CN112103220A - Monitoring device and monitoring method for wafer cleaning position - Google Patents
Monitoring device and monitoring method for wafer cleaning position Download PDFInfo
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- CN112103220A CN112103220A CN202011235545.2A CN202011235545A CN112103220A CN 112103220 A CN112103220 A CN 112103220A CN 202011235545 A CN202011235545 A CN 202011235545A CN 112103220 A CN112103220 A CN 112103220A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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Abstract
The invention discloses a monitoring device and a monitoring method for a wafer cleaning position, wherein the monitoring device for the wafer cleaning position comprises the following components: the transparent plate is provided with an initial mark area of a wafer cleaning position; the transparent groove is positioned on the transparent plate and is positioned in the starting mark area; the photoelectric sensor is connected with the transparent groove, a light emitter in the photoelectric sensor is positioned on one side of the transparent groove, and a receiver in the photoelectric sensor is positioned on the other side of the transparent groove; the bottom opening of the transparent groove, the top end of the transparent groove and the periphery of the transparent groove are of a closed structure, the interior of the transparent groove is of a hollow structure, and the bottom opening of the transparent groove is communicated with the transparent plate. By the invention, the operation error caused by inaccurate observation by naked eyes can be reduced.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a monitoring device and a monitoring method for a wafer cleaning position.
Background
The cleaning of the back of the wafer is an essential step in the process of coating and developing the wafer, and the normal operation of the step can effectively reduce the photoresist adhesion of the back of the wafer, thereby reducing the problems caused by the adhesion of the back of the wafer. When the cleaning position of the back of the wafer is adjusted by a traditional tool, the cleaning tool is operated by manually observing the spraying position on the wafer, but due to the narrow machine table, the light inside the machine table is dim, the color of the cleaning liquid is close to that of the transparent wafer (nearly transparent), the cleaning liquid is not easy to observe, and the observation angles of different people are different, so that errors can be brought to the observation results.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides a device and a method for monitoring a wafer cleaning position, wherein a transparent groove is formed at a spraying position, a light emitter and a receiver are respectively disposed at two sides of the transparent groove, and a photoelectric sensor is used to monitor whether a water column exists in the transparent groove to generate an electrical signal, so that an operator can accurately and intuitively know the position of an initial mark region. By the method, the operation error caused by inaccurate visual observation can be reduced, and meanwhile, whether the wafer cleaning position is at the preset position or not can be accurately judged.
In order to achieve the above and other objects, the present invention provides a wafer cleaning position monitoring apparatus, including:
the transparent plate is provided with an initial mark area of a wafer cleaning position;
the transparent groove is positioned on the transparent plate and is positioned in the starting mark area;
the photoelectric sensor is connected with the transparent groove, a light emitter in the photoelectric sensor is positioned on one side of the transparent groove, and a receiver in the photoelectric sensor is positioned on the other side of the transparent groove;
the bottom end of the transparent groove is open, the top end and the periphery of the transparent groove are of a closed structure, the interior of the transparent groove is of a hollow structure, and the bottom end opening of the transparent groove is communicated with the transparent plate.
In one embodiment, the size and shape of the transparent plate is the same as the size and shape of the wafer to be cleaned.
In one embodiment, the transparent plate is provided with a handle. The handle is in an inverted conical shape.
In one embodiment, the photoelectric sensor is connected with the transparent groove in a clamping mode.
In one embodiment, two side walls of the photoelectric sensor are provided with through holes, internal threads are arranged in the through holes, and the transparent groove is in threaded connection with the photoelectric sensor.
In one embodiment, the transparent groove is spaced from two side walls of the photoelectric sensor.
In one embodiment, the photosensor is in the shape of an arch.
In one embodiment, the photoelectric sensor is provided with a first signal lamp and a second signal lamp.
In one embodiment, the transparent groove is in the shape of a cube with an open bottom end, a cuboid with an open bottom end or a cylinder with an open bottom end.
The invention also aims to provide a method for monitoring the wafer cleaning position, which at least comprises the following steps:
providing the monitoring device;
monitoring whether a water column exists in the transparent groove through the photoelectric sensor to send an electric signal;
removing the transparent plate, and placing the wafer to be cleaned at the same position as the transparent plate;
and determining the cleaning position of the wafer to be cleaned according to the electric signal.
In one embodiment, in the step of sending an electrical signal by monitoring the presence or absence of a water column in the transparent groove through the photoelectric sensor,
if no water column exists in the transparent groove, a first signal lamp on the photoelectric sensor is on;
and if a water column is arranged in the transparent groove, a second signal lamp on the photoelectric sensor is on.
