CN112082478A

CN112082478A - High-precision optical backlight type dimension measuring instrument

Info

Publication number: CN112082478A
Application number: CN202010924649.8A
Authority: CN
Inventors: 杨发
Original assignee: Shenzhen Cstarvision Technology Ltd
Current assignee: Shenzhen Cstarvision Technology Ltd
Priority date: 2020-09-05
Filing date: 2020-09-05
Publication date: 2020-12-15

Abstract

The invention discloses a high-precision optical backlight type dimension measuring instrument which comprises an LED (light emitting diode) luminescent lamp, a light homogenizing plate, a measured object, an optical LENS LENS, a CMOSsensor, an iCatch SOC (System on chip), a memory bank, an embedded intelligent operation unit, an ISP (Internet service provider) image processing unit, a USB (Universal Serial bus) interface, a Uart serial interface, an I/O (input/output) interface and an SD (secure digital) interface; the iCatch SOC is used for exchanging and converting data information of each module; the method comprises the steps of recording an acquired target through a CMOSsensor, leading an image into an iCatch SOC after the image is measured through an embedded intelligent operation unit and an ISP image processing unit, and leading out and archiving the image by the iCatch SOC; the problem that products with very high precision requirements cannot accurately measure the sizes of the products is solved, and the problem that some extremely fine products cannot measure the sizes of the products is solved; the precision can be as accurate as 0.001MM, and the cost is low.

Description

High-precision optical backlight type dimension measuring instrument

Technical Field

The invention relates to a measuring instrument, in particular to a high-precision optical backlight type dimension measuring instrument.

Background

Common measuring tools in life commonly use vernier calipers, tape measures and the like, but when some extremely thin products are measured, accurate measurement and archiving cannot be achieved.

Disclosure of Invention

The invention relates to a high-precision optical backlight type dimension measuring instrument, which aims to solve the technical problems that a CMOSsensor records an acquired target, an iCatch SOC is led in after image measurement is completed through an embedded intelligent operation unit and an ISP image processing unit, and then the iCatch SOC is led out and filed; the problem that products with very high precision requirements cannot accurately measure the sizes of the products is solved, and the problem that some extremely fine products cannot measure the sizes of the products is solved; the precision can be accurate to 0.001 MM; and the cost is low.

The high-precision optical backlight type dimension measuring instrument is realized by the following technical scheme: the system comprises an LED luminescent lamp, a light homogenizing plate, an object to be measured, an optical LENS LENS, a CMOSsensor, an iCatch SOC, a memory bank, an embedded intelligent operation unit, an ISP image processing unit, a USB interface, a Uart serial port, an I/O interface and an SD interface; the iCatch SOC is used for exchanging and converting data information of each module; the iCatch SOC is connected with a light homogenizing plate; the light homogenizing plate is provided with an LED light-emitting lamp; an optical LENS LENS is arranged opposite to the light equalizing plate, and a measured object is arranged between the light equalizing plate and the optical LENS LENS; the optical LENS LENS is arranged on the CMOSsensor; CMOSsensor is connected to iCatch SOC; the iCatch SOC is sequentially connected with the memory bank, the embedded intelligent operation unit and the ISP image processing unit.

As a preferred technical scheme, PWM is arranged in the iCatch SOC; PWM controls the brightness of the LED luminescent lamp; the CMOSsensor transmits the YUV image signal to the iCatch SOC through the parallel port signal.

As a preferred technical scheme, the ISP image processing unit transmits the processed image to the embedded intelligent operation unit; the embedded intelligent operation unit transmits the calculated image data to the memory bank; the memory bank imports the image into the iCatch SOC.

As the preferred technical scheme, the iCatch SOC is connected with a USB interface, a Uart serial port, an I/O interface and an SD interface; the SD interface is used for installing an SD card.

