CN112038303A - Flexible display module, manufacturing method thereof and display terminal - Google Patents
Flexible display module, manufacturing method thereof and display terminal Download PDFInfo
- Publication number
- CN112038303A CN112038303A CN202010845065.1A CN202010845065A CN112038303A CN 112038303 A CN112038303 A CN 112038303A CN 202010845065 A CN202010845065 A CN 202010845065A CN 112038303 A CN112038303 A CN 112038303A
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive layer
- display module
- polarizer
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Polarising Elements (AREA)
Abstract
The flexible display module comprises a flexible substrate, a thin film transistor array layer, a display device layer, a packaging layer, a polarizer, a cover plate and an adhesive layer, wherein at least one of the packaging layer and the cover plate is attached to the polarizer through the adhesive layer made of porous adhesive, and stress generated in the folding or bending process of the flexible display module can be absorbed by the porous adhesive, so that the risks of cracks of inner film layers of the flexible display module and separation of adjacent film layers are reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display module, a manufacturing method thereof and a display terminal.
Background
The flexible display module is formed on the flexible substrate through the display device, so that the flexible display module can normally display information when being folded or bent, and the flexible display module has wide application prospect in the technical field of display.
When being folded or bent, the folded or bent part of the existing flexible display module can receive stronger concentrated stress, so that the films such as a cover plate, a polaroid and an encapsulation layer in the module can crack or the films which are originally laminated mutually can be separated, and the phenomenon of bad display of the flexible display module is caused. Therefore, it is desirable to provide a flexible display module, a method for manufacturing the same, and a display terminal to improve the defect.
Disclosure of Invention
The embodiment of the disclosure provides a flexible display module, a manufacturing method thereof and a display terminal, which are used for solving the problems of cracking and separation of a film layer caused by bending of the conventional flexible display module.
The disclosed embodiment provides a flexible display module, including:
a flexible substrate;
the thin film transistor array layer is arranged on the flexible substrate;
the display device layer is arranged on one side, far away from the flexible substrate, of the thin film transistor array layer;
an encapsulation layer covering the display device layer;
the polaroid is arranged on one side of the packaging layer, which is far away from the display device layer;
the cover plate is arranged on one side of the polaroid, which is far away from the packaging layer; and
an adhesive layer, the material of the adhesive layer including a porous adhesive, at least one of the packaging layer and the cover plate being attached to the polarizer via the adhesive layer.
According to an embodiment of the present disclosure, the adhesive layer includes a first adhesive layer disposed between the encapsulation layer and the polarizer.
According to an embodiment of the present disclosure, the adhesive layer includes a second adhesive layer disposed between the cover sheet and the polarizer.
According to an embodiment of the present disclosure, the flexible display module further includes a glass substrate, the glass substrate is disposed on a side of the flexible substrate away from the thin film transistor array layer, a third adhesive layer is disposed between the glass substrate and the flexible substrate, and a material of the third adhesive layer is the same as a material of the adhesive layer.
According to an embodiment of the present disclosure, the flexible display module includes a bending region and non-bending regions located at two sides of the bending region, and an orthographic projection area of the adhesive layer on the flexible substrate covers the bending region.
The display terminal comprises the flexible display module.
The embodiment of the present disclosure further provides a method for manufacturing a flexible display module, including:
providing a glass substrate, and forming a flexible substrate on the glass substrate;
forming a thin film transistor array layer on one side of the flexible substrate far away from the glass substrate;
forming a display device layer on one side of the thin film transistor array layer away from the flexible substrate;
forming an encapsulation layer on a side of the display device layer away from the thin film transistor array layer;
attaching a polarizer to the packaging layer;
attaching a cover plate to the polarizer; and
providing an adhesive layer, wherein the material of the adhesive layer comprises a porous adhesive, and at least one of the packaging layer and the cover plate is attached to the polarizer through the adhesive layer.
According to an embodiment of the present disclosure, the adhesive layer includes a first adhesive layer, and the polarizer is attached to the encapsulation layer through the first adhesive layer.
According to an embodiment of the present disclosure, the adhesive layer includes a second adhesive layer, and the cover sheet is attached to the polarizer through the second adhesive layer.
According to an embodiment of the present disclosure, a third adhesive layer is disposed between the glass substrate and the flexible substrate, and the third adhesive layer and the adhesive layer are made of the same material.