The invention provides a monitoring device and a monitoring method for a wafer cleaning position, wherein a transparent groove is arranged at a spraying position (an initial marking area), a light emitter and a receiver are respectively arranged at two sides of the transparent groove, and a photoelectric sensor is used for monitoring whether a water column exists in the transparent groove to send out an electric signal, so that an operator can accurately obtain the position of the initial marking area, the error caused by the fact that the initial marking area is observed by naked eyes is not accurate enough is avoided, and meanwhile, whether the wafer cleaning position is at a preset position or not can be accurately judged. The invention also greatly reduces the result error caused by different observation angles of different people. Specifically, the siphon principle is skillfully utilized, the cleaning liquid can rise a section of detectable water column in the transparent groove under the siphon action in the state that the transparent plate rotates at a high speed, the receiver can receive light under the condition of no blockage, but when the water column passes through the transparent groove, the light path is changed due to the refraction of the light, the receiver does not receive infrared light, the photoelectric switch acts to output a switch control signal to cut off or connect load current, and the cleaning position of the back surface of the wafer is reflected through the on-off of the LED lamp on the photoelectric sensor. The monitoring device and the monitoring method can effectively reduce the photoresist adhesion on the back of the wafer and reduce the problems caused by the adhesion of the back of the wafer. The invention has the advantages of easily understood principle, novel structure, convenient use, low cost and the like.
Drawings
FIG. 1: a schematic view of the transparent plate and the transparent groove in an embodiment of the present invention;
FIG. 2: in an embodiment of the present invention, a schematic diagram of a connection relationship between the photoelectric sensor and the transparent groove is shown;
FIG. 3: in an embodiment of the present invention, the photoelectric sensor is connected to the transparent groove in a snap-fit manner;
FIG. 4: in an embodiment of the present invention, the photoelectric sensor is an arched schematic diagram;
FIG. 5: the siphon principle model diagram applied by the invention;
FIG. 6: a schematic diagram of the transparent plate placed on a machine table for cleaning in one embodiment of the invention;
FIG. 7: in an embodiment of the invention, the wafer is placed on a machine for cleaning;
FIG. 8: the flow of the monitoring method in one embodiment of the invention is schematically illustrated.
Description of the symbols
101. A transparent plate; 1011. a handle; 102. a transparent groove; 103. a photosensor; 1031. a light emitter; 1032. a receiver; 1033. a first signal lamp; 1034. a second signal lamp; 1035. a through hole; A. the back of the wafer; B. a first container; C. a second container; D. a pin shaft; E. a start mark region; F. cleaning the machine table; G. a first nozzle; H. a second nozzle; I. a water pipe.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
In the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second," if any, are used for descriptive and distinguishing purposes only and are not to be construed as indicating or implying relative importance.
According to the invention, the transparent groove is arranged at the spraying position (initial marking area), the light emitter and the receiver are respectively arranged on two sides of the transparent groove, and the photoelectric sensor is used for monitoring whether a water column exists in the transparent groove to send out an electric signal, so that an operator can accurately learn the position of the initial marking area, and errors caused by inaccurate observation of the initial marking area by naked eyes are avoided.
Referring to fig. 1 to 4, in one embodiment, the monitoring device for the wafer cleaning position includes, but is not limited to, a transparent plate 101, a transparent groove 102 and a photoelectric sensor 103. The wafer cleaning position can effectively and visually monitor the cleaning position of the wafer back surface A.
Referring to fig. 1, in an embodiment, the transparent plate 101 has an initial mark area E of a wafer cleaning position, and the initial mark area E cannot be clearly observed by naked eyes due to a narrow machine space during a cleaning process, and is a preset initial position for spraying a cleaning solution. The transparent plate 101 is provided with a handle 1011, the handle 1011 is convenient for an operator to lift and place the transparent plate 101, and the shape of the handle 1011 is an inverted conical shape, for example. The remaining structure of the transparent plate 101 is the same as the wafer to be cleaned, for example, the size and shape of the transparent plate 101 is the same as the size and shape of the wafer to be cleaned.