The invention has the beneficial effects that: according to the invention, the measurement problem of products with very high precision requirements is solved through the embedded intelligent operation unit and the ISP image processing unit, and the iCatch SOC is connected with the USB interface, the Uart serial port, the I/O interface and the SD interface; the data implementing the iCatch SOC process is transferred to the backend device and saved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic frame diagram of a high-precision optical backlight-type dimension measuring apparatus according to the present invention;

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms such as "upper," "above," "lower," "below," and the like in describing relative spatial positions herein is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "sleeved," "connected," "penetrating," "plugged," and the like are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

As shown in fig. 1, the high-precision optical backlight size measuring instrument of the present invention includes an LED light emitting lamp, a light equalizing plate, an object to be measured, an optical LENS, a cmos sensor, an iCatch SOC, a memory bank, an embedded intelligent arithmetic unit, an ISP image processing unit, a USB interface, a Uart serial port, an I/O interface, and an SD interface;

the iCatch SOC is used for exchanging and converting data information of each module; the iCatch SOC is connected with an LED light-emitting lamp; the LED luminescent lamp is provided with a light equalizing plate; an optical LENS LENS is arranged opposite to the light equalizing plate, and a measured object is arranged between the light equalizing plate and the optical LENS LENS; the optical LENS LENS is arranged on the CMOSsensor; the CMOSsensor is connected to the iCatch SOC; the iCatch SOC is sequentially connected with the memory bank, the embedded intelligent operation unit and the ISP image processing unit.

In this embodiment, PWM is provided in iCatch SOC; PWM controls the brightness of the LED luminescent lamp; the CMOSsensor transmits the YUV image signal to the iCatch SOC through the parallel port signal.

In the embodiment, the ISP image processing unit transmits the processed image to the embedded intelligent operation unit; the embedded intelligent operation unit transmits the calculated image data to the memory bank; the memory bank imports the image into the iCatch SOC.

In this embodiment, the iCatch SOC is connected to the USB interface, the Uart serial port, the I/O interface, and the SD interface; the SD interface is used for installing an SD card; and the use and storage of the equipment output to the back end through the interfaces.

The working process is as follows: placing an article to be measured between a light homogenizing plate and an optical LENS LENS, and acquiring an image of the article through a CMOSsensor; the CMOSsensor transmits the YUV image signal to the iCatch SOC through a parallel port signal; the graph is led into an iCatch SOC after being measured by an embedded intelligent operation unit and an ISP image processing unit, and the iCatch SOC leads out data through a USB interface, a Uart serial port and an I/O interface; archived by an SD card within the SD interface.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims

1. A high-precision optical backlight type dimension measuring instrument is characterized by comprising an LED (light emitting diode) luminescent lamp, a light homogenizing plate, a measured object, an optical LENS LENS, a CMOSsensor, an iCatch SOC (System on chip), a memory bank, an embedded intelligent operation unit, an ISP (Internet service provider) image processing unit, a USB (Universal Serial bus) interface, a Uart serial interface, an I/O (input/output) interface and an SD (secure digital) interface;

the iCatch SOC is used for exchanging and converting data information of each module; the iCatch SOC is connected with a light homogenizing plate; an optical LENS LENS is arranged opposite to the light equalizing plate, and a measured object is placed between the light equalizing plate and the optical LENS LENS; the optical LENS is connected to the CMOSsensor; the CMOSsensor is connected to the iCatch SOC; the iCatch SOC is sequentially connected with the memory bank, the embedded intelligent operation unit and the ISP image processing unit.

2. A high-precision optical backlit dimension meter as in claim 1, wherein: PWM is arranged in the iCatch SOC; the PWM controls the brightness of the LED luminescent lamp; the CMOSsensor transmits the YUV image signal to the iCatch SOC through a parallel port signal.

3. A high-precision optical backlit dimension meter as in claim 1, wherein: the ISP image processing unit transmits the processed image to the embedded intelligent operation unit; the embedded intelligent operation unit transmits the calculated image data to the memory bank; the memory bank imports the image into the iCatch SOC.

4. A high-precision optical backlit dimension meter as in claim 1, wherein: the iCatch SOC is connected with a USB interface, a Uart serial port, an I/O interface and an SD interface; the SD interface is used for installing an SD card.

5. A high-precision optical backlit dimension meter as in claim 1, wherein: and the light equalizing plate is provided with an LED light-emitting lamp.