CN112091532A - Heat conducting plate with built-in heat pipe and preparation method - Google Patents
Heat conducting plate with built-in heat pipe and preparation method Download PDFInfo
- Publication number
- CN112091532A CN112091532A CN202010757091.9A CN202010757091A CN112091532A CN 112091532 A CN112091532 A CN 112091532A CN 202010757091 A CN202010757091 A CN 202010757091A CN 112091532 A CN112091532 A CN 112091532A
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- CN
- China
- Prior art keywords
- heat
- conducting plate
- heat pipe
- deep hole
- solder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat conducting plate with a built-in heat pipe and a preparation method thereof, wherein a plurality of deep holes are processed in the heat conducting plate, the heat pipe is buried in the deep holes, so that double-side heat dissipation is realized, any shape can be processed on two sides of the heat conducting plate, solder is added into a gap between the heat pipe and the deep holes, induction welding is adopted to melt the solder, a stirring effect is realized, the gap is fully and uniformly filled, a welding seam is compact, the contact area of the heat pipe and an aluminum alloy plate is increased, the contact thermal resistance is reduced, the bonding strength is increased, the heat conductivity coefficient is improved, the performance index of the heat conducting plate is greatly improved, and the problem of reliability in connection.
Description
Technical Field
The invention belongs to the technical field of machining, and particularly relates to a design technology of a heat conduction structure.
Background
Electronic products have higher and higher integration level, higher requirements are provided for heat dissipation of component shells, the method for selecting materials with high heat conductivity cannot meet the heat dissipation requirements, and the market promotes rapid development of heat conducting plates in recent years.
The invention of the heat pipe is a great revolution of the heat conduction mode, the heat conductivity coefficient of the common heat pipe is generally higher than that of metal by one magnitude, the heat pipe breaks through the limitation of the heat conductivity coefficient of the traditional heat conduction material, the heat pipe heat conduction plate is composed of the heat pipe and an aluminum alloy plate, the heat is transferred from one end to the other end, and the local high temperature of the component is reduced.
The common connection method of the aluminum alloy plate and the heat pipe comprises compression joint, glue joint and brazing, the contact thermal resistance between the aluminum alloy and the heat pipe determines the heat conduction efficiency, and the contact thermal resistance of the compression joint and the glue joint is far greater than that of the brazing, so the brazing is the optimal of the three connection methods.
Brazing has brazing flux to remain, the solder is not filled fully to increase the problem of contact thermal resistance, prior art sets up the recess with heat-conducting plate one side, and the heat pipe imbeds in the recess, and the heat pipe concreties with the heat-conducting plate through the welding mode of full weld, and this kind of method has the problem in two respects: firstly, only one side can conduct heat, secondly, the heat pipe is exposed outside, which increases the protection difficulty,
disclosure of Invention
The invention provides a heat conducting plate with a built-in heat pipe and a preparation method thereof in order to solve the problems in the prior art, and the invention adopts the following technical scheme in order to achieve the purpose.
The heat conducting plate with the built-in heat pipe comprises: the heat pipe comprises a heat conducting plate and a heat pipe, wherein a plurality of deep holes are formed in the heat conducting plate, one end of each deep hole is closed, and the other end of each deep hole is open; the heat pipe is buried in a deep hole in the heat conduction plate, one end of the heat pipe is sealed in the heat conduction plate, the other end of the heat pipe is sealed by adopting solder, and the solder is filled in a gap between the heat pipe and the deep hole.
Further, the solder is reshaped in the gap by heating and solidification.
Further, the heat conducting plate is made of an aluminum alloy material.
The preparation method comprises the following steps: processing a plurality of deep holes in the heat conducting plate to enable the deep holes to penetrate through two ends of the heat conducting plate; coating an electroplated layer on the inner wall of the deep hole to ensure that the surface of the heat conducting plate has weldability; cleaning the interior of the deep hole, and plugging one end of the deep hole by adopting electron beam welding; coating the surface of the heat pipe with soldering flux and burying the soldering flux into the deep hole; and adding solder into the gap between the heat pipe and the deep hole, and simultaneously heating the heat conducting plate by adopting induction welding to ensure that the solder is in a molten state until the gap is filled, and stopping heating.
Furthermore, a plurality of square holes are processed by adopting linear cutting, and/or a plurality of round holes are processed by adopting a deep hole drill.
Further, the heat conducting plate is detected by X-ray, the solder is displayed in dark color, and if the dark color area does not have light color, the gap is filled with the solder.