Referring to fig. 1 to 4, in an embodiment, the transparent groove 102 is located on the transparent plate 101, and the transparent groove 102 is located in the start mark area E, and the transparent groove 102 is fixedly connected to the transparent plate 101, for example, by welding. The interior of the transparent groove 102 is a hollow structure. Specifically, the bottom end of the transparent groove 102 is open, and the top end and the periphery of the transparent groove 102 are closed structures. The bottom opening of the transparent groove 102 is communicated with the transparent plate 101, that is, a through hole is formed in the starting mark area E of the transparent plate 101, and the through hole is open at the bottom of the transparent groove 102 and is communicated with the bottom opening of the transparent groove 102. The shape of the transparent groove 102 is, for example, a cube with an open bottom end, a cuboid with an open bottom end, or a cylinder with an open bottom end. In the present embodiment, the transparent groove 102 is, for example, a glass groove, which facilitates observation of a water column and allows light emitted from the photosensor 103 to easily pass therethrough.
Referring to fig. 1 to 4, in an embodiment, the photoelectric sensor 103 is connected to the transparent slot 102, and the photoelectric sensor 103 includes, but is not limited to, a light emitter 1031, a receiver 1032, an LED lamp and an optical circuit. Specifically, the light emitter 1031 of the photo sensor 103 is located on one side of the transparent slot 102, the receiver 1032 of the photo sensor 103 is located on the other side of the transparent slot 102, and the photo sensor 103 spans across the transparent slot 102, for example, in order to realize that the light emitter 1031 and the receiver 1032 are located on opposite sides. The photosensor 103 is provided with, for example, a first signal light 1033 and a second signal light 1034, and the electric signals are represented by the first signal light 1033 and the second signal light 1034. Specifically, for example, the first signal lamp 1033 is a red LED lamp, the second signal lamp 1034 is a green LED lamp, when there is a water column rising, the second signal lamp 1034 (green LED lamp) is on, and when there is no water column rising, the first signal lamp 1033 (red LED lamp) is on. The photoelectric sensor 103 monitors whether a water column exists in the transparent groove 102 or not to send out an electric signal, and the electric signal is presented through the red LED lamp and the green LED lamp.
Referring to fig. 1 to 4, in one embodiment, there are various connection manners between the photoelectric sensor 103 and the transparent slot 102, for example, as long as the light emitter 1031 and the receiver 1032 are ensured to be on opposite sides.
Referring to fig. 3, in an embodiment, the photoelectric sensor 103 is connected to the transparent groove 102 in a snap-fit manner, the transparent groove 102 is fixedly connected to the transparent plate 101, and the size of the transparent groove 102 matches with the groove at the middle position of the photoelectric sensor 103, so that the transparent groove 102 is connected to the photoelectric sensor 103 in a snap-fit manner, and the transparent groove 102 and the photoelectric sensor 103 are not thrown away in a high-speed rotation state.
The shape of the photosensor 103 is, for example, a rectangular parallelepiped with a groove in the middle, a cube with a groove in the middle, a cylinder with a groove in the middle, or an arch shape.
Referring to fig. 1 to 4, in another embodiment, if the photoelectric sensor 103 is not connected to the transparent groove 102 in a snap-fit manner, other connection manners may be provided, for example, a space is provided between the transparent groove 102 and two sidewalls of the photoelectric sensor 103. Two side walls of the photoelectric sensor 103 are provided with through holes 1035, the through holes 1035 are internally provided with internal threads, the transparent groove 102 and the photoelectric sensor 103 are connected through threads, specifically, for example, a pin shaft D with external threads is used for connecting the transparent groove 102 and the photoelectric sensor 103, and the external threads of the pin shaft are matched with the internal threads.
Referring to fig. 8, in an embodiment, the method for monitoring the wafer cleaning position includes the following steps:
s1, providing the monitoring device;
s2, monitoring whether a water column exists in the transparent groove through the photoelectric sensor to send an electric signal;
s3, removing the transparent plate, and placing the wafer to be cleaned at the same position as the transparent plate;
and S4, determining the cleaning position of the wafer to be cleaned according to the electric signal.
Specifically, in step S1, the monitoring device has the structure shown in fig. 1 to 4, and the monitoring device has the same structure as that described above. The monitoring device for the wafer cleaning position includes, but is not limited to, a transparent plate 101, a transparent groove 102 and a photoelectric sensor 103. The transparent plate 101 has a start mark area E of a wafer cleaning position. The transparent groove 102 is located on the transparent plate 101, and the transparent groove 102 is located in the start mark region E. The photosensor 103 is connected to the transparent slot 102, the light emitter 1031 of the photosensor 103 is located at one side of the transparent slot 102, and the receiver 1031 of the photosensor 103 is located at the other side of the transparent slot 102. The bottom end of the transparent groove 102 is open, the top end and the periphery of the transparent groove 102 are closed structures, the interior of the transparent groove 102 is a hollow structure, and the bottom end opening of the transparent groove 102 is communicated with the transparent plate 101.
