CN112077064B - Turnover semiconductor cleaning tank - Google Patents
Turnover semiconductor cleaning tank Download PDFInfo
- Publication number
- CN112077064B CN112077064B CN202010904125.2A CN202010904125A CN112077064B CN 112077064 B CN112077064 B CN 112077064B CN 202010904125 A CN202010904125 A CN 202010904125A CN 112077064 B CN112077064 B CN 112077064B
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- Prior art keywords
- water tank
- water
- fixed
- transmission shaft
- gear
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
- B08B3/047—Containers specially adapted therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a turnover type semiconductor cleaning tank which comprises a plurality of water tanks arranged in a row, wherein adjacent water tanks are close to each other; a transverse rack is fixed in the middle of the upper end face of the water tank, a gear is meshed with the rack, a gear insert sleeve is fixed on a transmission shaft, two ends of the transmission shaft extend out of the front side and the rear side of the water tank and are inserted into bearing seats, the bearing seats are fixed on sliding blocks of rodless cylinders, the rodless cylinders are distributed on the front side and the rear side of the water tank and are fixed on a plurality of L-shaped support plates, and the support plates are welded and fixed on the front side wall and the rear side wall of the water tank; and silicon wafer loading boxes are arranged on the transmission shafts on two sides of the gear.
Description
Technical Field
The invention relates to the technical field of semiconductor cleaning equipment, in particular to a turnover type semiconductor cleaning tank.
Background
The integrated circuit chip made of the silicon chip is a conventional semiconductor product, and the silicon chip needs to be cleaned before the integrated circuit chip is made. The existing silicon wafer cleaning is firstly put into a liquid medicine tank for surface chemical treatment, and then is put into a cleaning tank (adopting pure water for cleaning, also called as a pure water tank) to clean the liquid medicine adhered to the surface. The specific cleaning method is to arrange the silicon wafer on a material frame bearing the silicon wafer, soak the material frame bearing the silicon wafer in a liquid medicine tank, lift the material frame, drain, and then put the material frame in a pure water tank for soaking and cleaning. The stroke of the material frame falls, lifts and translates to the upper part of the next cleaning tank, the actions need to be repeated for a plurality of times, when the last cleaning tank is reached, the material frame falls, lifts and translates to the upper part of the first cleaning tank, the stroke control of the material frame needs a plurality of control mechanisms to be matched and needs a complex control system, the structure is complex, the manufacturing cost is high, a simple control structure needs to be designed to control the production cost, and the market competitiveness is improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a turnover type semiconductor cleaning tank which adopts a rolling type cleaning and moving structure, simplifies a control structure while meeting the requirement of semiconductor cleaning, reduces the production cost and can improve the market competitiveness.
A turnover type semiconductor cleaning tank comprises a plurality of water tanks which are arranged in a row, wherein adjacent water tanks are close to each other; a transverse rack is fixed in the middle of the upper end face of the water tank, a gear is meshed with the rack, a gear insert sleeve is fixed on a transmission shaft, two ends of the transmission shaft extend out of the front side and the rear side of the water tank and are inserted into bearing seats, the bearing seats are fixed on sliding blocks of rodless cylinders, the rodless cylinders are distributed on the front side and the rear side of the water tank and are fixed on a plurality of L-shaped support plates, and the support plates are welded and fixed on the front side wall and the rear side wall of the water tank; silicon chip loading boxes are arranged on the transmission shafts on the two sides of the gear;
the silicon wafer loading box comprises a cylindrical shell, a sealing plate is formed at one end, close to a gear, of the shell, an end cover is inserted at the other end of the shell, a rib plate is formed on the outer wall of the lower end of the shell, a positioning sleeve is formed at the lower end of the rib plate, and the positioning sleeve is fixed on a transmission shaft in an inserting mode; and a plurality of water passing grooves are formed in the outer wall of the shell.
Preferably, the water passing grooves on the silicon wafer loading box are uniformly distributed in an annular shape around the central axis of the shell.
Preferably, the length of the silicon wafer loading box is less than the distance from the gear to the inner wall of the front side of the water tank or the distance from the gear to the inner wall of the rear side of the water tank; the diameter of the upper shell of the silicon wafer loading box is equal to 1/6-1/8 of the length of the water tank.
Preferably, the shortest distance from the outer wall of the upper shell of the silicon wafer loading box to the transmission shaft is greater than the distance from the upper end face of the water tank to the transmission shaft.
Preferably, support plate's lower terminal surface is gone up to support and is leaned on there being horizontal enhancement angle bar, strengthens the angle bar welded fastening on the lateral wall of basin, support plate be linear evenly distributed on strengthening the angle bar.
Preferably, a support frame with an L-shaped cross section is fixed on the upper end face of the support frame plate, the support frame is composed of a horizontal plate and a vertical plate, a transverse guide rail groove is formed in the vertical plate of the support frame, support shafts are formed at two ends of the transmission shaft, guide wheels are inserted and sleeved on the support shafts and abut against the horizontal plate of the support frame, and the support shafts penetrate through the guide rail groove of the support frame and are fixedly inserted in bearings of the bearing seats.
Preferably, two end surfaces of the guide wheel respectively abut against the vertical plate of the support frame and the end surface of the transmission shaft.
Preferably, the lower end of the front side wall of the water tank is fixedly provided with a water discharge pipe in an inserting mode, a transverse water inlet pipe is arranged under the rack, the water inlet pipe is fixedly connected to the water tank in an inserting mode and located at the upper portion of the water tank, and a plurality of water outlets are formed in the water inlet pipe and distributed in the water tank.
The invention has the beneficial effects that: the semiconductor cleaning device adopts a rolling type cleaning and moving structure, can meet the requirement of semiconductor cleaning and simultaneously simplifies a control structure compared with a lifting structure, reduces the production cost, and thus can improve the market competitiveness.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a side view of the present invention.
In the figure: 1. a water tank; 2. a rack; 3. a gear; 4. a drive shaft; 5. a silicon wafer loading box; 51. a housing; 511. a water trough; 512. a rib plate; 513. a positioning sleeve; 52. an end cap; 6. a bearing seat; 7. a water inlet pipe; 71. a water outlet; 8. a rodless cylinder; 9. a support frame; 91. a guide rail groove; 10. a guide wheel; 11. a mounting plate; 12. reinforcing angle iron; 13. and a water discharge pipe.
Detailed Description
Example (b): as shown in fig. 1 to 3, a turnover type semiconductor cleaning tank comprises a plurality of water tanks 1 arranged in a row, wherein adjacent water tanks 1 are close to each other; a transverse rack 2 is fixed in the middle of the upper end face of the water tank 1, a gear 3 is meshed on the rack 2, the gear 3 is inserted and fixed on a transmission shaft 4, two ends of the transmission shaft 4 extend out of the front side and the rear side of the water tank 1 and are inserted into bearing seats 6, the bearing seats 6 are fixed on sliding blocks of rodless cylinders 8, the rodless cylinders 8 are distributed on the front side and the rear side of the water tank 1 and are fixed on a plurality of L-shaped support plates 11, and the support plates 11 are welded and fixed on the front side wall and the rear side wall of the water tank 1; a silicon wafer loading box 5 is arranged on the transmission shaft 4 on the two sides of the gear 3;
the silicon wafer loading box 5 comprises a cylindrical shell 51, a sealing plate is formed at one end, close to the gear 3, of the shell 51, an end cover 52 is inserted at the other end of the shell 51, a rib plate 512 is formed on the outer wall of the lower end of the shell 51, a positioning sleeve 513 is formed at the lower end of the rib plate 512, and the positioning sleeve 513 is inserted and fixed on the transmission shaft 4; a plurality of water passing grooves 511 are formed on the outer wall of the housing 51.
The water passing grooves 511 of the silicon wafer loading cassette 5 are formed annularly and uniformly around the central axis of the housing 51.
The length of the silicon wafer loading box 5 is less than the distance from the gear 3 to the inner wall of the front side of the water tank 1 or the distance from the gear 3 to the inner wall of the rear side of the water tank 1; the diameter of the upper shell 51 of the silicon wafer loading box 5 is equal to 1/6-1/8 of the length of the water tank 1.
The shortest distance from the outer wall of the shell 51 on the silicon wafer loading box 5 to the transmission shaft 4 is greater than the distance from the upper end surface of the water tank 1 to the transmission shaft 4.
The lower end face of the support plate 11 is abutted with a transverse reinforcing angle iron 12, the reinforcing angle iron 12 is welded and fixed on the outer side wall of the water tank 1, and the support plate 11 is linearly and uniformly distributed on the reinforcing angle iron 12.
A support frame 9 with an L-shaped cross section is fixed on the upper end face of the support frame plate 11, the support frame 9 is composed of a horizontal plate and a vertical plate, a transverse guide rail groove 91 is formed in the vertical plate of the support frame 9, support shafts are formed at two ends of the transmission shaft 4, guide wheels 10 are sleeved on the support shafts in an inserting mode, the guide wheels 10 abut against the horizontal plate of the support frame 9, and the support shafts penetrate through the guide rail groove 91 of the support frame 9 and are fixedly inserted in bearings of the bearing seats 6.
Two end surfaces of the guide wheel 10 are respectively abutted against the vertical plate of the support frame 9 and the end surface of the transmission shaft 4.
The water outlet pipe 13 is fixedly connected to the lower end of the front side wall of the water tank 1 in an inserted mode, a transverse water inlet pipe 7 is arranged under the rack 2, the water inlet pipe 7 is fixedly connected to the water tank 1 in an inserted mode and located on the upper portion of the water tank 1, a plurality of water outlets 71 are formed in the water inlet pipe 7, and the water outlets 71 are distributed in the water tank 1.
The working principle is as follows: the invention is a turnover type semiconductor cleaning tank, which is composed of a plurality of water tanks 1 which are arranged in parallel and form a row, a rodless drive 8 is utilized to drive a transmission shaft 4 to move above the water tanks 1, the transmission shaft 4 can realize the rotation of the transmission shaft 4 by utilizing a gear 3 and a rack 2 in the moving process, so that a silicon wafer loading box 5 on the transmission shaft 4 can move in a rolling mode, and the silicon wafer loading box 5 can enter the water tanks 1 to be cleaned in the rolling process; therefore, the rodless drive 8 is mainly controlled to move while cleaning is realized. (it is also possible to replace the rodless drive 8 by a lead screw transmission mechanism).
The examples are intended to illustrate the invention, but not to limit it. The described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the present invention, and therefore, the scope of the appended claims should be accorded the full scope of the invention as set forth in the appended claims.
Claims (7)
1. A turnover type semiconductor cleaning tank comprises a plurality of water tanks (1) which are arranged in a row, wherein adjacent water tanks (1) are close to each other; the method is characterized in that: a transverse rack (2) is fixed in the middle of the upper end face of the water tank (1), a gear (3) is meshed on the rack (2), the gear (3) is inserted and fixed on a transmission shaft (4), two ends of the transmission shaft (4) extend out of the front side and the rear side of the water tank (1) and are inserted into bearing seats (6), the bearing seats (6) are fixed on sliding blocks of rodless cylinders (8), the rodless cylinders (8) are distributed on the front side and the rear side of the water tank (1) and are fixed on a plurality of L-shaped support plates (11), and the support plates (11) are welded and fixed on the front side wall and the rear side wall of the water tank (1); silicon chip loading boxes (5) are arranged on the transmission shafts (4) on the two sides of the gear (3);
the silicon wafer loading box (5) comprises a cylindrical shell (51), a sealing plate is formed at one end, close to the gear (3), of the shell (51), an end cover (52) is inserted into the other end of the shell (51), a rib plate (512) is formed on the outer wall of the lower end of the shell (51), a positioning sleeve (513) is formed at the lower end of the rib plate (512), and the positioning sleeve (513) is inserted and fixed on the transmission shaft (4); a plurality of water through grooves (511) are formed in the outer wall of the shell (51);
the water passing grooves (511) on the silicon wafer loading box (5) are uniformly distributed in a ring shape around the central axis of the shell (51).
2. The flip-type semiconductor cleaning tank as claimed in claim 1, wherein: the length of the silicon wafer loading box (5) is less than the distance from the gear (3) to the inner wall of the front side of the water tank (1) or the distance from the gear (3) to the inner wall of the rear side of the water tank (1); the diameter of the upper shell (51) of the silicon wafer loading box (5) is equal to 1/6-1/8 of the length of the water tank (1).
3. The flip-type semiconductor cleaning tank as claimed in claim 2, wherein: the shortest distance from the outer wall of the shell (51) to the transmission shaft (4) on the silicon wafer loading box (5) is greater than the distance from the upper end surface of the water tank (1) to the transmission shaft (4).
4. The flip-type semiconductor cleaning tank as claimed in claim 1, wherein: the lower end face of the support plate (11) is abutted against a transverse reinforcing angle iron (12), the reinforcing angle iron (12) is welded and fixed on the outer side wall of the water tank (1), and the support plate (11) is linearly and uniformly distributed on the reinforcing angle iron (12).
5. The flip-type semiconductor cleaning tank as claimed in claim 1, wherein: the support frame is characterized in that a support frame (9) with an L-shaped cross section is fixed on the upper end face of the support frame plate (11), the support frame (9) is composed of a horizontal plate and a vertical plate, a transverse guide rail groove (91) is formed in the vertical plate of the support frame (9), support shafts are formed at two ends of the transmission shaft (4), guide wheels (10) are sleeved on the support shafts, the guide wheels (10) abut against the horizontal plate of the support frame (9), and the support shafts penetrate through the guide rail groove (91) of the support frame (9) and are fixedly inserted in bearings of the bearing blocks (6).
6. The flip-type semiconductor cleaning tank as claimed in claim 5, wherein: and two end surfaces of the guide wheel (10) are respectively abutted against the vertical plate of the support frame (9) and the end surface of the transmission shaft (4).
7. The flip-type semiconductor cleaning tank as claimed in claim 6, wherein: the water tank is characterized in that a drain pipe (13) is fixedly connected to the lower end of the front side wall of the water tank (1) in an inserted mode, a transverse water inlet pipe (7) is arranged under the rack (2), the water inlet pipe (7) is fixedly connected to the water tank (1) in an inserted mode and located on the upper portion of the water tank (1), a plurality of water outlets (71) are formed in the water inlet pipe (7), and the water outlets (71) are distributed in the water tank (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010904125.2A CN112077064B (en) | 2020-09-01 | 2020-09-01 | Turnover semiconductor cleaning tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010904125.2A CN112077064B (en) | 2020-09-01 | 2020-09-01 | Turnover semiconductor cleaning tank |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112077064A CN112077064A (en) | 2020-12-15 |
| CN112077064B true CN112077064B (en) | 2021-11-05 |
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ID=73731852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010904125.2A Active CN112077064B (en) | 2020-09-01 | 2020-09-01 | Turnover semiconductor cleaning tank |
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| Country | Link |
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| CN (1) | CN112077064B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205926460U (en) * | 2016-06-30 | 2017-02-08 | 江西大杰新能源技术有限公司 | 360 roll and impel reciprocating type silicon chip washing tank |
| CN107658252A (en) * | 2017-11-16 | 2018-02-02 | 北京南轩兴达电子科技有限公司 | A kind of full-automatic silicon wafer cleans module |
| CN108889702A (en) * | 2018-08-11 | 2018-11-27 | 山东联盛电子设备有限公司 | A kind of double-station wafer cleaning machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7138539B2 (en) * | 2018-10-18 | 2022-09-16 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
-
2020
- 2020-09-01 CN CN202010904125.2A patent/CN112077064B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205926460U (en) * | 2016-06-30 | 2017-02-08 | 江西大杰新能源技术有限公司 | 360 roll and impel reciprocating type silicon chip washing tank |
| CN107658252A (en) * | 2017-11-16 | 2018-02-02 | 北京南轩兴达电子科技有限公司 | A kind of full-automatic silicon wafer cleans module |
| CN108889702A (en) * | 2018-08-11 | 2018-11-27 | 山东联盛电子设备有限公司 | A kind of double-station wafer cleaning machine |
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| Publication number | Publication date |
|---|---|
| CN112077064A (en) | 2020-12-15 |
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Effective date of registration: 20211019 Address after: 453000 first floor of B1 plant, intelligent manufacturing industrial park, Xinxiang economic and Technological Development Zone, Xinxiang City, Henan Province Applicant after: Henan Taixin Nano Technology Co.,Ltd. Address before: 341003 Ganzhou yerun automation equipment Co., Ltd. north of Gongyi Road, Hong Kong Industrial Park, Ganzhou Economic Development Zone, Ganzhou City, Jiangxi Province Applicant before: Ganzhou yerun automation equipment Co.,Ltd. |
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