CN112071790A - Wafer storage box placing and clamping mechanism - Google Patents

Wafer storage box placing and clamping mechanism Download PDF

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Publication number
CN112071790A
CN112071790A CN202010853883.6A CN202010853883A CN112071790A CN 112071790 A CN112071790 A CN 112071790A CN 202010853883 A CN202010853883 A CN 202010853883A CN 112071790 A CN112071790 A CN 112071790A
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CN
China
Prior art keywords
fixed
plate
top surface
wafer storage
block
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010853883.6A
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Chinese (zh)
Inventor
罗永胜
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Taizhou Laolin Decoration Co ltd
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Taizhou Laolin Decoration Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Taizhou Laolin Decoration Co ltd filed Critical Taizhou Laolin Decoration Co ltd
Priority to CN202010853883.6A priority Critical patent/CN112071790A/en
Publication of CN112071790A publication Critical patent/CN112071790A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer storage box placing and clamping mechanism which comprises a transverse conveying mechanism, wherein an extension plate is fixed on the top surface of a moving block of the transverse conveying mechanism, a buffer plate is installed on the top surface of the end part of the extension plate, an upper support frame is fixed on the top surface of the buffer plate, side limiting plates are fixed on the top surfaces of the edges of a top plate of the upper support frame, the lower part of a wafer storage box is positioned among the four side limiting plates, and the wafer storage box is pressed against the top surfaces of a plurality of elastic blocks fixed on the top surface of the top plate of the upper support frame. The wafer storage box can be clamped and fixed, is not easy to move, has a good buffering effect, greatly reduces vibration generated during movement, and ensures stable movement.