Specifically, in step S2, in the step of sending an electrical signal by monitoring whether there is a water column in the transparent groove through the photoelectric sensor, if there is no water column in the transparent groove 102, the first signal lamp 1033 on the photoelectric sensor 103 is on; if there is a water column in the transparent slot 102, the second signal lamp 1034 on the photoelectric sensor 103 is on. Specifically, in a state that the transparent plate 101 rotates at a high speed, the cleaning liquid may rise a section of detectable water column in the transparent groove 102 due to a siphon action, and in a case of no blocking, the receiver 1032 may receive light, but when the water column passes through the transparent groove 102, a light path is changed due to refraction of the light, the receiver 1032 does not receive infrared light, the photoelectric switch operates to output a switch control signal to cut off or switch on a load current, and a cleaning position of the wafer back side a is reflected by turning on and off the red LED lamp and the green LED lamp on the photoelectric sensor 103.
Specifically, in step S3, before cleaning the wafer to be cleaned, the monitoring device is used to perform a cleaning process on the machine platform, and when the photoelectric sensor 103 monitors the cleaning position of the wafer to be cleaned, the object of the present invention is achieved.
Referring to fig. 5, fig. 5 includes two containers, which are respectively referred to as a first container B and a second container C, and the first container B and the second container C are connected by a water pipe I. The liquid level in the first container B is higher than the liquid level in the second container C, and the siphon principle is that water flows upwards, and is generated by the combined action of the atmospheric pressure and the water pressure. As shown in the model diagram of fig. 5, although the first container B and the second container C are at the same atmospheric pressure, the side with higher water pressure flows downward due to gravity and the side with lower water pressure flows upward due to the difference in water pressure until the atmospheric pressure and the water pressure in the two sides are equal, and the water level in the first container B and the second container C becomes the same height, and the water stops flowing.
Referring to fig. 1 to 7, in the present invention, a cleaning liquid is injected into the transparent groove 102 of the transparent plate 101 to exhaust a portion of the gas in the transparent groove 102, and the liquid rises up a detectable water column in the transparent groove 102 under the action of atmospheric pressure. In the case of no blocking, the receiver 1032 can receive light, but when the water column passes through the transparent slot 102, the path of the light changes due to refraction of the light, the receiver 1032 does not receive infrared light, the photoelectric switch is activated to output a switch control signal to switch off or on the load current, and the cleaning position of the wafer backside a is reflected by the on and off of the first signal light 1033 (red LED light) and the second signal light 1034 (green LED light) on the photoelectric sensor 103.
In the invention, the monitoring device and the monitoring method for the wafer cleaning position are equivalent to the simulation of the cleaning process of the wafer to be cleaned, when the initial mark area E on the transparent plate 101 is observed through the monitoring device and the wafer to be cleaned is placed at the same position of the transparent plate 101, the wafer to be cleaned can be cleaned at an accurate position, the adhesion of the photoresist on the back surface of the wafer can be effectively reduced, and the problem caused by the adhesion of the back surface of the wafer is reduced. In the simulation process, if the initial mark area cannot be observed, the position of the cleaning machine F needs to be adjusted, and then the positions of the first nozzle G and the second nozzle H are adjusted. As long as the electric signal from the photosensor 103 is observed, it can be known that the position of the transparent plate 101 is correct. The invention can accurately reflect whether the cleaning position of the wafer back surface A meets the standard, and the standard position of the spray cleaning can reduce the photoresist adhesion of the wafer back surface A, thereby reducing the related problems caused by the adhesion. The invention can unify the standard and avoid result errors caused by artificial different observation angles.
In summary, the present invention provides a device and a method for monitoring a wafer cleaning position, wherein a transparent groove is disposed at a spraying position (start mark region), a light emitter and a receiver are disposed on two sides of the transparent groove, and a photoelectric sensor is used to monitor whether a water column is present in the transparent groove to send an electrical signal, so that an operator can accurately obtain the position of the start mark region, thereby avoiding errors caused by inaccurate observation of the start mark region by naked eyes, and simultaneously, the present invention can accurately determine whether the wafer cleaning position is at a preset position. The invention also reduces the operation error caused by different observation angles of different people. Specifically, the siphon principle is skillfully utilized, the cleaning liquid can raise a section of detectable water column in the transparent groove under the siphon action in the state that the transparent plate rotates at a high speed, the receiver can receive light under the condition of no blockage, but when the water column passes through the transparent groove, the light path is changed due to the refraction of the light, the receiver does not receive infrared light, the photoelectric switch acts to output a switch control signal to cut off or connect load current, and the cleaning position of the back surface of the wafer is reflected through the on-off of the LED on the photoelectric sensor. The monitoring device and the monitoring method can effectively reduce the photoresist sticking on the back of the wafer and reduce the problems caused by the sticking on the back of the wafer. The invention has the advantages of easily understood principle, novel structure, convenient use, low cost and the like.