The beneficial effects of the disclosed embodiment are as follows: according to the embodiment of the disclosure, the polarizer is attached to the cover plate or the packaging layer through the adhesive layer made of the porous adhesive, and the stress generated in the folding or bending process of the flexible display module can be absorbed by the porous adhesive, so that the risks of cracking of the inner film layer of the flexible display module and separation of the adjacent film layers are reduced.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some of the disclosed embodiments, and that other drawings can be obtained by those skilled in the art without inventive effort.
Fig. 1 is a schematic diagram of a film structure of a flexible display module according to an embodiment of the disclosure;
fig. 2 is a structural schematic diagram of a flexible display module according to an embodiment of the disclosure in a bent state.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the disclosure may be practiced. Directional phrases used in this disclosure, such as [ upper ], [ lower ], [ front ], [ back ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terms used are used for the purpose of illustration and understanding of the present disclosure, and are not used to limit the present disclosure. In the drawings, elements having similar structures are denoted by the same reference numerals.
The present disclosure is further described with reference to the following drawings and detailed description.
The present disclosure provides a flexible display module, which is described in detail below with reference to fig. 1 to 2. As shown in fig. 1, fig. 1 is a schematic diagram of a film structure of a flexible display module according to an embodiment of the present disclosure, where the flexible display module includes a glass substrate 10, a flexible substrate 11, a thin film transistor array layer 12, a display device layer 13, an encapsulation layer 14, a polarizer 16, and a cover plate 17.
Specifically, the thin film transistor array layer 12 is disposed on the flexible substrate 11, and the thin film transistor array layer 12 includes a plurality of thin film transistors arranged in an array, and a plurality of data lines and scan lines disposed in the thin film transistor array layer 12. The display device layer 13 is disposed on a side of the thin film transistor array layer 12 away from the flexible substrate 11, the display device layer 13 includes a plurality of light emitting regions 131, and an anode, a light emitting layer, and a cathode are disposed in a stacked manner in the light emitting regions 131. The encapsulation layer 14 covers the display device layer 13 to prevent moisture or oxygen from penetrating into the display device layer 13, and has a structure substantially the same as that of the encapsulation layer in the related art, which is not limited herein. A polarizer 16 is arranged on the side of the encapsulation layer 14 remote from the display device layer 13 and a cover plate 17 is arranged on the side of the polarizer 16 remote from the encapsulation layer 14.
In the embodiment of the present disclosure, the flexible display module further includes an adhesive layer 15, a material of the adhesive layer 15 includes a porous adhesive, at least one of the encapsulation layer 14 and the cover plate 17 is attached to the polarizer 16 through the adhesive layer 15, and the porous adhesive includes a plurality of pores distributed irregularly therein, so as to absorb and eliminate stress generated during bending or bending of the flexible display module.
In the disclosed embodiment, the adhesive layer 15 includes a first adhesive layer 151, and the first adhesive layer 151 is disposed between the encapsulation layer 14 and the polarizer 16. As shown in fig. 2, fig. 2 is a schematic structural diagram of a flexible display module in a bent state according to an embodiment of the disclosure, a plurality of air holes in the first adhesive layer 151 may absorb and eliminate compressive stress generated between adjacent films of the encapsulation layer 14 and the polarizer 16 in the bending process or in the bent state, particularly compressive stress in a middle region of a bent portion, so as to reduce a risk of cracks occurring in the encapsulation layer 14, the polarizer 16 and the bent portions of the adjacent films, and simultaneously prevent film separation between the encapsulation layer 14, the polarizer 16 and the adjacent films.
Further, the adhesive layer 15 may further include a second adhesive layer 152, and the second adhesive layer 152 is disposed between the polarizer 16 and the cover 17. As shown in fig. 2, the polarizer 16 is attached to the cover plate 17 by the second adhesive 152, and during the bending process or in the bent state, the second adhesive 152 can effectively absorb and eliminate the compressive stress generated between the polarizer 16 and the cover plate 17 and the adjacent film layers, so as to reduce the risk of cracks occurring between the polarizer 16 and the cover plate 17 and between the bent portions of the adjacent film layers, and prevent the film layers from separating.
In the embodiment of the present disclosure, the flexible display module is a foldable flexible display module, and includes a bending region and non-bending regions located at two sides of the bending region, only the bending region of the flexible display module is shown in fig. 1 and 2, the orthographic projection regions of the first adhesive layer 151 and the second adhesive layer 152 on the flexible substrate 11 cover the bending region, and the non-bending regions may be bonded by using an optical adhesive, so that the risks of cracking and separation of the film layers stacked in the bending region can be reduced.
