CN112026303A - Wave-absorbing wood pile structure based on 3D printing technology and manufacturing method thereof - Google Patents
Wave-absorbing wood pile structure based on 3D printing technology and manufacturing method thereof Download PDFInfo
- Publication number
- CN112026303A CN112026303A CN202010947774.0A CN202010947774A CN112026303A CN 112026303 A CN112026303 A CN 112026303A CN 202010947774 A CN202010947774 A CN 202010947774A CN 112026303 A CN112026303 A CN 112026303A
- Authority
- CN
- China
- Prior art keywords
- wave
- layer
- pile structure
- layer part
- wood pile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/05—Filamentary, e.g. strands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0223—Vinyl resin fibres
- B32B2262/023—Aromatic vinyl resin, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The invention discloses a wave-absorbing wood pile structure based on a 3D printing technology, which comprises a bottom layer part, a middle layer part and a top layer part, wherein each layer is respectively formed by a plurality of cuboid strip layer units arranged at intervals in parallel, and the cuboid strip layer units are made of conductive ABS wires; the cuboid strip layer units of the middle layer part and the cuboid strip layer units of the bottom layer part are crossly stacked at an angle of 90 degrees; the cuboid strip layer units of the top layer part and the cuboid strip layer units of the middle layer part are stacked in a 90-degree crossed mode, and the cuboid strip layer units of the top layer part and the cuboid strip layer units of the bottom layer part are arranged in a staggered parallel mode. The invention also provides a manufacturing method of the wave-absorbing wood pile structure. The invention has the beneficial effects that: the wave-absorbing wood pile structure has a more complex space structure, the number of internal interfaces is greatly increased, incident electromagnetic waves are reflected and refracted for many times at the interfaces, the incidence times and the transmission distance of the electromagnetic waves are increased, and therefore the electromagnetic wave-absorbing performance of the material is effectively improved.
Description
Technical Field
The invention relates to the technical field of electromagnetic wave absorption, in particular to a wave-absorbing wood pile structure based on a 3D printing technology and a manufacturing method thereof.
Background
With the continuous development of science and technology, people increasingly rely on the great convenience brought by electronic products and equipment. However, the electromagnetic radiation generated by the electronic device during operation not only interferes with normal communication, but also continuously deteriorates the living environment of human beings, and endangers human health. In addition, with the continuous development of radar detection technology, missile, airplane, ship and other weaponry are more easily detected by radar, and the viability of missile, airplane, ship and other weaponry faces huge challenges. Aiming at the radar detection technology, the development of the radar wave-absorbing stealth material with stronger electromagnetic wave absorption capacity is an effective means for improving the battlefield viability of military weaponry and is also the most common and effective defense measure used in the war of the present generation. Therefore, the development of materials having high electromagnetic wave absorption performance is becoming more and more urgent in both civil and military fields.
Structural wave-absorbing materials have become a research hotspot in the field of electromagnetic wave absorption. By adjusting the macro structure and the micro structure of the structural wave absorber, the impedance matching of the structural wave absorber can be effectively adjusted, and the adjustment of the wave absorbing performance is further realized. At present, a plurality of honeycomb-shaped wave absorbers are adopted, and basically, materials with honeycomb structures are impregnated or coated, and an absorbent is attached to the surfaces of the materials with the honeycomb structures, so that the preparation of the structural wave absorbers is realized.
The 3D printing technology is a technology for manufacturing solid parts by adopting a layer-by-layer material accumulation mode on the basis of three-dimensional model data, is completely different from a traditional removal machining (cutting machining) method, can quickly manufacture complex parts with any shape structures in a short period, and realizes personalized manufacturing. Fused Deposition Modeling (FDM) is one of the most widely used techniques. The wire material is heated and extruded through a nozzle, and is stacked layer by layer according to a CAD model to finally form a solid part. Therefore, how to design the wave absorber with a complex structure by using a 3D printing technology to improve the electromagnetic wave absorption efficiency is a key issue of current research.
Disclosure of Invention
The invention aims to provide a wave-absorbing wood pile structure with high electromagnetic wave-absorbing efficiency based on 3D printing and a manufacturing method thereof, aiming at the defects of the prior art.
The technical scheme adopted by the invention is as follows: a wave-absorbing wood pile structure based on a 3D printing technology comprises a bottom layer part, a middle layer part and a top layer part, wherein each part is respectively formed by a plurality of cuboid strip layer units arranged at intervals in parallel, and the cuboid strip layer units are made of conductive ABS wires; the cuboid strip layer units of the middle layer part and the cuboid strip layer units of the bottom layer part are crossly stacked at an angle of 90 degrees; the cuboid strip layer units of the top layer part and the cuboid strip layer units of the middle layer part are stacked in a 90-degree crossed mode, and the cuboid strip layer units of the top layer part and the cuboid strip layer units of the bottom layer part are arranged in a staggered parallel mode.
According to the scheme, the distance D between every two adjacent cuboid strip layer units in each part is 3-8 mm.
According to the scheme, the length L of the cuboid strip layer unit is 180mm, the width W is 1-10 mm, and the height H is 1-3 mm.
The invention also provides a manufacturing method of the wave-absorbing wood pile structure, which comprises the following steps:
step one, establishing a model of a wave-absorbing wood pile structure;
step two, conducting slicing processing on the model STL and then leading the processed model STL into a 3D printer;
step three, preparing a printing material: melting and blending the multi-walled carbon nano-tube and ABS resin to obtain MWCNTs/ABS composite material particles;
step four, drawing wires: drying the MWCNTs/ABS composite material particles, and then feeding the particles into a single-screw extruder to obtain a printing wire material, namely a conductive ABS wire material;
step five: and (3) feeding the conductive ABS wire material into a nozzle of a 3D printer, setting forming process parameters, and printing layer by layer to obtain the wave-absorbing wood pile structure.
According to the scheme, in the third step, the using amount of the multi-walled carbon nano-tube is 2-6% of the mass of the resin.
According to the scheme, the diameter of the conductive ABS wire is 1.6-3.0 mm.
According to the scheme, the conductivity of the conductive ABS wire material is 10-10～10-3S/cm。
According to the scheme, the molding process parameters are as follows: the nozzle temperature is 220-280 ℃, the layer height for layer-by-layer printing is 0.1-0.2 mm, the filling degree is 100%, the printing speed is 20-60 mm/s, and the temperature of the printing platform is 80-110 ℃.
The invention has the beneficial effects that:
1. the wave-absorbing wood pile structure is a three-layer structure, the internal space is complex, and the layers are stacked in a crossed and staggered manner, so that the number of internal interfaces of the wave absorber is greatly increased, incident electromagnetic waves are reflected and refracted for multiple times at the interfaces, the incidence times and the transmission distance of the electromagnetic waves are increased, and the loss probability of the electromagnetic waves is obviously improved.
2. The wave-absorbing wood pile structure is manufactured by adopting a 3D printing technology, the operation is convenient, the safety is high, and the preparation of the three-layer wood pile complex structure can be realized with zero error.
Drawings
Fig. 1 is a top view of the overall structure of embodiment 1 of the present invention.
Fig. 2 is a side view of the whole structure of embodiment 1.
Fig. 3 is a partial structural view of embodiment 1.
FIG. 4 is a schematic view of a fused deposition modeling printer.
Fig. 5 is a schematic structural view of embodiment 2.
Fig. 6 is a graph showing the electromagnetic wave absorption property evaluation effect of example 1.
Fig. 7 is a graph showing the electromagnetic wave absorption property evaluation effect of example 2.
Fig. 8 is an evaluation effect diagram of the electromagnetic wave absorption performance of example 3.
FIG. 9 is a partial schematic view of embodiment 3.
Wherein: 1-printing silk material, 2-conveying wheel, 3-nozzle, 4-printing entity, 5-adhesive sheet, 6-printing platform, 7-top layer part, 8-middle layer part, 9-bottom layer part and 10-cuboid strip layer unit.
Detailed Description
For a better understanding of the present invention, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
The wave-absorbing wood pile structure based on the 3D printing technology comprises a bottom layer part 9, a middle layer part 8 and a top layer part 7, wherein each part is formed by a plurality of cuboid strip layer units 10 arranged at intervals in parallel, and the cuboid strip layer units 10 are made of conductive ABS wires; the cuboid strip layer units 10 of the middle layer part 8 and the cuboid strip layer units 10 of the bottom layer part 9 are crossly stacked at 90 degrees; the cuboid strip layer units 10 of the top layer part 7 and the cuboid strip layer units 10 of the middle layer part 8 are crossed and stacked by 90 degrees, and the cuboid strip layer units 10 of the top layer part 7 and the cuboid strip layer units 10 of the bottom layer part 9 are arranged in parallel in a staggered mode.
Preferably, the distance D between two adjacent cuboid strip layer units 10 in each part is 3-8 mm.
Preferably, the length L of the rectangular strip layer unit 10 is 180mm, the width W is 1-10 mm, and the height H is 1-3 mm.
FIG. 3 is a partial schematic view of embodiment 1, in which a bottom layer part 9 is formed by arranging a plurality of rectangular parallelepiped stripe layer units 10 side by side at intervals of 3-8 mm; the middle layer part 8 is formed by arranging a plurality of cuboid strip layer units 10 side by side at intervals of 3-8 mm; the top layer part 7 is arranged side by side at 3 ~ 8 mm's interval by a plurality of cuboid strip layer unit 10. The top layer part 7 and the middle layer part 8 are stacked in a 90-degree crossed manner, and the top layer part 7 and the bottom layer part 9 are in parallel in a staggered manner, namely the bottom layer part 9 translates 1-10 mm in the width direction and then translates 2-6 mm in the height direction to form the position of the top layer part 7.
A manufacturing method of the wave-absorbing wood pile structure comprises the following steps:
step one, modeling: and establishing the model of the wave-absorbing wood pile structure by adopting CAD software.
And step two, performing STL slice setting on the model, guiding the model after slice setting into a 3D printer, and leveling the printing platform 6.
Step three, preparing a printing material: and (2) carrying out melt blending on 2-6 wt% of multi-walled carbon nanotubes (MWCNTs) and ABS resin in a double-screw extruder to obtain MWCNTs/ABS composite material particles. The using amount of the multi-walled carbon nano-tube is 2-6% of the mass of the resin.
In the invention, the temperature of each zone of the double-screw extruder is as follows: the temperature of the first area is 185-205 ℃, the temperature of the second area is 195-215 ℃, the temperature of the third area is 200-220 ℃, the temperature of the fourth area is 200-225 ℃, and the temperature of the machine head is 195-215 ℃; melt blending using a twin screw extruder is prior art and will not be described in detail herein.
Step four, drawing wires: drying the MWCNTs/ABS composite material particles in an oven for 2-4 hours, and then feeding the particles into a single-screw extruder to obtain a printing wire 1, namely a conductive ABS wire.
In the invention, the conductivity of the conductive ABS wire is 10-10～10-3S/cm. The diameter of the conductive ABS wire is 1.6-3.0 mm.
In the invention, the temperature of each zone of the single-screw extruder is as follows: the temperature of the first area is 195-215 ℃, the temperature of the second area is 210-230 ℃, and the temperature of the third area is 200-220 ℃; the cooling water temperature is 50-60 ℃, the rotating speed of the main machine is 600-900 r/s, and the rotating speed of the tractor is 350-450 r/s; obtaining conductive wire material using a single screw extruder is prior art and will not be described herein.
Step five: and (3) feeding the conductive ABS wire material into a nozzle 3 of a 3D printer, setting forming process parameters, and printing layer by layer to obtain a wave-absorbing wood pile structure, namely a printing entity 4 in the figure 4. The molding process parameters are as follows: the temperature of the printer nozzle 3 is 220-280 ℃, the layer height for layer-by-layer printing is 0.1-0.2 mm, the filling degree is 100%, the printing speed is 20-60 mm/s, and the temperature of the printing platform 6 is 80-110 ℃. The 3D printer is a fused deposition modeling printer (FDM printer); use sticky sheet 5 on print platform 6 (sticky sheet 5 pastes on print platform 6, print entity 4 and print on sticky sheet successive layer, and sticky sheet 5 connects print platform 6 and print entity 4 promptly), guarantees to print the structure and does not warp.
Example 1
As shown in fig. 1-3, each layer of the wave-absorbing wood pile structure is formed by paralleling cuboid strip-layer units 10, wherein the length L of each cuboid strip-layer unit 10 is 180mm, the width W of each cuboid strip-layer unit is 5mm, and the height H of each cuboid strip-layer unit is 1.2 mm; the distance D between adjacent cuboid strip layer units 10 of the same layer part is 5 mm; the middle layer part 8 and the bottom layer part 9 are crossly stacked at 90 degrees; the top layer part 7 and the middle layer part 8 are crossly stacked at 90 degrees, the top layer part 7 and the bottom layer part 9 are in parallel in a staggered mode, namely the bottom layer part 9 translates 5mm in the width direction and then translates 2.4mm in the height direction to be the position of the top layer part 7, and the overall structure size is 180mm (length) x 180mm (width) x 3.6mm (height).
