CN112070194A - Novel technology for laser metal two-dimensional code product technology - Google Patents
Novel technology for laser metal two-dimensional code product technology Download PDFInfo
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- CN112070194A CN112070194A CN202010922049.8A CN202010922049A CN112070194A CN 112070194 A CN112070194 A CN 112070194A CN 202010922049 A CN202010922049 A CN 202010922049A CN 112070194 A CN112070194 A CN 112070194A
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- laser
- metal matrix
- dimensional code
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- magnetron sputtering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06037—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking multi-dimensional coding
Abstract
The invention discloses a novel technology of a laser metal two-dimensional code product, and particularly relates to the technical field of two-dimensional code etching. According to the invention, the heat conduction film layer is added on the lower layer of the laser thermal etching film to change the temperature field distribution in the laser thermal etching film, so that the heat diffusion in the horizontal direction in the thermal etching film layer can be effectively reduced, and the size of the effective thermal change threshold of the laser thermal etching material under the action of a laser beam is also reduced, so that the structure of the laser thermal etching film is simple, the controllability of the preparation process parameters is good, the resolution of the laser thermal etching two-dimensional code can be effectively improved, and the response speed of the two-dimensional code can be improved.
Description
Technical Field
The invention relates to the technical field of two-dimension code etching, in particular to a novel technology of a laser metal two-dimension code product.
Background
The two-dimensional bar code/two-dimensional code (2-dimensional bar code) is a figure which is distributed on a plane (two-dimensional direction) according to a certain rule by using a certain specific geometric figure, is alternate between black and white and records data symbol information, skillfully utilizes the concept of '0' and '1' bit stream which forms the internal logic basis of a computer in code programming, uses a plurality of geometric forms corresponding to binary systems to represent character numerical value information, and realizes automatic information processing by automatic reading of an image input device or a photoelectric scanning device: it has some commonality of barcode technology: each code system has its specific character set, each character occupies a certain width, has a certain checking function, etc., and also has the function of automatically identifying information of different rows and processing figure rotation change points.
With the continuous development of information technology, the preparation of a micro-nano graph structure with higher resolution is increasingly required, and in order to meet the requirement of a laser thermal etching technology in practical application, on the basis of preparing the micro-nano graph structure by utilizing the thermal change threshold effect of a laser thermal etching material, the resolution of the laser thermal etching graph is further improved.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a novel technology for a laser metal two-dimensional code product process, and the technical problems to be solved by the invention are as follows: the general laser etching method improves the resolution of the prepared micro-nano structure by reducing the acting wavelength of laser and increasing the numerical aperture of an objective lens, but along with the shortening of the wavelength of the laser and the increase of the numerical aperture, the improvement of the resolution is limited, and the identification speed of a two-dimensional code is influenced.
In order to achieve the purpose, the invention provides the following technical scheme: a new technology for a laser metal two-dimensional code product process comprises the following steps:
s1, processing pretreatment:
firstly, carrying out mechanical casting and machining molding on a metal matrix, then carrying out primary cleaning and machining treatment on the surface of the metal matrix, cleaning the metal matrix, then using absolute ethyl alcohol to carry out surface cleaning work on the metal matrix, then carrying out surface cleaning work on the metal matrix through acetone liquid, achieving twice thorough cleaning work on the metal matrix through the absolute ethyl alcohol and the acetone liquid, then carrying out drying treatment operation on the cleaned metal matrix through an air cooler, and after the metal matrix is air-dried, then using a sand blasting machine or polishing equipment to carry out uniform polishing treatment on the surface of the metal matrix, so that the surface of the metal matrix is smooth.
S2, sputtering of the coating film:
fixing a metal matrix by a substrate support of a magnetron sputtering instrument, clamping and fixing the substrate support fixed with the metal matrix on a substrate seat of an internal vacuum cavity of the magnetron sputtering instrument, closing a vacuum cavity door of the magnetron sputtering instrument, keeping the vacuum cavity in a sealed state, vacuumizing the vacuum cavity of the magnetron sputtering instrument, introducing argon when the vacuum degree of the internal vacuum sputtering cavity is more than 2 x 15-4Pa, controlling the introduction amount of the argon by a gas flowmeter of the magnetron sputtering instrument, controlling the introduction amount of the argon to be 50-90sccm, simultaneously implementing a gate valve of the magnetron sputtering instrument to ensure that the working pressure is maintained at 0.65-0.95Pa, adding 1-5kV direct current voltage on two electrodes of the magnetron sputtering instrument to generate glow discharge, forming a high-density plasma area near a target (cathode), namely, generating a sputtering effect by ions in the negative glow area under the acceleration of the direct current voltage of the target, atoms sputtered from the surface of the target material are deposited on a metal substrate to form a heat conduction film layer, then the operation is carried out in a radio frequency sputtering mode, a radio frequency alternating current power supply is connected indirectly to two electrodes, electrons which continuously move in plasma between the two electrodes obtain energy from a high-frequency electric field at the moment, the electrons collide with gas molecules, the gas molecules are ionized to generate a large number of ions and electrons, the target material is automatically positioned under a large negative potential at the moment, the gas ions generate a sputtering bombardment effect on the target material, and a heat etching film coating is formed on the heat conduction film layer at the moment.
S3, laser etching preparation:
connecting computer with laser via control line connector, converting the two-dimensional code into digital transmission signal, inputting into laser controller, then converting into current control signal by programming calculation, inputting into driver of laser, the driver forming response control signal, and the deflection travel angles of the reflection pillow mirror in the x direction and the y direction are respectively controlled by control signals, at the moment, the laser beam is focused on the surface of the metal matrix, a series of chemical bond fractures are triggered by the photoelectric and photothermal action of laser beams, the materials receive heat energy to be pressed and melted, the materials are caused to be re-solidified or evaporated, meanwhile, explosive phase change occurs, so that the laser beam can move in a track manner according to a set pattern, and further permanent nicks can be formed on the surface of the workpiece by etching, and the etched two-dimensional code is obtained.
S4, coating treatment:
and uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the first time, baking at the temperature of 160-220 ℃, uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the second time after the texture of the etched area of the metal matrix is dried, and performing high-temperature treatment at the temperature of 180-250 ℃ to ensure that the coating on the etched area of the metal matrix is tighter and the spraying processing technology is finished.
As a further scheme of the invention: the driver is in high-precision servo control consisting of a servo control card and a swing motor, and the swing motor can swing an angular servo control card according to an input driving signal and a conversion ratio of a certain voltage and an angle to output two paths of galvanometer control signals and one path of laser control pulse signal.
As a further scheme of the invention: the servo control card has the functions of compact size and high full-precision anti-interference strength, can be in communication connection with external equipment and can be mutually controlled.
As a further scheme of the invention: the laser power of the laser device is 500-7000W/mm2, and the incident angle is about 60 degrees relative to the surface of the metal substrate.
As a further scheme of the invention: the time for spraying the fluorocarbon coating for the first time in the step S4 is 15-30min, and the time for spraying the fluorocarbon coating for the second time in the step S4 is 18-40 min.
As a further scheme of the invention: the heat etching film layer is made of tellurium-antimony alloy, and the heat conduction film layer is made of silver (Ag), copper (Cu), aluminum (Al) or silicon (Si) with high heat conductivity.
The invention has the beneficial effects that:
1. the invention emits laser beams through the laser device, when the laser beams are focused on the thermal etching film layer of the metal substrate, the heat in the thermal etching film layer is changed, the heat is mainly diffused along the horizontal direction, simultaneously, the thermal conduction film layer under the thermal etching layer is also heated, and because the thermal conductivity of the thermal etching film is smaller than that of the thermal conduction film layer, the heat originally diffused in the thermal etching film layer along the horizontal direction is converted into heat mainly diffused along the vertical direction for heat conduction and vertical diffusion, thereby effectively reducing the heat diffusion in the horizontal direction in the thermal etching film layer, simultaneously reducing the size of the effective thermal change threshold value of the laser thermal etching material under the action of the laser beams, leading the invention to have simple structure and good controllability of preparation process parameters, and effectively improving the resolution ratio of the laser thermal etching two-dimensional code, thereby, the response speed of the two-dimensional code can be improved.
2. According to the invention, the fluorocarbon coating is sprayed on the etching area twice, so that the coating is tighter, and the fluororesin is used as the coating of the main film forming substance, so that the surface three-dimensional effect of the etched two-dimensional code is more obvious, wear-resistant and vivid, the high-gloss texture of the product is fully embodied, the surface gloss of the product is mellow, the metal texture is more obvious, and the effects of durability, economy and practicability are achieved.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1, comprising the steps of:
s1, processing pretreatment:
firstly, carrying out mechanical casting and machining molding on a metal matrix, then carrying out primary cleaning and machining treatment on the surface of the metal matrix, cleaning the metal matrix, then using absolute ethyl alcohol to carry out surface cleaning work on the metal matrix, then carrying out surface cleaning work on the metal matrix through acetone liquid, achieving twice thorough cleaning work on the metal matrix through the absolute ethyl alcohol and the acetone liquid, then carrying out drying treatment operation on the cleaned metal matrix through an air cooler, and after the metal matrix is air-dried, then using a sand blasting machine or polishing equipment to carry out uniform polishing treatment on the surface of the metal matrix, so that the surface of the metal matrix is smooth.
S2, sputtering of the coating film:
fixing a metal matrix by a substrate support of a magnetron sputtering instrument, clamping and fixing the substrate support fixed with the metal matrix on a substrate seat of an internal vacuum cavity of the magnetron sputtering instrument, closing a vacuum cavity door of the magnetron sputtering instrument, keeping the vacuum cavity in a sealed state, vacuumizing the vacuum cavity of the magnetron sputtering instrument, introducing argon when the vacuum degree of the internal vacuum sputtering cavity is more than 2 x 15 < -4 > Pa, controlling the introduction amount of the argon by a gas flow meter of the magnetron sputtering instrument, controlling the introduction amount of the argon to be 50sccm, simultaneously implementing a gate valve of the magnetron sputtering instrument to maintain the working air pressure at 0.65Pa, adding 1-5kV direct current voltage on two electrodes of the magnetron sputtering instrument to generate glow discharge, forming a high-density plasma area near a target (cathode), namely, bombarding the target in the area in a negative glow area under the acceleration of the direct current voltage to generate a sputtering effect, atoms sputtered from the surface of the target material are deposited on a metal substrate to form a heat conduction film layer, then the operation is carried out in a radio frequency sputtering mode, a radio frequency alternating current power supply is connected indirectly to two electrodes, electrons which continuously move in plasma between the two electrodes obtain energy from a high-frequency electric field at the moment, the electrons collide with gas molecules, the gas molecules are ionized to generate a large number of ions and electrons, the target material is automatically positioned under a large negative potential at the moment, the gas ions generate a sputtering bombardment effect on the target material, and a heat etching film coating is formed on the heat conduction film layer at the moment.
S3, laser etching preparation:
connecting computer with laser via control line connector, converting the two-dimensional code into digital transmission signal, inputting into laser controller, then converting into current control signal by programming calculation, inputting into driver of laser, the driver forming response control signal, and the deflection travel angles of the reflection pillow mirror in the x direction and the y direction are respectively controlled by control signals, at the moment, the laser beam is focused on the surface of the metal matrix, a series of chemical bond fractures are triggered by the photoelectric and photothermal action of laser beams, the materials receive heat energy to be pressed and melted, the materials are caused to be re-solidified or evaporated, meanwhile, explosive phase change occurs, so that the laser beam can move in a track manner according to a set pattern, and further permanent nicks can be formed on the surface of the workpiece by etching, and the etched two-dimensional code is obtained.
S4, coating treatment:
and uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the first time, baking at the temperature of 160 ℃, uniformly spraying fluorocarbon coating for the second time after the texture of the etched area of the metal matrix is dried, and performing high-temperature treatment at 180 ℃ to ensure that the coating of the etched area of the metal matrix is tighter and the spraying processing technology is finished.
The driver is a high-precision servo control consisting of a servo control card and a swing motor, and the swing motor can swing an angular servo control card according to an input driving signal and a conversion ratio of a certain voltage and an angle to output two paths of galvanometer control signals and one path of laser control pulse signal.
The servo control card has the functions of compact size and high full-precision anti-interference strength, can be in communication connection with external equipment and can be mutually controlled.
The laser power of the laser device is 500W/mm2The incident angle is an included angle of about 60 degrees with the surface of the metal substrate.
The time for spraying the fluorocarbon coating for the first time in S4 is 15min, and the time for spraying the fluorocarbon coating for the second time in S4 is 18 min.
The heat etching film layer is made of tellurium-antimony alloy, and the heat conduction film layer is made of silver (Ag), copper (Cu), aluminum (Al) or silicon (Si) with high heat conductivity.
Example 2, comprising the steps of:
s1, processing pretreatment:
firstly, carrying out mechanical casting and machining molding on a metal matrix, then carrying out primary cleaning and machining treatment on the surface of the metal matrix, cleaning the metal matrix, then using absolute ethyl alcohol to carry out surface cleaning work on the metal matrix, then carrying out surface cleaning work on the metal matrix through acetone liquid, achieving twice thorough cleaning work on the metal matrix through the absolute ethyl alcohol and the acetone liquid, then carrying out drying treatment operation on the cleaned metal matrix through an air cooler, and after the metal matrix is air-dried, then using a sand blasting machine or polishing equipment to carry out uniform polishing treatment on the surface of the metal matrix, so that the surface of the metal matrix is smooth.
S2, sputtering of the coating film:
fixing a metal matrix by a substrate support of a magnetron sputtering instrument, clamping and fixing the substrate support fixed with the metal matrix on a substrate seat of an internal vacuum cavity of the magnetron sputtering instrument, closing a vacuum cavity door of the magnetron sputtering instrument, keeping the vacuum cavity in a sealed state, vacuumizing the vacuum cavity of the magnetron sputtering instrument, introducing argon when the vacuum degree of the internal vacuum sputtering cavity is more than 2 x 15 < -4 > Pa, controlling the introduction amount of the argon by a gas flow meter of the magnetron sputtering instrument, controlling the introduction amount of the argon to be 70sccm, simultaneously implementing a gate valve of the magnetron sputtering instrument to maintain the working air pressure at 0.8Pa, adding 1-5kV direct current voltage on two electrodes of the magnetron sputtering instrument to generate glow discharge, forming a high-density plasma area near a target (cathode), namely, bombarding the target in the area in a negative glow area under the acceleration of the direct current voltage to generate a sputtering effect, atoms sputtered from the surface of the target material are deposited on a metal substrate to form a heat conduction film layer, then the operation is carried out in a radio frequency sputtering mode, a radio frequency alternating current power supply is connected indirectly to two electrodes, electrons which continuously move in plasma between the two electrodes obtain energy from a high-frequency electric field at the moment, the electrons collide with gas molecules, the gas molecules are ionized to generate a large number of ions and electrons, the target material is automatically positioned under a large negative potential at the moment, the gas ions generate a sputtering bombardment effect on the target material, and a heat etching film coating is formed on the heat conduction film layer at the moment.
S3, laser etching preparation:
connecting computer with laser via control line connector, converting the two-dimensional code into digital transmission signal, inputting into laser controller, then converting into current control signal by programming calculation, inputting into driver of laser, the driver forming response control signal, and the deflection travel angles of the reflection pillow mirror in the x direction and the y direction are respectively controlled by control signals, at the moment, the laser beam is focused on the surface of the metal matrix, a series of chemical bond fractures are triggered by the photoelectric and photothermal action of laser beams, the materials receive heat energy to be pressed and melted, the materials are caused to be re-solidified or evaporated, meanwhile, explosive phase change occurs, so that the laser beam can move in a track manner according to a set pattern, and further permanent nicks can be formed on the surface of the workpiece by etching, and the etched two-dimensional code is obtained.