Preferably, the first adhesive layer 151 and the second adhesive layer 152 cover the entire surface of the flexible display module, so that the process of coating the porous adhesive can be simplified, and the porous adhesive can also be used to absorb and eliminate the compressive stress of the bent portion, thereby reducing the risk of cracking and film separation. In addition, the flexible display module provided by the embodiment of the present disclosure is also suitable for a rollable display module or a retractable display module, and can also achieve the technical effect of the flexible display module, which is not described herein again.
In the embodiment of the present disclosure, a third adhesive layer 18 is further disposed between the glass substrate 10 and the flexible substrate 11, and a material of the third adhesive layer 18 is the same as a material of the adhesive layer 15, so that by using characteristics of the porous adhesive, a compressive stress between the glass substrate 10 and the flexible substrate 11 is absorbed, and a subsequent process is prevented from being affected by film separation between the glass substrate 10 and the flexible substrate 11, and the glass substrate 10 and the third adhesive layer 18 are peeled from the flexible substrate 11 after the process of the flexible display module is completed.
The beneficial effects of the disclosed embodiment are as follows: according to the embodiment of the disclosure, the polarizer is attached to the cover plate or the packaging layer through the adhesive layer made of the porous adhesive, and the stress generated in the folding or bending process of the flexible display module can be absorbed by the porous adhesive, so that the risks of cracks generated on the inner film layer of the flexible display module and separation of the adjacent film layers are reduced, and the bending resistance of the flexible display module is improved.
This embodiment of this disclosure still provides a display terminal, including the flexible display module that above-mentioned embodiment provided and be used for bearing the underframe structure of flexible display module, display terminal can be collapsible display terminal, can curl display terminal or scalable display terminal, and the display terminal that this embodiment of this disclosure provided can realize the same technological effect with above-mentioned flexible display module equally, and no longer gives details here.
The embodiment of the disclosure further provides a method for manufacturing a flexible display module, which is described in detail below with reference to fig. 1 and 2.
The manufacturing method of the flexible display module provided by the embodiment of the disclosure comprises the following steps:
step S10: providing a glass substrate 10, and forming a flexible substrate 11 on the glass substrate 10;
step S20: forming a thin film transistor array layer 12 on one side of the flexible substrate 11 away from the glass substrate 10;
step S30: forming a display device layer 13 on a side of the thin film transistor array layer 12 away from the flexible substrate 11;
step S40: forming an encapsulation layer 14 on a side of the display device layer 13 away from the thin film transistor array layer 12;
step S50: attaching a polarizer 16 to the encapsulation layer 14; and
step S60: and attaching a cover plate 17 to the polarizer 16.
In an embodiment of the present disclosure, the manufacturing method further includes: an adhesive layer 15 is provided, the material of the adhesive layer 15 includes a porous adhesive, and at least one of the packaging layer 14 and the cover plate 17 is attached to the polarizer 16 through the adhesive layer 15.
Specifically, in step S50, a porous adhesive is coated on the sealing layer 14 to form a first adhesive layer 151, and then the polarizer 16 is attached to the sealing layer 14 through the first adhesive layer 151. The air holes in the first adhesive layer 151 can absorb and eliminate the compressive stress generated between the adjacent films during the bending process or in the bent state of the packaging layer 14 and the polarizer 16, especially the compressive stress in the middle region of the bent portion, thereby reducing the risk of cracks in the packaging layer 14, the polarizer 16 and the bent portion of the adjacent films, and preventing the film separation between the packaging layer 14 and the polarizer 16 and the adjacent films.
In step S60, a porous adhesive may be coated on the polarizer 16 to form a second adhesive layer 152, and then the cover plate 17 is attached to the polarizer 16 through the second adhesive layer 152, so that the second adhesive layer 152 absorbs and eliminates the compressive stress generated between the cover plate 17 and the polarizer 16 during the bending process or in the bending state, thereby reducing the risk of cracks in the cover plate 17 and the polarizer 16 and the bent portions of the adjacent films, and preventing the film separation between the cover plate 17 and the polarizer 16 and the adjacent films. In addition, only the first adhesive layer 151 or only the second adhesive layer 152 may be disposed in the flexible display module, and other film layers may be bonded by a common optical adhesive, and in some embodiments, the first adhesive layer 151 and the second adhesive layer 152 may also be disposed at the same time to obtain better effects of preventing cracks and film layer separation, which is not limited herein.
In addition, in step S10, before forming the flexible substrate 11, a third adhesive layer 18 of the same material as the first adhesive layer 151 may be coated on the glass substrate 10, and then the flexible substrate 11 may be formed on the third adhesive layer 18. Therefore, the glass substrate 10 and the flexible substrate 11 are prevented from being separated from each other to affect the subsequent process, and after the process of the flexible display module is finished, the glass substrate 10, the third adhesive layer 18 and the flexible substrate are peeled.
The beneficial effects of the disclosed embodiment are as follows: according to the manufacturing method of the flexible display module, the polarizer is attached to the packaging layer or the cover plate through the porous adhesive, so that stress generated in the process that the flexible display module is folded or bent is absorbed and eliminated, the risks that cracks occur to the inner film layer of the flexible display module and adjacent film layers are separated are reduced, and the bending resistance of the flexible display module is improved.
In summary, although the present disclosure has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present disclosure, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, so that the scope of the present disclosure is defined by the appended claims.
Claims (10)
1. The utility model provides a flexible display module assembly which characterized in that includes:
a flexible substrate;
the thin film transistor array layer is arranged on the flexible substrate;
the display device layer is arranged on one side, far away from the flexible substrate, of the thin film transistor array layer;
an encapsulation layer covering the display device layer;
the polaroid is arranged on one side of the packaging layer, which is far away from the display device layer;
the cover plate is arranged on one side of the polaroid, which is far away from the packaging layer; and
an adhesive layer, the material of the adhesive layer including a porous adhesive, at least one of the packaging layer and the cover plate being attached to the polarizer via the adhesive layer.
2. The flexible display module of claim 1, wherein the adhesive layer comprises a first adhesive layer disposed between the encapsulation layer and the polarizer.
3. The flexible display module of claim 2, wherein the adhesive layer comprises a second adhesive layer disposed between the cover plate and the polarizer.
4. The flexible display module of claim 3, further comprising a glass substrate disposed on a side of the flexible substrate away from the thin film transistor array layer, wherein a third adhesive layer is disposed between the glass substrate and the flexible substrate, and a material of the third adhesive layer is the same as a material of the adhesive layer.
5. The flexible display module according to claim 1, wherein the flexible display module comprises a bending region and non-bending regions at two sides of the bending region, and an orthographic projection area of the adhesive layer on the flexible substrate covers the bending region.
6. A display terminal, characterized by comprising the flexible display module according to any one of claims 1 to 5.
7. A manufacturing method of a flexible display module is characterized by comprising the following steps:
providing a glass substrate, and forming a flexible substrate on the glass substrate;
forming a thin film transistor array layer on one side of the flexible substrate far away from the glass substrate;
forming a display device layer on one side of the thin film transistor array layer away from the flexible substrate;
forming an encapsulation layer on a side of the display device layer away from the thin film transistor array layer;
attaching a polarizer to the packaging layer;
attaching a cover plate to the polarizer; and
providing an adhesive layer, wherein the material of the adhesive layer comprises a porous adhesive, and at least one of the packaging layer and the cover plate is attached to the polarizer through the adhesive layer.
8. The method of claim 7, wherein the adhesive layer comprises a first adhesive layer, and the polarizer is attached to the encapsulation layer through the first adhesive layer.
9. The method of claim 8, wherein the adhesive layer comprises a second adhesive layer, and the cover plate is attached to the polarizer via the second adhesive layer.
10. The method as claimed in claim 9, wherein a third adhesive layer is disposed between the glass substrate and the flexible substrate, and the third adhesive layer is made of the same material as the adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010845065.1A CN112038303B (en) | 2020-08-20 | 2020-08-20 | Flexible display module, manufacturing method thereof and display terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010845065.1A CN112038303B (en) | 2020-08-20 | 2020-08-20 | Flexible display module, manufacturing method thereof and display terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112038303A true CN112038303A (en) | 2020-12-04 |
| CN112038303B CN112038303B (en) | 2022-11-01 |
Family
ID=73581043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010845065.1A Active CN112038303B (en) | 2020-08-20 | 2020-08-20 | Flexible display module, manufacturing method thereof and display terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112038303B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7370709B2 (en) | 2019-01-28 | 2023-10-30 | 日東電工株式会社 | Laminate, optical film, image display device, and manufacturing method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170075492A1 (en) * | 2015-09-15 | 2017-03-16 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| CN107305906A (en) * | 2016-04-21 | 2017-10-31 | 三星显示有限公司 | Flexible display apparatus |
| CN107636499A (en) * | 2015-06-15 | 2018-01-26 | 日东电工株式会社 | The polarizing coating and image display device of the subsidiary adhesive phase in two sides |
| CN108847133A (en) * | 2018-06-07 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel, display module, electronic device |
| CN109004100A (en) * | 2017-06-06 | 2018-12-14 | 上海和辉光电有限公司 | Flexible display device |
| CN208444864U (en) * | 2018-08-13 | 2019-01-29 | 云谷（固安）科技有限公司 | A kind of display device |
| CN109377889A (en) * | 2018-12-19 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Flexible display apparatus |
| CN109817684A (en) * | 2019-02-01 | 2019-05-28 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED mould group stacked structure and preparation method thereof |
-
2020
- 2020-08-20 CN CN202010845065.1A patent/CN112038303B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107636499A (en) * | 2015-06-15 | 2018-01-26 | 日东电工株式会社 | The polarizing coating and image display device of the subsidiary adhesive phase in two sides |
| US20170075492A1 (en) * | 2015-09-15 | 2017-03-16 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| CN107305906A (en) * | 2016-04-21 | 2017-10-31 | 三星显示有限公司 | Flexible display apparatus |
| CN109004100A (en) * | 2017-06-06 | 2018-12-14 | 上海和辉光电有限公司 | Flexible display device |
| CN108847133A (en) * | 2018-06-07 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel, display module, electronic device |
| CN208444864U (en) * | 2018-08-13 | 2019-01-29 | 云谷（固安）科技有限公司 | A kind of display device |
| CN109377889A (en) * | 2018-12-19 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Flexible display apparatus |
| CN109817684A (en) * | 2019-02-01 | 2019-05-28 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED mould group stacked structure and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7370709B2 (en) | 2019-01-28 | 2023-10-30 | 日東電工株式会社 | Laminate, optical film, image display device, and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112038303B (en) | 2022-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11801657B2 (en) | Flexible display module and manufacturing method thereof | |
| US20230165125A1 (en) | Display panel, display module, and display device | |
| CN114399956B (en) | Curved surface screen laminating equipment, laminating method, display panel and display device | |
| US20200227681A1 (en) | Array substrates, manufacturing methods thereof and display panels | |
| CN109545826B (en) | Display panel, manufacturing method thereof and display device comprising display panel | |
| WO2016161894A1 (en) | Foldable substrate and manufacturing method therefor, and flexible display device | |
| US10613402B2 (en) | Display panel with array substrate having thickness varying in packaging area, method of manufacturing display panel and display device | |
| US10476041B2 (en) | Method for manufacturing OLED panel | |
| US20190051857A1 (en) | Organic light-emitting diode encapsulation structure, method for fabricating the same, and organic light-emitting diode | |
| CN112038303B (en) | Flexible display module, manufacturing method thereof and display terminal | |
| US20220190277A1 (en) | Flexible cover plate, flexible display device, and manufacturing method of flexible cover plate | |
| US20240029591A1 (en) | Display module and manufacturing method thereof, and display apparatus | |
| US7630051B2 (en) | LCD panel and method having color filter and smoothing layers overlapping black matrix and first to third spacers in non-active area where the spacers are disposed on the smoothing layer at progressively increasing distances from substrate seal | |
| US20200136084A1 (en) | Press forming method for composite material | |
| CN106206991B (en) | Double-sided OLED display device | |
| WO2022242329A1 (en) | Oled display device and preparation method therefor, and display terminal | |
| US20210294153A1 (en) | Display panel manufacturing method and display panel manufactured using same | |
| CN111653548A (en) | Display substrate, display panel and preparation method thereof | |
| WO2022179182A1 (en) | Method for manufacturing spliced display screen and spliced display screen | |
| CN114495741B (en) | Display module and terminal equipment | |
| US11941209B2 (en) | Touch module, preparation method therefor, and display device | |
| CN114446179A (en) | Flexible display module, preparation method of flexible display module and flexible display device | |
| CN114220932A (en) | Display device | |
| US10754089B1 (en) | Display module | |
| CN209248210U (en) | A kind of shading glue frame and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |