CN112053851A - Solid electrolytic capacitor containing silver paste cathode - Google Patents
Solid electrolytic capacitor containing silver paste cathode Download PDFInfo
- Publication number
- CN112053851A CN112053851A CN202011122664.7A CN202011122664A CN112053851A CN 112053851 A CN112053851 A CN 112053851A CN 202011122664 A CN202011122664 A CN 202011122664A CN 112053851 A CN112053851 A CN 112053851A
- Authority
- CN
- China
- Prior art keywords
- silver paste
- silver
- inner core
- cathode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 102
- 239000004332 silver Substances 0.000 title claims abstract description 101
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 101
- 239000003990 capacitor Substances 0.000 title claims abstract description 31
- 239000007787 solid Substances 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000003792 electrolyte Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000010405 anode material Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000010923 batch production Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a solid electrolytic capacitor containing a silver paste cathode, wherein the cathode of the capacitor is an integrated silver-coated inner core, the silver-coated inner core comprises an inner core formed by stacking a plurality of layers of elements pre-soaked with silver paste, and the silver paste solidified layer is coated on the outer wall of the inner core; the preparation method of the silver paste curing layer comprises the steps of firstly injecting silver paste into a die with an inner core arranged inside, carrying out high-frequency vibration on the die, and then curing the silver paste in the die at high temperature to form an integrated silver-coated inner core; the invention has the advantages of convenient batch production, improved ESR performance and service life of the device, and the like.
Description
Technical Field
The invention relates to the technical field of electronic element manufacturing, in particular to a solid electrolytic capacitor with a silver paste cathode.
Background
The market demand of high-end capacitors gradually trends to high reliability, low ESR (equivalent series resistance), miniaturization and high capacity, in particular to a stacked solid electrolytic capacitor, and a dielectric medium and a conductive polymer are sequentially formed on the surface of a high-purity aluminum foil to serve as an electrolyte and a cathode lead-out layer. And finally, injecting resin into a packaging mold cavity for curing molding, wherein the resin shell plays a role in protecting the inner core. During the production process of the solid electrolytic capacitor, silver paste is needed to work on the cathode of the solid electrolytic capacitor core.
The prior art has the following disadvantages: because the impregnation mode realizes the silver-containing cathode layer of the single element, but the stacked structure realizes the parallel connection between the layers by the conductive silver paste mode, the contact area and the connection quality of the method can not be compared favorably with the effect of the solidified integrated silver paste, the ultra-low ESR can not be realized easily, and the ESR is distributed in a normal mode, so that the requirement of the high-frequency application field of the product on the ultra-low ESR can not be met easily, the application of the product in the high-performance field can be restricted, and the ESR performance is deteriorated because the adhesion interface is physically separated easily in the examination process. The invention aims to solve the technical problem of providing a silver paste cathode preparation method, which can effectively overcome the defects of the existing silver paste impregnation technology and silver paste lamination method and has the advantages of convenience in batch production, improvement on ESR (equivalent series resistance) performance and service life of devices and the like.
Disclosure of Invention
The solid electrolytic capacitor with the silver paste cathode provided by the invention has the advantages of convenience for batch production, improvement on ESR (equivalent series resistance) performance and service life of the device and the like.
The invention adopts the following technical scheme.
A solid electrolytic capacitor containing a silver paste cathode, wherein the cathode of the capacitor is an integrated silver-coated inner core, the silver-coated inner core comprises an inner core formed by stacking a plurality of layers of elements subjected to silver paste pre-impregnation treatment, and a silver paste curing layer coated on the outer wall of the inner core; the preparation method of the silver paste curing layer comprises the steps of firstly injecting silver paste into a die with an inner core arranged inside, carrying out high-frequency vibration on the die, and then curing the silver paste in the die at high temperature to form the integrated silver-coated inner core.
The preparation process of the capacitor comprises a prime processing process and a prime stacking process;
the element processing procedure comprises the following steps:
a1, forming an oxide film on the surface of the capacitor anode material to be used as an oxide film dielectric material;
a2, dividing a capacitance cathode area and an anode area at the position of an oxide film dielectric material by using barrier glue;
a3, forming a conductive high molecular polymer on the outer surface of the cathode area of the oxide film dielectric material to be used as a solid electrolyte layer;
step A4, forming a conductive carbon cathode layer on the outer surface of the electrolyte layer;
step A5, forming a conductive silver cathode layer on the outer surface of the conductive carbon cathode layer to form a silver-containing conductive cathode;
the prime stacking procedure comprises the following steps:
step B1, compacting the layers of the element to form an inner core with a laminated structure;
step B2, connecting the anodes of the multi-sheet elements and the anode of the lead frame by welding;
step B3, injecting silver paste by using a mould to solidify the inner core into an integrated silver-coated inner core;
and step B4, packaging the cured integrated silver-coated inner core.
The method adopted in the step A5 comprises the steps of pre-soaking the elements of the conductive carbon cathode layer with silver paste with the silver content of 45-65%;
the method of step B1 includes placing the lead frame cathode work piece between the elements while stacking the elements layer-by-layer, thereby sandwiching the lead frame cathode work piece between the stacked structures.
A rectangular mold cavity is arranged in the mold, and an injection opening is formed in the top of the mold;
when the step B3 is executed, the inner core is placed in the mold cavity, silver paste with the silver content of 35-55% is injected into the mold cavity from the top injection port of the mold, the mold is vibrated by using a high-frequency vibration technology, so that the silver paste injected into the mold cavity can fill the gaps between the elements and the space between the inner core and the cavity wall of the mold cavity, and then high-temperature curing is carried out.
The high-temperature curing is to cure the silver paste injected into the mold cavity for 30 minutes by using high temperature of 150 ℃.
The die comprises an upper die and a lower die.
The silver paste pre-impregnated with the primordium in step a5 has a higher silver content than the silver paste injected into the mold in step B3.
The scheme of the invention has the advantages of effectively overcoming the defects of the existing silver paste impregnation technology and silver paste laminating method, facilitating batch production, improving ESR (equivalent series resistance) of devices, prolonging service life of the devices and the like.
Drawings
The invention is described in further detail below with reference to the following figures and detailed description:
FIG. 1 is a schematic diagram of a capacitor according to the present invention;
FIG. 2 is a schematic view of the capacitor of the present invention in another orientation;
FIG. 3 is a schematic illustration of step B3;
FIG. 4 is another schematic diagram of step B3;
FIG. 5 is a schematic view of a mold;
in the figure: 1-an anode; 2-barrier glue; 3-a cathode; 4-lead frame cathode workpiece; 5-element; 6-molding; 7-a mould cavity; 8-upper die; and 9-lower die.
Detailed Description
As shown in the figure, the solid electrolytic capacitor containing the silver paste cathode has the structure that the cathode 2 of the capacitor is an integrated silver-coated inner core, the silver-coated inner core comprises an inner core formed by stacking a plurality of layers of elements 5 pre-soaked with silver paste, and a silver paste solidified layer coated on the outer wall of the inner core; the preparation method of the silver paste curing layer comprises the steps of firstly injecting silver paste into a die 6 internally provided with an inner core, carrying out high-frequency vibration on the die, and then curing the silver paste in the die at high temperature to form the integrated silver-coated inner core.
The preparation process of the capacitor comprises a prime processing process and a prime stacking process;
the element processing procedure comprises the following steps:
a1, forming an oxide film on the surface of the capacitor anode material to be used as an oxide film dielectric material;
a2, dividing a capacitance cathode area and an anode area at an oxide film dielectric material by using barrier glue 3;
a3, forming a conductive high molecular polymer on the outer surface of the cathode area of the oxide film dielectric material to be used as a solid electrolyte layer;
step A4, forming a conductive carbon cathode layer on the outer surface of the electrolyte layer;
step A5, forming a conductive silver cathode layer on the outer surface of the conductive carbon cathode layer to form a silver-containing conductive cathode;
the prime stacking procedure comprises the following steps:
step B1, compacting the layers of the element to form an inner core with a laminated structure;
step B2, connecting the anodes 1 of the multiple elements with the anode of the lead frame by welding;
step B3, injecting silver paste by using a mould to solidify the inner core into an integrated silver-coated inner core;
and step B4, packaging the cured integrated silver-coated inner core.
The method adopted in the step A5 comprises the steps of pre-soaking the elements of the conductive carbon cathode layer with silver paste with the silver content of 45-65%;
the method used in step B1 includes placing the lead frame cathode work piece 4 between the elements while stacking the elements layer by layer, thereby sandwiching the lead frame cathode work piece between the stacked structures.
A rectangular mould cavity 7 is arranged in the mould, and an injection opening is formed in the top of the mould;
when the step B3 is executed, the inner core is placed in the mold cavity, silver paste with the silver content of 35-55% is injected into the mold cavity from the top injection port of the mold, the mold is vibrated by using a high-frequency vibration technology, so that the silver paste injected into the mold cavity can fill the gaps between the elements and the space between the inner core and the cavity wall of the mold cavity, and then high-temperature curing is carried out.
The high-temperature curing is to cure the silver paste injected into the mold cavity for 30 minutes by using high temperature of 150 ℃.
The mold comprises an upper mold 8 and a lower mold 9.
The silver paste pre-impregnated with the primordium in step a5 has a higher silver content than the silver paste injected into the mold in step B3.
Example (b):
pre-impregnating a prime element of the conductive carbon cathode layer with silver paste with the silver content of 65%, clamping a cathode of a lead frame in the middle according to process requirements, stacking the prime elements layer by layer to form a laminated structure, placing a core formed after lamination in a rectangular mold cavity, injecting the silver paste with the silver content of 55% into the mold cavity from a top injection port after the mold is closed, and curing at the high temperature of 150 ℃ for 30 minutes by using a high-frequency vibration technology to fill the spaces between the prime elements and between four interfaces of the core and the mold; and taking out the core after silver paste solidification, and carrying out packaging treatment.
The high temperature test data of the monolithic capacitor element are shown in the following table:
Claims (7)
1. a solid electrolytic capacitor comprising a silver paste cathode, characterized in that: the cathode of the capacitor is an integrated silver-coated inner core, the silver-coated inner core comprises an inner core formed by stacking a plurality of layers of elements subjected to silver paste pre-impregnation treatment, and a silver paste curing layer coated on the outer wall of the inner core; the preparation method of the silver paste curing layer comprises the steps of firstly injecting silver paste into a die with an inner core arranged inside, carrying out high-frequency vibration on the die, and then curing the silver paste in the die at high temperature to form the integrated silver-coated inner core.
2. The solid electrolytic capacitor comprising a silver paste cathode according to claim 1, wherein: the preparation process of the capacitor comprises a prime processing process and a prime stacking process;
the element processing procedure comprises the following steps:
a1, forming an oxide film on the surface of the capacitor anode material to be used as an oxide film dielectric material;
a2, dividing a capacitance cathode area and an anode area at the position of an oxide film dielectric material by using barrier glue;
a3, forming a conductive high molecular polymer on the outer surface of the cathode area of the oxide film dielectric material to be used as a solid electrolyte layer;
step A4, forming a conductive carbon cathode layer on the outer surface of the electrolyte layer;
step A5, forming a conductive silver cathode layer on the outer surface of the conductive carbon cathode layer to form a silver-containing conductive cathode;
the prime stacking procedure comprises the following steps:
step B1, compacting the layers of the element to form an inner core with a laminated structure;
step B2, connecting the anodes of the multi-sheet elements and the anode of the lead frame by welding;
step B3, injecting silver paste by using a mould to solidify the inner core into an integrated silver-coated inner core;
and step B4, packaging the cured integrated silver-coated inner core.
3. The solid electrolytic capacitor comprising a silver paste cathode according to claim 2, wherein: the method adopted in the step A5 comprises the steps of pre-soaking the elements of the conductive carbon cathode layer with silver paste with the silver content of 45-65%;
the method of step B1 includes placing the lead frame cathode work piece between the elements while stacking the elements layer-by-layer, thereby sandwiching the lead frame cathode work piece between the stacked structures.
4. The solid electrolytic capacitor comprising a silver paste cathode according to claim 3, wherein: a rectangular mold cavity is arranged in the mold, and an injection opening is formed in the top of the mold;
when the step B3 is executed, the inner core is placed in the mold cavity, silver paste with the silver content of 35-55% is injected into the mold cavity from the top injection port of the mold, the mold is vibrated by using a high-frequency vibration technology, so that the silver paste injected into the mold cavity can fill the gaps between the elements and the space between the inner core and the cavity wall of the mold cavity, and then high-temperature curing is carried out.
5. The solid electrolytic capacitor comprising a silver paste cathode according to claim 4, wherein: the high-temperature curing is to cure the silver paste injected into the mold cavity for 30 minutes by using high temperature of 150 ℃.
6. The solid electrolytic capacitor comprising a silver paste cathode according to claim 4, wherein: the die comprises an upper die and a lower die.
7. The solid electrolytic capacitor comprising a silver paste cathode according to claim 4, wherein: the silver paste pre-impregnated with the primordium in step a5 has a higher silver content than the silver paste injected into the mold in step B3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011122664.7A CN112053851B (en) | 2020-10-20 | 2020-10-20 | Solid electrolytic capacitor containing silver paste cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011122664.7A CN112053851B (en) | 2020-10-20 | 2020-10-20 | Solid electrolytic capacitor containing silver paste cathode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112053851A true CN112053851A (en) | 2020-12-08 |
| CN112053851B CN112053851B (en) | 2022-08-12 |
Family
ID=73605792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011122664.7A Active CN112053851B (en) | 2020-10-20 | 2020-10-20 | Solid electrolytic capacitor containing silver paste cathode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112053851B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114664567A (en) * | 2022-05-05 | 2022-06-24 | 肇庆绿宝石电子科技股份有限公司 | Preparation method of chip capacitor unit with extremely low ESR |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1214524A (en) * | 1997-10-14 | 1999-04-21 | 三洋电机株式会社 | Solid electrolyte capacitor, and process and apparatus for producing same |
| US20100000086A1 (en) * | 2008-07-07 | 2010-01-07 | Cheng-Hung Yu | Method of making a molded interconnect device |
| JP2010050218A (en) * | 2008-08-20 | 2010-03-04 | Nec Tokin Corp | Laminated three terminal type solid electrolytic capacitor, and method of manufacturing the same |
| TW201327598A (en) * | 2011-12-28 | 2013-07-01 | Apaq Technology Co Ltd | Capacitor unit and stacked solid electrolytic capacitor |
| CN105241585A (en) * | 2015-11-12 | 2016-01-13 | 桂林电子科技大学 | Capacitive sensor device based on silver conductive adhesive and manufacturing method thereof |
| CN106971851A (en) * | 2017-04-10 | 2017-07-21 | 福建国光电子科技股份有限公司 | A kind of method for preparing the chip-type laminated solid aluminum electrolytic capacitor of polymer |
-
2020
- 2020-10-20 CN CN202011122664.7A patent/CN112053851B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1214524A (en) * | 1997-10-14 | 1999-04-21 | 三洋电机株式会社 | Solid electrolyte capacitor, and process and apparatus for producing same |
| US20100000086A1 (en) * | 2008-07-07 | 2010-01-07 | Cheng-Hung Yu | Method of making a molded interconnect device |
| JP2010050218A (en) * | 2008-08-20 | 2010-03-04 | Nec Tokin Corp | Laminated three terminal type solid electrolytic capacitor, and method of manufacturing the same |
| TW201327598A (en) * | 2011-12-28 | 2013-07-01 | Apaq Technology Co Ltd | Capacitor unit and stacked solid electrolytic capacitor |
| CN105241585A (en) * | 2015-11-12 | 2016-01-13 | 桂林电子科技大学 | Capacitive sensor device based on silver conductive adhesive and manufacturing method thereof |
| CN106971851A (en) * | 2017-04-10 | 2017-07-21 | 福建国光电子科技股份有限公司 | A kind of method for preparing the chip-type laminated solid aluminum electrolytic capacitor of polymer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114664567A (en) * | 2022-05-05 | 2022-06-24 | 肇庆绿宝石电子科技股份有限公司 | Preparation method of chip capacitor unit with extremely low ESR |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112053851B (en) | 2022-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5357399A (en) | Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor | |
| KR100880482B1 (en) | Solid electrolytic capacitor and method of producing the same | |
| WO2018074407A1 (en) | Solid electrolytic capacitor and method for producing solid electrolytic capacitor | |
| JP2023027349A (en) | Method for manufacturing electrolytic capacitor and electrolytic capacitor | |
| CN117038340A (en) | Solid electrolytic capacitor | |
| CN112053851B (en) | Solid electrolytic capacitor containing silver paste cathode | |
| JP2001185460A (en) | Solid electrolytic capacitor and its manufacturing method and substrate of an integrated circuitfor it | |
| US11521802B2 (en) | Solid electrolyte capacitor and fabrication method thereof | |
| CN114830275B (en) | Solid electrolytic capacitor | |
| JP7207606B2 (en) | Electrolytic capacitor and method for manufacturing electrolytic capacitor | |
| CN106971851B (en) | A method of preparing the chip-type laminated solid aluminum electrolytic capacitor of polymer | |
| CN109637811B (en) | Ultra-thin polymer sheet type laminated solid aluminum electrolytic capacitor and preparation method thereof | |
| CN113990664B (en) | Manufacturing method of laminated chip type solid aluminum electrolytic capacitor | |
| JPH07105317B2 (en) | Multilayer solid electrolytic capacitor and manufacturing method thereof | |
| JP7200912B2 (en) | Electrolytic capacitor | |
| JP7419791B2 (en) | solid electrolytic capacitor | |
| JP2004088073A (en) | Solid electrolytic capacitor | |
| TWI445032B (en) | Solid capacitor and manufacturing method thereof | |
| CN113488337A (en) | Novel laminated polymer aluminum electrolytic capacitor and manufacturing method thereof | |
| CN202695147U (en) | Solid electrolytic condenser | |
| JP2004281749A (en) | Solid electrolytic capacitor | |
| CN112071645B (en) | Lead frame type electronic component packaging method | |
| WO2023190050A1 (en) | Solid electrolytic capacitor | |
| TW201419336A (en) | Improved process for the production of solid-state electrolytic capacitor | |
| CN204215901U (en) | The solid electrolytic capacitor of metal anode improvement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240126 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Country or region after: China Address before: 200 xiyuangong Road, Shangjie Town, Minhou County, Fuzhou City, Fujian Province Patentee before: MINJIANG University Country or region before: China |