The method is adopted for manufacturing:
step one and step two are set as above, in step three, the multi-walled carbon nanotubes (MWCNTs) with the mass fraction of 6 wt.% and the ABS resin are melted and blended in a double-screw extruder, and the temperature of each area of the double-screw extruder is as follows: the MWCNTs/ABS composite material particles are obtained at 205 ℃ in the first area, 215 ℃ in the second area, 220 ℃ in the third area, 225 ℃ in the fourth area and 215 ℃ in the machine head. In the fourth step, the prepared MWCNTs/ABS composite material granules are dried in an oven for 4 hours, and then added into a single-screw extruder, wherein the temperature of each area of the single-screw extruder is as follows: 215 ℃ in the first area, 230 ℃ in the second area and 220 ℃ in the third area; the temperature of cooling water is 60 ℃, the rotating speed of a host machine is 870r/s, the rotating speed of a tractor is 410r/s, printable conductive ABS wires with the diameter of 2.85mm are obtained,the conductivity was 6.3X 10-3S/cm. In the fifth step, the nozzle temperature of the 3D printer is 260 ℃, the layer height of layer-by-layer printing is 0.1mm, the filling degree is 100%, the printing speed is 30mm/s, and the temperature of the printing platform 6 is 100 ℃; and printing layer by layer to obtain the wave-absorbing wood pile structure.
Example 2
The wave absorbing structure shown in figure 5 is a cuboid (flat plate, without internal structure) of 180mm (length) x 180mm (width) x 3.6mm (height). The preparation method is characterized by comprising the following steps:
the method comprises the following steps: ingredients
Carrying out melt blending on multi-walled carbon nanotubes (MWCNTs) with the mass fraction of 6 wt.% and ABS resin in a double-screw extruder, wherein the temperature of each zone of the double-screw extruder is as follows: the MWCNTs/ABS composite material particles are obtained at 205 ℃ in the first area, 215 ℃ in the second area, 220 ℃ in the third area, 225 ℃ in the fourth area and 215 ℃ in the machine head.
Step two: die pressing
And (2) putting the MWCNTs/ABS composite material particles with the theoretical forming mass of 110% prepared in the first step into a mould pressing mold, wherein the mould pressing temperature is 210 ℃, the mould pressing pressure is 5MPa, and the mould pressing time is 15 minutes, cooling the mould to 60 ℃, and demoulding to obtain the flat-plate type wave-absorbing material.
Example 3
The better honeycomb structure type electromagnetic wave-absorbing material prepared by the existing traditional impregnation method is shown in figure 9.
Evaluating the electromagnetic wave absorption performance:
for the wave-absorbing structure prepared in the embodiment 1 and the embodiment 2, a vector network analyzer is adopted to test the reflection loss of the wave-absorbing structure at 2-18GHz, so as to evaluate the electromagnetic wave-absorbing performance, as shown in fig. 6 and 7, it can be seen that the wave-absorbing structure in the embodiment 2 has a reflection loss peak value of only-6.95 dB, and the effective wave-absorbing bandwidth (lower than-10 dB, which indicates that more than 90% of electromagnetic wave is absorbed) is 0, and thus the wave-absorbing structure cannot meet the requirements of broadband wave absorption; the reflection loss peak value of the three-layer wave-absorbing wood pile structure in the embodiment 1 is-22.15 dB, the effective absorption bandwidth lower than-10 dB can reach 5.43GHz, the three-layer wave-absorbing wood pile structure is concentrated on two wave-absorbing frequency bands, namely a C band (4-8GHz) and a Ku band (12-18GHz), and the electromagnetic wave-absorbing efficiency is greatly improved; the electromagnetic wave absorbing performance of the superior honeycomb structure type electromagnetic wave absorbing material prepared by the conventional impregnation method is shown in fig. 8, and although the material can obtain a lower reflection loss peak value of-21.61 dB and a wider effective absorption bandwidth of 3.9GHz, the material has a single absorption frequency band and is only concentrated in an X-wave band (8-12GHz), so that the application of the material is limited.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (8)
1. A wave-absorbing wood pile structure based on a 3D printing technology is characterized by comprising a bottom layer part, a middle layer part and a top layer part, wherein each part is respectively formed by a plurality of cuboid strip layer units arranged at intervals in parallel, and the cuboid strip layer units are made of conductive ABS wires; the cuboid strip layer units of the middle layer part and the cuboid strip layer units of the bottom layer part are crossly stacked at an angle of 90 degrees; the cuboid strip layer units of the top layer part and the cuboid strip layer units of the middle layer part are stacked in a 90-degree crossed mode, and the cuboid strip layer units of the top layer part and the cuboid strip layer units of the bottom layer part are arranged in a staggered parallel mode.