Description

Wafer storage box placing and clamping mechanism
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer storage box placing and clamping mechanism.
Background
Among some wafer processing equipment such as current lithography apparatus, it need be with the sealed storage box of a plurality of places of wafer, then, need be carried with transport trolley or manual work, need place it on the mount table that corresponds, and in order to guarantee that follow-up equipment snatchs effects such as stable, need firmly fix the storage box on the mount table, current fixed mode is vertical a plurality of reference columns on the mount table, insert the locating hole on the bottom plate of storing the box through the reference column, it is fixed and unstable, when receiving slight collision, store the easy slope of box and remove.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a wafer storage box placing and clamping mechanism which can ensure that a wafer storage box is clamped and fixed and is not easy to move, has good buffering effect, greatly reduces the vibration generated during the movement and ensures the stable movement.
The technical solution of the invention is as follows:
a wafer storage box placing and clamping mechanism comprises a transverse conveying mechanism, wherein an extension plate is fixed on the top surface of a moving block of the transverse conveying mechanism, a buffer plate is installed on the top surface of the end part of the extension plate, an upper support frame is fixed on the top surface of the buffer plate, side limiting plates are fixed on the top surfaces of the edge parts of a top plate of the upper support frame, the lower part of a wafer storage box is positioned among the four side limiting plates, and the wafer storage box is pressed against the top surfaces of a plurality of elastic blocks fixed on the top surface of the top plate of the upper support frame;
the bottom surface middle part of the middle part backup pad of upper bracket frame is fixed with the lift cylinder, the push rod that promotes the cylinder passes the top surface of middle support plate and is fixed with the promotion post, promote the post plug bush in the middle part through-hole of the roof of upper bracket frame, the top that promotes the post stretches out the middle part through-hole is fixed with the toper piece, two circular arc blocks are in the both sides of toper piece, the lateral wall of toper piece presses on the interior toper lateral wall of circular arc block, the upper portion shaping of the lateral wall of two circular arc blocks has location arc bellying, the upper portion plug bush of two circular arc blocks is in the locating hole that the bottom surface middle part shaping of wafer storage box has, location arc bellying nestification is in the arc constant head tank that the shaping has on the inside wall of locating hole.
The top surface of the top plate of the upper support frame is fixedly provided with a ring sleeve body, the left inner side wall and the right inner side wall of the ring sleeve body are respectively fixedly provided with a spring, and the opposite ends of the two springs are respectively fixed on the outer side walls of the corresponding circular arc blocks.
And an upper elastic limiting block is fixed on the top surface of the arc block body, and the top surface of the upper elastic limiting block is tightly attached to the top surface of the positioning hole.
The middle top surface of the middle supporting plate is fixed with a guide sleeve, and a push rod of the lifting cylinder is inserted in the guide sleeve.
The self-lubricating sleeve is fixed on the inner side wall of the guide sleeve, a connecting plate is formed at the top end of a push rod of the lifting cylinder, the bottom end of the pushing column is fixed on the top surface of the connecting plate, and the outer side wall of the connecting plate is tightly attached to the inner side wall of the self-lubricating sleeve.
The top surface of the end part of the extension plate is fixed with a fixed bottom plate, the top surface of the fixed bottom plate is fixed with a plurality of buffering elastic blocks, and the buffering plate is fixed on the top surfaces of all the buffering elastic blocks.
The transverse conveying mechanism (10) comprises a guide groove body, a transverse moving screw rod is inserted in the guide groove body in a sleeved mode, two ends of the transverse moving screw rod are hinged to a left end plate and a right end plate of the guide groove body through bearings, a moving motor is fixed on the outer side wall of one end plate and drives the transverse moving screw rod to rotate, and a moving block is connected to the transverse moving screw rod in a threaded mode.
The bottom surface of the moving block is fixed with a sliding block, the top surface of the bottom plate of the guide groove body is fixed with a guide strip, and the upper portion of the guide strip is inserted in a sliding groove formed in the middle of the bottom surface of the sliding block.
The invention has the beneficial effects that: it can guarantee to store the box centre gripping fixed with the wafer, is difficult to remove, and its buffering effect is good moreover, and the vibration that produces when greatly reduced it removes guarantees to remove stably.
Drawings
FIG. 1 is a partial cross-sectional view of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
fig. 3 is a partial bottom view between two circular arc blocks of the present invention.
Detailed Description
Example (b): as shown in fig. 1 to 3, a wafer storage box placing and clamping mechanism includes a transverse conveying mechanism 10, an extension plate 12 is fixed on a top surface of a moving block 11 of the transverse conveying mechanism 10, a buffer plate 13 is installed on a top surface of an end portion of the extension plate 12, an upper support frame 20 is fixed on a top surface of the buffer plate 13, side limiting plates 21 are fixed on top surfaces of side portions of a top plate of the upper support frame 20, a lower portion of a wafer storage box 100 is located between the four side limiting plates 21, and the wafer storage box 100 is pressed against top surfaces of a plurality of elastic blocks 1 fixed on the top surface of the top plate of the upper support frame 20;
a lifting cylinder 23 is fixed in the middle of the bottom surface of the middle support plate 22 of the upper support frame 20, a push rod of the lifting cylinder 23 penetrates through the top surface of the middle support plate 22 and is fixed with a push column 24, the push column 24 is inserted and sleeved in a middle through hole 25 of the top plate of the upper support frame 20, the top end of the pushing column 24 extends out of the top surface of the middle through hole 25 and is fixed with a conical block 26, the two arc blocks 27 are positioned at two sides of the conical block 26, the outer side wall of the conical block 26 is pressed against the inner conical side wall of the arc block 27, the upper parts of the outer side walls of the two arc blocks 27 are formed with positioning arc-shaped convex parts 271, the upper parts of the two arc blocks 27 are inserted and sleeved in positioning holes 101 formed in the middle of the bottom surface of the wafer storage box 100, the positioning arc-shaped boss 271 is nested in an arc-shaped positioning groove formed on the inner side wall of the positioning hole 101, and the upper outer side wall of the arc block 27 is pressed against the inner side wall of the positioning hole 101.
Furthermore, a circular ring sleeve 28 is fixed on the top surface of the top plate of the upper support frame 20, springs 29 are fixed on the left inner side wall and the right inner side wall of the circular ring sleeve 28, and the opposite ends of the two springs 29 are fixed on the outer side walls of the corresponding circular arc blocks 27.
Furthermore, the top surface of the arc block 27 is fixed with an upper elastic limiting block 2, and the top surface of the upper elastic limiting block 2 is tightly attached to the top surface of the positioning hole 101.
Further, a guide sleeve 3 is fixed on the top surface of the middle part of the middle support plate 22, and a push rod of the lifting cylinder 23 is inserted in the guide sleeve 3.
Further, be fixed with self-lubricating cover 4 on the inside wall of uide bushing 3, the top shaping of the push rod of promotion cylinder 23 has the connecting plate, and the bottom mounting that promotes post 24 is on the top surface of connecting plate, and the inside wall of self-lubricating cover 4 is hugged closely to the lateral wall of connecting plate.
Further, a fixed base plate 14 is fixed to the top surface of the end portion of the extension plate 12, a plurality of buffer elastic blocks 15 are fixed to the top surface of the fixed base plate 14, and the buffer plate 13 is fixed to the top surfaces of all the buffer elastic blocks 15.
Further, the transverse conveying mechanism 10 includes a guide groove body 16, a transverse moving screw 17 is inserted in the guide groove body 16, two ends of the transverse moving screw 17 are hinged to two left and right end plates of the guide groove body 16 through bearings, a moving motor 18 is fixed on the outer side wall of one of the end plates, an output shaft of the moving motor 18 is a spline shaft, the spline shaft is inserted in a spline hole formed in one end of the transverse moving screw 17, the moving motor 18 drives the transverse moving screw 17 to rotate, and a moving block 11 is screwed on the transverse moving screw 17.
Further, a sliding block 111 is fixed on the bottom surface of the moving block 11, a guide bar 161 is fixed on the top surface of the bottom plate of the guide groove body 16, and the upper portion of the guide bar 161 is inserted into a sliding groove formed in the middle of the bottom surface of the sliding block 111.
In this embodiment, when using, place the wafer storage box 100 between four side limiting plates 21, the wafer storage box 100 presses on the top surface of the roof of upper support frame 20 on the top surface of a plurality of elastic blocks 1 that are fixed with, simultaneously, the upper portion of two circular arc block bodies 27 inserts in locating hole 101, then, push rod through lift cylinder 23 promotes, make conical block 26 promote, outwards promote two circular arc block bodies 27, make location arc bellying 271 nestification in the arc constant head tank that the shaping has on the inside wall of locating hole 101, realize the centre gripping of wafer storage box 100 is fixed, then, through the operation of mobile motor 18, realize the lateral shifting of wafer storage box 100, realize the transportation.

Claims (8)

1. A wafer storage box placing and clamping mechanism comprises a transverse conveying mechanism (10), and is characterized in that: an extension plate (12) is fixed on the top surface of a moving block (11) of the transverse conveying mechanism (10), a buffer plate (13) is installed on the top surface of the end portion of the extension plate (12), an upper support frame (20) is fixed on the top surface of the buffer plate (13), side limiting plates (21) are fixed on the top surfaces of the edges of a top plate of the upper support frame (20), the lower portion of a wafer storage box (100) is located among the four side limiting plates (21), and the wafer storage box (100) is pressed against the top surfaces of a plurality of elastic blocks (1) fixed on the top surface of the top plate of the upper support frame (20);
a lifting cylinder (23) is fixed in the middle of the bottom surface of a middle supporting plate (22) of an upper supporting frame (20), a push rod of the lifting cylinder (23) penetrates through the top surface of the middle supporting plate (22) and is fixed with a pushing column (24), the pushing column (24) is inserted and sleeved in a middle through hole (25) of a top plate of the upper supporting frame (20), the top end of the pushing column (24) extends out of the top surface of the middle through hole (25) and is fixed with a conical block (26), two arc blocks (27) are positioned at two sides of the conical block (26), the outer side wall of the conical block (26) is pressed against the inner conical side wall of the arc block (27), positioning arc-shaped protrusions (271) are formed at the upper parts of the outer side walls of the two arc blocks (27), the upper parts of the two arc blocks (27) are inserted and sleeved in positioning holes (101) formed in the middle of the bottom surface of a wafer storage box (100), and the positioning arc-shaped protrusions, the upper outer side wall of the arc block body (27) is pressed against the inner side wall of the positioning hole (101).
2. The wafer storage cassette placing and clamping mechanism of claim 1, wherein: the top surface of the top plate of the upper support frame (20) is fixed with a ring sleeve body (28), the left inner side wall and the right inner side wall of the ring sleeve body (28) are respectively fixed with a spring (29), and the opposite ends of the two springs (29) are respectively fixed on the outer side walls of the corresponding arc block bodies (27).
3. The wafer storage cassette placing and clamping mechanism of claim 1, wherein: the top surface of the arc block body (27) is fixed with an upper elastic limiting block (2), and the top surface of the upper elastic limiting block (2) is tightly attached to the top surface of the positioning hole (101).
4. The wafer storage cassette placing and clamping mechanism of claim 1, wherein: the middle top surface of the middle supporting plate (22) is fixed with a guide sleeve (3), and a push rod of the lifting cylinder (23) is inserted in the guide sleeve (3).
5. The wafer storage cassette placing and clamping mechanism of claim 4, wherein: be fixed with on the inside wall of uide bushing (3) from lubricated cover (4), the top shaping of the push rod of promotion cylinder (23) has the connecting plate, and the bottom mounting that promotes post (24) is on the top surface of connecting plate, and the inside wall of self-lubricating cover (4) is hugged closely to the lateral wall of connecting plate.
6. The wafer storage cassette placing and clamping mechanism of claim 1, wherein: the top surface of the end part of the extension plate (12) is fixed with a fixed bottom plate (14), the top surface of the fixed bottom plate (14) is fixed with a plurality of buffering elastic blocks (15), and the buffering plate (13) is fixed on the top surfaces of all the buffering elastic blocks (15).
7. The wafer storage cassette placing and clamping mechanism of claim 1, wherein: the transverse conveying mechanism (10) comprises a guide groove body (16), a transverse moving screw rod (17) is inserted in the guide groove body (16), two ends of the transverse moving screw rod (17) are hinged to a left end plate and a right end plate of the guide groove body (16) through bearings, a moving motor (18) is fixed on the outer side wall of one end plate, the moving motor (18) drives the transverse moving screw rod (17) to rotate, and a moving block (11) is connected to the transverse moving screw rod (17) in a threaded mode.
8. The wafer storage cassette placing and clamping mechanism of claim 7, wherein: the bottom surface of the moving block (11) is fixed with a sliding block (111), the top surface of the bottom plate of the guide groove body (16) is fixed with a guide strip (161), and the upper portion of the guide strip (161) is inserted in a sliding groove formed in the middle of the bottom surface of the sliding block (111).
CN202010853883.6A 2020-08-24 2020-08-24 Wafer storage box placing and clamping mechanism Pending CN112071790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010853883.6A CN112071790A (en) 2020-08-24 2020-08-24 Wafer storage box placing and clamping mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010853883.6A CN112071790A (en) 2020-08-24 2020-08-24 Wafer storage box placing and clamping mechanism

Publications (1)

Publication Number Publication Date
CN112071790A true CN112071790A (en) 2020-12-11

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CN202010853883.6A Pending CN112071790A (en) 2020-08-24 2020-08-24 Wafer storage box placing and clamping mechanism

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Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW490076U (en) * 2000-05-12 2002-06-01 Prosys Technology Integration Elevated apparatus for vertical elevation conveying wafer with precise positioning function
JP2004253756A (en) * 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd Substrate mounting apparatus, carrying arm, positioning methodology of semiconductor wafer, and device and method for inspecting substrate
CN1555331A (en) * 2001-07-14 2004-12-15 诚实公司 Protective shipper
CN1941313A (en) * 2005-09-29 2007-04-04 中芯国际集成电路制造(上海)有限公司 Guide track transmissioner of crystal-boat box with safety baffle
CN201094136Y (en) * 2007-10-26 2008-07-30 澔睿股份有限公司 Box door with anti-separating structure standard mechanical interface wafer box
CN103132121A (en) * 2011-11-30 2013-06-05 大日本网屏制造株式会社 Anodizing apparatus, an anodizing system having the same, and a semiconductor wafer
CN205102812U (en) * 2015-11-24 2016-03-23 台州市计量技术研究院 Silicon chip conveying measuring device
CN205984921U (en) * 2016-08-25 2017-02-22 麦斯克电子材料有限公司 A equidistance position control ware that is used for relative silicon chip piece grooved case to carry out position control
CN106898683A (en) * 2017-04-12 2017-06-27 东莞职业技术学院 A kind of LED wafer support packaging system and method for packing
CN108526792A (en) * 2018-06-11 2018-09-14 佛山市华普瑞联机电科技有限公司 A kind of central portion welding clamping device
CN208575457U (en) * 2018-06-11 2019-03-05 佛山市华普瑞联机电科技有限公司 A kind of central portion welding top positioning and clamping mechanism of clamping device
CN208575427U (en) * 2018-06-11 2019-03-05 佛山市华普瑞联机电科技有限公司 Clamping device is used in a kind of welding of central portion
CN110289238A (en) * 2019-06-13 2019-09-27 上海提牛机电设备有限公司 Wafer frame box horizontally moving device and wafer feeding system
CN210272296U (en) * 2019-09-06 2020-04-07 上海华力集成电路制造有限公司 Loading platform limiting device
CN210607195U (en) * 2020-04-07 2020-05-22 利德仕智能科技(苏州)有限公司 Packaging equipment

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW490076U (en) * 2000-05-12 2002-06-01 Prosys Technology Integration Elevated apparatus for vertical elevation conveying wafer with precise positioning function
CN1555331A (en) * 2001-07-14 2004-12-15 诚实公司 Protective shipper
JP2004253756A (en) * 2002-12-24 2004-09-09 Hitachi High-Tech Electronics Engineering Co Ltd Substrate mounting apparatus, carrying arm, positioning methodology of semiconductor wafer, and device and method for inspecting substrate
CN1941313A (en) * 2005-09-29 2007-04-04 中芯国际集成电路制造(上海)有限公司 Guide track transmissioner of crystal-boat box with safety baffle
CN201094136Y (en) * 2007-10-26 2008-07-30 澔睿股份有限公司 Box door with anti-separating structure standard mechanical interface wafer box
CN103132121A (en) * 2011-11-30 2013-06-05 大日本网屏制造株式会社 Anodizing apparatus, an anodizing system having the same, and a semiconductor wafer
CN205102812U (en) * 2015-11-24 2016-03-23 台州市计量技术研究院 Silicon chip conveying measuring device
CN205984921U (en) * 2016-08-25 2017-02-22 麦斯克电子材料有限公司 A equidistance position control ware that is used for relative silicon chip piece grooved case to carry out position control
CN106898683A (en) * 2017-04-12 2017-06-27 东莞职业技术学院 A kind of LED wafer support packaging system and method for packing
CN108526792A (en) * 2018-06-11 2018-09-14 佛山市华普瑞联机电科技有限公司 A kind of central portion welding clamping device
CN208575457U (en) * 2018-06-11 2019-03-05 佛山市华普瑞联机电科技有限公司 A kind of central portion welding top positioning and clamping mechanism of clamping device
CN208575427U (en) * 2018-06-11 2019-03-05 佛山市华普瑞联机电科技有限公司 Clamping device is used in a kind of welding of central portion
CN110289238A (en) * 2019-06-13 2019-09-27 上海提牛机电设备有限公司 Wafer frame box horizontally moving device and wafer feeding system
CN210272296U (en) * 2019-09-06 2020-04-07 上海华力集成电路制造有限公司 Loading platform limiting device
CN210607195U (en) * 2020-04-07 2020-05-22 利德仕智能科技(苏州)有限公司 Packaging equipment

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