The invention overcomes the technical problem that the high-efficiency heat dissipation on both sides cannot be realized because the surface is provided with the groove welding heat pipe in the prior art, slotting in the middle of the aluminum alloy plate, processing any shape on two sides of the heat conducting plate according to needs, inserting the heat pipe into the deep cavity, adopting induction brazing, having high speed, the temperature not exceeding the failure temperature of the reinforced aluminum alloy plate, stirring the solder by electromagnetic induction, fully filling the brazing seam after the solder is melted, having compact welding seam, embedding the heat pipe into the aluminum alloy plate, so that two sides of the aluminum alloy plate can conduct heat, solving the problem of high reliability of the connection of the heat pipe of the heat conducting plate and the aluminum alloy plate, improving the welding seam brazing rate and the contact area of the heat pipe and the aluminum alloy plate, reducing the contact thermal resistance, increasing the bonding strength, improving the heat conductivity coefficient, greatly improving the performance index of the heat conducting plate, having good heat conducting effect and wide popularization and application prospect.
Drawings
Fig. 1 is a front view of a heat conduction plate without a heat pipe embedded, fig. 2 is a front view of a heat conduction plate with a heat pipe embedded, fig. 3 is a plan view of the heat conduction plate, and fig. 4 is an X-ray inspection view.
Reference numerals: 1-aluminum alloy plate, 2-deep hole, 3-plugging, 4-heat pipe, 5-welding flux and 6-welding flux.
Detailed Description
The technical scheme of the invention is specifically explained in the following by combining the attached drawings.
The structure of the heat conducting plate with the built-in heat pipe is shown in figure 1, the heat conducting plate is made of metal with good heat dissipation performance, such as aluminum alloy and other materials, a plurality of deep holes 2 are machined in the aluminum alloy plate 1, the deep holes 2 penetrate through two ends of the aluminum alloy plate 1, and any shape can be machined on two sides of the aluminum alloy plate 1 without affecting heat transfer.
The method for processing the deep hole can adopt a linear cutting method to process a plurality of square holes and can also adopt a deep hole drill method to process a plurality of round holes, as shown in figure 3.
Coating an electroplated layer such as silver, tin and the like on the inner wall of the deep hole 2 to enable the surface of the aluminum alloy plate to have weldability, cleaning the interior of the deep hole, and plugging 3 one end of the deep hole by adopting electron beam welding, as shown in figure 2, so that one end of the deep hole 2 is closed and the other end is open.
The surface of the heat pipe 4 is coated with the soldering flux and is embedded into the deep hole, so that double-side heat conduction is realized, the heat pipe 4 is not welded on the surface of the aluminum alloy plate 1 through the grooves, the problem of reliability of connection between the heat pipe and the aluminum alloy plate is solved, as shown in fig. 2, one end of the heat pipe 4 is sealed inside the aluminum alloy plate, the other end of the heat pipe is communicated with the outside, and the soldering flux is added into a gap between the heat pipe and the deep hole.
Adopt induction welding heating aluminum alloy plate 1, the temperature is no longer than the failure temperature of the aluminum alloy plate after strengthening, makes welding flux 5 be in molten state rapidly, can also play the stirring effect to welding flux, even abundant filling up the clearance, stop the heating, welding flux is through heating and solidification's remolding in the clearance, and the welding seam is compact.
The heat conducting plate is detected by adopting X rays, the solder is displayed in a dark color, as shown in figure 4, if the dark color area does not have a light color, the gap is filled with the solder 5, the contact area between the heat pipe 4 and the aluminum alloy plate 1 is increased, the contact thermal resistance is reduced, the heat conductivity coefficient is improved, and the bonding strength is also increased.
The above-described embodiments are not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention are included in the scope of the present invention.
Claims (6)
1. A heat conducting plate with a built-in heat pipe is characterized by comprising: the heat pipe comprises a heat conducting plate and a heat pipe, wherein a plurality of deep holes are formed in the heat conducting plate, one end of each deep hole is closed, and the other end of each deep hole is open; the heat pipe is buried in a deep hole in the heat conduction plate, one end of the heat pipe is sealed in the heat conduction plate, the other end of the heat pipe is sealed by adopting solder, and the solder is filled in a gap between the heat pipe and the deep hole.
2. A heat-conducting plate of a built-in heat pipe according to claim 1, characterized in that the solder is remolded by heating and solidification in the gap.
3. A heat-conducting plate with a built-in heat pipe according to claim 1, wherein the heat-conducting plate is made of an aluminum alloy material.
