claim 2,
the surface of the packaging box (1) is provided with a heat dissipation layer, and the heat dissipation layer is a heat conduction polyester coating layer.
6. The package assembly of the LED lamp bead of claim 1, wherein,
the lower extreme surface of guard box (3) runs through and is equipped with a plurality of through-holes (11), be provided with the filter screen in through-hole (11).
7. The package assembly of the LED lamp bead of claim 6,
the cross section of the through hole (11) is set to be a circular and/or rectangular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011139533.XA CN112103379A (en) | 2020-10-22 | 2020-10-22 | Packaging assembly for LED lamp beads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011139533.XA CN112103379A (en) | 2020-10-22 | 2020-10-22 | Packaging assembly for LED lamp beads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112103379A true CN112103379A (en) | 2020-12-18 |
Family
ID=73785973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011139533.XA Pending CN112103379A (en) | 2020-10-22 | 2020-10-22 | Packaging assembly for LED lamp beads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112103379A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112925360A (en) * | 2021-01-25 | 2021-06-08 | 南昌鑫驰实业有限公司 | Temperature controller with protection function |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210837832U (en) * | 2019-09-12 | 2020-06-23 | 鹏盛国能(深圳)新能源集团有限公司 | Packaging structure of battery |
| CN210998634U (en) * | 2019-12-02 | 2020-07-14 | 江西腾远检疫科技有限公司 | Multifunctional tool box |
| CN211507603U (en) * | 2019-12-17 | 2020-09-15 | 广州佑之家居科技有限公司 | Electronic component packaging structure |
| CN211585165U (en) * | 2020-08-20 | 2020-09-29 | 江西现代职业技术学院 | Sports timer |
-
2020
- 2020-10-22 CN CN202011139533.XA patent/CN112103379A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210837832U (en) * | 2019-09-12 | 2020-06-23 | 鹏盛国能(深圳)新能源集团有限公司 | Packaging structure of battery |
| CN210998634U (en) * | 2019-12-02 | 2020-07-14 | 江西腾远检疫科技有限公司 | Multifunctional tool box |
| CN211507603U (en) * | 2019-12-17 | 2020-09-15 | 广州佑之家居科技有限公司 | Electronic component packaging structure |
| CN211585165U (en) * | 2020-08-20 | 2020-09-29 | 江西现代职业技术学院 | Sports timer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112925360A (en) * | 2021-01-25 | 2021-06-08 | 南昌鑫驰实业有限公司 | Temperature controller with protection function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201218 |
|
| RJ01 | Rejection of invention patent application after publication |