2. The wave-absorbing wood pile structure based on the 3D printing technology as claimed in claim 1, wherein the distance D between two adjacent cuboid strip layer units in each part is 3-8 mm.
3. The wave-absorbing wood pile structure based on the 3D printing technology is characterized in that the length L of the rectangular strip layer unit is 180mm, the width W of the rectangular strip layer unit is 1-10 mm, and the height H of the rectangular strip layer unit is 1-3 mm.
4. A method for manufacturing the wave-absorbing wood pile structure according to any one of claims 1-3, characterized in that the method comprises the following steps:
step one, establishing a model of a wave-absorbing wood pile structure;
step two, conducting slicing processing on the model STL and then leading the processed model STL into a 3D printer;
step three, preparing a printing material: melting and blending MWCNTs (multi-walled carbon nanotubes) and ABS (Acrylonitrile butadiene styrene) resin to obtain MWCNTs/ABS composite material particles;
step four, drawing wires: drying the MWCNTs/ABS composite material particles, and then feeding the particles into a single-screw extruder to obtain a printing wire material, namely a conductive ABS wire material;
step five: and (3) feeding the conductive ABS wire material into a nozzle of a 3D printer, setting forming process parameters, and printing layer by layer to obtain the wave-absorbing wood pile structure.
5. The method for manufacturing the wave-absorbing wood pile structure according to claim 4, wherein in the third step, the dosage of the multi-walled carbon nanotubes is 2-6% of the mass of the resin.
6. The method for manufacturing the wave-absorbing wood pile structure according to claim 4, wherein the diameter of the conductive ABS wire is 1.6-3.0 mm.
7. The method for preparing the wave-absorbing wood pile structure according to claim 4, wherein the conductivity of the conductive ABS wire is 10-10～10-3S/cm。
8. The method for preparing the wave-absorbing wood pile structure according to claim 4, wherein the molding process parameters are as follows: the nozzle temperature is 220-280 ℃, the layer height for layer-by-layer printing is 0.1-0.2 mm, the filling degree is 100%, the printing speed is 20-60 mm/s, and the temperature of the printing platform is 80-110 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947774.0A CN112026303B (en) | 2020-09-10 | 2020-09-10 | Wave-absorbing wood pile structure based on 3D printing technology and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947774.0A CN112026303B (en) | 2020-09-10 | 2020-09-10 | Wave-absorbing wood pile structure based on 3D printing technology and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112026303A true CN112026303A (en) | 2020-12-04 |
| CN112026303B CN112026303B (en) | 2022-07-19 |
Family
ID=73585271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010947774.0A Active CN112026303B (en) | 2020-09-10 | 2020-09-10 | Wave-absorbing wood pile structure based on 3D printing technology and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112026303B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012133423A1 (en) * | 2011-03-30 | 2012-10-04 | 日東電工株式会社 | Electromagnetic wave absorber and method for producing electromagnetic wave absorber |
| CN105252779A (en) * | 2015-11-25 | 2016-01-20 | 上海无线电设备研究所 | Three-dimensional forming manufacturing system and method for wave absorbing material |
| US20160325491A1 (en) * | 2013-12-26 | 2016-11-10 | Texas Tech University System | Microwave-induced localized heating of cnt filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated parts |
| CN106250610A (en) * | 2016-07-28 | 2016-12-21 | 西安交通大学 | The manufacture method that a kind of electromagnetic wave structure is stealthy |
| CN106380626A (en) * | 2016-08-30 | 2017-02-08 | 上海无线电设备研究所 | Broadband wave-absorbing material and preparation method thereof |
| CN108640673A (en) * | 2018-07-23 | 2018-10-12 | 山东大学 | A kind of suction wave functionally gradient material (FGM) and preparation method thereof based on 3D printing technique |
| CN108912670A (en) * | 2018-07-23 | 2018-11-30 | 山东大学 | A kind of suction wave functionally gradient material (FGM) and preparation method thereof based on increases material manufacturing technology |
-
2020
- 2020-09-10 CN CN202010947774.0A patent/CN112026303B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012133423A1 (en) * | 2011-03-30 | 2012-10-04 | 日東電工株式会社 | Electromagnetic wave absorber and method for producing electromagnetic wave absorber |
| US20160325491A1 (en) * | 2013-12-26 | 2016-11-10 | Texas Tech University System | Microwave-induced localized heating of cnt filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated parts |
| CN105252779A (en) * | 2015-11-25 | 2016-01-20 | 上海无线电设备研究所 | Three-dimensional forming manufacturing system and method for wave absorbing material |
| CN106250610A (en) * | 2016-07-28 | 2016-12-21 | 西安交通大学 | The manufacture method that a kind of electromagnetic wave structure is stealthy |
| CN106380626A (en) * | 2016-08-30 | 2017-02-08 | 上海无线电设备研究所 | Broadband wave-absorbing material and preparation method thereof |
| CN108640673A (en) * | 2018-07-23 | 2018-10-12 | 山东大学 | A kind of suction wave functionally gradient material (FGM) and preparation method thereof based on 3D printing technique |
| CN108912670A (en) * | 2018-07-23 | 2018-11-30 | 山东大学 | A kind of suction wave functionally gradient material (FGM) and preparation method thereof based on increases material manufacturing technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112026303B (en) | 2022-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103700951B (en) | Complex media double-deck FSS structure SRR metal level ultra-thin absorbing material | |
| CN112209733B (en) | Carbon nano tube-based broadband electromagnetic wave absorption honeycomb metamaterial and preparation method thereof | |
| CN106058482A (en) | Double-layer conductive thin film-based transparent broadband electromagnetic wave absorber | |
| WO2013016900A1 (en) | Man-made microstructure and artificial electromagnetic material | |
| CN103490169B (en) | Individual layer broadband random surface | |
| CN113597032B (en) | Compatible stealth anti-icing material and preparation method and application thereof | |
| CN213073498U (en) | Electromagnetic shielding carbon fiber reinforced composite material based on 3D printing | |
| CN115821642B (en) | Wave-absorbing honeycomb coated with absorbent on surface layer of aramid fiber paper and preparation method thereof | |
| CN117341288B (en) | Three-dimensional wave-absorbing frequency selecting material and manufacturing method thereof | |
| CN109551757A (en) | A kind of preparation method of flexibility Terahertz absorbing material | |
| CN112026303B (en) | Wave-absorbing wood pile structure based on 3D printing technology and manufacturing method thereof | |
| CN114311654B (en) | Metamaterial wave-absorbing structure based on 3D printing process and preparation method and application thereof | |
| CN106332534A (en) | Wave absorber structure | |
| KR102168863B1 (en) | Electromagnetic-wave-absorbing composite sheet | |
| Hyun et al. | Electromagnetic characteristics of 3D-printed composites by free-space measurement | |
| CN117002111A (en) | Layered high-temperature-resistant wave-absorbing glass cloth honeycomb core structure and preparation method thereof | |
| CN107683078A (en) | A kind of absorbing material and preparation method thereof | |
| CN117062426A (en) | Foam honeycomb structure for electromagnetic shielding and manufacturing method thereof | |
| CN105101764A (en) | Stereo unit broadband period wave-absorbing structure | |
| DE102010055850B4 (en) | Absorber for electromagnetic waves | |
| CN116001267A (en) | Preparation method of carbon fiber-polylactic acid electromagnetic shielding composite material based on 3D printing | |
| CN205303689U (en) | Absorbent structure and aircraft covering | |
| CN111688179A (en) | Electromagnetic/mechanical property multi-dimensional gradient controllable wave-absorbing structure 3D printing system and method | |
| CN108400448B (en) | Candy type metamaterial wave absorber | |
| CN205303688U (en) | Absorbent structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |