CN112062607A - Preparation method of copper paste printed circuit board - Google Patents
Preparation method of copper paste printed circuit board Download PDFInfo
- Publication number
- CN112062607A CN112062607A CN202010474281.XA CN202010474281A CN112062607A CN 112062607 A CN112062607 A CN 112062607A CN 202010474281 A CN202010474281 A CN 202010474281A CN 112062607 A CN112062607 A CN 112062607A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- copper paste
- printed circuit
- copper powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a preparation method of a copper paste printed circuit board, which comprises the steps of printing copper paste on a substrate, drying to remove volatile substances, and sintering by using a non-oxidizing atmosphere according to a designed circuit pattern to obtain the copper paste printed circuit board; the copper paste comprises mixed two-component copper powder, the diameter of the two-component copper powder is 1-50 mu m, the diameter ratio of the two-component copper powder is 1.5-2.5: 1, and the mixing ratio is 1: 0.4-1.5 in parts by weight. The preparation method of the invention obtains the copper slurry prepared from the high-density powder by limiting the proportion combination of the two-component copper powder in the copper slurry, limits the sintering atmosphere proportion, ensures that the contact area of copper powder particles is moderate, the dispersity is good, improves the price limit and the environmental protection problem of the original process, and has high copper layer density and good conductivity; meanwhile, the gas protection sintering process is adopted, so that the application of antioxidant compounds can be avoided, the pollution of redundant raw materials is avoided, and the antioxidant effect is improved.
Description
Technical Field
The invention relates to a preparation method of a circuit board, in particular to a preparation method of a copper paste printed circuit board.
Background
Printed Circuit Boards (PCBs) are widely used in almost all electronic devices as a fundamental and important component of the modern electronics industry.
At present, the printed circuit board is mainly prepared by an etching method, and the main principle is that a copper-clad plate is adopted as a raw material, under the protection of photosensitive resin, oxidizing etching liquid is used, the copper foil of the unnecessary part is etched and removed according to the requirements of a circuit design drawing, a basic circuit is formed, then a series of chemical and physical treatments are carried out, and components are welded, so that the functional circuit board is formed.
The above process removes excess copper layer by etching on the complete copper layer to form the designed circuit pattern, and is therefore also referred to as subtractive process.
In the process, the etching process is a process which has serious influence on the environment and human body, the main component of the etching liquid is liquid consisting of an oxidant and dilute acid, a large amount of copper ions are added into the waste liquid after etching, and the post-treatment difficulty of the waste liquid is very high. In the treatment process, corrosive acid mist can be generated to influence equipment, personnel and environment, and meanwhile, the etched copper-clad plate needs to be cleaned by a large amount of water to remove etching liquid and also generates a large amount of metal ion acidic waste liquid.
Therefore, the conventional PCB production, as a highly polluted industry, is subject to various degrees of restrictions in various regions, and the restrictions tend to be more and more severe as social development and environmental protection are increased.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the problems in the prior art, the invention provides the preparation method of the copper paste printed circuit board, which has good conductivity and simplified production process.
The technical scheme is as follows: the preparation method of the copper paste printed circuit board comprises the following steps: printing copper paste on a substrate, drying to remove volatile substances, and sintering in a non-oxidizing atmosphere according to a designed circuit pattern to obtain the copper paste printed circuit board; the copper paste is prepared by mixing two components of copper powder, and the diameters of the two components of copper powder are all 1-50 mu m; the diameter ratio of the two-component copper powder is 1: 1.5-2.5, and the mixing ratio is 1:0.4 to 1.5.
The copper paste is formed by mixing two components of copper powder, wherein the diameters of the two components of copper powder are 45-55 microns and 20-30 microns respectively, and the mixing proportion is 1:0.4 to 1.5.
Preferably, the copper powder refers to spherical powder prepared from pure copper with the copper content of more than 99%.
Further, the sintering temperature is 950-1060 ℃, and the sintering time is more than 1 minute.
Preferably, the sintering temperature is 980-1040 ℃.
Preferably, the sintering is performed in equipment capable of stably providing 800-.
Further, the non-oxidizing atmosphere comprises the following components in the following proportions: the volume ratio of hydrogen to carbon monoxide to inert gas is 0-100: 0 to 100: 1000-5000. The non-oxidizing atmosphere sintering is a gas atmosphere provided to prevent the copper powder from being oxidized in a large amount during the sintering process, and may be an inert gas or a reducing atmosphere.
Further, the sintering time is 5-120 min, and an argon furnace, a nitrogen furnace and the like are used for sintering.
Preferably, the printing of the copper paste is by screen printing or squeegee coating printing.
Preferably, the copper paste comprises the following components in parts by weight: 50-80 parts of double-component copper powder, 20-50 parts of water and 0-20 parts of an auxiliary agent, wherein the auxiliary agent comprises the following components in parts by weight: 0.05-5 parts of binder and 0-10 parts of rheological agent.
Wherein the water is deionized water, and the binder is one or more of carboxymethyl cellulose, hydroxymethyl cellulose, polyvinyl alcohol, polyacrylate or water-soluble copolymer of acrylate; the rheological agent is one or more of ethanol, acetone, methanol, isopropanol, glycerol, polyethylene glycol or polysiloxane; the antioxidant is one or more of vitamin C, phenolic compounds or amine compounds.
Preferably, the preparation method of the copper paste comprises the steps of dispersing the water and the binder in parts by weight into a glue solution at room temperature, adding the copper powder for dispersion, and adding the rheological agent for continuous dispersion.
Further, the temperature is controlled to be 10-50 ℃ during dispersion, and the stirring speed is 10-1000 r/min during dispersion.
Preferably, the substrate is a ceramic substrate.
Preferably, the ceramic substrate is a flat plate-shaped material sintered by one of silicon oxide, aluminum nitride, magnesium oxide and zirconium oxide, and the thickness of the flat plate-shaped material is 0.2-5 mm.
The drying in the preparation method is carried out by using an oven, an infrared dryer or a microwave dryer, and the volatile substances are moisture and other volatile substances.
Has the advantages that: the preparation method of the copper paste printed circuit board provided by the invention has the advantages that the proportion of the two-component copper powder in the copper paste is limited, the copper paste prepared from the high-density powder is obtained, the sintering atmosphere proportion is limited, the contact area of copper powder particles is moderate, the dispersity is good, the cost limitation and the environmental protection problems of the original process are improved, the density of a copper layer is high, and the conductivity is good; meanwhile, the gas protection sintering process is adopted, so that the application of antioxidant compounds can be avoided, the pollution of redundant raw materials is avoided, and the antioxidant effect is improved.
Detailed Description
Example 1
And (3) adding 20-50 g of deionized water and 0.05-5 g of sodium carboxymethylcellulose into a high-speed stirrer, dispersing for 5 minutes at 10 rpm, standing for 1 hour, and removing bubbles to obtain a binder solution.
And taking a binder solution, adding 1g of spherical copper powder with the particle size of 25 mu m and 1g of spherical copper powder with the particle size of 50 mu m into the binder solution, and dispersing the mixture for 10 minutes at 10 revolutions per minute to obtain copper slurry, wherein the dispersion temperature is 10 ℃.
And printing the copper paste on the alumina ceramic plate by using a 100-micron steel mesh, and drying in an oven to obtain a clear and stable printing pattern. The thickness is 0.2 mm.
The obtained pattern was sintered at 950 ℃ for 1 minute in an argon atmosphere furnace (containing 1000ppm of hydrogen) to obtain a conductive coating layer having a density of 7.81g/cm3, a density of 87%, and a resistivity of 2.89X 10-8Omega/m (1.75X 10 pure copper)-8Ω/m)。
Example 2
And (3) adding 50g of deionized water and 5g of sodium carboxymethylcellulose into a high-speed stirrer, dispersing for 5 minutes at 1000 rpm, standing for 1 hour to remove bubbles, and thus obtaining the binder solution.
Taking a binder solution, adding 1g of spherical copper powder with the particle size of 25 mu m and 1g of spherical copper powder with the particle size of 50 mu m into the binder solution, dispersing the mixture for 10 minutes at 1000 revolutions per minute, adding 10g of ethanol, and dispersing the mixture for 1 minute at 1000 revolutions per minute to obtain copper slurry, wherein the dispersion temperature is 50 ℃.
And printing the copper paste on the alumina ceramic plate by using a 100-micron steel mesh, and drying in an oven to obtain a clear and stable printing pattern. The thickness is 5 mm.
The obtained pattern was subjected to sintering in an argon atmosphere furnace (containing 1000ppm of hydrogen) at 1060 ℃ for 10 minutes to obtain a conductive layer having a density of 8.03g/cm3The compactness reaches 87 percent, and the resistivity is 2.26 multiplied by 10-8Omega/m (1.75X 10 pure copper)-8Ω/m)。
Example 3
And (3) adding 30g of deionized water and 3g of sodium carboxymethylcellulose into a high-speed stirrer, dispersing for 5 minutes at a speed of 600 revolutions per minute, standing for 1 hour to remove bubbles, and thus obtaining a binder solution.
Taking a binder solution, adding 1g of spherical copper powder with the particle size of 25 mu m and 1g of spherical copper powder with the particle size of 50 mu m into the binder solution, dispersing for 10 minutes at 900 revolutions per minute, adding 5g of ethanol, and dispersing for 1 minute at 900 revolutions per minute to obtain copper slurry, wherein the dispersion temperature is 30 ℃.
And printing the copper paste on the alumina ceramic plate by using a 100-micron steel mesh, and drying in an oven to obtain a clear and stable printing pattern. The thickness is 2.5 mm.
The obtained pattern was sintered at 980 ℃ for 5 minutes in an argon atmosphere furnace (containing 1000ppm of hydrogen) to obtain a conductive coating layer having a density of 8.23g/cm3, a density of 85%, and a resistivity of 2.58X 10-8Omega/m (1.75X 10 pure copper)-8Ω/m)。
Example 4
And (3) adding 40g of deionized water and 3.5g of sodium carboxymethylcellulose into a high-speed stirrer, dispersing for 5 minutes at 600 rpm, standing for 1 hour to remove bubbles, and thus obtaining a binder solution.
Taking a binder solution, adding 1g of spherical copper powder with the particle size of 25 mu m and 1g of spherical copper powder with the particle size of 50 mu m into the binder solution, dispersing for 10 minutes at 950 revolutions per minute, adding 8g of ethanol, and dispersing for 1 minute at 980 revolutions per minute to obtain copper slurry, wherein the dispersion temperature is 40 ℃.
And printing the copper paste on the alumina ceramic plate by using a 100-micron steel mesh, and drying in an oven to obtain a clear and stable printing pattern. The thickness is 3 mm.
Sintering the obtained pattern at 1040 ℃ for 6 minutes in an argon atmosphere furnace (containing 1000ppm of hydrogen) to obtain a conductive coating layer, wherein the density is 8.05g/cm3, the density is more than 89%, and the resistivity is 1.99 multiplied by 10-8Omega/m (1.75X 10 pure copper)-8Ω/m)。
Example 5
Designing a plurality of groups of parallel experiments, wherein the gas proportion of the non-oxidizing atmosphere during sintering is respectively as follows:
group one: the volume ratio of hydrogen, carbon monoxide and argon is 50: 50: 900;
and a second group: volume containing argon gas was 5000 ppm;
and (3) group III: the volume ratio of hydrogen, carbon monoxide and argon is 50: 50: 5000;
group four: the volume ratio of hydrogen, carbon monoxide and argon is 100: 50: 2500;
group five: the volume ratio of hydrogen, carbon monoxide and argon is 50: 100: 5000;
group six: the volume ratio of hydrogen, carbon monoxide and argon is 100: 50: 1000, parts by weight;
group seven: the volume ratio of hydrogen, carbon monoxide and argon is 150: 150: 900;
group eight: the volume ratio of hydrogen, carbon monoxide and argon is 150: 150: 6000;
the remaining raw materials, amounts of raw materials, instruments and steps were the same as in example 3, and the densities of the obtained conductive coatings were as shown in table 1:
TABLE 1 influence of the gas ratio of the non-oxidizing atmosphere on the quality of the conductive coating
As can be seen from table 1, the gas volume ratio of the non-oxidizing atmosphere during sintering is 0 to 100: 0 to 100: and when the thickness is 1000-5000 hours, the density and the conductivity of the conductive coating are good. Further, the volume ratio of the gas in the non-oxidizing atmosphere during sintering is 50 to 100: 50-100: and when the thickness is 1000-5000 hours, the density and the conductivity of the conductive coating are excellent. When the inert gas is too little or the hydrogen and the carbon monoxide are too little, the density, the compactness and the conductivity of the conductive coating are poor.
Example 6
Designing a plurality of groups of parallel experiments, wherein the grain diameter and the mass of the added copper powder are respectively as follows:
group one: 2 parts of 60-micron copper powder;
and a second group: 0.2 part of 25-micron-diameter copper powder is doped with 1 part of 50-micron-diameter copper powder;
and (3) group III: 1 part of copper powder with the diameter of 50 mu m is doped with 0.4 part of copper powder with the diameter of 20 mu m;
group four: 1 part of 45-micron-diameter copper powder is doped with 0.4 part of 25-micron copper powder;
group five: 1 part of copper powder with the diameter of 50 mu m is doped with 1.5 parts of copper powder with the diameter of 25 mu m;
group six: 1 part of 45-micron-diameter copper powder is doped with 1.5 parts of 20-micron copper powder;
group seven: 1 part of copper powder with the diameter of 50 mu m is doped with 0.7 part of copper powder with the diameter of 25 mu m;
group eight: 1 part of 45-micron-diameter copper powder is doped with 2 parts of 25-micron-diameter copper powder;
and (4) group nine: 2 parts of 10-micron copper powder;
group ten: 2 parts of 0.8 mu m copper powder;
the remaining raw materials, instruments and procedures were the same as in example 3, and the densities of the obtained conductive coatings are shown in table 2:
TABLE 2 influence of particle size and mass ratio of the two-component copper powder added on the quality of the conductive coating
When the two-component copper powder with the diameter of 45-55 mu m and 20-30 mu m is added, mixingMixing the components in a ratio of 1: 0.4-1.5, wherein the powder density of the two-component copper powder is 5.60-5.68 g/cm2And because the contact area of the particles is moderate and the dispersion degree is good, the density and the conductivity of the conductive coating are excellent.
On the contrary, when the amount of the large-particle copper powder added with the copper powder is too much, the density of the powder cannot be increased continuously due to the reason that the tension between the powder is too large and the like, but the powder tends to decrease, so that the density, the density and the conductivity of the conductive coating are poor. When the amount of the small-particle copper powder added with the copper powder is too much, the density and the conductivity of the conductive coating are poor and the price is high due to high dispersion difficulty.
Example 7
Designing a plurality of groups of parallel experiments, wherein the grain diameter and the mass of the added copper powder are respectively as follows:
group one: 2 parts of 60-micron copper powder;
and a second group: 1 part of copper powder with the diameter of 50 mu m is doped with 0.4 part of copper powder with the diameter of 10 mu m;
and (3) group III: 1 part of 2.5 mu m doped copper powder with a diameter of 0.4 part of 1 mu m;
group four: 1 part of 33 μm doped 1.5 parts of 50 μm diameter copper powder;
group five: 1 part of 16 μm doped 1 part of 40 μm diameter copper powder;
group six: 1 part of 10-micron doped copper powder with the diameter of 20 microns;
group seven: 1 part of 4 μm doped 1.5 parts of copper powder with a diameter of 10 μm;
group eight: 1 part of 1.5 μm doped 1.5 parts of 1 μm diameter copper powder;
and (4) group nine: 2 parts of 10-micron copper powder;
group ten: 2 parts of 0.8 mu m copper powder;
group eleven: 0.5 part of 10 μm copper powder, 0.5 part of 20 μm doped copper powder, 0.5 part of 30 μm copper powder.
The remaining raw materials, instruments and procedures were the same as in example 3, and the densities of the obtained conductive coatings were as shown in table 3:
TABLE 3 influence of particle size and mass ratio of the two-component copper powder added on the quality of the conductive coating
As can be seen from Table 3, the diameters of the two-component copper powder are all 1-50 μm; the diameter ratio of the two-component copper powder is 1: 1.5-2.5, and the mixing ratio is 1: when the thickness is 0.4-1.5, the density and the conductivity of the conductive coating are good because the contact area of the particles is moderate and the dispersity is good.
On the contrary, when the amount of copper powder added is too much, the powder density cannot be increased continuously due to the reason of too large tension between the powders, and the like, but the powder density tends to decrease, so that the density, density and conductivity of the conductive coating are poor. When the copper powder with the particle size of less than 1 mu m is excessively added, the density, the compactness and the conductivity of the conductive coating are poor due to high dispersion difficulty.
Example 8
Designing a plurality of groups of parallel experiments, wherein the sintering temperature is respectively as follows:
group one: 900 ℃; and a second group: 950 ℃; and (3) group III: 980 ℃; group four is 1000 ℃; group five: 1040 ℃; group six: 1060 deg.C; seventy seven in group 1100 ℃; the sintering time is 30 min;
the remaining raw materials, instruments and steps were the same as in example 3, and the nitrogen element removal rate and the phosphorus element removal rate were as shown in Table 4:
TABLE 4 influence of sintering temperature on the quality of the conductive coating
As can be seen from Table 4, the density, compactness and conductivity of the conductive coating are all good when the sintering temperature is 950 ℃ -1060 ℃. Particularly, when the sintering temperature is 980-1040 ℃, the density and the conductivity of the conductive coating are good. When the temperature is lower than 950 ℃, the copper slurry is not easy to melt and sinter, and when the temperature is higher than 1060 ℃, the system flows and cannot maintain the pattern, so the density, the compactness and the conductivity of the conductive coating are poor.
Claims (10)
1. A preparation method of a copper paste printed circuit board is characterized by comprising the following steps: printing copper paste on a substrate, drying to remove volatile substances, and sintering in a non-oxidizing atmosphere according to a designed circuit pattern to obtain the copper paste printed circuit board; the copper paste comprises mixed two-component copper powder, wherein the diameter of the two-component copper powder is 1-50 mu m, the diameter ratio of the two-component copper powder is 1.5-2.5: 1, and the mixing ratio is 1: 0.4-1.5 parts by weight.
2. The method for manufacturing a copper paste printed circuit board according to claim 1, wherein: the diameters of the two-component copper powder are 45-50 microns and 20-25 microns respectively, and the mixing proportion is 1:0.4 to 1.5.
3. The method for manufacturing a copper paste printed circuit board according to claim 1, wherein: the sintering temperature is 950-1060 ℃, and the sintering time is more than 1 minute.
4. The method for manufacturing a copper paste printed circuit board according to claim 3, wherein: the sintering temperature is 980-1040 ℃.
5. The method for manufacturing a copper paste printed circuit board according to claim 1, wherein the non-oxidizing atmosphere comprises the following components in the following ratio: the volume ratio of hydrogen to carbon monoxide to inert gas is 0-100: 0 to 100: 1000-5000.
6. The method for manufacturing a copper paste printed circuit board according to claim 1, wherein: the copper paste comprises, by weight, 50-80 parts of two-component copper powder, 20-50 parts of water and 0-20 parts of an auxiliary agent, wherein the auxiliary agent comprises, by weight, 0.05-5 parts of a binder and 0-10 parts of a rheological agent.
7. The method for manufacturing a copper paste printed circuit board according to claim 6, wherein: the preparation method of the copper paste comprises the steps of dispersing water and a binder in parts by weight into a glue solution at room temperature, adding copper powder for dispersion, and adding a rheological agent for continuous dispersion.
8. The method for manufacturing a copper paste printed circuit board according to claim 7, wherein: the temperature is controlled to be 10-50 ℃ during dispersion, and the stirring speed is 10-1000 r/min during dispersion.
9. The method for manufacturing a copper paste printed circuit board according to claim 1, wherein: the substrate is a ceramic substrate.
10. The method for manufacturing a copper paste printed circuit board according to claim 9, wherein: the ceramic substrate is a flat plate-shaped material with the thickness of 0.2-5 mm and sintered by one of silicon oxide, aluminum nitride, magnesium oxide or zirconium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010474281.XA CN112062607A (en) | 2020-05-29 | 2020-05-29 | Preparation method of copper paste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010474281.XA CN112062607A (en) | 2020-05-29 | 2020-05-29 | Preparation method of copper paste printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112062607A true CN112062607A (en) | 2020-12-11 |
Family
ID=73656243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010474281.XA Pending CN112062607A (en) | 2020-05-29 | 2020-05-29 | Preparation method of copper paste printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112062607A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1035396A (en) * | 1987-09-24 | 1989-09-06 | 气体产品与化学公司 | Method with infrared heating heating furnace manufactured copper thick film conductor |
| EP1383361A2 (en) * | 2002-07-17 | 2004-01-21 | Ngk Spark Plug Co., Ltd | Copper paste, wiring board using the same, and production method of wiring board |
| CN102503579A (en) * | 2011-10-13 | 2012-06-20 | 华中科技大学 | Method for preparing metallized ceramic substrate by low-temperature sintering |
| CN103369851A (en) * | 2012-04-09 | 2013-10-23 | 戴培钧 | Printed circuit board and manufacturing method thereof |
| CN103680677A (en) * | 2012-09-10 | 2014-03-26 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | Low firing temperature copper composition |
-
2020
- 2020-05-29 CN CN202010474281.XA patent/CN112062607A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1035396A (en) * | 1987-09-24 | 1989-09-06 | 气体产品与化学公司 | Method with infrared heating heating furnace manufactured copper thick film conductor |
| EP1383361A2 (en) * | 2002-07-17 | 2004-01-21 | Ngk Spark Plug Co., Ltd | Copper paste, wiring board using the same, and production method of wiring board |
| CN102503579A (en) * | 2011-10-13 | 2012-06-20 | 华中科技大学 | Method for preparing metallized ceramic substrate by low-temperature sintering |
| CN103369851A (en) * | 2012-04-09 | 2013-10-23 | 戴培钧 | Printed circuit board and manufacturing method thereof |
| CN103680677A (en) * | 2012-09-10 | 2014-03-26 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | Low firing temperature copper composition |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100565713C (en) | Nickel powder, conductive paste and the multilayer electronic component that uses them | |
| WO2005075133A1 (en) | Highly crystalline silver powder and method for production thereof | |
| JP2007184143A (en) | Surface treatment method of conductive powder, and conductive powder and conductive paste | |
| WO2015194366A1 (en) | Method for firing copper paste | |
| US8623225B2 (en) | Production method of metallized ceramic substrate | |
| JP6562196B2 (en) | Copper fine particle sintered body and method for producing conductive substrate | |
| JP2010043339A (en) | Nickel powder and its method for manufacturing | |
| CN111540503A (en) | Conductive copper paste and using method thereof | |
| EP3246115B1 (en) | Silver powder | |
| CN112062607A (en) | Preparation method of copper paste printed circuit board | |
| JP2001067951A (en) | Manufacture of electroconductive thick film paste, electroconductive thick film paste and laminated ceramic electronic component | |
| US8562808B2 (en) | Polymer thick film silver electrode composition for use as a plating link | |
| CN114049983B (en) | Chip resistor paste with high resistance concentration and preparation method thereof | |
| CN114255904B (en) | Nickel electrode paste, resistor and preparation method of resistor | |
| JP3906881B2 (en) | Conductor composition | |
| JPH08162762A (en) | Glass ceramic multilayer circuit board | |
| JP2004055557A (en) | Copper paste, wiring board using the same and manufacturing method of wiring board | |
| JP2005220402A (en) | Dispersion of metallic oxide | |
| JPH1179828A (en) | Production of alumina ceramic substrate | |
| CN117672592A (en) | LTCC filter external electrode material capable of resisting high temperature and high humidity and preparation method thereof | |
| CN115516578A (en) | Thick film resistor paste, thick film resistor, and electronic component | |
| CN114334214A (en) | Conductive silver paste and preparation method and application thereof | |
| JP3856946B2 (en) | Thick film paste, inorganic powder composition for thick film paste, ceramic wiring board and method for producing the same, and semiconductor device | |
| CN115516579A (en) | Thick film resistor paste, thick film resistor, and electronic component | |
| JP2005085907A (en) | Cu-ni thick-film resistor, forming method thereof, and manufacturing method of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210406 Address after: 266111 No.6, Jinxia Road, high tech Zone, Chengyang District, Qingdao City, Shandong Province Applicant after: QINGDAO ZHONGQING ELECTRONIC SOFTWARE Co.,Ltd. Address before: No. 606, ningliu Road, Liuhe District, Nanjing City, Jiangsu Province, 211500 Applicant before: Nanjing Kaitai Chemical Technology Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220303 Address after: 510000 room 209, building 1, No. 318, Waihuan West Road, University Town, Xiaoguwei street, Panyu District, Guangzhou, Guangdong Applicant after: Guangzhou Qingmiao New Material Technology Co.,Ltd. Address before: 266111 No.6, Jinxia Road, high tech Zone, Chengyang District, Qingdao City, Shandong Province Applicant before: QINGDAO ZHONGQING ELECTRONIC SOFTWARE Co.,Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201211 |