S4, coating treatment:
and uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the first time, baking at the temperature of 190 ℃, uniformly spraying fluorocarbon coating for the second time after the texture of the etched area of the metal matrix is dried, and performing high-temperature treatment at 210 ℃ to ensure that the coating of the etched area of the metal matrix is tighter and the spraying processing technology is finished.
The driver is a high-precision servo control consisting of a servo control card and a swing motor, and the swing motor can swing an angular servo control card according to an input driving signal and a conversion ratio of a certain voltage and an angle to output two paths of galvanometer control signals and one path of laser control pulse signal.
The servo control card has the functions of compact size and high full-precision anti-interference strength, can be in communication connection with external equipment and can be mutually controlled.
The laser power of the laser device is 3500W/mm2, and the incident angle is about 60 degrees with the surface of the metal substrate.
The time for spraying the fluorocarbon coating for the first time in S4 is 23min, and the time for spraying the fluorocarbon coating for the second time in S4 is 29 min.
The heat etching film layer is made of tellurium-antimony alloy, and the heat conduction film layer is made of silver (Ag), copper (Cu), aluminum (Al) or silicon (Si) with high heat conductivity.
Example 3, comprising the steps of:
s1, processing pretreatment:
firstly, carrying out mechanical casting and machining molding on a metal matrix, then carrying out primary cleaning and machining treatment on the surface of the metal matrix, cleaning the metal matrix, then using absolute ethyl alcohol to carry out surface cleaning work on the metal matrix, then carrying out surface cleaning work on the metal matrix through acetone liquid, achieving twice thorough cleaning work on the metal matrix through the absolute ethyl alcohol and the acetone liquid, then carrying out drying treatment operation on the cleaned metal matrix through an air cooler, and after the metal matrix is air-dried, then using a sand blasting machine or polishing equipment to carry out uniform polishing treatment on the surface of the metal matrix, so that the surface of the metal matrix is smooth.
S2, sputtering of the coating film:
fixing a metal matrix by a substrate support of a magnetron sputtering instrument, clamping and fixing the substrate support fixed with the metal matrix on a substrate seat of an internal vacuum cavity of the magnetron sputtering instrument, closing a vacuum cavity door of the magnetron sputtering instrument, keeping the vacuum cavity in a sealed state, vacuumizing the vacuum cavity of the magnetron sputtering instrument, introducing argon when the vacuum degree of the internal vacuum sputtering cavity is more than 2 x 15-4Pa, controlling the introduction amount of the argon by a gas flow meter of the magnetron sputtering instrument, controlling the introduction amount of the argon to be 90sccm, simultaneously implementing a gate valve of the magnetron sputtering instrument to maintain the working air pressure at 0.95Pa, adding a direct current voltage of 1-5kV on two electrodes of the magnetron sputtering instrument to generate glow discharge, forming a high-density plasma area near a target (cathode), namely, bombarding the target in the area in a negative glow area under the acceleration of the direct current voltage to generate a sputtering effect, atoms sputtered from the surface of the target material are deposited on a metal substrate to form a heat conduction film layer, then the operation is carried out in a radio frequency sputtering mode, a radio frequency alternating current power supply is connected indirectly to two electrodes, electrons which continuously move in plasma between the two electrodes obtain energy from a high-frequency electric field at the moment, the electrons collide with gas molecules, the gas molecules are ionized to generate a large number of ions and electrons, the target material is automatically positioned under a large negative potential at the moment, the gas ions generate a sputtering bombardment effect on the target material, and a heat etching film coating is formed on the heat conduction film layer at the moment.
S3, laser etching preparation:
connecting computer with laser via control line connector, converting the two-dimensional code into digital transmission signal, inputting into laser controller, then converting into current control signal by programming calculation, inputting into driver of laser, the driver forming response control signal, and the deflection travel angles of the reflection pillow mirror in the x direction and the y direction are respectively controlled by control signals, at the moment, the laser beam is focused on the surface of the metal matrix, a series of chemical bond fractures are triggered by the photoelectric and photothermal action of laser beams, the materials receive heat energy to be pressed and melted, the materials are caused to be re-solidified or evaporated, meanwhile, explosive phase change occurs, so that the laser beam can move in a track manner according to a set pattern, and further permanent nicks can be formed on the surface of the workpiece by etching, and the etched two-dimensional code is obtained.
S4, coating treatment:
and uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the first time, baking at the temperature of 220 ℃, uniformly spraying fluorocarbon coating for the second time after the texture of the etched area of the metal matrix is dried, and performing high-temperature treatment at the temperature of 210 ℃ to ensure that the coating of the etched area of the metal matrix is tighter and the spraying processing technology is finished.
The driver is a high-precision servo control consisting of a servo control card and a swing motor, and the swing motor can swing an angular servo control card according to an input driving signal and a conversion ratio of a certain voltage and an angle to output two paths of galvanometer control signals and one path of laser control pulse signal.
The servo control card has the functions of compact size and high full-precision anti-interference strength, can be in communication connection with external equipment and can be mutually controlled.
The laser power of the laser device is 7000W/mm2, and the incident angle is about 60 degrees with the surface of the metal substrate.
The time for spraying the fluorocarbon coating for the first time in S4 is 130min, and the time for spraying the fluorocarbon coating for the second time in S4 is 40 min.
The heat etching film layer is made of tellurium-antimony alloy, and the heat conduction film layer is made of silver (Ag), copper (Cu), aluminum (Al) or silicon (Si) with high heat conductivity.
The points to be finally explained are: although the present invention has been described in detail with reference to the general description and the specific embodiments, on the basis of the present invention, the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. A new technology for a laser metal two-dimensional code product is characterized by comprising the following steps:
s1, processing pretreatment:
firstly, carrying out mechanical casting and machining molding on a metal matrix, then carrying out primary cleaning and machining treatment on the surface of the metal matrix, cleaning the surface of the metal matrix by using absolute ethyl alcohol, then carrying out surface cleaning on the metal matrix by using acetone liquid, achieving thorough cleaning work of the metal matrix twice through the absolute ethyl alcohol and the acetone liquid, then carrying out drying treatment on the cleaned metal matrix by using an air cooler, and after the metal matrix is air-dried, carrying out uniform polishing treatment on the surface of the metal matrix by using a sand blasting machine or polishing equipment to ensure that the surface of the metal matrix is smooth;
s2, sputtering of the coating film:
fixing a metal matrix by a substrate support of a magnetron sputtering instrument, clamping and fixing the substrate support fixed with the metal matrix on a substrate seat of an internal vacuum cavity of the magnetron sputtering instrument, closing a vacuum cavity door of the magnetron sputtering instrument, keeping the vacuum cavity in a sealed state, vacuumizing the vacuum cavity of the magnetron sputtering instrument, introducing argon when the vacuum degree of the internal vacuum sputtering cavity is more than 2 x 15-4Pa, controlling the introduction amount of the argon by a gas flowmeter of the magnetron sputtering instrument, controlling the introduction amount of the argon to be 50-90sccm, simultaneously implementing a gate valve of the magnetron sputtering instrument to ensure that the working pressure is maintained at 0.65-0.95Pa, adding 1-5kV direct current voltage on two electrodes of the magnetron sputtering instrument to generate glow discharge, forming a high-density plasma area near a target (cathode), namely, generating a sputtering effect by ions in the negative glow area under the acceleration of the direct current voltage of the target, atoms sputtered from the surface of the target material are deposited on a metal substrate to form a heat conduction film layer, then the operation is carried out in a radio frequency sputtering mode, a radio frequency alternating current power supply is connected indirectly to two electrodes, electrons which continuously move in plasma between the two electrodes obtain energy from a high-frequency electric field at the moment, the electrons collide with gas molecules, the gas molecules are ionized to generate a large amount of ions and electrons, the target material is automatically positioned under a large negative potential to cause the gas ions to generate a sputtering bombardment effect on the target material, and a heat etching film coating is formed on the heat conduction film layer at the moment;
s3, laser etching preparation:
connecting computer with laser via control line connector, converting the two-dimensional code into digital transmission signal, inputting into laser controller, then converting into current control signal by programming calculation, inputting into driver of laser, the driver forming response control signal, and the deflection travel angles of the reflection pillow mirror in the x direction and the y direction are respectively controlled by control signals, at the moment, the laser beam is focused on the surface of the metal matrix, a series of chemical bond fractures are triggered by the photoelectric and photothermal action of laser beams, the materials receive heat energy to be pressed and melted, the materials are caused to be re-solidified or evaporated, meanwhile, explosive phase change occurs, and finally the laser beam can move in a track according to a set pattern, so that permanent nicks can be formed on the surface of the workpiece by etching to obtain an etched two-dimensional code;
s4, coating treatment:
and uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the first time, baking at the temperature of 160-220 ℃, uniformly spraying fluorocarbon coating on the etched area of the metal matrix for the second time after the texture of the etched area of the metal matrix is dried, and performing high-temperature treatment at the temperature of 180-250 ℃ to ensure that the coating on the etched area of the metal matrix is tighter and the spraying processing technology is finished.
2. The new technology of laser metal two-dimensional code product process of claim 1, characterized in that: the driver is in high-precision servo control consisting of a servo control card and a swing motor, and the swing motor can swing an angular servo control card according to an input driving signal and a conversion ratio of a certain voltage and an angle to output two paths of galvanometer control signals and one path of laser control pulse signal.
3. The new technology of laser metal two-dimensional code product process of claim 2, characterized in that: the servo control card has the functions of compact size and high full-precision anti-interference strength, can be in communication connection with external equipment and can be mutually controlled.
4. The new technology of laser metal two-dimensional code product process of claim 1, characterized in that: the laserThe power of the laser device is 500-7000W/mm2The incident angle is an included angle of about 60 degrees with the surface of the metal substrate.
5. The new technology of laser metal two-dimensional code product process of claim 1, characterized in that: the time for spraying the fluorocarbon coating for the first time in the step S4 is 15-30min, and the time for spraying the fluorocarbon coating for the second time in the step S4 is 18-40 min.
6. The new technology of laser metal two-dimensional code product process of claim 1, characterized in that: the heat etching film layer is made of tellurium-antimony alloy, and the heat conduction film layer is made of silver (Ag), copper (Cu), aluminum (Al) or silicon (Si) with high heat conductivity.
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| CN202010922049.8A CN112070194A (en) | 2020-09-04 | 2020-09-04 | Novel technology for laser metal two-dimensional code product technology |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102423753A (en) * | 2011-10-21 | 2012-04-25 | 许浩洪 | Surface treatment process (fluorine-carbon spraying) for carrying out lasers on metal surface |
| CN102636958A (en) * | 2012-04-11 | 2012-08-15 | 中国科学院上海光学精密机械研究所 | Thin film structure capable of improving laser thermal etching graphics resolution and preparation method of thin film structure |
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2020
- 2020-09-04 CN CN202010922049.8A patent/CN112070194A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102423753A (en) * | 2011-10-21 | 2012-04-25 | 许浩洪 | Surface treatment process (fluorine-carbon spraying) for carrying out lasers on metal surface |
| CN102636958A (en) * | 2012-04-11 | 2012-08-15 | 中国科学院上海光学精密机械研究所 | Thin film structure capable of improving laser thermal etching graphics resolution and preparation method of thin film structure |
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