4. A preparation method of a heat conducting plate with a built-in heat pipe is characterized by comprising the following steps: processing a plurality of deep holes in the heat conducting plate to enable the deep holes to penetrate through two ends of the heat conducting plate; coating an electroplated layer on the inner wall of the deep hole to ensure that the surface of the heat conducting plate has weldability; cleaning the interior of the deep hole, and plugging one end of the deep hole by adopting electron beam welding; coating the surface of the heat pipe with soldering flux and burying the soldering flux into the deep hole; and adding solder into the gap between the heat pipe and the deep hole, and simultaneously heating the heat conducting plate by adopting induction welding to ensure that the solder is in a molten state until the gap is filled, and stopping heating.
5. A method for preparing a heat-conducting plate with a built-in heat pipe according to claim 4, wherein the step of processing a plurality of deep holes in the heat-conducting plate comprises the following steps: and (3) processing a plurality of square holes by adopting linear cutting and/or processing a plurality of round holes by adopting a deep hole drill.
6. A method for preparing a heat-conducting plate with built-in heat pipe according to claim 4, further comprising: the heat conducting plate is detected by X-ray, the solder is displayed in dark color, and if the dark color area does not have light color, the gap is filled with the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010757091.9A CN112091532A (en) | 2020-07-31 | 2020-07-31 | Heat conducting plate with built-in heat pipe and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010757091.9A CN112091532A (en) | 2020-07-31 | 2020-07-31 | Heat conducting plate with built-in heat pipe and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112091532A true CN112091532A (en) | 2020-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010757091.9A Pending CN112091532A (en) | 2020-07-31 | 2020-07-31 | Heat conducting plate with built-in heat pipe and preparation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN112091532A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116171009A (en) * | 2022-12-30 | 2023-05-26 | 常州富烯科技股份有限公司 | Enhanced heat conducting fin based on graphene and preparation method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271862A (en) * | 1985-05-28 | 1986-12-02 | Furukawa Electric Co Ltd:The | Heat pipe type semiconductor cooler |
| JPH03175291A (en) * | 1989-12-01 | 1991-07-30 | Hitachi Cable Ltd | Method of burying and fixing heat pipe |
| CN2136698Y (en) * | 1992-10-28 | 1993-06-23 | 刘建堂 | High voltage insulator |
| GB2278676A (en) * | 1993-05-14 | 1994-12-07 | Furukawa Electric Co Ltd | Cooling electronic apparatus |
| CN101072483A (en) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101116886A (en) * | 2006-08-04 | 2008-02-06 | 捷飞有限公司 | Method for preparing samming board |
| US20090133855A1 (en) * | 2007-11-23 | 2009-05-28 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation device and assembly method thereof |
| CN107105603A (en) * | 2017-05-16 | 2017-08-29 | 天津锐新昌轻合金股份有限公司 | A kind of processing method of the aluminium alloy heat radiator coordinated with heat pipe |
| CN208624032U (en) * | 2018-07-17 | 2019-03-19 | 深圳市京视智能科技有限公司 | Intelligent temperature control panel |
| CN111442671A (en) * | 2020-04-30 | 2020-07-24 | 江苏海鋆自动化技术有限公司 | Electrochemical corrosion resistant radiator heat pipe embedded structure |
-
2020
- 2020-07-31 CN CN202010757091.9A patent/CN112091532A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271862A (en) * | 1985-05-28 | 1986-12-02 | Furukawa Electric Co Ltd:The | Heat pipe type semiconductor cooler |
| JPH03175291A (en) * | 1989-12-01 | 1991-07-30 | Hitachi Cable Ltd | Method of burying and fixing heat pipe |
| CN2136698Y (en) * | 1992-10-28 | 1993-06-23 | 刘建堂 | High voltage insulator |
| GB2278676A (en) * | 1993-05-14 | 1994-12-07 | Furukawa Electric Co Ltd | Cooling electronic apparatus |
| CN101072483A (en) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101116886A (en) * | 2006-08-04 | 2008-02-06 | 捷飞有限公司 | Method for preparing samming board |
| US20090133855A1 (en) * | 2007-11-23 | 2009-05-28 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation device and assembly method thereof |
| CN107105603A (en) * | 2017-05-16 | 2017-08-29 | 天津锐新昌轻合金股份有限公司 | A kind of processing method of the aluminium alloy heat radiator coordinated with heat pipe |
| CN208624032U (en) * | 2018-07-17 | 2019-03-19 | 深圳市京视智能科技有限公司 | Intelligent temperature control panel |
| CN111442671A (en) * | 2020-04-30 | 2020-07-24 | 江苏海鋆自动化技术有限公司 | Electrochemical corrosion resistant radiator heat pipe embedded structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116171009A (en) * | 2022-12-30 | 2023-05-26 | 常州富烯科技股份有限公司 | Enhanced heat conducting fin based on graphene and preparation method |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201218 |
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| RJ01 | Rejection of invention patent application after publication |