The above description is only a preferred embodiment of the present application and a description of the applied technical principle, and it should be understood by those skilled in the art that the scope of the present invention related to the present application is not limited to the technical solution of the specific combination of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, for example, the technical solutions formed by mutually replacing the above features with (but not limited to) technical features having similar functions disclosed in the present application.
Other technical features than those described in the specification are known to those skilled in the art, and are not described herein in detail in order to highlight the innovative features of the present invention.
Claims (11)
1. A device for monitoring a cleaning position of a wafer, comprising:
the transparent plate is provided with an initial mark area of a wafer cleaning position;
the transparent groove is positioned on the transparent plate and is positioned in the starting mark area;
the photoelectric sensor is connected with the transparent groove, a light emitter in the photoelectric sensor is positioned on one side of the transparent groove, and a receiver in the photoelectric sensor is positioned on the other side of the transparent groove;
the bottom opening of the transparent groove, the top end of the transparent groove and the periphery of the transparent groove are of a closed structure, the interior of the transparent groove is of a hollow structure, and the bottom opening of the transparent groove is communicated with the transparent plate.
2. A wafer cleaning position monitoring apparatus as claimed in claim 1, wherein the transparent plate has the same size and shape as the wafer to be cleaned.
3. A wafer cleaning position monitoring apparatus as claimed in claim 1, wherein the transparent plate is provided with a handle.
4. The apparatus as claimed in claim 1, wherein the photoelectric sensor is engaged with the transparent slot.
5. The wafer cleaning position monitoring device as claimed in claim 1, wherein the two side walls of the photoelectric sensor are provided with through holes, the through holes are internally provided with internal threads, and the transparent groove is in threaded connection with the photoelectric sensor.
6. A device for monitoring the cleaning position of a wafer as claimed in claim 5, wherein the transparent slot is spaced from two side walls of the photoelectric sensor.
7. A wafer cleaning position monitoring apparatus as claimed in claim 1, wherein the photoelectric sensor is arch-shaped.
8. A monitoring device for a wafer cleaning position as claimed in claim 7, wherein the photoelectric sensor is provided with a first signal light and a second signal light.
9. The apparatus as claimed in claim 1, wherein the transparent groove is in the shape of a square with an open bottom, a cuboid with an open bottom, or a cylinder with an open bottom.
10. A method for monitoring a wafer cleaning position is characterized by at least comprising the following steps:
providing a monitoring device according to any one of claims 1-9;
monitoring whether a water column exists in the transparent groove through the photoelectric sensor to send an electric signal;
removing the transparent plate, and placing the wafer to be cleaned at the same position as the transparent plate;
and determining the cleaning position of the wafer to be cleaned according to the electric signal.
11. The method according to claim 10, wherein in the step of generating an electric signal by monitoring the presence or absence of the water column in the transparent tank by the photoelectric sensor,
if no water column exists in the transparent groove, a first signal lamp on the photoelectric sensor is on;
and if a water column is arranged in the transparent groove, a second signal lamp on the photoelectric sensor is on.
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| CN202011235545.2A CN112103220B (en) | 2020-11-09 | 2020-11-09 | Monitoring device and monitoring method for wafer cleaning position |
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| CN109755152A (en) * | 2017-11-08 | 2019-05-14 | 长鑫存储技术有限公司 | Semiconductor crystal wafer processing unit and semiconductor crystal wafer processing method |
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| US20050058775A1 (en) * | 2003-07-31 | 2005-03-17 | Akio Oku | Method and apparatus for forming coating film |
| CN105552007A (en) * | 2016-02-24 | 2016-05-04 | 北京七星华创电子股份有限公司 | Device and method for improving corrosion uniformity of chip |
| CN106842820A (en) * | 2017-03-28 | 2017-06-13 | 厦门市三安光电科技有限公司 | A kind of wafer rear coating process for reducing photoresistance number of bubbles |
| CN109755152A (en) * | 2017-11-08 | 2019-05-14 | 长鑫存储技术有限公司 | Semiconductor crystal wafer processing unit and semiconductor crystal wafer processing method |
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